CN219162649U - Forward ventilation type computer host heat dissipation structure - Google Patents
Forward ventilation type computer host heat dissipation structure Download PDFInfo
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- CN219162649U CN219162649U CN202223332611.5U CN202223332611U CN219162649U CN 219162649 U CN219162649 U CN 219162649U CN 202223332611 U CN202223332611 U CN 202223332611U CN 219162649 U CN219162649 U CN 219162649U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a heat radiation structure of a forward ventilation type computer host, which comprises a heat radiation component and a heat radiation hole, wherein the heat radiation component is arranged in the computer host and is close to a front side panel of the computer host; the front air inlet channel and the heat dissipation air outlet channel form a heat dissipation convection channel in the front and back directions of the computer host, heat generated by heating components in the computer host is taken away from the front to the back under the drive of the heat dissipation component, and the heat is blown out from the heat dissipation air outlet channel on the back side panel, so that the purpose of comprehensively and efficiently dissipating the heat in the computer host is realized.
Description
Technical Field
The utility model relates to the technical field of computer heat dissipation, in particular to a forward ventilation type computer host heat dissipation structure.
Background
Along with the continuous improvement of living standard, computers are indispensable for household, wherein a computer host is one of indispensable devices in the process of using the computer, and the computer host is core equipment of the whole computer, wherein a case in the computer host is one of indispensable components of the computer host. The computer host generates more heat in the computer host under the long-time working state, and the running performance of the computer host is seriously affected by the heat accumulation, so that the heat dissipation and the temperature reduction of the computer host are important problems to be solved in the computer industry.
The technical scheme adopted by the patent application with the application number of CN201721880831.8 is to provide a radiating dustproof computer mainframe box, which comprises a box body, wherein an air inlet is formed in one end of the box body, an air outlet is formed in the other end of the box body, an air inlet fan is arranged in the air inlet, a primary filter screen is arranged at the end part of the air inlet, and the primary filter screen is in threaded connection with the end part of the air inlet; the air inlet is provided with a socket, the socket is internally provided with a high-efficiency filter plate, and the air outlet is internally provided with an exhaust fan; the utility model provides a radiating dustproof computer mainframe box, wherein a two-stage filtering device is arranged at an air inlet to well filter foreign matters and dust in air and prevent the foreign matters and dust from entering the mainframe box. Meanwhile, the semiconductor refrigeration piece and the water circulation are adopted for refrigeration, so that the effect of high-efficiency cooling is achieved, and meanwhile, the noise of cooling is low.
In the above-mentioned scheme, although the opposite direction heat dissipation air outlet channel is formed through the air inlet and the air outlet which are opened in opposite direction, in practical application production, for the aesthetic property of the computer host, the air inlet is generally not opened on the forward face of the front side panel of the computer host, therefore, the existing computer host adopts the side face or the top to open the air inlet, but the air inlet which is opened in this way cannot form linear convection with the air outlet on the back side panel of the computer host, and part of heating components in the computer host do not fall on the heat dissipation paths of the air inlet and the air outlet, so that the heat dissipation effect is poor.
Disclosure of Invention
In order to overcome the problems in the prior art, the utility model provides a forward ventilation type computer host heat dissipation structure, which can form a forward and backward heat dissipation convection channel of the computer host while ensuring the attractiveness of the computer host, so as to realize the purpose of comprehensively and efficiently dissipating heat inside the computer host.
In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides a forward ventilation formula computer host computer heat radiation structure, it includes the radiator unit that sets up in the inside and near the computer host computer front panel setting of computer host and the louvre that the relative radiator unit was seted up on the computer host back side board, form forward air inlet passageway between radiator unit and the front panel, form the heat dissipation air-out passageway between radiator unit and the louvre, radiator unit is used for sucking the air current of forward air inlet passageway to the inside of computer host and blows out the inside air current of computer host from the heat dissipation air-out passageway.
Preferably, the heat dissipation assembly comprises a fan mounting plate and an air inlet position heat dissipation component arranged on the fan mounting plate, the fan mounting plate is arranged inside the computer host and is close to the front side panel of the computer host, and a forward air inlet channel is arranged between the fan mounting plate and the front side panel.
Preferably, the air inlet position radiating component is an air inlet position radiating fan, and the air flow sweeping direction of the air inlet position radiating fan is from one side of the front air inlet channel to one side of the heat radiation air outlet channel.
Preferably, the air inlet of the forward air inlet channel is arranged at the lower end of the front side panel of the computer, and the opening direction is downward.
Preferably, a gap height difference is arranged between the lower end of the front side panel of the computer and the lowest position of the heightened shock-proof pad foot of the computer host.
Preferably, the heat dissipation hole of the back side panel is provided with an air outlet heat dissipation part, and the air outlet heat dissipation part is used for blowing air flow in the computer host to the outside of the computer host from the heat dissipation air outlet channel.
Preferably, the air outlet position radiating component is an air outlet position radiating fan, and the air flow sweeping direction of the air outlet position radiating fan is from the inside of the computer host to the outside of the computer host.
Preferably, a top air flow channel is arranged at the top of the computer host, and the top air flow channel is arranged opposite to the installation position of the display card driving part inside the computer host.
Preferably, a top air flow channel is arranged at the bottom of the computer host, and the bottom air flow channel is arranged opposite to a power supply installation position inside the computer host.
Preferably, the top airflow channel and the bottom airflow channel are both provided with dustproof screens.
The beneficial effects of the utility model are as follows:
1. according to the utility model, the forward air inlet channel is formed between the heat radiating component and the front side panel, and the heat radiating air outlet channel is formed between the heat radiating component and the heat radiating hole, so that the forward air inlet channel and the heat radiating air outlet channel form a forward and backward heat radiating convection channel of the computer host, heat generated by heating components in the computer host is taken away from front to back under the drive of the heat radiating component, and the heat is blown out from the heat radiating hole on the back side panel, so that the purpose of comprehensively and efficiently radiating the inside of the computer host is realized.
2. According to the utility model, the air outlet position cooling fan is arranged on the cooling hole of the back side panel, and the air flow sweeping direction of the air outlet position cooling fan is from the inside of the computer host to the outside of the computer host, so that the air flow in the computer host is actively blown to the outside of the computer host through the cooling hole, and the cooling efficiency of the computer host is further improved.
3. The utility model can directly blow the external air flow to the display card driving part and the computer host power supply which are arranged in the computer host by arranging the top air flow channel and the bottom air flow channel, and provide additional heat dissipation air flow for the display card driving part and the computer host power supply so as to pertinently improve the heat dissipation efficiency of the heating device in the computer host.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipation structure of a front-ventilated computer host according to an embodiment of the utility model.
Fig. 2 is a schematic diagram of another perspective structure of a heat dissipation structure of a front-ventilated computer host according to an embodiment of the utility model.
Fig. 3 is a schematic cross-sectional view of a heat dissipation structure of a front-ventilated computer host according to an embodiment of the utility model.
Fig. 4 is an enlarged schematic view of the portion a in fig. 3.
The components in the drawings are marked as follows:
1. a computer host; 101. a forward air inlet channel; 102. a heat dissipation air outlet channel; 103. a top gas flow passage; 104. a bottom gas flow channel; 11. a front panel; 111. a forward face; 112. a lower connection surface; 101a, an air inlet; 12. a heat dissipation assembly; 121. a fan mounting plate; 122. an air inlet position cooling fan; 13. a back side panel; 131. a heat radiation hole; 132. an air outlet heat radiation fan; 14. heightening the shock-proof pad foot.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.
The embodiment of the utility model provides a heat dissipation structure of a forward ventilation type computer host, as shown in fig. 1 to 4, the heat dissipation structure comprises a heat dissipation component 12 arranged inside a computer host 1 and close to a front side panel 11 of the computer host 1, and a heat dissipation hole 131 arranged on a back side panel 13 of the computer host 1 relative to the heat dissipation component 12, wherein a forward air inlet channel 101 is formed between the heat dissipation component 12 and the front side panel 11, a heat dissipation air outlet channel 102 is formed between the heat dissipation component 12 and the heat dissipation hole 131, and the heat dissipation component 12 is used for sucking air flow of the forward air inlet channel 101 into the computer host 1 and blowing out air flow inside the computer host 1 from the heat dissipation air outlet channel 102, so that all heating devices arranged inside the computer host 1 are comprehensively dissipated.
The installation cavity of the computer driving device is arranged between the front side panel 11 and the back side panel 13 of the computer host 1, in the installation cavity, the important heating components such as the computer CPU, the display card and the main board are respectively arranged on the side plate of the host from front to back, the heat dissipation convection channel circulates from front to back, and the important heating components such as the computer CPU, the display card and the main board are all arranged on the heat dissipation convection channel.
The heat dissipation assembly 12 comprises a fan mounting plate 121 and an air inlet position heat dissipation component; as shown in fig. 1 to 3, the fan mounting plate 121 is disposed inside the computer host 1 and near the front panel 11 of the computer host 1, and the airflow holes are uniformly distributed on the fan mounting plate 121, and the air inlet heat dissipation component is specifically an air inlet heat dissipation fan 122, and the airflow blowing direction of the air inlet heat dissipation fan 122 is from the side of the front air inlet channel 101 to the side of the heat dissipation air outlet channel 102.
As shown in fig. 3, a certain space is reserved between the front side panel 11 and the fan mounting plate 121, and the space is the front air inlet channel 101, and an air inlet 101a of the front air inlet channel 101 is formed at the side of the computer host 1; in order to avoid influencing the use of the computer, the air inlet 101a of the forward air inlet channel 101 is preferably formed at the bottom of the computer host 1.
As shown in fig. 3 and 4, the front panel 11 of the computer includes a front surface 111 and four side connecting surfaces, i.e., upper, lower, left and right side connecting surfaces, which extend rearward from the upper, lower, left and right outer edges of the front surface 111 and are connected to the side panels of the computer host 1. The front surface 111 of the front panel 11 of the computer is not provided with any vent hole, the air inlet 101a of the front air inlet channel 101 is arranged on the lower connecting surface 112 of the front panel 11, and the opening direction is downward; the bottom of the computer host 1 is provided with a heightening shock pad foot 14, and a gap height difference is arranged between the lower side connecting surface 112 of the computer front panel 11 and the lowest position of the heightening shock pad foot 14, and the gap height difference forms an air inlet space of the forward air inlet channel 101. Preferably, the fan mounting plate 121 is provided with a dust screen on a side opposite to the forward air intake passage 101.
When external air flow enters the forward air inlet channel 101 through the air inlet 101a at the bottom of the computer host 1, the air inlet position cooling fan 122 sucks the air flow in the forward air inlet channel 101 into the computer host 1, takes away heat generated by important heating components such as a CPU, a display card and a main board from front to back, and blows out the heat generated by the important heating components from the heat dissipation holes 131 on the back side panel 13, so as to form a cooling convection channel penetrating through the whole computer driving device mounting cavity from front to back, and achieve the purpose of comprehensively and efficiently cooling the inside of the computer host 1.
As shown in fig. 1 and 3, the heat dissipation hole 131 of the back side panel 13 is provided with an air outlet heat dissipation component, the air outlet heat dissipation component is an air outlet heat dissipation fan 132, and the air flow purging direction of the air outlet heat dissipation fan 132 is from the inside of the computer host 1 to the outside of the computer host 1, so that the air flow inside the computer host 1 is actively blown to the outside of the computer host 1 through the heat dissipation hole 131, and the heat dissipation efficiency of the computer host 1 is further improved.
In addition, as shown in fig. 1, a top air flow channel 103 is disposed at the top of the computer host 1, the top air flow channel 103 is disposed opposite to the mounting position of the display card driving component inside the computer host 1, and external air flow can enter the inside of the computer host 1 through the top air flow channel 103 and directly blow to the display card driving component mounted inside the computer host 1, so as to provide additional heat dissipation air flow for the display card driving component, thereby improving the heat dissipation efficiency of the display card driving component.
The bottom of the computer host 1 is provided with a bottom air flow channel 104, the bottom air flow channel 104 is arranged relative to the power supply installation position inside the computer host 1, and external air flow can enter the computer host 1 through the bottom air flow channel 104 and directly blow to the power supply of the computer host 1 installed inside the computer host 1, so as to provide additional heat dissipation air flow for the power supply of the computer host 1 and improve the heat dissipation efficiency of the power supply of the computer host 1 in a targeted manner.
In order to prevent dust from being carried into the computer 1 by external air flow, dust screens are arranged on the top air flow channel 103 and the bottom air flow channel 104.
The foregoing is only illustrative of the present utility model and is not to be construed as limiting the scope of the utility model, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the present utility model and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the utility model.
Claims (10)
1. The utility model provides a forward ventilation formula computer host computer heat radiation structure which characterized in that, including set up in the inside and the radiating component that is close to the setting of computer host computer front panel of computer host and the louvre of arranging on the computer host back side board relative radiating component, form forward air inlet passageway between radiating component and the front side board, form the heat dissipation air-out passageway between radiating component and the louvre, radiating component is used for sucking the air current of forward air inlet passageway to the inside of computer host and blows out the air current of computer host inside from the heat dissipation air-out passageway.
2. The structure of claim 1, wherein the heat dissipation assembly comprises a fan mounting plate and an air inlet heat dissipation part mounted on the fan mounting plate, the fan mounting plate is disposed inside the computer and near a front panel of the computer, and a forward air inlet channel is disposed between the fan mounting plate and the front panel.
3. The front-ventilation type computer host heat dissipation structure according to claim 2, wherein the air inlet position heat dissipation component is an air inlet position heat dissipation fan, and the air flow sweeping direction of the air inlet position heat dissipation fan is from one side of the front air inlet channel to one side of the heat dissipation air outlet channel.
4. The heat dissipating structure of the front-vented computer host of claim 1, wherein the air inlet of the front-vented air inlet is disposed at the lower end of the front panel of the computer with the opening direction facing downward.
5. The heat dissipating structure of the front-vented computer host of claim 4, wherein a gap height difference is provided between the lower end of the front side panel of the computer and the lowest position of the raised crash pad foot of the computer host.
6. The heat dissipating structure of the front-vented computer host of claim 1, wherein the heat dissipating hole of the back side panel is provided with an air outlet heat dissipating member for blowing the air flow inside the computer host from the heat dissipating air outlet channel to outside the computer host.
7. The structure of claim 6, wherein the heat dissipation component is an air-out heat dissipation fan, and the direction of air flow of the air-out heat dissipation fan is from the inside of the computer to the outside of the computer.
8. The front-vented computer host heat dissipation structure of claim 1, wherein the top of the computer host is provided with a top air flow channel, and the top air flow channel is disposed opposite to a display card driving component mounting position inside the computer host.
9. The heat dissipating structure of the front-vented computer host of claim 8, wherein the bottom of the computer host is provided with a bottom air flow channel, and wherein the bottom air flow channel is disposed opposite to a power supply mounting location inside the computer host.
10. The front-vented computer host heat dissipating structure of claim 9, wherein the top airflow channel and the bottom airflow channel are each provided with a dust screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223332611.5U CN219162649U (en) | 2022-12-13 | 2022-12-13 | Forward ventilation type computer host heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223332611.5U CN219162649U (en) | 2022-12-13 | 2022-12-13 | Forward ventilation type computer host heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219162649U true CN219162649U (en) | 2023-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223332611.5U Active CN219162649U (en) | 2022-12-13 | 2022-12-13 | Forward ventilation type computer host heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219162649U (en) |
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2022
- 2022-12-13 CN CN202223332611.5U patent/CN219162649U/en active Active
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