CN219171884U

CN219171884U - A-level heat-preservation ceramsite non-bearing PC board

Info

Publication number: CN219171884U
Application number: CN202223106386.3U
Authority: CN
Inventors: 吴子启; 王星程
Original assignee: Qingdao Fuqiyuan New Building Materials Co ltd
Current assignee: Qingdao Fuqiyuan New Building Materials Co ltd
Priority date: 2022-11-22
Filing date: 2022-11-22
Publication date: 2023-06-13
Anticipated expiration: 2032-11-22

Abstract

The utility model discloses a non-bearing PC board of A-level heat preservation ceramsite, which relates to the technical field of PC boards and comprises a PC board body, wherein a core layer is arranged in the middle of the PC board body, the core layer comprises a first PC material layer, a heat preservation layer and a second PC material layer, the heat preservation layer is positioned in the middle of the core layer, the second PC material layer is hot-pressed on the upper surface of the heat preservation layer, the first PC material layer is hot-pressed on the lower surface of the heat preservation layer, a first reinforcing layer is arranged above the core layer, a second reinforcing layer is arranged below the core layer, the first reinforcing layer and the second reinforcing layer are hot-pressed and fixed, the first reinforcing layer comprises a first cotton reinforcing net layer and an antioxidant layer, and the second reinforcing layer comprises a second cotton reinforcing net layer and a wear-resistant layer. The A-level heat-preservation non-bearing PC board comprises a PC board body consisting of a core layer, a first reinforcing layer and a second reinforcing layer through hot pressing, so that the toughness and tensile strength of the PC board body are improved, and the service life of the PC board body is prolonged.

Description

A-level heat-preservation ceramsite non-bearing PC board

Technical Field

The utility model relates to the technical field of PC boards, in particular to a class A heat-insulating ceramsite non-bearing PC board.

Background

The PC board is a high-tech, extremely excellent in comprehensive performance, energy-saving and environment-friendly plastic board, and is a plastic building material commonly used internationally.

The existing A-level heat-insulating non-bearing PC board is easy to crack and even break due to the fact that the layer structure is thinner and the tensile strength and the toughness are insufficient when the roof installation construction falls down, so that the construction use cost is increased. Therefore, it is necessary to invent a class A heat-insulating ceramsite non-bearing PC board to solve the above problems.

Disclosure of Invention

The utility model aims to provide an A-level heat-insulating ceramsite non-bearing PC board so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a non-bearing PC board of level A heat preservation haydite, includes the PC board body, the middle part of PC board body is provided with the core layer, the core layer includes first PC material layer, heat preservation and second PC material layer, the middle part of core layer is located to the heat preservation, second PC material layer hot pressing is at the upper surface of heat preservation, first PC material layer hot pressing is at the lower surface of heat preservation, the top of core layer is provided with first enhancement layer, the below of core layer is provided with the second enhancement layer, hot pressing is fixed between core layer, first enhancement layer, the second enhancement layer.

Preferably, the first reinforcing layer comprises a first cotton reinforcing mesh layer and an oxidation resistant layer, the first cotton reinforcing mesh layer is hot-pressed on the upper surface of the second PC material layer, and the oxidation resistant layer is hot-pressed on the upper surface of the first cotton reinforcing mesh layer.

Preferably, the second reinforcing layer comprises a second cotton reinforcing mesh layer and a wear-resistant layer, the second cotton reinforcing mesh layer is hot-pressed on the lower surface of the first PC material layer, and the wear-resistant layer is hot-pressed on the lower surface of the second cotton reinforcing mesh layer.

Preferably, the first cotton reinforcing mesh layer and the second cotton reinforcing mesh layer are formed by weaving cotton warp yarns and cotton weft yarns.

Preferably, ninety degrees of angle intersection is formed between the cotton warp and the cotton weft, and the cotton warp and the cotton weft are fixed through hot pressing.

Preferably, the lower surface of the wear-resistant layer is provided with wear-resistant grains, and the wear-resistant grains are equidistantly distributed in multiple groups.

Preferably, the wear-resistant patterns are in a cross-shaped structure.

The utility model has the technical effects and advantages that:

1. the PC board body is formed by hot pressing the core layer, the first reinforcing layer and the second reinforcing layer, so that the toughness and the tensile strength of the PC board body are improved, and the service life is prolonged;

2. the heat preservation layer in the middle of the core layer can improve the heat preservation effect of the PC board body;

3. the first cotton reinforcing net layer and the second cotton reinforcing net layer are woven by cotton warp yarns and cotton weft yarns, so that the PC board body has stronger tensile strength and the whole transparency of the PC board body is not affected.

Drawings

FIG. 1 is a schematic diagram of a grade A heat preservation non-load bearing PC board structure of the utility model.

FIG. 2 is a schematic diagram of a grade A heat preservation non-load bearing PC board structure of the utility model.

Fig. 3 is an enlarged schematic view of the structure of fig. 2 a according to the present utility model.

Fig. 4 is a schematic diagram of cotton warp and cotton weft structures according to the present utility model.

Fig. 5 is a schematic view of the structure of the wear-resistant layer of the present utility model.

In the figure: 1. a PC board body; 2. an oxidation resistant layer; 3. a first cotton reinforcing mesh layer; 4. a heat preservation layer; 5. a first layer of PC material; 6. a wear-resistant layer; 7. cotton warp yarns; 8. cotton weft; 9. wear-resistant lines; 10. a second layer of PC material; 11. and a second cotton reinforcing mesh layer.

Detailed Description

The technical solutions in the embodiments of the present utility model will be made clear below in conjunction with the drawings in the embodiments of the present utility model; it will be apparent that the embodiments described are only some, but not all, of the embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a class A heat-insulating ceramsite non-bearing PC board as shown in figures 1-5, which comprises a PC board body 1, wherein a core layer is arranged in the middle of the PC board body 1, the core layer comprises a first PC material layer 5, a heat-insulating layer 4 and a second PC material layer 10, the heat-insulating layer 4 is positioned in the middle of the core layer, and the heat-insulating layer 4 can be a polyurethane foam heat-insulating layer, is light in material and can improve heat-insulating effect. The second PC material layer 10 hot pressing is at the upper surface of heat preservation 4, and the hot pressing of first PC material layer 5 is at the lower surface of heat preservation 4, and the top of core layer is provided with first enhancement layer, and the below of core layer is provided with the second enhancement layer, and hot pressing is fixed between core layer, first enhancement layer, the second enhancement layer. The toughness and the tensile strength of the PC board body 1 are greatly increased under the combined action of the core layer, the first reinforcing layer and the second reinforcing layer.

The utility model provides a class A heat preservation ceramsite non-bearing PC board as shown in figures 2-3, wherein a first reinforcing layer comprises a first cotton reinforcing net layer 3 and an oxidation resistant layer 2. The first cotton reinforcing mesh layer 3 is hot-pressed on the upper surface of the second PC material layer 10, the antioxidation layer 2 is hot-pressed on the upper surface of the first cotton reinforcing mesh layer 3, and the antioxidation layer 2 can be, but not limited to, a tpe polymer material layer, so that thermal oxidation can be prevented, and ageing of the second PC material layer 10 can be reduced. The first cotton reinforcing net layer 3 is directly bonded on the upper surface of the second PC material layer 10 in a hot pressing mode, and production is facilitated.

The utility model provides a class A heat preservation ceramsite non-bearing PC board as shown in figures 2-3, wherein a second reinforcing layer comprises a second cotton reinforcing net layer 11 and a wear-resistant layer 6. The second cotton reinforcing mesh layer 11 is hot-pressed on the lower surface of the first PC material layer 5, and the wear-resistant layer 6 is hot-pressed on the lower surface of the second cotton reinforcing mesh layer 11. The abrasion-resistant layer 6 can be used for preventing the abrasion of the PC board body 1 by adopting a process of adding a nano coating, and the second cotton reinforcing mesh layer 11 is directly bonded on the lower surface of the first PC material layer 5 in a hot pressing way, so that the production is convenient.

The utility model provides a class A heat preservation ceramsite non-bearing PC board shown in figures 3-4, wherein a first cotton reinforcing net layer 3 and a second cotton reinforcing net layer 11 are woven by cotton warp yarns 7 and cotton weft yarns 8.

The cotton warp 7 and the cotton weft 8 are woven to form the PC board body 1 with stronger tensile strength.

The utility model provides an A-level heat-insulating ceramsite non-bearing PC board shown in fig. 4, wherein ninety degrees of angle intersection is formed between cotton warp 7 and cotton weft 8, the integral transparency of the PC board body 1 is not affected, and the cotton warp 7 and the cotton weft 8 are fixed by hot pressing, so that the tensile strength of the PC board body 1 is further improved.

The utility model provides a class A heat-insulating ceramsite non-bearing PC board shown in figure 5, wherein the lower surface of a wear-resistant layer 6 is provided with wear-resistant grains 9, the wear-resistant grains 9 are equidistantly distributed in a plurality of groups, the wear-resistant grains 9 are in a cross structure, and the wear-resistant grains 9 have an anti-skid effect.

Claims

1. The utility model provides a non-bearing PC board of level A heat preservation haydite, includes PC board body (1), its characterized in that: the middle part of PC board body (1) is provided with the core layer, the core layer includes first PC material layer (5), heat preservation (4) and second PC material layer (10), heat preservation (4) are located the middle part of core layer, the upper surface at heat preservation (4) is hot pressed on second PC material layer (10), the lower surface at heat preservation (4) is hot pressed on first PC material layer (5), the top of core layer is provided with first enhancement layer, the below of core layer is provided with the second enhancement layer, and hot pressing is fixed between core layer, first enhancement layer, the second enhancement layer.

2. The grade-a thermal-insulation ceramsite non-load-bearing PC board according to claim 1, wherein: the first reinforcing layer comprises a first cotton reinforcing net layer (3) and an oxidation resistant layer (2), the first cotton reinforcing net layer (3) is hot-pressed on the upper surface of the second PC material layer (10), and the oxidation resistant layer (2) is hot-pressed on the upper surface of the first cotton reinforcing net layer (3).

3. The grade-a thermal-insulation ceramsite non-load-bearing PC board according to claim 2, wherein: the second reinforcing layer comprises a second cotton reinforcing net layer (11) and a wear-resistant layer (6), the second cotton reinforcing net layer (11) is hot-pressed on the lower surface of the first PC material layer (5), and the wear-resistant layer (6) is hot-pressed on the lower surface of the second cotton reinforcing net layer (11).

4. A grade a thermal-insulating ceramsite non-load-bearing PC board according to claim 3, wherein: the first cotton reinforcing net layer (3) and the second cotton reinforcing net layer (11) are formed by weaving cotton warp yarns (7) and cotton weft yarns (8).

5. The grade-A heat-insulating ceramsite non-load-bearing PC board as defined in claim 4, wherein: ninety-degree angle intersection is formed between the cotton warp (7) and the cotton weft (8), and the cotton warp (7) and the cotton weft (8) are fixed through hot pressing.

6. A grade a thermal-insulating ceramsite non-load-bearing PC board according to claim 3, wherein: the lower surface of the wear-resistant layer (6) is provided with wear-resistant grains (9), and the wear-resistant grains (9) are equidistantly distributed in multiple groups.

7. The grade-a thermal-insulation ceramsite non-load-bearing PC board as defined in claim 6, wherein: the wear-resistant lines (9) are in a cross-shaped structure.