CN219212802U - Surface treatment equipment for cleaning semiconductor - Google Patents

Surface treatment equipment for cleaning semiconductor Download PDF

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Publication number
CN219212802U
CN219212802U CN202320123026.XU CN202320123026U CN219212802U CN 219212802 U CN219212802 U CN 219212802U CN 202320123026 U CN202320123026 U CN 202320123026U CN 219212802 U CN219212802 U CN 219212802U
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fixedly connected
motor
box
surface treatment
spray gun
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CN202320123026.XU
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Chinese (zh)
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黄小峰
顾湘郡
于苏轼
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Chongqing Kelintai Electronics Co ltd
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Chongqing Kelintai Electronics Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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Abstract

The utility model discloses surface treatment equipment for semiconductor cleaning, which comprises a box body, wherein two first spray guns are symmetrically arranged on one side of the box body, a collecting inclined plate box is arranged at the lower end of the box body, a second spray gun is arranged at the lower end of a feeding bin, a second motor is arranged at the lower end of a third fixing plate, and an outlet is arranged at the lower end of the second motor. Through above-mentioned structure, collect the first spray gun of swash plate case one side fixedly connected with, the output of first spray gun is inboard towards the feeding storehouse for it is convenient for draw the sand material after using to the feeding storehouse inboard and recycle, and first motor and second pivot one end are provided with electric putter structure and clamping plate, make semiconductor structure press from both sides tightly in its one end, carry out surface treatment through upper end spray gun structure sandblast, can multidirectional the rotation carry out the sandblast when making the semiconductor press from both sides tightly in its inside through above structure, make its sand blasting effect splendid.

Description

Surface treatment equipment for cleaning semiconductor
Technical Field
The utility model relates to the technical field of surface treatment for semiconductor cleaning, in particular to surface treatment equipment for semiconductor cleaning.
Background
After cleaning, the semiconductor surface needs to be sandblasted so that the semiconductor surface has a certain roughness, so that a surface treatment apparatus for cleaning the semiconductor needs to be provided.
When the sand blasting treatment is carried out on the semiconductor, a plurality of sand materials can fall to the bottom of the device after sand blasting, and the sand materials can only be placed in the device at the bottom of the device, so that the sand is inconvenient to take out, and when the sand is blasted, the sand blasting structure in the prior art is used for blasting the semiconductor in a single direction, and the sand blasting efficiency cannot be expected.
Disclosure of Invention
The utility model aims to provide surface treatment equipment for cleaning a semiconductor, which is convenient for recycling sand materials to perform sandblasting again and can perform sandblasting in multiple directions.
In order to achieve the above-mentioned purpose, provide a surface treatment equipment that semiconductor washs and uses, the power distribution box comprises a box body, box one side symmetry is provided with two first spray guns, the box lower extreme is provided with collects the swash plate case, collect inside fixedly connected with hang plate of swash plate case, the box upper end runs through fixedly connected with feeding storehouse, the feeding storehouse lower extreme is provided with the second spray gun, the second spray gun lower extreme is provided with places the case, place incasement wall symmetry and be provided with two first motors, first motor one end is provided with electric putter, electric putter one end symmetry is provided with two springs, place case lower extreme fixedly connected with third fixed plate, third fixed plate lower extreme is provided with the second motor, the second motor lower extreme is provided with the export.
According to the surface treatment equipment for cleaning the semiconductor, four support columns are uniformly and fixedly connected to the lower end of the box body, and the support columns are fixedly connected with the collecting inclined plate box.
According to the surface treatment equipment for cleaning the semiconductor, one end of the first spray gun is fixedly connected to one side of the collecting inclined plate box, an absorption pipe is arranged on one side of the first spray gun, and the absorption pipe is communicated with the input end of the first spray gun.
According to the surface treatment equipment for cleaning the semiconductor, one end of the first motor is fixedly connected with a first fixing plate, one end of the first fixing plate is fixedly connected with the inner wall of the placement box, the other end of the first motor is provided with a first rotating shaft, the first rotating shaft is fixedly connected with the output end of the first motor, and one end of the first rotating shaft is fixedly connected with one end of the electric push rod.
According to the surface treatment equipment for cleaning the semiconductor, damping is arranged in the spring, one end of the spring is fixedly connected with a second fixing plate, one end of the second fixing plate is fixedly connected with one end of the electric push rod, and the other end of the spring is fixedly connected with a clamping plate.
According to the surface treatment equipment for cleaning the semiconductor, the sliding seat is fixedly connected to the bottom of the inner side of the placing box, two discharging pipes are symmetrically arranged on two sides of the sliding seat, and the discharging pipes are communicated with the third fixing plate.
According to the surface treatment equipment for cleaning the semiconductor, a second rotating shaft is arranged at the upper end of the second motor, the output end of the second motor is fixedly connected with one end of the second rotating shaft, and the upper end of the second rotating shaft is connected with the lower end of the third fixing plate.
According to the surface treatment equipment for cleaning the semiconductor, the upper end of the outlet is provided with the cage sloping plate column, and the upper end of the cage sloping plate column is fixedly connected to the bottom of the second motor.
The beneficial effects are that:
1. four support columns of even fixedly connected with of box lower extreme, fixedly connected with collection swash plate case between the support column, collect the first spray gun of swash plate case one side fixedly connected with, the output of first spray gun is inboard towards the feeding storehouse for it is convenient for draw the sand material after using to the feeding storehouse inboard and carry out reuse.
2. The inside second motor and the second pivot structure of being provided with of box, second motor structure upper end is provided with places the case, places incasement wall symmetry and is provided with two first motors and first pivot structure, and first motor and second pivot one end are provided with electric putter structure and clamping plate for semiconductor structure presss from both sides tightly in its one end, carries out surface treatment through upper end spray gun structure sandblast, makes the semiconductor clamp can multidirectional rotate and carry out the sandblast in its inside through above structure, makes its sand blasting effect splendid.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The utility model is further described below with reference to the drawings and examples;
fig. 1 is a perspective view of a surface treatment apparatus for semiconductor cleaning according to the present utility model;
fig. 2 is a cross-sectional view of a housing of a surface treatment apparatus for semiconductor cleaning according to the present utility model;
fig. 3 is a schematic structural view of a first spray gun and a collecting inclined plate box of a surface treatment device for cleaning a semiconductor according to the present utility model;
FIG. 4 is a schematic diagram illustrating the structure of FIG. 2A according to the present utility model;
fig. 5 is a schematic diagram of the structure of fig. 4B according to the present utility model.
Legend description:
1. a case; 2. a cage sloping plate column; 3. a support column; 4. collecting an inclined plate box; 5. a first spray gun; 6. an absorption tube; 7. an inclined plate; 8. placing a box; 9. a second spray gun; 10. a feeding bin; 11. a first fixing plate; 12. a first motor; 13. a first rotating shaft; 14. an electric push rod; 15. a second fixing plate; 16. a spring; 17. damping is carried out; 18. a clamping plate; 19. sliding the seat; 20. a discharge pipe; 21. a third fixing plate; 22. a second rotating shaft; 23. a second motor; 24. and an outlet.
Detailed Description
Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.
Referring to fig. 1-5, a surface treatment device for cleaning a semiconductor according to an embodiment of the present utility model includes a box 1, two first spray guns 5 are symmetrically disposed on one side of the box 1, a collecting inclined plate box 4 is disposed at the lower end of the box 1, an inclined plate 7 is fixedly connected inside the collecting inclined plate box 4, a feeding bin 10 is fixedly connected through the upper end of the box 1, a second spray gun 9 is disposed at the lower end of the feeding bin 10, the first spray guns 5 and the second spray guns 9 utilize the principle of compressed air to spray sand particles forming high-speed flow onto the surface of a workpiece, a placement box 8 is disposed at the lower end of the second spray gun 9, two first motors 12 are symmetrically disposed on the inner wall of the placement box 8, one end of each first motor 12 is provided with an electric push rod 14, the electric push rod 14 is powered by an internal motor structure in the prior art, one end of each electric push rod 14 is symmetrically provided with two springs 16, a third fixing plate 21 is fixedly connected to the lower end of the placement box 8, a second motor 23 is disposed at the lower end of the third fixing plate 21, and an outlet 24 is disposed at the lower end of the second motor 23.
The even fixedly connected with four support columns 3 of box 1 lower extreme, support column 3 and collection swash plate case 4 fixed connection.
One end of the first spray gun 5 is fixedly connected to one side of the collecting inclined plate box 4, an absorption pipe 6 is arranged on one side of the first spray gun 5, and the absorption pipe 6 is communicated with the input end of the first spray gun 5.
First fixed plate 11 of first motor 12 one end fixedly connected with, first fixed plate 11 one end fixed connection is in placing case 8 inner wall, and first motor 12 other end is provided with first pivot 13, and first pivot 13 and the output fixed connection of first motor 12, first pivot 13 one end fixed connection is in electric putter 14 one end.
The inside damping 17 that is provided with of spring 16, damping 17 and spring 16 are connected fixedly through prior art for there is the cushioning effect when semiconductor is tight, and spring 16 one end fixedly connected with second fixed plate 15, second fixed plate 15 one end and electric putter 14 one end fixed connection, spring 16 other end fixedly connected with clamping plate 18.
The bottom of the inner side of the placement box 8 is fixedly connected with a sliding seat 19, two discharging pipes 20 are symmetrically arranged on two sides of the sliding seat 19, and the discharging pipes 20 are communicated with a third fixing plate 21.
The upper end of the second motor 23 is provided with a second rotating shaft 22, the second rotating shaft 22 drives the third fixing plate 21 to rotate, the output end of the second motor 23 is fixedly connected with one end of the second rotating shaft 22, and the upper end of the second rotating shaft 22 is connected with the lower end of the third fixing plate 21.
The upper end of the outlet 24 is provided with a cage sloping plate column 2, and the upper end of the cage sloping plate column 2 is fixedly connected to the bottom of the second motor 23.
Working principle: the device is installed, a semiconductor is placed inside the placement box 8, sand is placed inside the feeding bin 10, the sand is ejected to the semiconductor through the second spray gun 9, the semiconductor drives the semiconductor to rotate through the first motor 12 structures on two sides, the placement box 8 is driven by the second motor 23 structures on the lower end of the placement box 8 to rotate, the sand blasting efficiency is high, and the sand falling during sand blasting can enter the collection inclined plate box 4 to be extracted again to the inside of the feeding bin 10 for reuse.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims (8)

1. The utility model provides a surface treatment equipment that semiconductor washs and uses, includes box (1), its characterized in that: the utility model discloses a box, including box (1), electric putter (14), box (1) lower extreme, box (1) one side symmetry is provided with collects swash plate case (4), collect inside fixedly connected with swash plate (7) of swash plate case (4), box (1) upper end runs through fixedly connected with feeding storehouse (10), feeding storehouse (10) lower extreme is provided with second spray gun (9), second spray gun (9) lower extreme is provided with places case (8), place case (8) inner wall symmetry and be provided with two first motors (12), first motor (12) one end is provided with electric putter (14), electric putter (14) one end symmetry is provided with two springs (16), place case (8) lower extreme fixedly connected with third fixed plate (21), third fixed plate (21) lower extreme is provided with second motor (23), second motor (23) lower extreme is provided with export (24).
2. The surface treatment device for semiconductor cleaning according to claim 1, wherein four support columns (3) are uniformly and fixedly connected to the lower end of the box body (1), and the support columns (3) are fixedly connected with the collecting inclined plate box (4).
3. The surface treatment equipment for semiconductor cleaning according to claim 1, wherein one end of the first spray gun (5) is fixedly connected to one side of the collecting inclined plate box (4), an absorption tube (6) is arranged on one side of the first spray gun (5), and the absorption tube (6) is communicated with the input end of the first spray gun (5).
4. The surface treatment device for semiconductor cleaning according to claim 1, wherein one end of the first motor (12) is fixedly connected with a first fixing plate (11), one end of the first fixing plate (11) is fixedly connected to the inner wall of the placement box (8), the other end of the first motor (12) is provided with a first rotating shaft (13), the first rotating shaft (13) is fixedly connected with the output end of the first motor (12), and one end of the first rotating shaft (13) is fixedly connected to one end of the electric push rod (14).
5. The surface treatment device for semiconductor cleaning according to claim 1, wherein a damping damper (17) is provided inside the spring (16), one end of the spring (16) is fixedly connected with a second fixing plate (15), one end of the second fixing plate (15) is fixedly connected with one end of the electric push rod (14), and the other end of the spring (16) is fixedly connected with a clamping plate (18).
6. The surface treatment device for semiconductor cleaning according to claim 1, wherein a sliding seat (19) is fixedly connected to the bottom of the inner side of the placing box (8), two discharging pipes (20) are symmetrically arranged on two sides of the sliding seat (19), and the discharging pipes (20) are communicated with a third fixing plate (21).
7. The surface treatment device for semiconductor cleaning according to claim 1, wherein a second rotating shaft (22) is provided at an upper end of the second motor (23), an output end of the second motor (23) is fixedly connected to one end of the second rotating shaft (22), and an upper end of the second rotating shaft (22) is connected to a lower end of the third fixing plate (21).
8. A surface treatment apparatus for semiconductor cleaning according to claim 1, wherein the upper end of the outlet (24) is provided with a cage swash plate column (2), and the upper end of the cage swash plate column (2) is fixedly connected to the bottom of the second motor (23).
CN202320123026.XU 2023-02-06 2023-02-06 Surface treatment equipment for cleaning semiconductor Active CN219212802U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320123026.XU CN219212802U (en) 2023-02-06 2023-02-06 Surface treatment equipment for cleaning semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320123026.XU CN219212802U (en) 2023-02-06 2023-02-06 Surface treatment equipment for cleaning semiconductor

Publications (1)

Publication Number Publication Date
CN219212802U true CN219212802U (en) 2023-06-20

Family

ID=86735964

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320123026.XU Active CN219212802U (en) 2023-02-06 2023-02-06 Surface treatment equipment for cleaning semiconductor

Country Status (1)

Country Link
CN (1) CN219212802U (en)

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