CN219181410U

CN219181410U - Power supply circuit and electronic equipment

Info

Publication number: CN219181410U
Application number: CN202222985985.0U
Authority: CN
Inventors: 张立新
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-11-08
Filing date: 2022-11-08
Publication date: 2023-06-13
Anticipated expiration: 2032-11-08

Abstract

The embodiment of the application provides a power supply circuit and electronic equipment, which are applied to the technical field of electronics. The power supply circuit comprises a power management module and a frame inserting chip; the first voltage output end of the power management module is connected with the first voltage input end of the frame inserting chip and is used for providing a first power supply voltage for the frame inserting chip; the second voltage output end of the power management module is directly connected with the second voltage input end of the frame inserting chip or is connected with the second voltage input end of the frame inserting chip through the voltage conversion module and is used for providing a second power supply voltage for the frame inserting chip; the first supply voltage is not equal to the second supply voltage. Therefore, the embodiment of the application can adopt the original power management module or the original power management module and the voltage conversion module to provide the second power supply voltage for the frame inserting chip, so that the power consumption of the frame inserting chip is reduced; and the area occupied by the capacitor and the inductor arranged at the periphery of the frame inserting chip is reduced, and the cost of the electronic equipment is also reduced.

Description

Power supply circuit and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a power supply circuit and electronic equipment.

Background

With the continuous development of electronic devices such as mobile phones and tablet computers, the requirements of users on the quality of pictures displayed by the electronic devices are higher and higher. At present, some electronic devices may be provided with a frame inserting chip, and the frame inserting chip is used to perform frame inserting processing on an original video image to be displayed, so as to obtain a video image with a high frame rate, so as to improve the smoothness of the video image during display.

At present, a power management module can be used for providing a first power supply voltage for the frame inserting chip, the frame inserting chip can reduce the first power supply voltage to a second power supply voltage through components arranged on the periphery of the frame inserting chip, the second power supply voltage is output, and the output second power supply voltage can be input to the frame inserting chip again, so that the frame inserting chip can normally perform frame inserting processing.

However, in this manner of providing the second power supply voltage for the frame inserting chip, the frame inserting chip needs to step down the first power supply voltage provided for the frame inserting chip to the second power supply voltage, which leads to an increase in power consumption of the frame inserting chip; in addition, components are required to be arranged on the periphery of the frame inserting chip, the components on the periphery of the frame inserting chip occupy the area of the circuit board additionally, and the cost of the electronic equipment is increased.

Disclosure of Invention

The embodiment of the application provides a power supply circuit and electronic equipment, through the power management module originally set in the electronic equipment, or power management module and voltage conversion module, directly provide second power supply voltage to the frame inserting chip to reduce the consumption of frame inserting chip, and reduced the area occupied by the components and parts that the frame inserting chip periphery set up, also reduced electronic equipment's cost.

In a first aspect, an embodiment of the present application provides a power supply circuit, including a power management module and a frame insertion chip; the first voltage output end of the power management module is connected with the first voltage input end of the frame inserting chip and is used for providing a first power supply voltage for the frame inserting chip; the second voltage output end of the power management module is directly connected with the second voltage input end of the frame inserting chip or is connected with the second voltage input end of the frame inserting chip through the voltage conversion module and is used for providing a second power supply voltage for the frame inserting chip; the first power supply voltage is used for supplying power to components in the frame inserting chip, the second power supply voltage is working voltage when the frame inserting chip performs frame inserting processing, and the first power supply voltage is unequal to the second power supply voltage.

Therefore, the power management module originally arranged on the circuit board can be used for directly providing the second power supply voltage for the frame inserting chip, or the power management module originally arranged on the circuit board and the voltage conversion module originally arranged on the circuit board can be used for providing the second power supply voltage for the frame inserting chip, so that the voltage reduction processing is not needed through components in the frame inserting chip, capacitors, inductors and other devices on the periphery of the frame inserting chip, and the power consumption of the frame inserting chip is reduced; in addition, the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip can be removed, the occupied area of the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip is reduced, and the cost of the electronic equipment is also reduced.

In one possible implementation, the second supply voltage is less than the first supply voltage. The first supply voltage may be 1.8V, and the second supply voltage may be 0.9V.

In one possible implementation, the power supply circuit further includes a voltage conversion module; the second voltage output end of the power management module is connected with the voltage input end of the voltage conversion module and is used for providing a third power supply voltage for the voltage conversion module; the voltage output end of the voltage conversion module is connected with the second voltage input end of the frame inserting chip and is used for converting the third power supply voltage into the second power supply voltage so as to provide the second power supply voltage for the frame inserting chip; the third supply voltage is not equal to the second supply voltage. Therefore, the power management module originally arranged on the circuit board and the voltage conversion module originally arranged on the circuit board can be used for providing the second power supply voltage for the frame inserting chip, so that the power consumption of the frame inserting chip is reduced, the occupied area of devices such as a capacitor and an inductor arranged on the periphery of the frame inserting chip is also reduced, and the cost of the electronic equipment is reduced.

In one possible implementation, the voltage conversion module comprises one or more voltage conversion units cascaded in sequence. In this way, the embodiment of the application may form the voltage conversion module by one voltage conversion unit or a plurality of voltage conversion units cascaded in sequence according to the difference between the third power supply voltage and the second power supply voltage. When the difference between the third power supply voltage and the second power supply voltage is smaller, the voltage conversion module can comprise a voltage conversion unit, so that the circuit structure of the voltage conversion module is simpler; when the difference between the third power supply voltage and the second power supply voltage is larger, the voltage conversion module can comprise a plurality of cascaded voltage conversion units, so that the problem that components in the voltage reduction unit are damaged easily due to the larger range of single voltage reduction is solved.

In one possible implementation, the third supply voltage is greater than the second supply voltage, and the voltage conversion unit is a first step-down unit. The first voltage reduction unit comprises a first switch tube, a first diode, a first inductor and a first energy storage capacitor; the first end of the first switch tube is connected with the second voltage output end of the power management module, and the second end of the first switch tube is connected with the first end of the first inductor; the second end of the first inductor is connected with the second voltage input end of the frame inserting chip; the anode of the first diode is connected with the grounding end, and the cathode of the first diode is connected with the second end of the first switch tube; the first end of the first energy storage capacitor is connected with the second end of the first inductor, and the second end of the first energy storage capacitor is connected with the grounding end. Thus, when the third power supply voltage is greater than the second power supply voltage and the difference between the third power supply voltage and the second power supply voltage is greater, the buck circuit can be used as the voltage conversion unit, so that the conversion efficiency is improved and the heating value is reduced.

In one possible implementation, the third supply voltage is greater than the second supply voltage, and the voltage conversion unit is a second step-down unit. The second voltage reducing unit comprises a voltage adjusting tube, an error amplifier, a first resistor, a second resistor and a reference power supply; the control end of the voltage adjusting tube is connected with the output end of the error amplifier, the first end of the voltage adjusting tube is connected with the second voltage output end of the power management module, and the second end of the voltage adjusting tube is connected with the second voltage input end of the frame inserting chip; the first end of the first resistor is connected with the second end of the voltage regulating tube, and the second end of the first resistor is connected with the non-inverting input end of the error amplifier; the first end of the second resistor is connected with the second end of the first resistor, and the second end of the second resistor is connected with the grounding end; the reference power supply is connected with the inverting input terminal of the error amplifier. In this way, when the third supply voltage is greater than the second supply voltage and the difference between the third supply voltage and the second supply voltage is smaller, a low dropout linear regulator (low dropout regulator, LDO) circuit may be used as the voltage conversion unit to reduce output ripple and improve stability of the output second supply voltage.

In one possible implementation, the third supply voltage is smaller than the second supply voltage, and the voltage conversion unit is a boost unit. The boosting unit comprises a second switching tube, a second diode, a second inductor and a second energy storage capacitor; the first end of the second inductor is connected with the second voltage output end of the power management module, and the second end of the second inductor is connected with the anode of the second diode; the cathode of the second diode is connected with the second voltage input end of the frame inserting chip; the first end of the second switching tube is connected with the second end of the second inductor, and the second end of the second switching tube is connected with the grounding end; the first end of the second energy storage capacitor is connected with the cathode of the second diode, and the second end of the second energy storage capacitor is connected with the grounding end. Thus, when the third supply voltage is smaller than the second supply voltage, the boost circuit can be used as the voltage conversion unit to output and obtain the second supply voltage.

In one possible implementation manner, the power supply circuit further comprises a first filtering module, a first end of the first filtering module is connected with a first voltage input end of the frame inserting chip, and a second end of the first filtering module is connected with a grounding end; the first filtering module is used for filtering the first power supply voltage provided for the frame inserting chip. Therefore, the first power supply voltage provided for the frame inserting chip is subjected to filtering processing through the first filtering module, so that the stability of the first power supply voltage input to the frame inserting chip is improved, the anti-interference capability of the frame inserting chip is improved, and the accuracy of the frame inserting chip in working is improved.

In one possible implementation, the first filtering module includes a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor connected in parallel; the first end of the first capacitor, the first end of the second capacitor, the first end of the third capacitor and the first end of the fourth capacitor are all connected with the first voltage input end of the frame inserting chip; the second end of the first capacitor, the second end of the second capacitor, the second end of the third capacitor and the second end of the fourth capacitor are all connected with the grounding end.

In one possible implementation manner, the power supply circuit further includes a second filtering module, a first end of the second filtering module is connected with the second voltage input end of the frame inserting chip, and a second end of the second filtering module is connected with the ground end; and the second filtering module is used for filtering the second power supply voltage provided for the frame inserting chip. Therefore, the second power supply voltage provided for the frame inserting chip is subjected to filtering processing through the second filtering module, so that the stability of the second power supply voltage input to the frame inserting chip is improved, the anti-interference capability of the frame inserting chip is improved, and the accuracy of the frame inserting chip in working is improved.

In one possible implementation manner, the second filtering module includes a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, and an eleventh capacitor connected in parallel; the first end of the fifth capacitor, the first end of the sixth capacitor, the first end of the seventh capacitor, the first end of the eighth capacitor, the first end of the ninth capacitor, the first end of the tenth capacitor and the first end of the eleventh capacitor are all connected with the second voltage input end of the frame inserting chip; the second end of the fifth capacitor, the second end of the sixth capacitor, the second end of the seventh capacitor, the second end of the eighth capacitor, the second end of the ninth capacitor, the second end of the tenth capacitor and the second end of the eleventh capacitor are all connected with the grounding end.

In a second aspect, an embodiment of the present application proposes an electronic device, including a processor and the above power supply circuit; the processor is connected with a frame inserting chip in the power supply circuit.

The effects of each possible implementation manner of the second aspect are similar to those of the first aspect and the possible designs of the first aspect, and are not described herein.

Drawings

Fig. 1 is a schematic structural diagram of a power supply circuit provided in the related art;

fig. 2 is a schematic diagram of a hardware system structure of an electronic device according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a power supply circuit according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of another power supply circuit according to an embodiment of the present disclosure;

fig. 5 is a circuit diagram of a voltage step-down unit according to an embodiment of the present application;

fig. 6 is a circuit diagram of another voltage step-down unit according to an embodiment of the present application;

fig. 7 is a circuit diagram of a boost unit provided in an embodiment of the present application;

fig. 8 is a circuit diagram of a buck-boost circuit according to an embodiment of the present application.

Detailed Description

In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same item or similar items having substantially the same function and effect. For example, the first chip and the second chip are merely for distinguishing different chips, and the order of the different chips is not limited. It will be appreciated by those of skill in the art that the words "first," "second," and the like do not limit the amount and order of execution, and that the words "first," "second," and the like do not necessarily differ.

It should be noted that, in the embodiments of the present application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a alone, a and B together, and B alone, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b, or c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural.

With the continuous development of electronic devices such as mobile phones and tablet computers, the requirements of users on the quality of pictures displayed by the electronic devices are higher and higher. In order to improve smoothness of the electronic device in a video playing scene or a game scene, some electronic devices may be provided with a frame inserting chip.

The frame inserting chip can also be called an independent display chip (simply called a single display chip), and is a frame inserting special chip integrated with motion estimation and motion compensation (motion estimate and motion compensation, MEMC). The method can calculate the transition image between two adjacent frame images in the original video image, and insert the transition image between the two adjacent frame images to improve the frame rate of the video image, thereby improving the fluency of the video image and improving the watching experience of users.

For example, the sampling frame rate of the original video image is 30 transmission frame rate per second (frames per second, fps), and after the frame inserting chip frame inserting process, the frame rate of the video image can be raised to 60fps or 90 fps.

In order to enable the frame inserting chip provided in the electronic device to be used normally, therefore, power needs to be supplied to the frame inserting chip. In the related art, as shown in fig. 1, a power supply circuit for supplying power to a frame inserting chip may include a power management module, a frame inserting chip, and a peripheral circuit.

The power management module may also be referred to as a Power Management Integrated Circuit (PMIC), which may include buck-boost (buck-boost) circuits and a voltage regulator circuit, which may be an LDO circuit.

In some embodiments, the voltage input of the power management module may be connected to a battery in the electronic device, which may provide an input voltage to the power management module. The voltage input end of the power management module can be also connected with the charging management module, and the charging management module can receive the charging input of the wired charger through a universal serial bus (universal serial bus, USB) interface and provide input voltage for the voltage input end of the power management module; alternatively, the charge management module may receive a wireless charge input through a wireless charge coil of the electronic device and provide an input voltage to a voltage input of the power management module.

After the buck-boost circuit in the power management module performs voltage conversion on the input voltage, the input voltage is processed by the voltage stabilizing circuit, so as to obtain a first power supply voltage (VREG_1P8 shown in FIG. 1). For example, the first supply voltage may be 1.8V.

As shown in fig. 1, the frame inserting chip has a plurality of pins, which are respectively: vdd_rx_1 pin, vdd_rx_2 pin, vdd_18_rx pin, vdd_tx pin, VDD18_tx pin, avdd_pll pin, dvdd18_1 pin, dvdd18_2 pin, VIN18_1 pin, VIN18_2 pin, VEN pin, LX0 pin, LX1 pin, VFB pin, vdd_1 pin, vdd_2 pin, vdd_3 pin, vdd_4 pin, vdd_5 pin, vss_rx_1 pin, vss_rx_2 pin, vss_tx pin, avss_pll pin, VFUSE pin, vss_1 pin, vss_2 pin, vss_3 pin, vss_4 pin, and vss_5 pin.

The peripheral circuit includes a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, an inductor L10 and a ground copper sheet SG.

The VDD18_rx pin, VDD18_tx pin, dvdd18_1 pin, dvdd18_2 pin, VIN18_1 pin and VIN18_2 pin are used for connecting with a power management module, and can receive a first power supply voltage input by the power management module to supply power to components in the plug-in frame chip.

The LX0 pin and the LX1 pin are connected to the second terminal of the inductor L10, the first terminal of the inductor L10 is connected to the first terminal of the thirteenth capacitor C13, and the second terminal of the thirteenth capacitor C13 is connected to the ground GND. The components inside the frame inserting chip, the inductor L10 and the thirteenth capacitor C13 together form a voltage reducing circuit, which can convert the first power supply voltage received by the frame inserting chip into a second power supply voltage, and output the second power supply voltage (vdd_0p9 shown in fig. 1) through the first end of the inductor L10. For example, the second supply voltage may be 0.9V.

In addition, as shown in fig. 1, the first end of the inductor L10 is further connected to the vdd_rx_1 pin, the vdd_rx_2 pin, the vdd_tx pin, the avdd_pll pin, the vdd_1 pin, the vdd_2 pin, the vdd_3 pin, the vdd_4 pin and the vdd_5 pin, respectively, so that the second power supply voltage output from the first end of the inductor L10 is input to the frame inserting chip again, so that the frame inserting chip can perform frame inserting processing normally.

In addition, the first end of the inductor L10 is also connected to the VFB pin through a ground copper sheet SG, which is used to input a feedback voltage to the VFB pin. The first end of the first capacitor C1, the first end of the second capacitor C2, the first end of the third capacitor C3 and the first end of the fourth capacitor C4 are all connected with the VDD18_RX pin, the second end of the first capacitor C1, the second end of the second capacitor C2, the second end of the third capacitor C3 and the second end of the fourth capacitor C4 are all connected with the grounding end GND, and the first capacitor C1, the second capacitor C2, the third capacitor C3 and the fourth capacitor C4 are used for filtering the first power supply voltage input by the power management module. The first end of the fifth capacitor C5 and the first end of the sixth capacitor C6 are connected to the vdd_rx_1 pin, the first end of the seventh capacitor C7 is connected to the vdd_tx pin, the first end of the eighth capacitor C8 is connected to the avdd_pll pin, the first end of the ninth capacitor C9, the first end of the tenth capacitor C10 and the first end of the eleventh capacitor C11 are connected to the vdd_1 pin, the second end of the fifth capacitor C5, the second end of the sixth capacitor C6, the second end of the seventh capacitor C7, the second end of the eighth capacitor C8, the second end of the ninth capacitor C9, the second end of the tenth capacitor C10 and the second end of the eleventh capacitor C11 are connected to the ground GND, and the fifth capacitor C5, the sixth capacitor C6, the seventh capacitor C7, the eighth capacitor C8, the ninth capacitor C9, the tenth capacitor C10 and the eleventh capacitor C11 are used for filtering the second power supply voltage input to the frame inserting chip. The VEN pin is connected to a processor (not shown) in the electronic device for receiving an enable signal gpio_dppic_rst_n sent by the processor; the first end of the twelfth capacitor C12 is connected to the VEN pin, and the second end of the twelfth capacitor C12 is connected to the ground GND, which is used for filtering the enable signal sent by the processor. The VSS_RX_1 pin, the VSS_RX_2 pin, the VSS_TX pin, the AVSS_PLL pin, the VFUSE pin, the VSS_1 pin, the VSS_2 pin, the VSS_3 pin, the VSS_4 pin and the VSS_5 pin are all connected with the ground GND.

In summary, by adopting the mode of supplying power to the frame inserting chip shown in fig. 1, the frame inserting chip needs to obtain the first power supply voltage from the power management module, the first power supply voltage needs to supply power to components inside the frame inserting chip, the first power supply voltage also needs to be input to a voltage reducing circuit formed by the components inside the frame inserting chip, the inductor L10 and the thirteenth capacitor C13 together, and the voltage reducing circuit formed can reduce the first power supply voltage to obtain the second power supply voltage, and the second power supply voltage is input to the frame inserting chip again. For example, the first supply voltage may be 1.8V, and the second supply voltage may be 0.9V, so that the voltage reduction circuit formed by the components inside the frame inserting chip, the inductor L10 and the thirteenth capacitor C13 together has a difference between the input voltage and the output voltage of 0.9V, which results in greater power consumption when the frame inserting chip works.

In addition, the voltage reduction circuit formed by the components inside the frame inserting chip, the inductor L10 and the thirteenth capacitor C13 is required to be additionally arranged on the periphery of the frame inserting chip, the inductor L10 and the thirteenth capacitor C13 need to occupy the area of the circuit board additionally, and the cost of an external bill of materials (bill of materials, BOM) of the electronic equipment is increased, so that the cost of the electronic equipment is increased. An external bill of materials refers to all components required to produce one electronic device.

Based on the above, the embodiment of the application provides a power supply circuit and electronic equipment, wherein the power supply circuit comprises a power management module and a frame inserting chip; the first voltage output end of the power management module is connected with the first voltage input end of the frame inserting chip and is used for providing a first power supply voltage for the frame inserting chip; the second voltage output end of the power management module is connected with the second voltage input end of the frame inserting chip directly or through the voltage conversion module and is used for providing a second power supply voltage for the frame inserting chip. The first power supply voltage is used for supplying power to components in the frame inserting chip, the second power supply voltage is working voltage when the frame inserting chip performs frame inserting processing, and the first power supply voltage is unequal to the second power supply voltage. Therefore, the voltage input pin for receiving the second power supply voltage in the frame inserting chip is directly connected with the power supply outside the frame inserting chip by changing the power supply mode of the second power supply voltage required by the frame inserting chip, so that the second power supply voltage is provided for the frame inserting chip through the power supply outside the frame inserting chip, the power supply outside the frame inserting chip can be a power supply management module, or the power supply outside the frame inserting chip can also comprise the power supply management module and a voltage conversion module originally arranged in the electronic equipment. In this way, the originally arranged power management module on the circuit board can be used for directly providing the second power supply voltage for the frame inserting chip, or the originally arranged power management module and the originally arranged voltage conversion module on the circuit board can be used for providing the second power supply voltage for the frame inserting chip, namely the original power supply on the circuit board is used for providing the second power supply voltage for the frame inserting chip, namely the voltage reduction processing is not needed through components in the frame inserting chip, capacitance, inductance and other devices on the periphery of the frame inserting chip, so that the second power supply voltage after the voltage reduction processing is provided for the frame inserting chip, and the power consumption of the frame inserting chip is reduced; in addition, the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip can be removed, the occupied area of the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip is reduced, and the cost of the electronic equipment is also reduced.

It should be noted that, the capacitance set at the periphery of the frame inserting chip removed in the embodiment of the present application is the thirteenth capacitance C13 shown in fig. 1, and the inductance set at the periphery of the frame inserting chip removed in the embodiment of the present application is the inductance L10 shown in fig. 1.

The electronic device provided by the embodiment of the application may be an electronic device with a frame insertion chip, such as a mobile phone, a tablet computer (Pad), a wearable device, a vehicle-mounted device, an augmented reality (augmented reality, AR) device, a Virtual Reality (VR) device, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (personal digital assistant, PDA) and the like. The embodiment of the application does not limit the specific technology and the specific equipment form adopted by the electronic equipment.

In order to better understand the embodiments of the present application, the structure of the electronic device of the embodiments of the present application is described below.

Fig. 2 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application. The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a usb interface 130, a charge management module 140, a power management module 141, a battery 142, a first antenna, a second antenna, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, keys 190, a motor 191, an indicator 192, a camera 193, a display 194, and a subscriber identity module (subscriberidentification module, SIM) card interface 195, etc.

It is to be understood that the structure illustrated in the embodiments of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The processor 110 may include one or more processing units, such as: the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processingunit, GPU), an image signal processor (image signal processor, ISP), a controller, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and/or a neural network processor (neural-network processing unit, NPU), etc. Wherein the different processing units may be separate devices or may be integrated in one or more processors.

The controller can generate operation control signals according to the instruction operation codes and the time sequence signals to finish the control of instruction fetching and instruction execution.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to reuse the instruction or data, it may be called from memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby improving the efficiency of the system.

The charge management module 140 is configured to receive a charge input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charge management module 140 may receive a charging input of a wired charger through the USB interface 130. In some wireless charging embodiments, the charge management module 140 may receive wireless charging input through a wireless charging coil of the electronic device 100. The charging management module 140 may also supply power to the electronic device through the power management module 141 while charging the battery 142.

The power management module 141 is used for connecting the battery 142, and the charge management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140 to power the processor 110, the internal memory 121, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also be configured to monitor battery capacity, battery cycle number, battery health (leakage, impedance) and other parameters. In other embodiments, the power management module 141 may also be provided in the processor 110. In other embodiments, the power management module 141 and the charge management module 140 may be disposed in the same device.

In some embodiments, electronic device 100 may further include a frame-inserting chip 111, and frame-inserting chip 111 and processor 110 may be two separate chips. The first voltage output terminal of the power management module 141 may be directly connected to the first voltage input terminal of the frame inserting chip 111, and may provide the first power supply voltage to the frame inserting chip 111. In addition, the second voltage output terminal of the power management module 141 may be directly connected to the second voltage input terminal of the frame inserting chip 111, which may provide the second power supply voltage to the frame inserting chip 111; alternatively, the second voltage output terminal of the power management module 141 may be connected to the second voltage input terminal of the frame inserting chip 111 through a voltage conversion module, and the second power supply voltage may be provided to the frame inserting chip 111 through the voltage conversion module.

In addition, the frame inserting chip 111 may also be connected to the processor 110, and is configured to receive an enable signal sent by the processor 110, so as to control the frame inserting chip 111 to operate; in addition, the frame inserting chip 111 may be further connected between the processor 110 and a display driving integrated circuit (integrated circuit, IC) of the display screen 194, and is configured to receive the original video image sent by the processor 110, and perform frame inserting processing on the original video image, so as to send the video image after frame inserting processing to the display driving IC.

The wireless communication function of the electronic device 100 may be implemented by a first antenna, a second antenna, a mobile communication module 150, a wireless communication module 160, a modem processor, a baseband processor, and the like.

The electronic device 100 implements display functions through a GPU, a display screen 194, an application processor, and the like. The GPU is a microprocessor for image processing, and is connected to the display 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or change display information.

The display screen 194 is used for displaying images, displaying videos, receiving sliding operations, and the like. The display 194 includes a display panel. The display panel may employ a liquid crystal display (liquid crystal display, LCD), an organic light-emitting diode (OLED), an active-matrixorganic light emitting diod (AMOLED), a flexible light-emitting diode (flex), a mini, a Micro-OLED, a quantum dot light-emitting diode (quantum dot lightemitting diodes, QLED), or the like. In some embodiments, the electronic device 100 may include 1 or more display screens 194.

The electronic device 100 may implement photographing functions through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, and the like.

The external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to enable expansion of the memory capabilities of the electronic device 100. The external memory card communicates with the processor 110 through an external memory interface 120 to implement data storage functions. For example, files such as music, video, etc. are stored in an external memory card.

The internal memory 121 may be used to store computer-executable program code that includes instructions. The internal memory 121 may include a storage program area and a storage data area. The storage program area may store an application program (such as a sound playing function, an image playing function, etc.) required for at least one function of the operating system, etc. The storage data area may store data created during use of the electronic device 100 (e.g., audio data, phonebook, etc.), and so on. In addition, the internal memory 121 may include a high-speed random access memory, and may further include a nonvolatile memory such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (universal flash storage, UFS), and the like. The processor 110 performs various functional applications of the electronic device 100 and data processing by executing instructions stored in the internal memory 121 and/or instructions stored in a memory provided in the processor.

The electronic device 100 may implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, an application processor, and the like. Such as music playing, recording, etc.

The keys 190 include a power-on key, a volume key, etc. The motor 191 may generate a vibration cue. The motor 191 may be used for incoming call vibration alerting as well as for touch vibration feedback. The indicator 192 may be an indicator light, may be used to indicate a state of charge, a change in charge, a message indicating a missed call, a notification, etc. The SIM card interface 195 is used to connect a SIM card. The SIM card may be inserted into the SIM card interface 195, or removed from the SIM card interface 195 to enable contact and separation with the electronic device 100.

The following describes the technical solutions of the present application and how the technical solutions of the present application solve the above technical problems in detail with specific embodiments. The following embodiments may be implemented independently or combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

Fig. 3 is a schematic structural diagram of a power supply circuit according to an embodiment of the present application. Referring to fig. 3, the power supply circuit includes a power management module 141 and a frame insertion chip 111. The first voltage output end of the power management module 141 is connected with the first voltage input end of the frame inserting chip 111, and is used for providing a first power supply voltage for the frame inserting chip 111; the second voltage output end of the power management module 141 is directly connected to the second voltage input end of the frame inserting chip 111, and is used for providing the second power supply voltage to the frame inserting chip 111; the first power supply voltage is used for supplying power to components in the frame inserting chip 111, the second power supply voltage is a working voltage when the frame inserting chip 111 performs frame inserting processing, and the first power supply voltage is not equal to the second power supply voltage.

As shown in fig. 3, the first voltage input terminal of the frame inserting chip 111 may include a plurality of first voltage input pins, where the plurality of first voltage input pins are respectively: the VDD18 RX pin, the VDD18 TX pin, the dvdd18_1 pin, the dvdd18_2 pin, the VIN18_1 pin, the VIN18_2 pin, and the like.

The first voltage output terminal of the power management module 141 is connected to the VDD18_rx pin, the VDD18_tx pin, the dvdd18_1 pin, the dvdd18_2 pin, the VIN18_1 pin and the VIN18_2 pin, respectively. The first voltage output terminal of the power management module 141 may directly output a first power supply voltage (vreg_1p8 shown in fig. 3), which may be input to the frame inserting chip 111 through the VDD18_rx pin, the VDD18_tx pin, the dvdd18_1 pin, the dvdd18_2 pin, the VIN18_1 pin and the VIN18_2 pin. The first power supply voltage is used to power the components in the frame inserting chip 111.

As shown in fig. 3, the second voltage input terminal of the frame inserting chip 111 may include a plurality of second voltage input pins, where the plurality of voltage input pins are respectively: vdd_rx_1 pin, vdd_rx_2 pin, vdd_tx pin, avdd_pll pin, vdd_1 pin, vdd_2 pin, vdd_3 pin, vdd_4 pin, vdd_5 pin, and the like.

The second voltage output terminal of the power management module 141 is connected to the vdd_rx_1 pin, the vdd_rx_2 pin, the vdd_tx pin, the avdd_pll pin, the vdd_1 pin, the vdd_2 pin, the vdd_3 pin, the vdd_4 pin, and the vdd_5 pin, respectively. The second voltage output terminal of the power management module 141 may directly output a second power supply voltage (e.g., vdd_0p9 in fig. 3), which may be input to the frame inserting chip 111 through the vdd_rx_1 pin, vdd_rx_2 pin, vdd_tx pin, avdd_pll pin, vdd_1 pin, vdd_2 pin, vdd_3 pin, vdd_4 pin, and vdd_5 pin. The second power supply voltage is an operating voltage when the frame inserting chip 111 performs the frame inserting process.

That is, in order for the frame inserting chip 111 to operate normally, the power management module 141 needs to supply the first power supply voltage and the second power supply voltage to the frame inserting chip 111, and the first power supply voltage is not equal to the second power supply voltage.

Since the power management module 141 in the electronic device can generally output a plurality of power supply voltages with unequal voltages, the power supply voltages can be matched with the working requirements of different load modules arranged on the circuit board. Therefore, if the power management module 141 originally provided in the electronic device 100 can output the second power supply voltage, the embodiment of the present application may directly connect the second voltage output end of the power management module 141 for outputting the second power supply voltage with the second voltage input end of the frame inserting chip 111 to provide the second power supply voltage for the frame inserting chip 111, so that the voltage reduction process is not required to be performed through components inside the frame inserting chip 111 and devices such as a capacitor and an inductor on the periphery of the frame inserting chip, so as to provide the reduced second power supply voltage for the frame inserting chip 111, thereby reducing the power consumption of the frame inserting chip 111; in addition, the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip 111 can be removed, the occupied area of the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip 111 is reduced, and the cost of the electronic equipment 100 is also reduced.

It should be noted that, in the embodiment of the present application, when the power management module 141 originally set on the circuit board is used to directly provide the second power supply voltage to the frame inserting chip 111, the LX0 pin, the LX1 pin and the VFB pin in the frame inserting chip 111 are empty and are no longer connected to other devices.

It can be understood that, in the embodiment of the present application, the power management module 141 that provides the first power supply voltage to the frame inserting chip 111 and the power management module 141 that provides the second power supply voltage to the frame inserting chip 111 may be the same power management module or two power management modules that are independently arranged.

In actual products, the power management module 141, the frame insertion chip 111, and other devices may be disposed on a circuit board in the electronic device 100, which may also be referred to as a motherboard.

In some embodiments, the first supply voltage may be 1.8V and the second supply voltage may be 0.9V. Therefore, it can be seen that the second power supply voltage is smaller than the first power supply voltage.

Fig. 4 is a schematic structural diagram of another power supply circuit according to an embodiment of the present application. Referring to fig. 4, the power supply circuit includes a power management module 141, a frame inserting chip 111, and a voltage conversion module 401. The first voltage output end of the power management module 141 is connected with the first voltage input end of the frame inserting chip 111, and is used for providing a first power supply voltage for the frame inserting chip 111; the second voltage output terminal of the power management module 141 is connected to the second voltage input terminal of the frame inserting chip 111 through the voltage conversion module 401, and is used for providing the second power supply voltage to the frame inserting chip 111.

Specifically, the second voltage output end of the power management module 141 is connected to the voltage input end of the voltage conversion module 401, and is configured to provide the third power supply voltage to the voltage conversion module 401; the voltage output end of the voltage conversion module 401 is connected to the second voltage input end of the frame inserting chip 111, and is used for converting the third power supply voltage into the second power supply voltage so as to provide the second power supply voltage for the frame inserting chip 111; the third supply voltage is not equal to the second supply voltage.

As shown in fig. 4, the second voltage input terminal of the frame inserting chip 111 may include a plurality of second voltage input pins, where the plurality of voltage input pins are respectively: vdd_rx_1 pin, vdd_rx_2 pin, vdd_tx pin, avdd_pll pin, vdd_1 pin, vdd_2 pin, vdd_3 pin, vdd_4 pin, vdd_5 pin, and the like.

The power management module 141 may input a third power supply voltage to the voltage conversion module 401, and the voltage conversion module 401 may perform voltage conversion on the third power supply voltage to obtain a second power supply voltage. The voltage output terminals of the voltage conversion module 401 are respectively connected to vdd_rx_1 pin, vdd_rx_2 pin, vdd_tx pin, avdd_pll pin, vdd_1 pin, vdd_2 pin, vdd_3 pin, vdd_4 pin and vdd_5 pin. The voltage output terminal of the voltage conversion module 401 may output a second power supply voltage, which may be input to the frame inserting chip 111 through the vdd_rx_1 pin, the vdd_rx_2 pin, the vdd_tx pin, the avdd_pll pin, the vdd_1 pin, the vdd_2 pin, the vdd_3 pin, the vdd_4 pin, and the vdd_5 pin.

Since the power management module 141 in the electronic device 100 can generally output a plurality of power supply voltages with unequal voltages, the power supply voltages can be matched with the operation requirements of different load modules arranged on the circuit board. In some practical products, in order to make some load modules in the electronic device work normally, it also selects one supply voltage from a plurality of supply voltages with unequal voltages (the selected supply voltage may be a third supply voltage), and converts the third supply voltage into a second supply voltage through a voltage conversion module 401 originally provided on the circuit board, so as to provide the second supply voltage to the load module. Therefore, the voltage conversion module 401 connected to the power management module 141 may be directly connected to the second voltage input end of the frame inserting chip 111 to provide the second power supply voltage to the frame inserting chip 111, so that the voltage reduction processing is not required to be performed by components inside the frame inserting chip 111 and devices such as a capacitor and an inductor at the periphery of the frame inserting chip, so as to provide the reduced second power supply voltage to the frame inserting chip 111, thereby reducing the power consumption of the frame inserting chip 111; in addition, the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip 111 can be removed, the occupied area of the devices such as the capacitor and the inductor arranged on the periphery of the frame inserting chip 111 is reduced, and the cost of the electronic equipment 100 is also reduced.

It can be understood that, in the embodiment of the present application, the power management module 141 that provides the first power supply voltage to the frame inserting chip 111 and the power management module 141 that provides the third power supply voltage to the voltage conversion module 401 may be the same power management module or two power management modules that are separately provided.

When the power management module 141 for inputting the third power supply voltage to the voltage conversion module 401 is selected on the circuit board, it may select an appropriate power management module 141 according to the distance between the frame inserting chip 111 and the power management module 141, the routing distribution, and the like.

If the difference between the third power supply voltage and the second power supply voltage output by the selected power management module 141 is large, the voltage conversion module 401 may include a plurality of cascaded voltage conversion units. For example, the voltage conversion module 401 includes two stages of voltage conversion units, and the voltage conversion unit may be a step-down unit, and the step-down unit of two stages performs step-down processing on the third supply voltage provided by the power management module 141 to provide the second supply voltage to the second voltage input terminal of the frame inserting chip 111, so as to improve the problem that the components in the step-down unit are easily damaged due to a large single voltage drop range.

The voltage conversion module 401 may also include a voltage conversion unit if the difference between the third power supply voltage and the second power supply voltage outputted by the selected power management module 141 is small.

Thus, in some embodiments, the voltage conversion module 401 includes one or more voltage conversion units that are cascaded in sequence. In this embodiment of the present application, one voltage conversion unit, or a plurality of voltage conversion units cascaded in sequence may be selected as the voltage conversion module 401 according to actual situations. And, the specific circuits of any two voltage conversion units in the plurality of voltage conversion units which are sequentially cascaded may be the same or different.

In some embodiments, if the third supply voltage output by the power management module 141 is greater than the second supply voltage required by the frame inserting chip 111, the voltage conversion unit included in the voltage conversion module 401 may be a first voltage reduction unit, and the first voltage reduction unit may also be referred to as a buck circuit.

As shown in fig. 5, the first buck unit 4011 includes a first switching tube Q1, a first diode D1, a first inductance L1, and a first storage capacitor Cst1. The first end of the first switching tube Q1 is connected with the second voltage output end of the power management module 141, and the second end of the first switching tube Q1 is connected with the first end of the first inductor L1; the second end of the first inductor L1 is connected with the second voltage input end of the frame inserting chip 111; the anode of the first diode D1 is connected with the ground end GND, and the cathode of the first diode D1 is connected with the second end of the first switch tube Q1; the first end of the first energy storage capacitor Cst1 is connected with the second end of the first inductor L1, and the second end of the first energy storage capacitor Cst1 is connected with the ground end GND.

The first end of the first switching tube Q1 refers to a voltage input end of the voltage conversion module 401, and the second end of the first inductor L1 refers to a voltage output end of the voltage conversion module 401.

It should be noted that the control end of the first switching tube Q1 may be connected to a certain control signal end. For example, the control signal terminal may be a control signal terminal in the power management module 141, or the first voltage reducing unit 4011 may further include a control unit, and the control unit may be used as a control signal terminal and connected to a control terminal of the first switching tube Q1. Of course, the control signal terminal may also be another signal terminal for controlling on-off of the first switching tube Q1, which is not limited in the embodiment of the present application.

In the embodiment of the present application, the first switching transistor Q1 may be a metal-oxide-semiconductor (MOS) transistor. Of course, the first switching transistor Q1 may be any other suitable controllable device, such as a bipolar transistor (bipolar junction transistor, BJT) device or an insulated gate bipolar transistor (insulated gate bipolar transistor, IGBT) device.

Taking the first switching tube Q1 as an example of a MOS tube. The first switching tube Q1 may be a P-type MOS tube, the control end of the first switching tube Q1 refers to a gate of the first switching tube Q1, the first end of the first switching tube Q1 refers to a source of the first switching tube Q1, and the second end of the first switching tube Q1 refers to a drain of the first switching tube Q1, which is turned on when the gate inputs a low level and turned off when the gate inputs a high level. Alternatively, the first switching tube Q1 may be replaced by an N-type MOS tube, where the control end of the first switching tube Q1 refers to the gate of the first switching tube Q1, the first end of the first switching tube Q1 refers to the drain of the first switching tube Q1, and the second end of the first switching tube Q1 refers to the source of the first switching tube Q1, which is turned on when the gate inputs a high level and turned off when the gate inputs a low level.

In the actual working process of the first voltage reduction unit 4011, in a first stage of the same period, the first switching tube Q1 may be controlled to be turned on, at this time, the first diode D1 is turned off reversely, the power management module 141 charges the first inductor L1, the current flowing through the first inductor L1 increases gradually, and simultaneously, the first energy storage capacitor Cst1 is powered, and the frame inserting chip 111 is powered; in the second phase of the same period, the first switching tube Q1 may be controlled to be turned off, at this time, the first diode D1 is turned on, the first inductor L1 discharges through the first storage capacitor Cst1 and the frame inserting chip 111, and the current flowing through the first inductor L1 gradually decreases.

Therefore, by inputting a pulse width modulation (pulse width modulation, PWM) signal to the control terminal of the first switching tube Q1, the switching state of the first switching tube Q1 is continuously changed, and the above-described process is repeatedly performed, so that the output voltage of the first voltage reducing unit 4011 is lower than the input voltage, that is, the input third power supply voltage is reduced to the second power supply voltage.

For example, the third supply voltage output by the second voltage output end of the power management module 141 is 3.3V, and the embodiment of the present application may use the first step-down unit 4011 shown in fig. 5 to reduce the third supply voltage of 3.3V to the second supply voltage of 0.9V.

In other embodiments, if the third supply voltage output by the power management module 141 is greater than the second supply voltage required by the frame inserting chip 111, the voltage conversion unit included in the voltage conversion module 401 may be a second voltage reduction unit, and the second voltage reduction unit may be referred to as an LDO circuit.

As shown in fig. 6, the second step-down unit 4012 includes a voltage adjustment tube M1, an error amplifier A1, a first resistor R1, a second resistor R2, and a reference power supply VERF. The control end of the voltage adjusting tube M1 is connected with the output end of the error amplifier A1, the first end of the voltage adjusting tube M1 is connected with the second voltage output end of the power management module 141, and the second end of the voltage adjusting tube M1 is connected with the second voltage input end of the frame inserting chip 111; the first end of the first resistor R1 is connected with the second end of the voltage regulating tube M1, and the second end of the first resistor R1 is connected with the non-inverting input end of the error amplifier A1; the first end of the second resistor R2 is connected with the second end of the first resistor R1, and the second end of the second resistor R2 is connected with the ground end GND; the reference power supply VERF is connected to the inverting input of the error amplifier A1.

The first end of the voltage adjustment tube M1 refers to the voltage input end of the voltage conversion module 401, and the second end of the voltage adjustment tube M1 refers to the voltage output end of the voltage conversion module 401.

The voltage adjusting tube M1 may be a P-type MOS tube, the control end of the voltage adjusting tube M1 refers to the gate of the voltage adjusting tube M1, the first end of the voltage adjusting tube M1 refers to the source of the voltage adjusting tube M1, and the second end of the voltage adjusting tube M1 refers to the drain of the voltage adjusting tube M1.

The voltage adjusting tube M1 corresponds to an adjustable resistor, when the current input to the control end of the voltage adjusting tube M1 is larger, the voltage drop of the voltage adjusting tube M1 is smaller, and when the current input to the control end of the voltage adjusting tube M1 is smaller, the voltage drop of the voltage adjusting tube M1 is larger. The voltage drop of the voltage adjustment tube M1 refers to a difference obtained by subtracting the voltage of the second end of the voltage adjustment tube M1 from the voltage of the first end of the voltage adjustment tube M1.

In the actual working process of the second step-down unit 4012, after the second voltage output end of the power management module 141 inputs the third supply voltage to the first end of the voltage adjustment tube M1, the second end of the voltage adjustment tube M1 will correspondingly input the voltage to be adjusted, and the first resistor R1 and the second resistor R2 will divide the voltage to be adjusted, so that a divided voltage is generated at the node between the first resistor R1 and the second resistor R2. Because the resistances of the first resistor R1 and the second resistor R2 are constant, the divided voltage generated at the node between the first resistor R1 and the second resistor R2 is in direct proportion to the voltage to be regulated output from the second end of the voltage regulating tube M1, and the divided voltage at the node between the first resistor R1 and the second resistor R2 acts on the non-inverting input end of the error amplifier A1. And the reference voltage provided by the reference power supply VREF is applied to the inverting input of the error amplifier A1.

When the voltage to be regulated output by the second end of the voltage regulating tube M1 increases relative to the preset second power supply voltage, the divided voltage acting on the non-inverting input end of the error amplifier A1 also increases, so that the current output by the output end of the error amplifier A1 to the control end of the voltage regulating tube M1 decreases, so that the voltage drop of the voltage regulating tube M1 increases, and the voltage output by the second end of the voltage regulating tube M1 decreases to the second power supply voltage.

When the voltage to be regulated output by the second end of the voltage regulating tube M1 is reduced relative to the preset second power supply voltage, the divided voltage acting on the non-inverting input end of the error amplifier A1 is also reduced, so that the current output by the output end of the error amplifier A1 to the control end of the voltage regulating tube M1 is increased, the voltage drop of the voltage regulating tube M1 is reduced, and the voltage output by the second end of the voltage regulating tube M1 is increased to the second power supply voltage.

Therefore, as can be seen from the second voltage reducing unit 4012 shown in fig. 6, the second voltage reducing unit 4012 can utilize the negative feedback mechanism of the first resistor R1 and the second resistor R2, so that the second voltage reducing unit 4012 performs the voltage reducing process on the third supply voltage, so as to always stabilize the voltage output by the output terminal of the second voltage reducing unit 4012 around the second supply voltage.

For example, the third supply voltage output by the second voltage output terminal of the power management module 141 may be 1.1V, and the embodiment of the present application may use the second step-down unit 4012 shown in fig. 6 to reduce the third supply voltage of 1.1V to the second supply voltage of 0.9V.

It should be noted that, when the difference between the third supply voltage and the second supply voltage is large, the step-down processing may be performed by using the first step-down unit 4011 described above, so as to improve the conversion efficiency and reduce the amount of heat generation. When the difference between the third supply voltage and the second supply voltage is smaller, the second step-down unit 4012 may be used to perform step-down processing, so as to reduce output ripple and improve stability of the output second supply voltage. Of course, in one possible implementation, the first step-down unit 4011 and the second step-down unit 4012 that are cascaded may also be used to jointly reduce the third supply voltage to the second supply voltage.

In still other embodiments, if the third supply voltage output by the power management module 141 is smaller than the second supply voltage required by the frame inserting chip 111, the voltage conversion unit included in the voltage conversion module 401 may be a boost unit, which may also be referred to as a boost circuit.

As shown in fig. 7, the boost unit 4013 includes a second switching tube Q2, a second diode D2, a second inductance L2, and a second storage capacitor Cst2. The first end of the second inductor L2 is connected to the second voltage output end of the power management module 141, and the second end of the second inductor L2 is connected to the anode of the second diode D2; the cathode of the second diode D2 is connected with a second voltage input end of the frame inserting chip 111; the first end of the second switching tube Q2 is connected with the second end of the second inductor L2, and the second end of the second switching tube Q2 is connected with the grounding end GND; the first end of the second storage capacitor Cst2 is connected with the cathode of the second diode D2, and the second end of the second storage capacitor Cst2 is connected with the ground end GND.

The first terminal of the second inductor L2 refers to the voltage input terminal of the voltage conversion module 401, and the cathode of the second diode D2 refers to the voltage output terminal of the voltage conversion module 401.

It should be noted that the control end of the second switching tube Q2 may be connected to a certain control signal end. For example, the control signal terminal may be a control signal terminal in the power management module 141, or the boost unit 4013 may further include a control unit, and the control unit may be used as a control signal terminal and connected to a control terminal of the second switching tube Q2. Of course, the control signal terminal may also be another signal terminal for controlling on/off of the second switching tube Q2, which is not limited in the embodiment of the present application.

In this embodiment of the present application, the second switching tube Q2 may be a MOS tube. Of course, the second switching tube Q2 may be other suitable controllable devices, such as a BJT device or an IGBT device.

Taking the second switching tube Q2 as an example of a MOS tube. The second switching tube Q2 may be a P-type MOS tube, the control end of the second switching tube Q2 refers to the gate of the second switching tube Q2, the first end of the second switching tube Q2 refers to the source of the second switching tube Q2, and the second end of the second switching tube Q2 refers to the drain of the second switching tube Q2, which is turned on when the gate inputs a low level and turned off when the gate inputs a high level. Alternatively, the second switching tube Q2 may be replaced by an N-type MOS tube, where the control end of the second switching tube Q2 refers to the gate of the second switching tube Q2, the first end of the second switching tube Q2 refers to the drain of the second switching tube Q2, and the second end of the second switching tube Q2 refers to the source of the second switching tube Q2, which is turned on when the gate inputs a high level and turned off when the gate inputs a low level.

In the actual working process of the boost unit 4013, in the first stage of the same period, the second switching tube Q2 can be controlled to be turned on, the power management module 141 charges the second inductor L2, the current flowing through the second inductor L2 gradually increases with the increase of time, the second diode D2 at this time is turned off reversely, the second energy storage capacitor Cst2 at this time discharges to the frame inserting chip 111, and the voltage at two ends of the second energy storage capacitor Cst2 gradually decreases with the increase of time; in the first stage of the same period, the second switching tube Q2 may be controlled to be turned off, so that the second diode D2 is turned on, the second inductor L2 discharges, and as time increases, the current on the second inductor L2 gradually decreases, at this time, the third power supply voltage provided by the power management module 141 and the voltage on the second inductor L2 are superimposed to charge the second storage capacitor Cst2 together, and simultaneously power the frame inserting chip 111, and as time increases, the voltage at two ends of the second storage capacitor Cst2 gradually increases.

Therefore, by inputting the PWM signal to the control terminal of the second switching tube Q2, the switching state of the second switching tube Q2 is continuously changed, and the above-described process is repeatedly performed, so that the output voltage of the voltage boosting unit 4013 is higher than the input voltage, that is, the boosting of the input third power supply voltage into the second power supply voltage is achieved.

In another embodiment, as shown in fig. 8, the voltage conversion module 401 may further include a buck-boost circuit 4014. The buck-boost circuit 4014 comprises a third switching tube Q3, a fourth switching tube Q4, a fifth switching tube Q5, a sixth switching tube Q6 and a third inductor L3.

The first end of the third switching tube Q3 is connected with the second voltage output end of the power management module 141, and the second end of the third switching tube Q3 is connected with the first end of the third inductor L3; the first end of the fourth switching tube Q4 is connected with the second end of the third switching tube Q3, and the second end of the fourth switching tube Q4 is connected with the grounding end GND; the first end of the fifth switching tube Q5 is connected with the second voltage input end of the frame inserting chip 111, and the second end of the fifth switching tube Q5 is connected with the second end of the third inductor L3; the first end of the sixth switching tube Q6 is connected to the second end of the fifth switching tube Q5, and the second end of the sixth switching tube Q6 is connected to the ground GND.

The first end of the third switching tube Q3 refers to the voltage input end of the voltage conversion module 401, and the first end of the fifth switching tube Q5 refers to the voltage output end of the voltage conversion module 401.

The control end of the third switching tube Q3, the control end of the fourth switching tube Q4, the control end of the fifth switching tube Q5, and the control end of the sixth switching tube Q6 may be connected to a certain control signal end. For example, the control signal terminal may be a control signal terminal in the power management module 141, or the buck-boost circuit 4014 may further include a control unit, where the control unit may be used as a control signal terminal and connected to the control terminal of the third switching tube Q3, the control terminal of the fourth switching tube Q4, the control terminal of the fifth switching tube Q5, and the control terminal of the sixth switching tube Q6. Of course, the control signal end may also be other signal ends for controlling the on/off of the third switching tube Q3, the fourth switching tube Q4, the fifth switching tube Q5, and the sixth switching tube Q6, which is not limited in the embodiment of the present application.

In this embodiment of the present application, the third switching tube Q3, the fourth switching tube Q4, the fifth switching tube Q5, and the sixth switching tube Q6 may be all MOS tubes. Of course, the third switching tube Q3, the fourth switching tube Q4, the fifth switching tube Q5 and the sixth switching tube Q6 may be other suitable controllable devices, such as BJT devices or IGBT devices.

Taking the third switching tube Q3, the fourth switching tube Q4, the fifth switching tube Q5 and the sixth switching tube Q6 as examples. The third switching tube Q3 can be a P-type transistor, the fourth switching tube Q4 can be an N-type transistor, the fifth switching tube Q5 can be a P-type MOS tube, and the sixth switching tube Q6 can be an N-type MOS tube. Of course, it can be understood that the third switching tube Q3 may be replaced by an N-type MOS tube, the fourth switching tube Q4 may be replaced by a P-type MOS tube, the fifth switching tube Q5 may be replaced by an N-type MOS tube, and the sixth switching tube Q6 may be replaced by a P-type MOS tube.

During actual operation of the buck-boost circuit 4014, the buck-boost circuit 4014 can be controlled to be in a buck mode or a boost mode according to actual conditions.

If the third supply voltage output by the power management module 141 is greater than the second supply voltage required by the frame inserting chip 111, the buck-boost circuit 4014 can be controlled to be in the buck mode. When buck-boost circuit 4014 is in buck mode, fifth switching tube Q5 is controlled to be always on, and sixth switching tube Q6 is controlled to be always off. In the first phase of the same cycle, the third switching tube Q3 is controlled to be turned on and the fourth switching tube Q4 is controlled to be turned off, and in the second phase of the same cycle, the third switching tube Q3 is controlled to be turned off and the fourth switching tube Q4 is controlled to be turned on. Therefore, the step-down function is realized by controlling the alternate conduction of the third switching tube Q3 and the fourth switching tube Q4.

If the third supply voltage output by the power management module 141 is smaller than the second supply voltage required by the frame inserting chip 111, the buck-boost circuit 4014 can be controlled to be in the boost mode. When the buck-boost circuit 4014 is in the boost mode, the third switching transistor Q3 is controlled to be in the on state all the time, and the fourth switching transistor Q4 is controlled to be in the off state all the time. In the first phase of the same cycle, the sixth switching tube Q6 is controlled to be turned on and the fifth switching tube Q5 is controlled to be turned off, and in the second phase of the same cycle, the fifth switching tube Q5 is controlled to be turned on and the sixth switching tube Q6 is controlled to be turned off. Thus, the boosting function is achieved by controlling the alternate conduction of the fifth switching tube Q5 and the sixth switching tube Q6.

In summary, fig. 5 to 8 illustrate four possible implementations of the voltage conversion module 401, it should be understood that the specific circuit structure of the voltage conversion module 401 is not limited to the circuits shown in fig. 5 to 8, as long as the voltage conversion module 401 capable of converting the third power supply voltage into the second power supply voltage is applicable, which is not limited in this embodiment of the present application.

As shown in fig. 3 and 4, the power supply circuit further includes a first filter module 301, a first end of the first filter module 301 is connected to the first voltage input end of the frame inserting chip 111, and a second end of the first filter module 301 is connected to the ground GND. The first filtering module 301 is configured to perform filtering processing on a first supply voltage provided to the frame inserting chip 111.

Specifically, the first terminal of the first filtering module 301 is connected to the VDD18_rx pin, the VDD18_tx pin, the dvdd18_1 pin, the dvdd18_2 pin, the VIN18_1 pin, and the VIN18_2 pin, respectively.

In this way, the first filtering module 301 disposed at the periphery of the frame inserting chip 111 performs filtering processing on the first power supply voltage provided to the frame inserting chip 111, so as to improve stability of the first power supply voltage input to the frame inserting chip 111, and improve anti-interference capability of the frame inserting chip 111, thereby improving accuracy of the frame inserting chip 111 during operation.

In one possible implementation, the first filtering module 301 includes a first capacitor C1, a second capacitor C2, a third capacitor C3, and a fourth capacitor C4 connected in parallel. The first end of the first capacitor C1, the first end of the second capacitor C2, the first end of the third capacitor C3 and the first end of the fourth capacitor C4 are all connected with the first voltage input end of the frame inserting chip 111; the second end of the first capacitor C1, the second end of the second capacitor C2, the second end of the third capacitor C3 and the second end of the fourth capacitor C4 are all connected to the ground GND.

As shown in fig. 3 and 4, the power supply circuit further includes a second filter module 302, a first end of the second filter module 302 is connected to the second voltage input end of the frame inserting chip 111, and a second end of the second filter module 302 is connected to the ground GND; the second filtering module 302 is configured to perform a filtering process on the second supply voltage provided to the frame inserting chip 111.

Specifically, the first terminal of the second filtering module 302 is connected to vdd_rx_1 pin, vdd_rx_2 pin, vdd_tx pin, avdd_pll pin, vdd_1 pin, vdd_2 pin, vdd_3 pin, vdd_4 pin, and vdd_5 pin, respectively.

In this way, the second filtering module 302 disposed at the periphery of the frame inserting chip 111 performs filtering processing on the second power supply voltage provided to the frame inserting chip 111, so as to improve stability of the second power supply voltage input to the frame inserting chip 111, and improve anti-interference capability of the frame inserting chip 111, thereby improving accuracy of the frame inserting chip 111 during operation.

In one possible implementation, the second filtering module 302 includes a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, and an eleventh capacitor C11 connected in parallel. The first end of the fifth capacitor C5, the first end of the sixth capacitor C6, the first end of the seventh capacitor C7, the first end of the eighth capacitor C8, the first end of the ninth capacitor C9, the first end of the tenth capacitor C10 and the first end of the eleventh capacitor C11 are all connected to the second voltage input end of the frame inserting chip 111; the second end of the fifth capacitor C5, the second end of the sixth capacitor C6, the second end of the seventh capacitor C7, the second end of the eighth capacitor C8, the second end of the ninth capacitor C9, the second end of the tenth capacitor C10 and the second end of the eleventh capacitor C11 are all connected to the ground GND.

As shown in fig. 3 and 4, the frame inserting chip 111 further includes a VEN pin, which is connected to the processor 110 in the electronic device 100 and is used for receiving the enable signal gpio_dppic_rst_n sent by the processor 110 to control the frame inserting chip 111 to operate.

Further, the power supply circuit further includes a third filtering module 303, a first end of the third filtering module 303 is connected to the VEN pin, and a second end of the third filtering module 303 is connected to the ground GND, which is configured to perform filtering processing on the enable signal sent by the processor 110. In one possible implementation, the third filtering module 303 includes a twelfth capacitor C12, where a first end of the twelfth capacitor C12 is connected to the VEN pin, and a second end of the twelfth capacitor C12 is connected to the ground.

In addition, the frame inserting chip 111 further includes a vss_rx_1 pin, a vss_rx_2 pin, a vss_tx pin, an avss_pll pin, a VFUSE pin, a vss_1 pin, a vss_2 pin, a vss_3 pin, a vss_4 pin, and a vss_5 pin, wherein the vss_rx_1 pin, the vss_rx_2 pin, the vss_tx pin, the avss_pll pin, the VFUSE pin, the vss_1 pin, the vss_2 pin, the vss_3 pin, the vss_4 pin, and the vss_5 pin are all connected to the ground GND.

The foregoing detailed description of the embodiments has further described the objects, technical solutions and advantageous effects of the present application, and it should be understood that the foregoing is only a detailed description of the present application and is not intended to limit the scope of the present application, and any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the present application should be included in the scope of protection of the present application.

Claims

1. The power supply circuit is characterized by comprising a power management module and a frame inserting chip;

the first voltage output end of the power management module is connected with the first voltage input end of the frame inserting chip and is used for providing a first power supply voltage for the frame inserting chip;

the second voltage output end of the power management module is directly connected with the second voltage input end of the frame inserting chip or is connected with the second voltage input end of the frame inserting chip through the voltage conversion module and is used for providing a second power supply voltage for the frame inserting chip;

the first power supply voltage is used for supplying power to components in the frame inserting chip, the second power supply voltage is working voltage when the frame inserting chip performs frame inserting processing, and the first power supply voltage is unequal to the second power supply voltage.

2. The power supply circuit of claim 1, wherein the second supply voltage is less than the first supply voltage.

3. The power supply circuit of claim 1, further comprising a voltage conversion module;

the second voltage output end of the power management module is connected with the voltage input end of the voltage conversion module and is used for providing a third power supply voltage for the voltage conversion module;

The voltage output end of the voltage conversion module is connected with the second voltage input end of the frame inserting chip and is used for converting the third power supply voltage into the second power supply voltage so as to provide the second power supply voltage for the frame inserting chip; the third supply voltage is not equal to the second supply voltage.

4. A power supply circuit according to claim 3, wherein the voltage conversion module comprises one or more voltage conversion units cascaded in sequence.

5. The power supply circuit of claim 4, wherein the third power supply voltage is greater than the second power supply voltage, and the voltage conversion unit is a first step-down unit; the first voltage reduction unit comprises a first switch tube, a first diode, a first inductor and a first energy storage capacitor;

the first end of the first switching tube is connected with the second voltage output end of the power management module, and the second end of the first switching tube is connected with the first end of the first inductor;

the second end of the first inductor is connected with the second voltage input end of the frame inserting chip;

the anode of the first diode is connected with the grounding end, and the cathode of the first diode is connected with the second end of the first switching tube;

The first end of the first energy storage capacitor is connected with the second end of the first inductor, and the second end of the first energy storage capacitor is connected with the grounding end.

6. The power supply circuit according to claim 4, wherein the third power supply voltage is larger than the second power supply voltage, and the voltage conversion unit is a second step-down unit; the second voltage reducing unit comprises a voltage adjusting tube, an error amplifier, a first resistor, a second resistor and a reference power supply;

the control end of the voltage regulating tube is connected with the output end of the error amplifier, the first end of the voltage regulating tube is connected with the second voltage output end of the power management module, and the second end of the voltage regulating tube is connected with the second voltage input end of the frame inserting chip;

the first end of the first resistor is connected with the second end of the voltage regulating tube, and the second end of the first resistor is connected with the non-inverting input end of the error amplifier;

the first end of the second resistor is connected with the second end of the first resistor, and the second end of the second resistor is connected with the grounding end;

the reference power supply is connected with the inverting input end of the error amplifier.

7. The power supply circuit according to claim 4, wherein the third power supply voltage is smaller than the second power supply voltage, and the voltage conversion unit is a step-up unit; the boosting unit comprises a second switch tube, a second diode, a second inductor and a second energy storage capacitor;

the first end of the second inductor is connected with the second voltage output end of the power management module, and the second end of the second inductor is connected with the anode of the second diode;

the cathode of the second diode is connected with the second voltage input end of the frame inserting chip;

the first end of the second switching tube is connected with the second end of the second inductor, and the second end of the second switching tube is connected with the grounding end;

the first end of the second energy storage capacitor is connected with the cathode of the second diode, and the second end of the second energy storage capacitor is connected with the grounding end.

8. The power supply circuit of claim 1, further comprising a first filter module, a first end of the first filter module being connected to a first voltage input of the frame-inserted chip, a second end of the first filter module being connected to a ground terminal;

The first filtering module is used for filtering the first power supply voltage provided for the frame inserting chip.

9. The power supply circuit of claim 8, wherein the first filter module comprises a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor in parallel;

the first end of the first capacitor, the first end of the second capacitor, the first end of the third capacitor and the first end of the fourth capacitor are all connected with the first voltage input end of the frame inserting chip;

the second end of the first capacitor, the second end of the second capacitor, the second end of the third capacitor and the second end of the fourth capacitor are all connected with the grounding end.

10. The power supply circuit of claim 1, further comprising a second filter module, a first end of the second filter module being connected to a second voltage input of the frame-inserted chip, a second end of the second filter module being connected to a ground terminal;

and the second filtering module is used for filtering the second power supply voltage provided for the frame inserting chip.

11. The power supply circuit of claim 10, wherein the second filter module comprises a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, and an eleventh capacitor in parallel;

The first end of the fifth capacitor, the first end of the sixth capacitor, the first end of the seventh capacitor, the first end of the eighth capacitor, the first end of the ninth capacitor, the first end of the tenth capacitor and the first end of the eleventh capacitor are all connected with the second voltage input end of the frame inserting chip;

the second end of the fifth capacitor, the second end of the sixth capacitor, the second end of the seventh capacitor, the second end of the eighth capacitor, the second end of the ninth capacitor, the second end of the tenth capacitor and the second end of the eleventh capacitor are all connected with the grounding end.

12. An electronic device comprising a processor and a power supply circuit as claimed in any one of claims 1 to 11; the processor is connected with a frame inserting chip in the power supply circuit.