CN219189614U - Grinding equipment for processing semiconductor chip - Google Patents
Grinding equipment for processing semiconductor chip Download PDFInfo
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- CN219189614U CN219189614U CN202222496305.9U CN202222496305U CN219189614U CN 219189614 U CN219189614 U CN 219189614U CN 202222496305 U CN202222496305 U CN 202222496305U CN 219189614 U CN219189614 U CN 219189614U
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- disc
- semiconductor chip
- cup jointed
- gear
- fixing base
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Abstract
The utility model relates to the technical field of semiconductor processing, and discloses grinding equipment for processing a semiconductor chip, which comprises a fixed seat, wherein a first disc is movably sleeved at the top of an inner cavity of the fixed seat, a first gear is fixedly connected with an output shaft of a driving motor at the bottom of the inner cavity of the fixed seat, a second rotating block is movably sleeved in the first disc, and a second gear is fixedly connected with the top of the second rotating block. According to the utility model, the fixing rod, the vertical frame, the second disc and the round rod are arranged, and the vertical frame can move up and down along the outer surface of the fixing rod through the cooperation between the fixing rod and the vertical frame, so that the second disc can be extruded through the cooperation between the vertical frame and the second disc, the round rod can be driven to move upwards through the second disc, and further, the semiconductor chip in the discharge groove can be pushed to be separated from the discharge groove, and the semiconductor chip can be conveniently detached.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to grinding equipment for processing a semiconductor chip.
Background
At present, when working on a semiconductor chip, a worker often needs to use a grinding device, and in the process of practical use, although the grinding device in the prior art can realize the basic function of grinding the semiconductor chip, before grinding the semiconductor chip, the semiconductor chip needs to be inlaid in the grinding device, and because the semiconductor chip is tightly attached to the grinding device, the worker is more laborious to take out the semiconductor chip, and inconvenience is brought to the worker, so that improvement is needed.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides grinding equipment for processing a semiconductor chip, which has the advantages of being convenient for taking materials and grinding.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a grinding equipment that semiconductor chip processing used, includes the fixing base, the top activity of fixing base inner chamber has cup jointed first disc, the bottom fixed mounting of fixing base inner chamber has driving motor's the first gear of output shaft fixedly connected with, the inside activity of first disc has cup jointed the second and has revolved the piece, the top fixedly connected with second gear of second revolves the piece, a plurality of blowing groove has been seted up on the surface of second gear, the middle part activity of fixing base has cup jointed the second disc, the inboard activity of second disc has cup jointed first revolved the piece, the top fixedly connected with round bar of first revolve the piece, the surface activity of round bar has cup jointed first spring, the outside fixedly connected with dead lever of fixing base, the surface activity of dead lever has cup jointed the vertical frame.
As a preferable technical scheme of the utility model, a fixed block is fixedly arranged on the back of the fixed seat, a movable frame is movably sleeved on the inner side of the fixed block, a grinding disc is fixedly connected to the top end of the movable frame, a mounting plate is fixedly connected to the top of the fixed block, a pull rod is movably sleeved in the mounting plate, a fixed ring is fixedly sleeved on the outer surface of the pull rod, and a second spring is movably sleeved on the outer surface of the pull rod.
As a preferable technical scheme of the utility model, the first gear is meshed with the second gear, and the round rod penetrates through the second rotary block and is positioned at the inner side of the discharge groove.
As a preferable technical scheme of the utility model, the top of the fixing seat is tooth-shaped, the number of the second gears is four, and the second gears are in meshed connection with the fixing seat.
As a preferable technical scheme of the utility model, the first spring is elastically supported between the second rotating block and the first rotating block, and the vertical frame is in extrusion contact with the second disc.
As a preferable technical scheme of the utility model, the second spring is elastically supported between the fixed ring and the mounting plate, and the pull rod penetrates through the movable frame and is movably sleeved with the movable frame.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the fixing rod, the vertical frame, the second disc and the round rod are arranged, and the vertical frame can move up and down along the outer surface of the fixing rod through the cooperation between the fixing rod and the vertical frame, so that the second disc can be extruded through the cooperation between the vertical frame and the second disc, the round rod can be driven to move upwards through the second disc, and further, the semiconductor chip in the discharge groove can be pushed to be separated from the discharge groove, and the semiconductor chip can be conveniently detached.
2. According to the utility model, the fixed block, the movable frame, the second spring and the grinding disc are arranged, and the movable frame can rotate along the inside of the fixed block through the cooperation between the fixed block and the movable frame, so that the grinding disc can be driven to move to the top of the fixed seat to be in contact with the semiconductor chip, and at the moment, the second spring is in a compressed state, so that an elastic force is applied to the fixed ring, the movable frame can be limited by driving the pull rod through the cooperation of the pull rod and the movable frame, the grinding disc can be fixed, and the semiconductor chip can be ground conveniently.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the back surface of the present utility model;
FIG. 3 is a schematic cross-sectional view of the front face of the present utility model;
FIG. 4 is a schematic cross-sectional view of the top portion of the present utility model;
fig. 5 is a schematic view of the disassembled structure of the inside of the present utility model.
In the figure: 1. a fixing seat; 2. a first disc; 3. a driving motor; 4. a first gear; 5. a second gear; 6. a discharge groove; 7. a second disc; 8. a first spin block; 9. a round bar; 10. a first spring; 11. a second rotating block; 12. a fixed rod; 13. a vertical frame; 14. a fixed block; 15. a movable frame; 16. a mounting plate; 17. a pull rod; 18. a fixing ring; 19. a second spring; 20. grinding disc.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 5, the utility model provides grinding equipment for processing a semiconductor chip, which comprises a fixed seat 1, wherein a first disc 2 is movably sleeved at the top of an inner cavity of the fixed seat 1, an output shaft of a driving motor 3 is fixedly connected with a first gear 4 at the bottom of the inner cavity of the fixed seat 1, a second rotary block 11 is movably sleeved in the first disc 2, a second gear 5 is fixedly connected with the top of the second rotary block 11, a plurality of discharging grooves 6 are formed in the surface of the second gear 5, a second disc 7 is movably sleeved in the middle of the fixed seat 1, a first rotary block 8 is movably sleeved in the inner side of the second disc 7, a round rod 9 is fixedly connected with the top of the first rotary block 8, a first spring 10 is movably sleeved on the outer surface of the round rod 9, a fixed rod 12 is fixedly connected with the outer side of the fixed seat 1, and a vertical frame 13 is movably sleeved on the outer surface of the fixed rod 12.
Through the cooperation between dead lever 12 and the vertical frame 13 for vertical frame 13 can reciprocate along the surface of dead lever 12, thereby can extrude second disc 7 through the cooperation between vertical frame 13 and the second disc 7, make will drive round bar 9 through second disc 7 and upwards remove, and then can promote the semiconductor chip and the separation of blowing groove 6 inside of blowing groove 6, be convenient for dismantle the semiconductor chip, simultaneously because first spring 10 is compressed state, consequently can exert an elasticity to first rotary block 8, make can drive first spring 10 through second disc 7 and reset.
Wherein, fixed block 14 is fixed on the back of fixing base 1, and movable frame 15 has been cup jointed to the inboard activity of fixed block 14, and movable frame 15's top fixedly connected with mill 20, fixed block 14's top fixedly connected with mounting panel 16, the inside activity of mounting panel 16 cup joints pull rod 17, and fixed ring 18 has been cup jointed to the surface fixed of pull rod 17, and second spring 19 has been cup jointed to the surface activity of pull rod 17.
Through the cooperation between fixed block 14 and the movable frame 15 for movable frame 15 can rotate along the inside of fixed block 14, thereby can drive mill 20 and remove to the top of fixing base 1 and semiconductor chip contact, because second spring 19 is compressed state this moment, consequently can exert an elasticity to solid fixed ring 18, thereby can drive pull rod 17 and carry out spacingly to movable frame 15 through the cooperation of pull rod 17 and movable frame 15, and then can fix mill 20, be convenient for grind semiconductor chip.
Wherein, first gear 4 and second gear 5 meshing are connected, and round bar 9 passes second rotary piece 11 and is located the inboard of blowing groove 6.
Through the cooperation between first spring 10 and fixing base 1 for first spring 10 can follow the inboard of fixing base 1 and reciprocate, thereby can drive round bar 9 through second disc 7 and remove and reciprocate, is convenient for with the semiconductor chip ejecting.
The top of the fixing seat 1 is tooth-shaped, the number of the second gears 5 is four, and the second gears 5 are meshed with the fixing seat 1.
Through the cooperation between the first gear 4 and the second gear 5 and the cooperation between the second gear 5 and the fixing base 1, the first gear 4 will drive the four second gears 5 to rotate when rotating.
Wherein the first spring 10 is elastically supported between the second rotary block 11 and the first rotary block 8, and the vertical frame 13 is in pressing contact with the second disk 7.
Through the design of the first spring 10, the first rotary block 8 has good elastic resetting performance, and at the moment, the first spring 10 is in a compressed state, so that an elastic force can be applied to the first rotary block 8, and the second disc 7 can be driven to reset.
The second spring 19 is elastically supported between the fixed ring 18 and the mounting plate 16, and the pull rod 17 passes through the movable frame 15 and is movably sleeved with the movable frame 15.
By the design of the second spring 19, the fixed ring 18 has good elastic resetting performance, and the second spring 19 is in a compressed state at this time, so that an elastic force is applied to the fixed ring 18, and the pull rod 17 and the movable frame 15 can be matched more tightly.
The working principle and the using flow of the utility model are as follows:
firstly, through the cooperation between the fixed rod 12 and the vertical frame 13, the vertical frame 13 can move up and down along the outer surface of the fixed rod 12, so that the second disc 7 can be extruded through the cooperation between the vertical frame 13 and the second disc 7, the round rod 9 can be driven to move upwards through the second disc 7, and further, a semiconductor chip in the discharge groove 6 can be pushed to be separated from the discharge groove 6, and the semiconductor chip can be conveniently detached;
afterwards, through the cooperation between fixed block 14 and movable frame 15 for movable frame 15 can rotate along the inside of fixed block 14, thereby can drive mill 20 and remove to the top of fixing base 1 and semiconductor chip contact, because second spring 19 is compressed state at this moment, consequently can exert an elasticity to solid fixed ring 18, thereby can drive pull rod 17 and carry out spacing to movable frame 15 through the cooperation of pull rod 17 and movable frame 15, and then can fix mill 20, be convenient for grind the semiconductor chip.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Grinding equipment that semiconductor chip processing used, including fixing base (1), its characterized in that: the top activity of fixing base (1) inner chamber has cup jointed first disc (2), the output shaft fixedly connected with first gear (4) of driving motor (3) are installed to the bottom fixed mounting of fixing base (1) inner chamber, the inside activity of first disc (2) has cup jointed second soon piece (11), the top fixedly connected with second gear (5) of second soon piece (11), a plurality of blowing groove (6) have been seted up on the surface of second gear (5), second disc (7) have been cup jointed in the middle part activity of fixing base (1), the inboard activity of second disc (7) has cup jointed first soon piece (8), the top fixedly connected with round bar (9) of first soon piece (8), the surface activity of round bar (9) has cup jointed first spring (10), the outside fixedly connected with dead lever (12) of fixing base (1), the surface activity of dead lever (12) has cup jointed perpendicular frame (13).
2. The polishing apparatus for use in semiconductor chip processing according to claim 1, wherein: the utility model discloses a fixing base, including fixing base (1), fixed block (14) are installed to the back fixed mounting, movable frame (15) have been cup jointed in the inboard activity of fixed block (14), the top fixedly connected with mill (20) of movable frame (15), the top fixedly connected with mounting panel (16) of fixed block (14), pull rod (17) have been cup jointed in the inside activity of mounting panel (16), fixed ring (18) have been cup jointed in the surface fixed of pull rod (17), second spring (19) have been cup jointed in the surface activity of pull rod (17).
3. The polishing apparatus for use in semiconductor chip processing according to claim 1, wherein: the first gear (4) is connected with the second gear (5) in a meshed mode, and the round rod (9) penetrates through the second rotary block (11) and is located at the inner side of the discharge groove (6).
4. The polishing apparatus for use in semiconductor chip processing according to claim 1, wherein: the top of fixing base (1) is tooth form, the quantity of second gear (5) is four, second gear (5) are connected with fixing base (1) meshing.
5. The polishing apparatus for use in semiconductor chip processing according to claim 1, wherein: the first spring (10) is elastically supported between the second rotary block (11) and the first rotary block (8), and the vertical frame (13) is in extrusion contact with the second disc (7).
6. The polishing apparatus for use in semiconductor chip processing according to claim 2, wherein: the second spring (19) is elastically supported between the fixed ring (18) and the mounting plate (16), and the pull rod (17) penetrates through the movable frame (15) and is movably sleeved with the movable frame (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222496305.9U CN219189614U (en) | 2022-09-21 | 2022-09-21 | Grinding equipment for processing semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222496305.9U CN219189614U (en) | 2022-09-21 | 2022-09-21 | Grinding equipment for processing semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219189614U true CN219189614U (en) | 2023-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222496305.9U Active CN219189614U (en) | 2022-09-21 | 2022-09-21 | Grinding equipment for processing semiconductor chip |
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| Country | Link |
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| CN (1) | CN219189614U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118372178A (en) * | 2024-05-27 | 2024-07-23 | 浙江精瓷半导体有限责任公司 | Grinding disc cooling mechanism of chip grinder and cooling method thereof |
-
2022
- 2022-09-21 CN CN202222496305.9U patent/CN219189614U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118372178A (en) * | 2024-05-27 | 2024-07-23 | 浙江精瓷半导体有限责任公司 | Grinding disc cooling mechanism of chip grinder and cooling method thereof |
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