CN219161502U

CN219161502U - Indoor temperature monitoring equipment and system

Info

Publication number: CN219161502U
Application number: CN202223538772.XU
Authority: CN
Inventors: 王越; 梁康康
Original assignee: Beijing Tiansheng Taifeng Internet Of Things Technology Co ltd
Current assignee: Beijing Tiansheng Taifeng Internet Of Things Technology Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-06-09
Anticipated expiration: 2032-12-29

Abstract

The specification relates to the technical field of indoor temperature monitoring, and particularly discloses indoor temperature monitoring equipment and a system, wherein the equipment comprises a battery module, a PCB main board, a temperature sensor and a shell; the shell is used for accommodating the battery module and the PCB main board; the battery module is used for supplying power to the PCB main board and the temperature sensor; the temperature sensor is connected with the PCB main board and is arranged on the PCB main board; the casing is provided with a preformed hole corresponding to the temperature sensor, and the temperature sensor can pass through the preformed hole to be in direct contact with indoor air so as to monitor indoor temperature. The equipment can monitor indoor temperature in real time, does not need to go to the door for temperature measurement and investigation, and can effectively improve efficiency.

Description

Indoor temperature monitoring equipment and system

Technical Field

The present disclosure relates to the field of indoor temperature monitoring technologies, and in particular, to an indoor temperature monitoring device and system.

Background

Along with the development of digital city construction, the popularization of electronic equipment has become normal, and intelligent equipment is more various, so that people feel convenient and fast, the life quality is improved, and especially the household intelligent equipment is an indispensable part of daily life. When the winter heating season comes, heating is not up to standard in some areas due to ageing inside the pipelines, and related staff are usually required to be dispatched by a thermal company to conduct door-to-door temperature measurement and investigation, so that manpower is wasted, and efficiency is low.

In view of the above problems, no effective solution has been proposed at present.

Disclosure of Invention

The embodiment of the specification provides indoor temperature monitoring equipment and system, which are used for solving the technical problems of low temperature measurement and investigation efficiency and high cost in the prior art.

The embodiment of the specification provides an indoor temperature monitoring device, which comprises: the device comprises a battery module, a PCB main board, a temperature sensor and a shell;

the shell is used for accommodating the battery module and the PCB main board;

the battery module is used for supplying power to the PCB main board and the temperature sensor;

the temperature sensor is connected with the PCB main board and is arranged on the PCB main board; the casing is provided with a preformed hole corresponding to the temperature sensor, and the temperature sensor can pass through the preformed hole to be in direct contact with indoor air so as to monitor indoor temperature.

In one embodiment, the housing comprises a front housing and a rear housing, the front housing is provided with the preformed hole, the rear housing is provided with a housing fixing frame, and the housing fixing frame is used for fixing the rear housing on an indoor roof or a ceiling.

In one embodiment, the housing mount is secured to an indoor roof or ceiling by expansion tubes and self-tapping screws.

In one embodiment, the temperature sensor has a humidity sensing function integrated thereon to monitor indoor humidity.

In an embodiment, an internet of things module is arranged on the PCB main board, and the internet of things module is used for uploading the temperature data detected by the temperature sensor to an internet of things platform.

In one embodiment, the internet of things module is a narrowband communication chip.

In one embodiment, the PCB main board determines whether the temperature data meets a preset condition, and uploads the temperature data to the internet of things platform through the internet of things module when the temperature data meets the preset condition.

In one embodiment, an alarm is further arranged on the PCB main board, and the PCB main board alarms through the alarm when the temperature data meets the preset condition.

The embodiment of the specification also provides an indoor temperature monitoring system, which comprises:

the indoor temperature monitoring device described in any of the above embodiments;

and the internet of things platform is in communication connection with the indoor temperature monitoring equipment, so as to receive the temperature data detected by the indoor temperature monitoring equipment and generate alarm information according to the temperature data.

In one embodiment, the internet of things platform is further configured to send the alarm information to a client corresponding to a manager.

In an embodiment of the present disclosure, an indoor temperature monitoring device is provided, including a battery module, a PCB main board, a temperature sensor, and a housing; the shell is used for accommodating the battery module and the PCB main board; the battery module is used for supplying power to the PCB main board and the temperature sensor; the temperature sensor is connected with the PCB main board and is arranged on the PCB main board; the casing is provided with a preformed hole corresponding to the temperature sensor, and the temperature sensor can pass through the preformed hole to be in direct contact with indoor air so as to monitor indoor temperature. In the above-mentioned scheme, temperature sensor in the indoor temperature monitoring equipment can pass the preformed hole on the casing and contact indoor air, can improve indoor temperature measurement's precision, can preset the processing through setting up the PCB mainboard and can be sent to the server for example, need not the staff and go up the investigation, can improve efficiency, practice thrift the cost.

Drawings

The accompanying drawings are included to provide a further understanding of the specification, and are incorporated in and constitute a part of this specification. In the drawings:

fig. 1 is a schematic structural view showing an indoor temperature monitoring apparatus according to an embodiment of the present disclosure;

FIG. 2 shows an enlarged schematic view of a preformed hole of an indoor temperature monitoring device in an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a PCB main board in an embodiment of the present disclosure;

fig. 4 shows a schematic diagram of an indoor temperature monitoring system in an embodiment of the present specification.

Detailed Description

The principles and spirit of the present specification will be described below with reference to several exemplary embodiments. It should be understood that these embodiments are presented merely to enable one skilled in the art to better understand and practice the present description, and are not intended to limit the scope of the present description in any way. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

Those skilled in the art will appreciate that the embodiments of the present description may be implemented as a system, apparatus, method, or computer program product. Accordingly, the present disclosure may be embodied in the form of: complete hardware, complete software (including firmware, resident software, micro-code, etc.), or a combination of hardware and software.

The embodiment of the specification provides indoor temperature monitoring equipment. Fig. 1 is a schematic structural view of an indoor temperature monitoring apparatus according to an embodiment of the present disclosure. As shown in fig. 1, the indoor temperature monitoring apparatus may include a battery module 10, a PCB main board 20, a temperature sensor 30, and a housing.

The case may serve to accommodate the battery module 10 and the PCB main board 20.

The battery module 10 may be used to power the PCB main board 20 and the temperature sensor 30. The plug connector of the battery module 10 can be plugged with a socket on the PCB main board 20, and provides electricity for the PCB main board 20 at ordinary times.

The temperature sensor 30 is connected to the PCB main board 20, and may be disposed on the PCB main board 20. The housing is provided with a preformed hole 43 corresponding to the temperature sensor 30.

Referring to fig. 2, an enlarged schematic view of a preformed hole of the indoor temperature monitoring apparatus in an embodiment of the present disclosure is shown. As shown in fig. 2, the temperature sensor 30 can be in direct contact with the indoor air through the preformed hole 43 to monitor the indoor temperature.

In the above embodiment, the temperature sensor in the indoor temperature monitoring device can pass through the preformed hole on the shell to contact with indoor air, so that the accuracy of indoor temperature measurement can be improved, the received temperature data can be subjected to preset processing by arranging the PCB main board, for example, the received temperature data can be sent to a server, the operator is not required to go to the door for checking, the efficiency can be improved, and the cost is saved.

With continued reference to fig. 1, as shown in fig. 1, in some embodiments of the present disclosure, the housing includes a front shell 41 and a rear shell 42, the front shell 41 is provided with the preformed hole 43, and the rear shell 42 is provided with the housing fixing frame 44. The housing mount 44 may be used to mount the rear housing to an indoor roof or ceiling.

In some embodiments of the present disclosure, the housing mount 44 may be secured to an indoor roof or ceiling by expansion tubes and self-tapping screws.

In some embodiments of the present disclosure, the temperature sensor 30 may also have a humidity sensing function integrated thereon to monitor indoor humidity. For example, the temperature sensor may be a temperature and humidity sensor.

Referring to fig. 3, a schematic structural diagram of a PCB motherboard in an embodiment of the present disclosure is shown. As shown in fig. 3, in some embodiments of the present disclosure, an internet of things module 21 is disposed on the PCB main board, and the internet of things module 21 may be configured to upload temperature data detected by the temperature sensor 30 to an internet of things platform.

In some embodiments of the present disclosure, the internet of things module is a narrowband communication chip. That is, the internet of things module may be an NB module and the internet of things platform may be an NB-IoT platform.

In some embodiments of the present disclosure, the PCB main board 20 may determine whether the temperature data meets a preset condition, and upload the temperature data to an internet of things platform through the internet of things module 21 when the temperature data meets the preset condition.

In one embodiment, the temperature data is determined to satisfy a preset condition when the temperature data indicates that the temperature is above or below a normal temperature value.

In another embodiment, the temperature data is determined to satisfy the preset condition when the temperature data indicates that the temperature is not within the preset temperature range.

In some embodiments of the present disclosure, an alarm is further disposed on the PCB main board, and the PCB main board alarms through the alarm when the temperature data meets a preset condition.

In this embodiment, the alarm may be a voice alarm, a vibration alarm, or an optical alarm. Through the mode, residents can be reminded that the temperature does not meet the preset condition, and the user can feed back to the manager conveniently.

In one embodiment of the present disclosure, the indoor temperature monitoring device may be installed in a flat area of an indoor roof or ceiling, and the housing mount is fixed by expansion pipes and self-tapping screws. Besides the shell, the indoor temperature monitoring equipment is internally composed of a battery module, an NB module (narrow band communication chip) and a digital temperature and humidity sensor. The NB module and the digital temperature and humidity sensor are part of the PCB main board (shown in fig. 3), the PCB main board is fixed on the rear shell of the shell, the battery module plug connector is plugged with a socket on the PCB main board, electric quantity is provided for the main board at ordinary times, the digital temperature and humidity sensor module is just outside a reserved hole of the front shell (shown in fig. 2), the sensor can directly contact with indoor air, measured temperature and humidity are more accurate, when indoor temperature or humidity is higher than or lower than a normal value, the temperature and humidity are automatically judged through an internal program, data are uploaded to an NB-IoT platform, and relevant personnel are timely notified through a mobile phone App.

In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. Specific reference may be made to the foregoing description of related embodiments of the related process, which is not described herein in detail.

The foregoing describes specific embodiments of the present disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

Based on the same inventive concept, an indoor temperature monitoring system is also provided in the embodiments of the present specification, as described in the following embodiments. Because the principle of solving the problem of the indoor temperature monitoring system is similar to that of the indoor temperature monitoring device, the implementation of the indoor temperature monitoring system can be referred to the implementation of the indoor temperature monitoring device, and the repetition is omitted. Fig. 4 is a block diagram of an indoor temperature monitoring system according to an embodiment of the present disclosure, and as shown in fig. 4, an indoor temperature monitoring system 40 may include: the indoor temperature monitoring device 401 and the internet of things platform 402 described in any of the above embodiments are described below.

The internet of things platform 402 may be communicatively connected with the indoor temperature monitoring device 401, so as to receive temperature data detected by the indoor temperature monitoring device 401, and generate alarm information according to the temperature data.

As shown in fig. 4, a plurality of indoor temperature monitoring devices 401 may be communicatively connected to an internet of things platform 402.

In some embodiments of the present disclosure, the internet of things platform 402 is further configured to send the alarm information to a client corresponding to a manager. For example, the alarm information can be sent to the client corresponding to the manager in a short message or APP message pushing mode.

From the above description, it can be seen that the following technical effects are achieved in the embodiments of the present specification: the temperature sensor in the indoor temperature monitoring equipment can pass through the preformed hole on the shell to contact indoor air, so that the indoor temperature measurement precision can be improved, the PCB main board can be arranged to perform preset processing on received temperature data, for example, the received temperature data can be sent to a server, the personnel is not required to go to the door for checking, the efficiency can be improved, and the cost is saved.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the disclosure should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the embodiments of the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification should be included in the protection scope of the present specification.

Claims

1. The indoor temperature monitoring device is characterized by comprising a battery module, a PCB main board, a temperature sensor and a shell;

the shell is used for accommodating the battery module and the PCB main board;

2. The indoor temperature monitoring device of claim 1, wherein the housing comprises a front housing and a rear housing, the front housing having the preformed hole disposed therein, the rear housing having a housing mount disposed thereon for securing the rear housing to an indoor roof or ceiling.

3. The indoor temperature monitoring apparatus of claim 2, wherein the housing mount is fixed to an indoor roof or ceiling by an expansion pipe and a tapping screw.

4. The indoor temperature monitoring device of claim 1, wherein the temperature sensor has a humidity sensing function integrated thereon to monitor indoor humidity.

5. The indoor temperature monitoring device of claim 1, wherein an internet of things module is arranged on the PCB main board and is used for uploading temperature data detected by the temperature sensor to an internet of things platform.

6. The indoor temperature monitoring device of claim 5, wherein the internet of things module is a narrowband communication chip.

7. The indoor temperature monitoring device of claim 5, wherein the PCB main board determines whether the temperature data satisfies a preset condition, and uploads the temperature data to an internet of things platform through the internet of things module if the temperature data satisfies the preset condition.

8. The indoor temperature monitoring device of claim 7, wherein an alarm is further provided on the PCB main board, and the PCB main board alarms through the alarm if the temperature data satisfies a preset condition.

9. An indoor temperature monitoring system, comprising:

the indoor temperature monitoring apparatus of any one of claims 1 to 8;

10. The indoor temperature monitoring system of claim 9, wherein the internet of things platform is further configured to send the alarm information to a client corresponding to a manager.