CN219203101U - Wet etching acid storage device - Google Patents
Wet etching acid storage device Download PDFInfo
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- CN219203101U CN219203101U CN202222957189.6U CN202222957189U CN219203101U CN 219203101 U CN219203101 U CN 219203101U CN 202222957189 U CN202222957189 U CN 202222957189U CN 219203101 U CN219203101 U CN 219203101U
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Abstract
The utility model provides a wet etching acid storage device, which comprises a liquid storage device, a gas circulation device, a liquid circulation device and an air source supply device, wherein the liquid storage device is connected with the gas circulation device; the gas circulation device comprises a gas inlet pipeline, a gas conveying device and a gas distribution pipeline which are connected in sequence; the air inlet pipeline is arranged above the liquid level of the liquid storage device, and the air distribution device is arranged at the bottom of the liquid storage device; the liquid circulation device comprises a liquid conveying device; the liquid conveying device is connected with a liquid outlet of the liquid storage device; the air source supply device is connected with the liquid storage device. The utility model reduces the defect of introducing unnecessary moisture by supplementing liquid acid through the arrangement of the air source supply device, reduces the overflow flow of the liquid storage device and saves the consumption of acid. Moreover, the air source supply device is easier to carry and store, less in leakage hazard and safer to use.
Description
Technical Field
The utility model belongs to the technical field of wet etching, relates to a wet etching device, and particularly relates to a wet etching acid storage device.
Background
With the continuous development of integrated circuits, the critical dimensions of semiconductor devices are becoming smaller, and cleaning processes and etching processes are becoming more important as indispensable processes in semiconductor production. Typically, the cleaning process is performed in a trench wet cleaner and the wet etching of the etching process is performed in a trench wet etching station. Along with the progress of wet etching, the concentration of acid in the groove type wet etching machine table can be gradually changed, and the etching precision and speed are affected, so that the acid in the groove of the wet etching machine table needs to be supplemented.
The prior wet etching technology generally adopts HNO 3 And etching the silicon wafer by using HF solution, wherein the consumed acid solution is obtained by supplementing HNO with standard concentration according to the number of wafers 3 The HF acid solution is replenished. HNO commonly used in general 3 The concentration of (2) is 69-71wt%, and the concentration of HF is 49wt%, so that the mixed solution in the acid tank after each addition is additionally added with unnecessary moisture besides the required chemicals, thereby causing the wet etching acid storage device to be quickly filled up and causing a great amount of overflow loss of the solution.
CN 112271232a discloses a method for manufacturing a solar cell, comprising: a back acid etching and polishing step, wherein during the back acid etching and polishing step, working fluid is continuously supplemented to the etching groove in a preset unit quantity so as to maintain the concentration of the working fluid, and the working fluid comprises HF and HNO 3 H and H 2 SO 4 . By continuously supplementing HF and HNO 3 H and H 2 SO 4 The process of working fluids results in the introduction of large amounts of unnecessary moisture, which in turn results in the overflow loss of large amounts of solution.
CN 114613704a discloses a wet etching device capable of adjusting the concentration of etching liquid, which comprises an etching cavity, an etching liquid tank, a spraying device and a spraying liquid management system; the etching cavity is used for accommodating and etching the substrate, the etching liquid tank is used for storing etching liquid, the spraying device is used for spraying the etching liquid in the etching liquid tank into the etching cavity, the etching liquid tank is communicated with the bottom of the etching cavity, and the etching liquid management system is used for supplementing raw materials into the etching liquid; and the etching cavity is provided with a main exhaust pipe, and an exhaust pump is arranged on the main exhaust pipe. The disclosed wet etching device discharges water vapor through the arrangement of the heating device, realizes the adjustment of the concentration of acid liquid in etching liquid, and particularly enables the concentration of phosphoric acid to rise back or remain stable, thereby keeping the etching rate of the etching liquid stable and avoiding etching residues. However, the energy consumption is high, and the acid loss is inevitably caused by the temperature rising process.
In this regard, it is desirable to provide a wet etching acid storage device that is low in energy consumption and that can simply replenish the acid concentration.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model aims to provide the wet etching acid storage device, which reduces the defect that liquid acid is supplemented to introduce unnecessary moisture through the arrangement of the air source supply device, reduces the overflow flow of the liquid storage device and saves the use amount of acid. Moreover, the air source supply device is easier to carry and store, less in leakage hazard and safer to use.
To achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a wet etching acid storage device, which comprises a liquid storage device, a gas circulation device, a liquid circulation device and an air source supply device, wherein the liquid storage device is connected with the gas circulation device;
the gas circulation device comprises a gas inlet pipeline, a gas conveying device and a gas distribution pipeline which are connected in sequence; the air inlet pipeline and the gas conveying device are arranged above the liquid level of the liquid storage device, and the gas distribution pipeline is arranged at the bottom of the liquid storage device;
the liquid circulation device comprises a liquid conveying device; the liquid outlet of the liquid conveying device is connected with the reaction tank, and the liquid inlet of the liquid conveying device is connected with the liquid outlet of the liquid storage device;
the air source supply device is connected with the liquid storage device.
According to the wet etching acid storage device provided by the utility model, the acid concentration is supplemented for the acid liquid in the liquid storage device through the gas by arranging the gas source supply device. The gaseous source is directly added into the acid liquid in the liquid storage device, so that the defect of introducing moisture during liquid acid addition can be reduced, the overflow amount of the acid liquid in the liquid storage device is reduced, and the use amount of the acid is saved. Moreover, the air source supply device is flexible in air supply mode, more convenient to transport and store and relatively less in leakage hazard.
When the wet etching acid storage device provided by the utility model is used, the acid solution to be replenished is stored in the liquid storage device, and the air source provided by the air source supply device is introduced into the liquid storage device to be contacted with the acid solution to be replenished in the liquid storage device, so that the acid concentration in the acid solution to be replenished is replenished.
Because the liquid absorbs the acid gas at a lower rate, partial gas entering the liquid storage device flows through the gas inlet pipeline, the gas conveying device and the gas distribution pipeline in sequence by the arrangement of the gas circulation device, and the gas is distributed in the acid liquid to be supplemented through the gas distribution pipeline, so that the absorption efficiency of the acid liquid to be supplemented to the gas is improved. The gas circulation device includes, but is not limited to, an air pump.
When the concentration of the acid liquor in the replenishing solution reaches a preset value, the acid liquor flows out from a liquid outlet of the liquid storage device and is conveyed by the liquid conveying device.
Preferably, the gas supply means comprises at least 2 acid gas storage means, such as 2, 3, 4, 5, 6 or 8, but not limited to the recited values, other non-recited values within the range of values are equally applicable; the at least 2 acid gas storage devices are connected with a top gas inlet of the liquid storage device.
The conventional etching acid in the field is mixed acid including HNO 3 HF or H 2 SO 4 Typically, but not by way of limitation, a combination of at least two of (a) and (b) includes HNO 3 Combination with HF, HF and H 2 SO 4 Is a combination of HNO 3 And H is 2 SO 4 Or HNO (combination of (C) 3 HF and H 2 SO 4 Is a combination of (a) and (b). In order to realize the supplementation of the concentration of each acid in the mixed acid, the utility modelThe gas source supply device comprises at least 2 acid gas storage devices; the at least 2 acid gas storage devices provide different gases depending on the acid species in the mixed acid.
Preferably, the air supply line of the air supply device extends below the liquid level of the liquid storage device.
The utility model improves the absorption of the liquid in the liquid storage device to the acid gas by extending the air supply pipeline of the air supply device to the position below the liquid level of the liquid storage device.
Preferably, the acid gas storage device comprises a gas storage tank.
Preferably, a liquid inlet is arranged at the top of the liquid storage device; the liquid outlet of the reaction tank is connected with the liquid inlet.
Preferably, the liquid storage device is further provided with an overflow port; the overflow port is arranged between the air inlet pipeline and the liquid level of the liquid storage device.
Preferably, the gas source supply device further comprises an oxidizing gas supply device; the oxidizing gas supply device is connected with a gas inlet of the gas mixing device.
Preferably, the reservoir further comprises a top vent.
Preferably, the top vent is provided with a back pressure means.
Preferably, the wet etching acid storage device further comprises a gas absorbing device; the gas absorbing device is connected with the back pressure device.
The gas absorption device comprises an absorption liquid storage tank, wherein the absorption liquid comprises alkaline absorption liquid.
Compared with the prior art, the utility model has the beneficial effects that:
according to the wet etching acid storage device provided by the utility model, the acid concentration is supplemented for the acid liquid in the liquid storage device through the gas by arranging the gas source supply device. The gaseous source is directly added into the acid liquid in the liquid storage device, so that the defect of introducing moisture during liquid acid addition can be reduced, the overflow amount of the acid liquid in the liquid storage device is reduced, and the use amount of the acid is saved. Moreover, the air source supply device is flexible in air supply mode, more convenient to transport and store and relatively less in leakage hazard.
Drawings
Fig. 1 is a schematic structural diagram of a wet etching acid storage device provided in embodiment 1;
fig. 2 is a schematic structural diagram of a wet etching acid storage device according to embodiment 2.
Wherein: 1, a liquid storage device; 11, a liquid outlet; 12, a liquid inlet; 13, an overflow port; 14, a liquid outlet; 2, a gas conveying device; 3, an acid gas storage device; 4, a reaction tank.
Detailed Description
It is to be understood that in the description of the present utility model, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus are not to be construed as limiting the present utility model.
It should be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
The utility model provides a wet etching acid storage device, which comprises a liquid storage device, a gas circulation device, a liquid circulation device and an air source supply device, wherein the liquid storage device is connected with the gas circulation device;
the gas circulation device comprises a gas inlet pipeline, a gas conveying device and a gas distribution pipeline which are connected in sequence; the gas conveying device is arranged above the liquid level of the liquid storage device, and the gas distribution pipeline is arranged at the bottom of the liquid storage device;
the liquid circulation device comprises a liquid conveying device; the liquid outlet of the liquid conveying device is connected with the reaction tank, and the liquid inlet of the liquid conveying device is connected with the liquid outlet of the liquid storage device;
the air source supply device is connected with the liquid storage device.
According to the wet etching acid storage device provided by the utility model, the acid concentration is supplemented for the acid liquid in the liquid storage device through the gas by arranging the gas source supply device. The gaseous source is directly added into the acid liquid in the liquid storage device, so that the defect of introducing moisture during liquid acid addition can be reduced, the overflow amount of the acid liquid in the liquid storage device is reduced, and the use amount of the acid is saved. Moreover, the air source supply device is flexible in air supply mode, more convenient to transport and store and relatively less in leakage hazard.
When the wet etching acid storage device provided by the utility model is used, the acid solution to be replenished is stored in the liquid storage device, and the air source provided by the air source supply device is introduced into the liquid storage device to be contacted with the acid solution to be replenished in the liquid storage device, so that the acid concentration in the acid solution to be replenished is replenished.
Because the liquid absorbs the acid gas at a lower rate, partial gas entering the liquid storage device flows through the gas inlet pipeline, the gas conveying device and the gas distribution pipeline in sequence by the arrangement of the gas circulation device, and the gas is distributed in the acid liquid to be supplemented through the gas distribution pipeline, so that the absorption efficiency of the acid liquid to be supplemented to the gas is improved. The gas circulation device includes, but is not limited to, an air pump.
When the concentration of the acid liquor in the replenishing solution reaches a preset value, the acid liquor flows out from a liquid outlet of the liquid storage device and is conveyed by the liquid conveying device.
In certain embodiments, the gas supply means comprises at least 2 acid gas storage means, such as 2, 3, 4, 5, 6, or 8, but not limited to the recited values, other non-recited values within the range of values are equally applicable; the at least 2 acid gas storage devices are connected with a top gas inlet of the liquid storage device.
The conventional etching acid in the field is mixed acid including HNO 3 HF or H 2 SO 4 Typically, but not by way of limitation, a combination of at least two of (a) and (b) includes HNO 3 Combination with HF, HF and H 2 SO 4 Is a combination of HNO 3 And H is 2 SO 4 Or HNO (combination of (C) 3 HF and H 2 SO 4 Is a combination of (a) and (b). In order to realize the supplementation of the concentration of each acid in the mixed acid, the gas source supply device comprises at least 2 acid gas storage devices; the at least 2 acid gas storage devices provide different gases depending on the acid species in the mixed acid.
In certain embodiments, the air supply line of the air supply device extends below the liquid level of the liquid storage device.
The air supply pipeline of the air supply device extends below the liquid level of the liquid storage device, so that the liquid in the liquid storage device is beneficial to absorbing acid gas. The gas which cannot be absorbed in time is re-distributed through the gas circulation device, so that the gas absorption efficiency is further improved.
In certain embodiments, the acid gas storage device comprises a gas storage tank.
According to the utility model, the gas storage tank is used as the acid gas storage device, and the acid gas can be supplemented without arranging a gas conveying device because the gas in the gas storage tank is high-pressure gas. The person skilled in the art only needs to arrange necessary valves on the connecting pipelines for connecting the acid gas storage device with the top air inlet of the liquid storage device.
In certain embodiments, the top of the reservoir is provided with a liquid inlet; the liquid outlet of the reaction tank is connected with the liquid inlet.
According to the utility model, the liquid outlet of the reaction tank is connected with the liquid inlet, so that the liquid circularly flows, the contact area of the acid liquid and the gas is increased, and the acid liquid concentration supplementing efficiency is further improved.
In certain embodiments, the reservoir is further provided with an overflow port; the overflow port is arranged between the air inlet pipeline and the liquid level of the liquid storage device.
In certain embodiments, the gas source supply means further comprises oxidizing gas supply means; the oxidizing gas supply device is connected with a gas inlet of the gas mixing device.
The utility model ensures that the gas provided by the acid gas storage device is NO through the arrangement of the oxidizing gas supply device 2 And/or SO 2 When in use, it is convenient for NO 2 And/or SO 2 Conversion to HNO upon contact with a solvent 3 And/or H 2 SO 4 。
In certain embodiments, the reservoir further comprises a top vent.
In certain embodiments, the top vent is provided with a back pressure device.
In certain embodiments, the wet etch acid storage device further comprises a gas absorbing device; the gas absorbing device is connected with the back pressure device.
When the top gas of the liquid storage device is more, the working efficiency of the gas conveying device is reduced, and the gas cannot be effectively conveyed to the bottom of the acid liquor. According to the utility model, the top exhaust port is arranged on the liquid storage device, the back pressure device is arranged on the top exhaust port, and when the top gas pressure of the liquid storage device reaches a set value, redundant gas is discharged and enters the subsequent gas absorption device, so that the pollution of acid gas to the environment is avoided.
The gas absorption device comprises an absorption liquid storage tank, wherein the absorption liquid comprises alkaline absorption liquid.
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
Example 1
The embodiment provides a wet etching acid storage device shown in fig. 1, which comprises a liquid storage device 1, a gas circulation device, a liquid circulation device and an air source supply device;
the gas circulation device comprises a gas inlet pipeline, a gas conveying device 2 and a gas distribution pipeline which are connected in sequence; the air inlet pipeline and the gas conveying device 2 are arranged above the liquid level of the liquid storage device 1, and the gas distribution pipeline is arranged at the bottom of the liquid storage device 1;
the liquid circulation device comprises a liquid conveying device; the liquid outlet of the liquid conveying device is connected with the reaction tank 4, and the liquid inlet of the liquid conveying device is connected with the liquid outlet 11 of the liquid storage device 1;
the air source supply device is connected with the liquid storage device 1.
The gas source supply device comprises 2 acid gas storage devices 3, and the 2 acid gas storage devices 3 are connected with a top gas inlet of the liquid storage device 1; the 2 acid gas storage devices 3 are respectively an HF gas storage tank and NO 2 And a gas storage tank.
The top of the liquid storage device 1 is provided with a liquid inlet 12; the liquid outlet of the reaction tank 4 is connected with a liquid inlet 12.
The liquid storage device 1 is also provided with an overflow port 13; the overflow port 13 is arranged between the air inlet pipeline and the liquid level of the liquid storage device 1.
When the wet etching acid storage device provided by the embodiment is applied, the acid solution to be replenished is stored in the liquid storage device 1, and the air source provided by the air source supply device is introduced into the liquid storage device 1 to be contacted with the acid solution to be replenished in the liquid storage device 1, so that the acid concentration in the acid solution to be replenished is replenished.
Because the liquid absorbs the acid gas at a lower rate, partial gas entering the liquid storage device 1 flows through the gas inlet pipeline, the gas conveying device 2 and the gas distribution pipeline in sequence by the arrangement of the gas circulation device, and the gas is distributed in the acid liquid to be supplemented through the gas distribution pipeline, so that the absorption efficiency of the acid liquid to be supplemented to the gas is improved. When the concentration of the acid liquid in the replenishing solution reaches a preset value, the acid liquid flows out from the liquid outlet 11 of the liquid storage device 1 and is conveyed by the liquid conveying device.
When the acid liquor in the liquid storage device 1 is used up and needs to be discharged, a liquid discharge port 14 at the bottom of the liquid storage device 1 is opened to discharge liquid.
Example 2
In comparison with embodiment 1, the air supply pipeline of the air supply device of this embodiment extends to below the liquid level of the liquid storage device 1
The air supply pipeline of the air supply device extends below the liquid level of the liquid storage device, so that the liquid in the liquid storage device is beneficial to absorbing acid gas; the gas which cannot be absorbed in time is re-distributed through the gas circulation device, so that the gas absorption efficiency is further improved.
Example 3
The embodiment provides a wet etching acid storage device, and compared with embodiment 2, the embodiment provides a gas source supply device further comprising an oxidizing gas supply device; the oxidizing gas supply device is connected with a gas inlet of the gas mixing device.
The utility model ensures that the gas provided by the acid gas storage device is smoothly converted into the required acid liquid after contacting with the solvent through the arrangement of the oxidizing gas supply device.
Example 4
Compared with the embodiment 2, the liquid storage device further comprises an exhaust port, wherein the exhaust port is provided with a back pressure device which is a back pressure valve;
the wet etching acid storage device provided by the embodiment further comprises a gas absorption device; the gas absorbing device is connected with the back pressure device.
In the embodiment, the exhaust port is arranged on the liquid storage device, the back pressure device is arranged on the exhaust port, and when the top gas pressure of the liquid storage device reaches a set value, redundant gas is discharged and enters the subsequent gas absorption device, so that the pollution of acid gas to the environment is avoided.
In summary, the wet etching acid storage device provided by the utility model is provided with the air source supply device, and the acid concentration is supplemented for the acid liquid in the liquid storage device through the air. The gaseous source is directly added into the acid liquid in the liquid storage device, so that the defect of introducing moisture during liquid acid addition can be reduced, the overflow amount of the acid liquid in the liquid storage device is reduced, and the use amount of the acid is saved. Moreover, the air source supply device is flexible in air supply mode, more convenient to transport and store and relatively less in leakage hazard.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that fall within the technical scope of the present utility model disclosed herein are within the scope of the present utility model.
Claims (10)
1. The wet etching acid storage device is characterized by comprising a liquid storage device, a gas circulation device, a liquid circulation device and an air source supply device;
the gas circulation device comprises a gas inlet pipeline, a gas conveying device and a gas distribution pipeline which are connected in sequence; the air inlet pipeline and the gas conveying device are arranged above the liquid level of the liquid storage device, and the gas distribution pipeline is arranged at the bottom of the liquid storage device;
the liquid circulation device comprises a liquid conveying device; the liquid outlet of the liquid conveying device is connected with the reaction tank, and the liquid inlet of the liquid conveying device is connected with the liquid outlet of the liquid storage device;
the air source supply device is connected with the liquid storage device.
2. The wet etching acid storage device of claim 1, wherein the gas source supply means comprises at least 2 acid gas storage devices;
the at least 2 acid gas storage devices are connected with a top gas inlet of the liquid storage device.
3. A wet etching acid storage apparatus according to claim 2, wherein the air supply line of the air supply means extends below the liquid level of the liquid storage means.
4. A wet etching acid storage device according to claim 2 or 3, wherein the acid gas storage device comprises a gas storage tank.
5. The wet etching acid storage device according to claim 1, wherein a liquid inlet is formed in the top of the liquid storage device;
the liquid outlet of the reaction tank is connected with the liquid inlet.
6. The wet etching acid storage device according to claim 1, wherein the liquid storage device is further provided with an overflow port;
the overflow port is arranged between the air inlet pipeline and the liquid level of the liquid storage device.
7. A wet etching acid storage apparatus according to claim 3, wherein said gas source supply means further comprises oxidizing gas supply means;
the oxidizing gas supply device is connected with a gas inlet of the gas mixing device.
8. The wet etching acid storage device of claim 1, wherein the liquid storage device further comprises a top vent.
9. The wet etching acid storage device of claim 8, wherein the top vent is provided with a back pressure device.
10. The wet etching acid storage device of claim 9, further comprising a gas absorbing device;
the gas absorbing device is connected with the back pressure device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222957189.6U CN219203101U (en) | 2022-11-07 | 2022-11-07 | Wet etching acid storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222957189.6U CN219203101U (en) | 2022-11-07 | 2022-11-07 | Wet etching acid storage device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219203101U true CN219203101U (en) | 2023-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222957189.6U Active CN219203101U (en) | 2022-11-07 | 2022-11-07 | Wet etching acid storage device |
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|---|---|
| CN (1) | CN219203101U (en) |
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2022
- 2022-11-07 CN CN202222957189.6U patent/CN219203101U/en active Active
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