CN219163672U - Temperature compensation attenuator and electronic equipment - Google Patents
Temperature compensation attenuator and electronic equipment Download PDFInfo
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- CN219163672U CN219163672U CN202223370001.4U CN202223370001U CN219163672U CN 219163672 U CN219163672 U CN 219163672U CN 202223370001 U CN202223370001 U CN 202223370001U CN 219163672 U CN219163672 U CN 219163672U
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- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
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- 230000009286 beneficial effect Effects 0.000 description 2
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Abstract
The application provides a temperature compensation attenuator and electronic equipment, wherein the temperature compensation attenuator comprises a substrate, at least two thermistors and a grounding end; at least two thermistors are fixed on the first surface of the matrix, and the grounding end is fixed on the second surface opposite to the first surface; at least two thermistors are electrically connected through at least one intermediate electrode. The temperature compensation attenuator forms a multi-stage microstrip line through at least two thermistors and the grounding end, so that the effect of temperature compensation can be realized without too many electronic devices, and the cost is lower.
Description
Technical Field
The application belongs to the field of temperature compensation, and particularly relates to a temperature compensation attenuator and electronic equipment.
Background
At present, in the working process of active devices such as high frequency devices, microwaves and the like, the problem of temperature drift often occurs along with the increase of working time or the change of environmental temperature, and the characteristic index of the devices, even the stability of the whole system, is seriously influenced.
The existing temperature compensation method generally adopts a hardware circuit formed by a plurality of electronic devices to carry out temperature compensation on the whole system, and has the advantages of more electronic devices and higher cost.
Disclosure of Invention
The purpose of the application is to provide a temperature compensation attenuator and electronic equipment, and aims to solve the problems that the traditional temperature compensation attenuator uses more electronic devices and has higher cost.
In order to achieve the above object, in a first aspect, an embodiment of the present application provides a temperature compensated attenuator, including a substrate, at least two thermistors, a ground terminal, and an intermediate electrode;
the at least two thermistors are fixed on the first surface of the matrix, and the grounding end is fixed on the second surface opposite to the first surface;
the at least two thermistors are electrically connected through at least one intermediate electrode.
In another possible implementation manner of the first aspect, the temperature compensation attenuator further includes an input terminal and an output terminal;
the input end is electrically connected with one end of the at least two thermistors, and the output end is electrically connected with the other end of the at least two thermistors.
In another possible implementation of the first aspect, the at least two thermistors include a first thermistor and a second thermistor, and the at least one intermediate electrode includes a first intermediate electrode;
one end of the first thermistor and one end of the second thermistor are respectively and electrically connected with two ends of the first intermediate electrode.
In another possible implementation manner of the first aspect, the resistance value of the first thermistor is equal to the resistance value of the second thermistor.
In another possible implementation of the first aspect, the at least two thermistors include a third thermistor, a fourth thermistor, and a fifth thermistor, and the at least one intermediate electrode includes a second intermediate electrode and a third intermediate electrode;
the two ends of the second intermediate electrode are respectively and electrically connected with one end of the third thermistor and one end of the fourth thermistor, and the two ends of the third intermediate electrode are respectively and electrically connected with the other end of the fourth thermistor and one end of the fifth thermistor.
In another possible implementation manner of the first aspect, a resistance value of the third thermistor and a resistance value of the fifth thermistor are equal.
In another possible implementation of the first aspect, the at least two thermistors comprise negative temperature coefficient thick film thermistors.
In another possible implementation manner of the first aspect, the intermediate electrode is a gold electrode or a silver palladium electrode, and the substrate is a ceramic substrate.
In another possible implementation manner of the first aspect, the temperature compensation attenuator further includes a resin, and the resin covers the thermistor and the intermediate electrode.
In a second aspect, an embodiment of the present application provides an electronic device including the temperature compensated attenuator.
Compared with the prior art, the embodiment of the application has the beneficial effects that: according to the temperature compensation attenuator, the multistage microstrip line is formed by the at least two thermistors and the grounding end, so that the effect of temperature compensation can be realized without too many electronic devices, and the cost is low.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a temperature compensated attenuator according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of a temperature compensated attenuator provided in an embodiment of the present application;
FIG. 3 is a schematic diagram of a second structure of a temperature compensated attenuator according to an embodiment of the present application;
fig. 4 is a graph of attenuation versus frequency for different temperature conditions of the temperature compensated attenuator according to the embodiment of the present application.
Reference numerals illustrate:
100-matrix, 200-thermistor, 300-ground, 400-intermediate electrode, 500-input, 600-output.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality of" means two or more, unless specifically defined otherwise.
In high-frequency microwave circuits and systems, particularly in the fields of mobile communication systems, navigation systems, radar systems, etc. where temperature characteristics are strict, temperature compensation attenuators are often used to compensate for temperature drift due to temperature changes. However, the conventional temperature compensation attenuator generally adopts a hardware circuit formed by a plurality of electronic devices to perform temperature compensation on the whole system, the electronic devices are more, the cost is higher, and meanwhile, the applicable temperature frequency is generally below 20 CHz.
Therefore, the temperature compensation attenuator is provided, and the multistage microstrip line is formed by the at least two thermistors and the grounding end, so that the effect of temperature compensation can be realized without too many electronic devices, and the cost is low.
The temperature compensated attenuator provided in the present application will be exemplarily described with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of a first structure of a temperature compensated attenuator according to an embodiment of the present application. Fig. 2 is a cross-sectional view of a temperature compensated attenuator provided in an embodiment of the present application. As shown in fig. 1 and 2, an exemplary temperature compensated attenuator includes a substrate 100, at least two thermistors 200, a ground 300, and a middle electrode 400.
At least two thermistors 200 are mounted on a first surface of the substrate 100 and a ground 300 is mounted on a second surface opposite the first surface.
At least two thermistors 200 are electrically connected by at least one intermediate electrode 400.
In the embodiment of the application, the two intermediate electrodes 400 are connected in series with at least two thermistors 200, and the at least two thermistors 200 and the ground terminal 300 are respectively disposed at two sides of the substrate 100, so as to form a multi-stage microstrip line structure for transmitting signals, and meanwhile, the temperature change in the working environment of the circuit is detected in real time through the at least two thermistors 200, and the resistance values of the at least two thermistors 200 are changed along with the change of the environmental temperature, so that the loss of the whole circuit due to the temperature drift in the working environment is compensated.
As shown in fig. 1, the temperature compensated attenuator further illustratively includes an input 500 and an output 600.
The input terminal 500 is electrically connected to one end of at least two thermistors 200, and the output terminal 600 is electrically connected to the other end of at least two thermistors 200.
In the embodiment of the present application, the input terminal 500 and the output terminal 600 are also provided for at least two thermistors 200, so that an input signal is input from the input terminal 500 and output from the output terminal 600. Wherein the input 500 and the output 600 may be symmetrical and interchangeable.
As shown in fig. 1, illustratively, at least two thermistors 200 include a first thermistor and a second thermistor, and at least one intermediate electrode includes a first intermediate electrode.
One end of the first thermistor and one end of the second thermistor are respectively and electrically connected with two ends of the first intermediate electrode.
In this embodiment, two ends of the first thermistor are electrically connected to the input end 500 and one end of the first intermediate electrode, respectively, and two ends of the second thermistor are electrically connected to the output end 600 and the other end of the first intermediate electrode, respectively, so as to form a temperature compensation attenuator with a series structure of two thermistors.
The widths of the first intermediate electrode and the two thermistors are selected to be 0.25-0.37 mm, preferably 0.25mm. The width is generally preferably the width of the 50 ohm microstrip line, but is not limited to the width of the 50 ohm microstrip line, and the width of the microstrip line can be appropriately adjusted according to the thermal sensitive material selected. The motor paste of the first intermediate electrode, the input end electrode and the output end electrode can be gold electrode or silver palladium electrode. Since the working frequency in the embodiment of the application is generally about 30GHz, gold electrodes can be selected. Meanwhile, the length of the first intermediate electrode can be generally 0.6-1.2 mm, and the working frequency range of the temperature compensation attenuator can be correspondingly adjusted by adjusting the length of the first intermediate electrode. Wherein, the substrate 100 can be 96 ceramics with the thickness of 0.25mm, the length and the width of the substrate 100 can be 3.0mm, and the width of the substrate can be 1.7mm. The electrode paste of the grounding terminal 300 may be silver palladium electrode, so as to play a role of the grounding terminal of the microwave microstrip line.
In addition, in the embodiment of the application, the attenuation of the temperature compensation attenuator is 2dB at 18-32 GHz, the first thermistor and the second thermistor are thick film thermistors with negative temperature coefficients, the resistance values of the first thermistor and the second thermistor are all preferably 15 ohms, and the effective lengths of the first thermistor and the second thermistor are preferably 0.10 mm. Meanwhile, for moisture and oxidation prevention, the first intermediate electrode and the upper parts of the two thermistors may be covered with a resin.
Illustratively, the resistance of the first thermistor is equal to the resistance of the second thermistor.
In this embodiment of the present application, the resistance of the first thermistor and the resistance of the second thermistor may be set to be equal, so as to form a temperature compensation attenuator with two symmetrical sides, where the input end and the output end are also symmetrically set and may be replaced with each other.
Fig. 3 is a schematic diagram of a second structure of a temperature compensated attenuator according to an embodiment of the present application. As shown in fig. 3, illustratively, at least two thermistors 200 include a third thermistor, a fourth thermistor, and a fifth thermistor, and at least one intermediate electrode 400 includes a second intermediate electrode and a third intermediate electrode.
The two ends of the second intermediate electrode are respectively and electrically connected with one end of the third thermistor and one end of the fourth thermistor, and the two ends of the third intermediate electrode are respectively and electrically connected with the other end of the fourth thermistor and one end of the fifth thermistor.
In this embodiment of the present application, two ends of the third thermistor are electrically connected to the input end 500 and one end of the second intermediate electrode, two ends of the fourth thermistor are electrically connected to the other end of the second intermediate electrode and one end of the third intermediate electrode, and two ends of the fifth thermistor are electrically connected to the other end of the third intermediate electrode and the output end 600, respectively, so as to form a temperature compensation attenuator of three thermistor serial structures.
The widths of the two intermediate electrodes and the three thermistors can be selected to be 0.25-0.37 mm, preferably 0.25mm. The width is generally preferably the width of the 50 ohm microstrip line, but is not limited to the width of the 50 ohm microstrip line, and the width of the microstrip line can be appropriately adjusted according to the thermal sensitive material selected. The motor paste of the second intermediate electrode, the third intermediate electrode, the input end electrode and the output end electrode can be gold electrodes or silver palladium electrodes. In the embodiment of the application, the working frequency is generally about 30GHz, so that a gold electrode is selected. The lengths of the second intermediate electrode and the third intermediate electrode can be the same or different, and the working frequency range of the temperature compensation attenuator can be adjusted.
Meanwhile, the lengths of the second intermediate electrode and the third intermediate electrode can be generally selected to be 0.6-1.1 mm, the lengths of the second intermediate electrode and the third intermediate electrode can be selected to be 1.0mm, the third thermistor and the fifth thermistor can be selected to be Negative Temperature Coefficient (NTC) thermistors with the resistance value of 28 ohms, and the fourth thermistor can be selected to be Negative Temperature Coefficient (NTC) thermistors with the resistance value of 38.5 ohms. The third thermistor, the fourth thermistor and the fifth thermistor can be processed by adopting a thick film process, and the resistance value of the thick film thermistor can be accurately adjusted by laser group adjustment, but if the group adjustment is excessive, the microwave frequency characteristic is affected, so that the group adjustment is as little as possible, or the group adjustment is not performed, and the desired resistance value is realized directly by the thick film process. The substrate 100 may be 96 ceramic with a thickness of 0.25mm, the length of the substrate 100 may be 3.0mm, and the width of the substrate 100 may be 1.7mm. The electrode paste of the grounding terminal 300 may be silver palladium electrode, so as to play a role of the grounding terminal of the microwave microstrip line.
In addition, the attenuation amount of the temperature compensation attenuator is 6dB at 18-36 GHz, and the third thermistor, the fourth thermistor and the fifth thermistor are thick film thermistors with negative temperature coefficients. The effective length of the third thermistor, the fourth thermistor and the fifth thermistor is preferably 0.12 mm. Meanwhile, for the purpose of moisture resistance and oxidation resistance, resin can be covered above the two middle electrodes and the three thermistors.
Illustratively, the resistance of the third thermistor is equal to the resistance of the fifth thermistor.
In this embodiment of the present application, the resistance of the third thermistor and the resistance of the fifth thermistor may be set equal, so as to form a temperature compensation attenuator with two symmetrical sides, where the input end and the output end are also symmetrically set and may be replaced with each other.
Fig. 4 is a graph of attenuation versus frequency for different temperature conditions of the temperature compensated attenuator according to the embodiment of the present application. As shown in fig. 4, the middle curve is the test result of the temperature compensation attenuator of 6dB at normal temperature of 25 ℃; when the temperature is increased to 85 ℃, the attenuation amount is reduced, namely, the attenuation amount is reduced when the temperature is normal; when the temperature is reduced to-40 ℃, the attenuation amount is increased, namely, when the temperature is reduced to minus temperature, the attenuation amount is increased, so that the attenuation amount of the temperature compensation attenuator is reduced along with the increase of the temperature, and along with the decrease of the temperature, the attenuation amount is increased, and the attenuation amount is opposite to the temperature drift characteristic of the whole system circuit, so that the loss of the whole circuit caused by temperature drift in the working environment can be effectively compensated, and the stability of the whole system is improved.
Exemplary, embodiments of the present application provide an electronic device including a temperature compensated attenuator.
In the embodiment of the application, the temperature compensation attenuator can be installed in electronic equipment, and a multi-stage microstrip line is formed by at least two thermistors and a grounding end, so that the effect of temperature compensation can be realized without too many electronic devices, and the cost is lower.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic of each process, and should not limit the implementation process of the embodiment of the present application in any way.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the electronic device may refer to the corresponding process in the foregoing embodiment, which is not described herein again.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or as a combination of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided herein, it should be understood that the disclosed temperature compensated attenuator may be implemented in other ways. For example, the temperature compensated attenuator embodiments described above are merely illustrative, e.g., the division of modules or units is merely a logical functional division, and there may be additional divisions in actual implementation, e.g., multiple units or components may be combined or integrated into another electronic device, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via a number of multi-interface electronic devices, apparatuses or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. The temperature compensation attenuator is characterized by comprising a substrate, at least two thermistors, a grounding end and an intermediate electrode;
the at least two thermistors are fixed on the first surface of the matrix, and the grounding end is fixed on the second surface opposite to the first surface;
the at least two thermistors are electrically connected through at least one intermediate electrode.
2. The temperature-compensated attenuator of claim 1, further comprising an input and an output;
the input end is electrically connected with one end of the at least two thermistors, and the output end is electrically connected with the other end of the at least two thermistors.
3. The temperature-compensated attenuator of claim 1, wherein the at least two thermistors comprise a first thermistor and a second thermistor, and the at least one intermediate electrode comprises a first intermediate electrode;
one end of the first thermistor and one end of the second thermistor are respectively and electrically connected with two ends of the first intermediate electrode.
4. The temperature-compensated attenuator of claim 3, wherein the resistance of the first thermistor and the resistance of the second thermistor are equal.
5. The temperature-compensated attenuator of claim 1, wherein the at least two thermistors comprise a third thermistor, a fourth thermistor, and a fifth thermistor, and the at least one intermediate electrode comprises a second intermediate electrode and a third intermediate electrode;
the two ends of the second intermediate electrode are respectively and electrically connected with one end of the third thermistor and one end of the fourth thermistor, and the two ends of the third intermediate electrode are respectively and electrically connected with the other end of the fourth thermistor and one end of the fifth thermistor.
6. The temperature-compensated attenuator of claim 5, wherein the resistance of the third thermistor is equal to the resistance of the fifth thermistor.
7. The temperature-compensated attenuator of any of claims 1-6, wherein the at least two thermistors comprise negative temperature coefficient thick film thermistors.
8. The temperature-compensated attenuator of any of claims 1-6, wherein the intermediate electrode is a gold electrode or a silver palladium electrode and the substrate is a ceramic substrate.
9. The temperature-compensated attenuator of any of claims 1-6, further comprising a resin covering the thermistor and the intermediate electrode.
10. An electronic device comprising a temperature compensated attenuator as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223370001.4U CN219163672U (en) | 2022-12-14 | 2022-12-14 | Temperature compensation attenuator and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223370001.4U CN219163672U (en) | 2022-12-14 | 2022-12-14 | Temperature compensation attenuator and electronic equipment |
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| Publication Number | Publication Date |
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| CN219163672U true CN219163672U (en) | 2023-06-09 |
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| CN202223370001.4U Active CN219163672U (en) | 2022-12-14 | 2022-12-14 | Temperature compensation attenuator and electronic equipment |
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| CN (1) | CN219163672U (en) |
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Address after: No. 308-322, 3rd floor, Building 1, Xili Xinyuan Industrial Plant, No. 35, Wenyuan Street, Xili Community, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Yantong High Frequency Technology Co.,Ltd. Address before: No. 308-322, 3rd floor, Building 1, Xili Xinyuan Industrial Plant, No. 35, Wenyuan Street, Xili Community, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: YANTEL Corp. |
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