CN219179602U

CN219179602U - Distance measuring sensor

Info

Publication number: CN219179602U
Application number: CN202320007939.5U
Authority: CN
Inventors: 沈玉丰; 侴智
Original assignee: Shenzhen Mileseey Technology Co ltd
Current assignee: Shenzhen Mileseey Technology Co ltd
Priority date: 2023-01-04
Filing date: 2023-01-04
Publication date: 2023-06-13
Anticipated expiration: 2033-01-04

Abstract

The application relates to a ranging sensor, which comprises a shell, a laser emitting assembly, a laser receiving assembly and a circuit processing assembly; the laser emission component is used for emitting infrared laser and is arranged in the shell; the laser receiving assembly is used for receiving the reflected infrared laser and is arranged in the shell, the optical axis of the laser receiving assembly is parallel to the optical axis of the laser emitting assembly, the laser receiving assembly comprises a first receiving lens, a reflecting mirror and a second receiving lens, an out-of-band wave absorption film is arranged on the surface of the reflecting mirror, and an out-of-band wave suppression film is arranged on the surfaces of the first receiving lens and the second receiving lens; the circuit processing component is used for processing the infrared laser received by the laser receiving component and is arranged in the shell. In the scheme, interference of light outside the light wave band on the circuit processing assembly in the reflected infrared laser signal processing process is reduced, so that the signal-to-noise ratio of the system is improved.

Description

Distance measuring sensor

Technical Field

The application relates to the technical field of laser ranging and laser radar, in particular to a ranging sensor.

Background

The laser ranging is increasingly applied to the fields of industry, traffic, safety protection, exploration, search and rescue and the like, the traditional ranging sensor at present generally comprises a laser transmitter, a laser receiver and the like, the laser transmitter transmits laser frequency signals, a diffuse reflection target is encountered, part of the signals are reflected to the receiving range of the receiver, laser echo signals are converged on a detection chip of the laser receiver through a refraction or reflection type receiving lens group, and then available information is extracted for application through circuit processing and signal processing. Because of the diversified use environments, there are rain and fog, space signal and other influences, when the intensity of the transmitted laser frequency signal is unchanged and the system volume is not increased, the laser receiver needs to respond to the echo signal, and the signal to noise ratio of the system needs to be improved.

Disclosure of Invention

Based on the above, it is necessary to provide a ranging sensor, which aims to solve the problem of low signal-to-noise ratio of the laser ranging sensor system in the prior art.

The application provides a ranging sensor, which comprises a shell, a laser emitting assembly, a laser receiving assembly and a circuit processing assembly; the laser emission component is used for emitting infrared laser and is arranged in the shell; the laser receiving assembly is used for receiving reflected infrared laser, is arranged in the shell, and has an optical axis parallel to the optical axis of the laser emitting assembly, and comprises a first receiving lens, a reflecting mirror and a second receiving lens, wherein the surface of the reflecting mirror is provided with an out-of-band wave absorption film, and the surfaces of the first receiving lens and the second receiving lens are respectively provided with an out-of-band wave suppression film; the circuit processing component is used for processing the infrared laser received by the laser receiving component and is arranged in the shell.

In the scheme, the out-of-band wave absorption film is plated on the surface of the reflecting mirror in the laser receiving component, and the out-of-band wave inhibition films are plated on the surfaces of the first receiving lens and the second receiving lens, so that light with the light wave size outside the light wave band is difficult to enter the first receiving lens and the second receiving lens, and part of light with the light wave size outside the light wave band can be absorbed by the reflecting mirror even after passing through the first receiving lens and the second receiving lens, thereby reducing interference of the light with the light wave size outside the light wave band in the processing process of the reflected infrared laser signals of the circuit processing component, and further improving the signal to noise ratio of the system.

The technical scheme of the application is further described below:

in any embodiment, the ranging sensor further comprises a laser indicator for emitting visible light, the laser indicator is mounted inside the housing, and an optical axis of the laser indicator is parallel to an optical axis of the laser emitting assembly.

In any embodiment, the first receiving lens is provided with a notch, the notch penetrates through the first receiving lens in the direction of the optical axis, and at least part of the laser emitting assembly and/or at least part of the laser indicator are/is in the range of the notch in the circumferential direction of the optical axis.

In any embodiment, the notch is disposed at a circumference of the first receiving lens.

In any embodiment, the notch comprises an arcuate portion and a straight cut portion.

In any embodiment, the second receiving lens is in a wedge-shaped structure and comprises a first incident surface, a second incident surface and an arc-shaped surface, the first incident surface and the second incident surface are arranged at an acute angle, the first incident surface is used for receiving infrared laser reflected by the first receiving lens, and the reflected infrared laser is transmitted to the reflecting mirror from the second incident surface and reflected by the reflecting mirror to be emitted to the arc-shaped surface from the second incident surface.

In any embodiment, the second receiving lens is glued to the housing.

In any embodiment, the laser emission component comprises a laser emitter, and a first emission lens and a second emission lens which are sequentially arranged according to the light path sequence, wherein the laser emitter is used for emitting infrared laser, and the infrared laser is emitted to the outside of the ranging sensor through the first emission lens and the second emission lens.

In any embodiment, the laser emitting assembly further includes a pressing ring that presses against a circumferential edge of the second emission lens in an optical axis direction and is connected to the housing.

In any embodiment, the circuit processing assembly includes a laser receiver, a main board, and a signal processing board connected, the laser receiver being located on a transmission optical path of the second receiving lens and disposed toward the second receiving lens.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application, illustrate and explain the application and are not to be construed as limiting the application.

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a cross-sectional view of a ranging sensor according to one embodiment of the present application;

FIG. 2 is a second cross-sectional view of a ranging sensor according to an embodiment of the present application;

FIG. 3 is a schematic view of the first receiving lens of FIG. 1;

FIG. 4 is a schematic diagram of the structure of the second receiving lens in FIG. 1;

fig. 5 is a schematic diagram of the positions of a laser emitting assembly, a laser receiving assembly, and a laser pointer of a ranging sensor according to an embodiment of the present application.

Reference numerals illustrate:

100. a ranging sensor; 110. a housing; 120. a laser emitting assembly; 121. a laser emitter; 122. a first emission lens; 123. a second emission lens; 124. a pressing ring; 130. a laser receiving assembly; 131. a first receiving lens; 1311. a notch; 13111. an arc-shaped portion; 13112. a straight cut portion; 132. a reflecting mirror; 1321. a reflecting surface; 133. a second receiving lens; 1331. a first incident surface; 1332. a second incident surface; 1333. an arc surface; 140. a circuit processing assembly; 141. a laser receiver; 142. a main board; 143. a signal processing board; 150. a laser pointer.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other ways than those herein described and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not limited to the specific embodiments disclosed below.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Preferred embodiments of the present application will be described below with reference to the accompanying drawings.

As shown in fig. 1 and 2, a ranging sensor 100 according to an embodiment of the present application adopts infrared laser ranging, and can be applied to various fields to realize a ranging function. As shown in fig. 1 and 2, the ranging sensor 100 includes a housing 110, a laser emitting assembly 120, a laser receiving assembly 130, and a circuit processing assembly 140. Wherein the housing 110 is used to secure and support the laser emitting assembly 120, the laser receiving assembly 130, and the circuit processing assembly 140.

As shown in fig. 2, according to some embodiments of the present application, optionally, the ranging sensor 100 further includes a laser indicator 150 mounted inside the housing 110, the laser indicator 150 is configured to emit visible light, and an optical axis of the laser indicator 150 is parallel to an optical axis of the laser emitting assembly 120, and the laser indicator 150 emits the visible light to the target object, so as to manually confirm whether the target object measured by the infrared laser is accurate.

As shown in fig. 1, the laser emitting assembly 120 is installed inside the housing 110 to emit infrared laser light, and the emitted infrared laser light is emitted to the outside of the housing 110 and reaches the target object to range the target object.

As shown in fig. 1, according to some embodiments of the present application, optionally, the laser emitting assembly 120 includes a laser emitter 121, and a first emitting lens 122 and a second emitting lens 123 sequentially disposed in the order of the optical path, and it is understood that the laser emitter 121, the first emitting lens 122, and the second emitting lens 123 are all coaxially disposed. The laser emitter 121 is configured to emit infrared laser light, and the first and

second emission lenses

122 and 123 are configured to transmit the infrared laser light to collimate the infrared laser light, and the infrared laser light is emitted to the outside of the ranging sensor 100 through the first and

second emission lenses

122 and 123.

As shown in fig. 1, according to some embodiments of the present application, optionally, the laser emitting assembly 120 further includes a pressing ring 124, and the pressing ring 124 is pressed against a circumferential edge of the second emitting lens 123 in an optical axis direction and connected to the housing 110 to fix the first emitting lens 122 and the second emitting lens 123 inside the housing 110, preventing the first emitting lens 122 and the second emitting lens 123 from being displaced.

As shown in fig. 1 and 2, a laser receiving assembly 130 is installed inside the housing 110, the laser receiving assembly 130 is configured to receive infrared laser light reflected by a target object, and an optical axis of the laser receiving assembly 130 is parallel to an optical axis of the laser emitting assembly 120, so as to be able to receive the infrared laser light.

As shown in fig. 1, the laser light receiving assembly 130 includes a first receiving lens 131, a reflecting mirror 132, and a second receiving lens 133, the surface of the reflecting mirror 132 is provided with an out-of-band wave absorbing film, and the surfaces of the first receiving lens 131 and the second receiving lens 133 are each provided with an out-of-band wave suppressing film. It is understood that the out-of-band wave absorbing film refers to a film for absorbing light having a light wave size outside the light wave band so that a part of the light having a light wave size outside the light wave band can be absorbed by the reflecting mirror 132 even after passing through the first receiving lens 131 and the second receiving lens 133, and the out-of-band wave suppressing film refers to a film for suppressing light having a light wave size outside the light wave band so that light having a light wave size outside the light wave band is difficult to enter the first receiving lens 131 and the second receiving lens 133. Thereby reducing interference of light outside the optical band to the processing of the reflected infrared laser signal by the circuit processing component 140, and improving the signal-to-noise ratio of the system.

It is understood that the out-band wave refers to light with a light wave size outside the light wave band, where the light wave band can be selected according to practical application requirements, for example, in this embodiment, the light wave bandwidth is: 95nm-105nm, in other embodiments, the optical band may be selected as desired.

It is understood that the signal-to-noise ratio refers to the ratio of the useful signal to the unwanted signal in the received signal, the higher the signal-to-noise ratio. In the infrared laser ranging field, the out-of-band wave is the "noise" in the signal-to-noise ratio, which interferes with the signal processing of the circuit processing component 140, and reducing the out-of-band wave received by the circuit processing component 140 can improve the signal-to-noise ratio of the ranging sensor 100.

As shown in fig. 3 and 5, according to some embodiments of the present application, optionally, the first receiving lens 131 is provided with a notch 1311, the notch 1311 penetrates the first receiving lens 131 in the optical axis direction, and at least part of the laser emitting assembly 120 and/or at least part of the laser pointer 150 are within the range of the notch 1311 in the circumferential direction of the optical axis, so that the ranging sensor 100 is compact, thereby reducing the structural size of the ranging sensor 100.

In the embodiment shown in fig. 5, both the laser emitting assembly 120 and the laser pointer 150 are partially positioned within the notch 1311 to reduce the size of the ranging sensor 100. It will be appreciated that the more portions of the laser emitting assembly 120 and the laser pointer 150 that are within the confines of the notch 1311, the smaller the structure of the ranging sensor 100, but it should be noted that the notch 1311 is not capable of affecting the transmission of the first receiving lens 131.

As shown in fig. 3, according to some embodiments of the present application, optionally, a notch 1311 is provided at the circumference of the first receiving lens 131. In other embodiments, the notch 1311 may not be provided on the circumference of the first receiving lens 131, and a through hole may be provided in the first receiving lens 131 to form the notch 1311.

As shown in fig. 3 and 5, the notch 1311 optionally includes an arcuate portion 13111 and a straight cut portion 13112, the arcuate portion 13111 and the straight cut portion 13112 communicating, in accordance with some embodiments of the present application. Optionally, the center of arc 13111 coincides with the optical axis of laser emitting assembly 120. Preferably, as shown in fig. 1, the notch 1311 and the first receiving lens 131 adopt a circular arc transition.

As shown in fig. 1, 2 and 4, according to some embodiments of the present application, optionally, the second receiving lens 133 has a wedge-shaped structure, including a first incident surface 1331, a second incident surface 1332 and an arc-shaped surface 1333, where the first incident surface 1331 and the second incident surface 1332 are disposed at an acute angle. The first incident surface 1331 is for receiving the reflected infrared laser light passing through the first receiving lens 131, and the reflected infrared laser light is transmitted from the second incident surface 1332 to the reflecting mirror 132 and reflected by the reflecting mirror 132 from the second incident surface 1332 toward the arc-shaped surface 1333. When the laser receiving assembly 130 receives the reflected infrared laser light, the reflected infrared laser light enters the housing 110 through the first receiving lens 131, then enters the second receiving lens 133 through the first incident surface 1331 of the second receiving lens 133, enters the reflecting mirror 132 from the second incident surface 1332 of the second receiving lens 133, and then reenters the second receiving lens 133 from the second incident surface 1332 of the second receiving lens 133 after being reflected by the reflecting mirror 132, and finally exits the second receiving lens 133 from the arc surface 1333 of the second receiving lens 133.

According to some embodiments of the present application, the second receiving lens 133 is optionally glued to the housing 110, optionally, in this embodiment, the second receiving lens 133 is connected to the housing 110 by dispensing.

As shown in fig. 1 and 2, the circuit processing component 140 is configured to process the infrared laser light received by the laser light receiving component 130, and calculate the distance of the target object from the time difference between the emission time and the receiving time of the infrared laser light. The circuit processing assembly 140 is mounted inside the housing 110.

As shown in fig. 1, optionally, the circuit processing assembly 140 includes a laser receiver 141, a main board 142, and a signal processing board 143 connected, the laser receiver 141 being located in the transmission path of the second receiving lens 133 and disposed toward the second receiving lens 133, according to some embodiments of the present application.

In the above-mentioned scheme, the surface of the reflecting mirror 132 in the laser receiving assembly 130 is coated with the out-of-band wave absorbing film, and the surfaces of the first receiving lens 131 and the second receiving lens 133 are coated with the out-of-band wave suppressing film, so that light with a light wave size outside the light wave band is difficult to enter the first receiving lens 131 and the second receiving lens 133, and part of light with the light wave size outside the light wave band can be absorbed by the reflecting mirror 132 even after passing through the first receiving lens 131 and the second receiving lens 133, thereby reducing interference of the light with the light wave size outside the light wave band in the processing process of the reflected infrared laser signal by the circuit processing assembly 140, and further improving the signal-to-noise ratio of the system.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the embodiments, and are intended to be included within the scope of the claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims

1. A ranging sensor, comprising:

a housing;

the laser emission component is used for emitting infrared laser and is arranged in the shell;

the laser receiving assembly is used for receiving the reflected infrared laser and is arranged in the shell, the optical axis of the laser receiving assembly is parallel to the optical axis of the laser emitting assembly, the laser receiving assembly comprises a first receiving lens, a reflecting mirror and a second receiving lens, an out-of-band wave absorption film is arranged on the surface of the reflecting mirror, and an out-of-band wave suppression film is arranged on the surfaces of the first receiving lens and the second receiving lens;

the circuit processing component is used for processing the infrared laser received by the laser receiving component and is arranged in the shell.

2. The ranging sensor as recited in claim 1 further comprising a laser pointer for emitting visible light mounted inside the housing with an optical axis of the laser pointer parallel to an optical axis of the laser emitting assembly.

3. A distance measuring sensor according to claim 2, wherein the first receiving lens is provided with a notch extending through the first receiving lens in the direction of the optical axis, at least part of the laser emitting assembly and/or at least part of the laser pointer being within the scope of the notch in the circumferential direction of the optical axis.

4. A ranging sensor as claimed in claim 3 wherein the notch is provided in the circumference of the first receiving lens.

5. The ranging sensor as recited in claim 3 or 4 wherein the notch comprises an arcuate portion and a straight cut portion.

6. The ranging sensor of claim 1, wherein the second receiving lens has a wedge-shaped structure and comprises a first incident surface, a second incident surface and an arc surface, the first incident surface and the second incident surface are disposed at an acute angle, the first incident surface is used for receiving the reflected infrared laser light passing through the first receiving lens, and the reflected infrared laser light is transmitted from the second incident surface to the reflecting mirror and reflected by the reflecting mirror from the second incident surface toward the arc surface.

7. The ranging sensor as recited in claim 6 wherein the second receiving lens is glued to the housing.

8. The ranging sensor as claimed in claim 1, wherein the laser emitting assembly comprises a laser emitter for emitting infrared laser light, and a first emitting lens and a second emitting lens sequentially arranged in an optical path order, the infrared laser light being emitted to the outside of the ranging sensor through the first emitting lens and the second emitting lens.

9. The ranging sensor as recited in claim 8 wherein the laser emitting assembly further comprises a clamping ring that is crimped over a circumferential edge of the second emission lens in an optical axis direction and is coupled to the housing.

10. The ranging sensor of claim 1 wherein the circuit processing assembly comprises a laser receiver, a motherboard, and a signal processing board connected, the laser receiver being located on a transmission light path of the second receiving lens and disposed toward the second receiving lens.