CN219144136U

CN219144136U - Wafer carrier and material device with same

Info

Publication number: CN219144136U
Application number: CN202223523434.9U
Authority: CN
Inventors: 施心星
Original assignee: Suzhou Lumi Laser Technology Co ltd
Current assignee: Suzhou Lumi Laser Technology Co ltd; Suzhou Radiance Manufacturing Equipment Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-06-06
Anticipated expiration: 2032-12-28

Abstract

The utility model discloses a wafer carrier and a material device with the same, wherein the wafer carrier comprises a base body and a carrier body, and the base body is provided with two openings and a cavity channel communicated with the two openings; the carrier is accommodated in the cavity and used for carrying the wafer to be tested fed from one opening, and the carrier is movably arranged relative to the base body so as to have a moving-out stroke for driving the wafer to be tested to move out of the other opening, so that the detection mechanism can detect the wafer to be tested. According to the utility model, each wafer to be tested can move along a uniform linear reciprocating movement path, so that the accuracy and consistency of batch wafer detection to be tested can be improved; the carrier only contacts the edge of the wafer to be detected, so that the wafer pollution caused by excessive contact between other components such as the seat body and the wafer to be detected in the linear reciprocating movement process is effectively prevented, and the detection reliability is improved.

Description

Wafer carrier and material device with same

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a wafer carrier and a material device with the same, and especially relates to a wafer carrier capable of linearly and reciprocally transferring wafers and a material device with the same.

Background

The wafer test link runs through in the wafer manufacturing and sealing process so as to form feedback, and the performance and reliability of the semiconductor are improved from the source. For example: and in the front test (CP) link, invalid chips on the wafer are positioned as much as possible, so that the packaging and finished product test (FT) cost is reduced, and the yield of the chips leaving the factory is improved.

In view of the foregoing, there is a need for a wafer carrier and a material device having the same, which can linearly and reciprocally transfer wafers, thereby adapting the wafer transfer mode in semiconductor devices and transplanting the wafers for testing.

Disclosure of Invention

The utility model mainly aims to provide a wafer carrier and a material device with the same, and aims to provide a wafer carrier capable of linearly and reciprocally transferring wafers and a material device with the same.

In order to achieve the above object, the wafer carrier according to the present utility model includes:

the seat body is provided with two openings and a cavity channel communicated with the two openings; the method comprises the steps of,

the carrier is accommodated in the cavity and used for carrying the wafer to be tested fed from one opening, and the carrier is movably arranged relative to the base body so as to have a moving-out stroke for driving the wafer to be tested to move out of the other opening, so that the detection mechanism can detect the wafer to be tested when the moving-out stroke is carried out.

Optionally, the connecting line direction between the two openings is the front-back direction;

the wafer carrier further comprises a positioning assembly, the positioning assembly comprises two positioning pieces protruding on the carrier, the two positioning pieces are spaced from each other and extend along the front-back direction respectively, positioning protrusions are protruding on the end face of each positioning piece, the end faces of the two positioning pieces located between the two positioning protrusions form a bearing surface, and when the bearing surface bears the wafer to be detected, the two positioning protrusions stop and position the corresponding side of the wafer to be detected.

Optionally, the bearing surface includes a guide surface disposed adjacent to the opening, and the guide surface is disposed gradually and obliquely adjacent to the carrier in a direction approaching the corresponding opening; and/or the number of the groups of groups,

the two positioning protrusions are arranged on one side face close to each other, the stop face comprises a guide face close to the opening, and the two guide faces are obliquely arranged away from each other in the direction of approaching the opening adjacent to each other.

Optionally, the positioning components are provided with a plurality of positioning protrusions, a first space is formed between two positioning protrusions of each positioning component, and the first spaces of the positioning components are arranged differently;

in each two positioning assemblies, the height of the positioning protrusions of the positioning assembly with smaller first spacing is H1, and the height of the bearing surface of the positioning assembly with larger first spacing is H2, so that H1 is less than or equal to H2.

one of the movable joints of the cavity and the object-carrying body is provided with a sliding groove extending along the front-back direction, and the other one of the movable joints is provided with a sliding block which is in sliding connection with the sliding groove.

Optionally, the cavity wall of the cavity near each opening is provided with a connecting piece, and the carrier is correspondingly provided with a butt joint piece, so that when the carrier moves to be near any opening, the butt joint piece is fixedly connected with the corresponding connecting piece.

Optionally, one of the connecting piece and the butt piece is a magnetic absorption piece, and the other is a magnetic matching piece.

Optionally, the wafer carrier further includes a cover plate, where the cover plate is movably covered on the opening to enable the opening to be opened and closed; and/or the number of the groups of groups,

the object carrying bodies are respectively provided with avoidance concave parts corresponding to the openings, and the avoidance concave parts are communicated with the adjacent openings.

Optionally, an installation position for installing the wafer box is arranged on the outer wall of one side of the seat body;

the wafer carrier further comprises a positioning baffle piece, wherein the positioning baffle piece is arranged corresponding to the side part or the corner part of the installation position so as to perform stop positioning on the corresponding side of the wafer box in the installation position;

the positioning baffle piece is movably arranged in a regulating way in the direction of approaching and separating from the installation position.

In addition, in order to achieve the above object, the present utility model also provides a material device, including:

the wafer carrier comprises a base body and a carrier body, wherein the base body is provided with two openings and a cavity channel communicated with the two openings; the carrier is accommodated in the cavity and used for carrying the wafer to be tested fed from one opening, and the carrier is movably arranged relative to the seat body so as to have a moving-out stroke for driving the wafer to be tested to move out of the other opening; the method comprises the steps of,

the detection mechanism is arranged on the base body and is used for detecting the wafer to be detected when the carrier body moves out of the travel.

In the technical scheme provided by the utility model, one of the two openings is used as an inlet for the wafer to be tested to enter the cavity and be arranged on the carrier, and the other opening is used as an outlet for the carrier to drive the wafer to be tested to move out of the cavity, so that the wafer to be tested can be orderly fed, detected and discharged; the cavity channel defines a path when the carrier performs linear reciprocating movement, so that a moving path of wafers to be detected on the carrier is defined, each wafer to be detected can move along a uniform linear reciprocating moving path, and the accuracy and consistency of batch detection of the wafers to be detected are improved; compared with the scheme of directly movably mounting the wafer to be tested on the seat body, the carrier can adjust the contact position and the contact area with the wafer to be tested through the structural design, so that the carrier can only contact the edge of the wafer to be tested, and further, other components such as the seat body and the like are effectively prevented from being in excessive contact with the wafer to be tested in the linear reciprocating movement process, the wafer pollution is caused, and the detection reliability is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of a wafer carrier according to an embodiment of the present utility model;

FIG. 2 is a perspective view of the wafer carrier of FIG. 1 with a cover plate removed from the wafer carrier at a first view angle;

FIG. 3 is a perspective view of the wafer carrier of FIG. 1 with the cover plate removed at a second view angle;

FIG. 4 is a schematic view of the structure of the susceptor in FIG. 1;

FIG. 5 is an enlarged schematic view of the structure shown at A in FIG. 4;

FIG. 6 is a schematic view of the structure of the carrier of FIG. 1;

fig. 7 is an enlarged schematic view of the structure at B in fig. 6.

Reference numerals illustrate:

1-a wafer carrier; 100-a base; 111-a first opening; 112-a second opening; 120-lane; 130-mounting site; 140-positioning a stopper; 141-a first catch arm; 142-second catch arm; 143-connecting holes; 150-locating pins; 200-carrying an article; 210-relief recess; 220-an operation part; 310 a-a first positioning member; 310 b-a second positioning member; 311 a-first positioning projections; 311 b-a second positioning protrusion; 311 c-stop surface; 311 d-guiding surface; 312 a-a first bearing surface; 312 b-a second bearing surface; 312 c-a guide surface; 320-supporting the protrusions; 410-a chute; 420-a slider; 510-abutment projections; 511-a first connector; 512-a second connector; 520-mating projections; 521-butt-joint pieces; 600-cover plate; 700-substrate; 8-wafer to be tested.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1 to 3, a wafer carrier 1 provided by the present utility model includes a base 100 and a carrier 200. Wherein, the seat 100 is provided with two openings and a cavity 120 communicating the two openings; the carrier 200 is accommodated in the cavity 120 and is used for carrying the wafer 8 to be tested fed from one opening, and the carrier 200 is movably disposed relative to the base 100, so as to have a removal stroke for driving the wafer 8 to be tested to be removed from the other opening, so that the detection mechanism can detect the wafer 8 to be tested when the removal stroke is performed.

In the technical scheme provided by the utility model, one of the two openings is used as an inlet of the wafer 8 to be tested entering the cavity 120 and being arranged on the carrier 200, and the other opening is used as an outlet of the carrier 200 driving the wafer 8 to be tested to move out of the cavity 120, so that orderly feeding, detecting and discharging of the wafer 8 to be tested are facilitated; the cavity 120 defines a path when the carrier 200 moves linearly and reciprocally, so as to define a moving path of the wafers 8 to be tested on the carrier 200, so that each wafer 8 to be tested can move along a uniform linear and reciprocally moving path, which is helpful for improving the accuracy and consistency of batch detection of the wafers 8 to be tested; compared with the scheme of directly movably mounting the wafer 8 to be tested on the seat body 100, the carrier 200 can adjust the contact position and the contact area with the wafer 8 to be tested through the structural design, which is beneficial to enabling the carrier 200 to only contact the edge of the wafer 8 to be tested, thereby effectively preventing excessive contact between other components such as the seat body 100 and the wafer 8 to be tested in the linear reciprocating movement process, causing wafer pollution and improving the detection reliability.

In order to facilitate the description of the relative direction of the components of the wafer carrier 1, in the following embodiments, the wafer carrier 1 has a substantially vertical up-down direction and a horizontal direction, where the horizontal direction includes a front-back direction and a left-right direction that are disposed in a crossing manner. The three-dimensional coordinate system is formed by the vertical direction, the front-back direction and the left-right direction. In this design, the vertical direction, the front-rear direction, and the horizontal direction do not limit the absolute direction of the entire wafer carrier 1 in practical use.

The specific form of the seat 100 is not limited in this design, and may be set to a desired shape, size and material according to actual needs. Since the wafer carrier 1 is generally applied to a material device, or further disposed in a wafer inspection line or a wafer production line, the base 100 may be configured to be directly connected to the material device or the like, or may be configured to be indirectly connected to the material device or the like through a structure of a substrate 700 or the like additionally disposed.

The opening direction, size, cross-sectional shape, extending direction, etc. of the two openings are also not limited. The two openings may be formed on any two side surfaces of the base 100 according to actual needs, and the cavity 120 is generally configured to extend in a straight line, so as to realize linear reciprocation of the carrier 200 in the cavity 120.

Based on the above, for ease of understanding, in the present embodiment, the base 100 is substantially rectangular and has an upper end face, a lower end face, and left, right, front and rear side faces connecting the upper and lower end faces. The cavity 120 penetrates the seat 100 in the front-back direction, and forms a first opening 111 on the rear side of the seat 100, and forms a second opening 112 on the front side of the seat 100, where the first opening 111 and the second opening 112 form the two openings.

The first opening 111 may serve as an entrance for handling the wafer 8 to be tested into the chamber 120. It will be appreciated that in the initial state, the carrier 200 is received within the cavity 120. After the wafer 8 to be tested is handled and enters the chamber 120 through the first opening 111, it can be placed directly on the carrier 200 or indirectly guided to the carrier 200 by other guiding structures. The wafer 8 to be tested enters the cavity 120 through the first opening 111 may be manually performed by an operator, or may be performed by an additional mechanical mechanism, such as a mechanical arm, a loading mechanism, etc.

The second opening 112 serves as at least a portion of the carrier 200 and an outlet for the wafer 8 to be tested to move out of the chamber 120. It will be appreciated that the carrier 200 moves from back to front for the removal stroke. When the removal stroke is completed, the carrier member 200 may be configured to be integrally separated from the base 100, or may be configured to remain connected to the base 100 at its rear end by a limit position limiting structure or the like.

The carrier 200 may be configured to be plate-shaped, block-shaped, frame-shaped, etc. according to practical needs, for example, in this embodiment, the carrier 200 is substantially plate-shaped to enhance the overall structural strength. Of course, the carrier 200 may also be partially hollowed out to reduce the contact area with the wafer 8 to be tested.

The carrier 200 requires a driving force during the back-to-front movement. It will be appreciated that this driving force may be accomplished manually by an operator. Based on this, the operation portion 220 may be disposed at the front end of the carrier 200, that is, near the end of the second opening 112, and the operation portion 220 is beneficial to the structure of the user for applying force to the carrier 200, such as a pull ring, a pull rope, an operation lever, a handle, and the like, which is ergonomically designed, and achieves the purposes of saving labor and not interfering with the inspection mechanism to inspect the wafer 8 to be inspected as much as possible.

Based on the above, in order to reduce the contact area between the carrier 200 and the wafer 8 to be tested, the structure of the carrier 200 may be modified, for example, the carrier 200 is configured to be plate-shaped but partially hollowed out, or the carrier 200 is configured to be frame-shaped. Of course, as shown in fig. 6, in an embodiment, the carrier 200 is configured to have a plate shape, and the wafer carrier 1 further includes a positioning assembly, where the positioning assembly includes two positioning members protruding on the carrier 200. The positioning component is arranged, so that each wafer 8 to be tested can be accurately positioned on the carrier 200, and the two positioning components heighten the wafer 8 to be tested, so that the lower surface of the wafer 8 to be tested is spaced from the upper surface of the carrier 200, the contact area between the wafer 8 to be tested and the carrier 200 can be effectively reduced, and pollution to the wafer 8 to be tested in the detection process can be reduced.

The two positioning members may be spaced apart in any dimension of the carrier 200, such as the length, width, diagonal, etc. of the carrier 200. Each positioning element may be disposed along any dimension direction of the carrier 200, for example, a length direction, a width direction, a diagonal direction, etc. of the carrier 200, so as to achieve the above-mentioned positioning effect and raising supporting effect on the wafer 8 to be tested.

However, in an embodiment, two positioning members are spaced from each other and extend along the front-rear direction respectively, and each positioning member has a positioning protrusion protruding from an end surface thereof, and the end surfaces of the two positioning members between the two positioning protrusions form a bearing surface, so that when the bearing surface bears the wafer 8 to be tested, the two positioning protrusions perform stop positioning on the corresponding side of the wafer 8 to be tested.

Thus, by providing each positioning member extending in the front-rear direction, the wafer 8 to be tested can be driven to enter the moving direction of the cavity 120 through the first opening 111 in a sequential manner, so that the entering process and the positioning and positioning process on the carrier 200 can be driven by the driving force in the same direction. By arranging the two positioning pieces at intervals along the left-right direction, the support stability of the bearing surface to the wafer 8 to be tested is improved.

By arranging two positioning protrusions, stop positioning is performed on the corresponding two sides, namely the left side and the right side, of the wafer 8 to be tested, so that the two positioning pieces are spaced apart along the left and the right directions as far as possible and only contact with the edge part of the wafer 8 to be tested. In a further aspect, the height of the bearing surface relative to the carrier 200 may be 1/2-2/3 of the height of the positioning protrusion relative to the carrier 200, which is not only sufficient height of the positioning protrusion relative to the bearing surface, i.e. sufficient stop surface 311c, but also prevents excessive drop from being formed, thereby affecting the placement of the wafer 8 to be tested on the bearing surface.

In addition, the positioning protrusions occupy a certain space of the end face of the corresponding positioning piece, so that the area of the bearing surface on the positioning piece is effectively reduced, and the contact area between the positioning assembly and the wafer 8 to be tested is further reduced.

Next, referring to fig. 7, in an embodiment, the bearing surface includes a guiding surface 312c disposed adjacent to the opening, and the guiding surface 312c is disposed obliquely gradually adjacent to the carrier 200 in a direction approaching the corresponding opening. Taking the view angle of the first opening 111 shown in fig. 7 as an example, a portion of the bearing surface near the first opening 111 forms a guide surface 312c. The guiding surface 312c is arranged to help to form a larger space in the up-down direction, so that the wafer 8 to be tested is easy to operate, smoothly enters the first opening 111 and moves onto the bearing surface; then, by gradually tilting, the wafer 8 to be tested is gradually guided to a desired height and gradually positioned to an accurate position, i.e. fully abutted against the carrying surface.

And/or in an embodiment, a side surface of the two positioning protrusions, which is close to each other, is a stop surface 311c, the stop surface 311c includes a guide surface 311d disposed close to the opening, and the two guide surfaces 311d are disposed away from each other in a direction of approaching the openings adjacent to each other. Also taking the view angle at the first opening 111 shown in fig. 7 as an example, the stop surface 311c contacts the wafer 8 to be tested, so as to realize the stop positioning on the corresponding side of the wafer 8 to be tested. The guiding surface 311d is disposed to facilitate forming a larger space in the left-right direction, so that the wafer 8 to be tested is easy to be operated to smoothly enter the first opening 111 and move between the two positioning protrusions; then, by gradually tilting, the wafer 8 to be tested is gradually guided to the required area between the two stop surfaces 311c, and is gradually positioned to an accurate position, that is, is completely abutted against the stop surfaces 311c at both sides.

Based on any of the above embodiments, referring to fig. 6 to 7, in a further aspect, a plurality of positioning assemblies are provided, a first space is formed between two positioning protrusions of each positioning assembly, and the first spaces of the positioning assemblies are differently arranged; in each two positioning assemblies, the height of the positioning protrusions of the positioning assembly with smaller first spacing is H1, and the height of the bearing surface of the positioning assembly with larger first spacing is H2, so that H1 is less than or equal to H2.

By differently setting the first spacing of the positioning components, it is helpful to match suitable positioning components for the wafers 8 to be tested of various specifications. For ease of understanding, taking every two adjacent positioning components as an example, the positioning component with smaller first space is a first positioning component, the positioning component is a first positioning component 310a, the positioning protrusion is a first positioning protrusion 311a, and the bearing surface is a first bearing surface 312a; the first positioning component with larger space is a second positioning component, the positioning piece is a second positioning piece 310b, the positioning bulge is a second positioning bulge 311b, and the bearing surface is a second bearing surface 312b.

The first positioning component is adapted to a wafer 8 to be tested (hereinafter referred to as a small-sized wafer to be tested) with a relatively small lateral dimension, so that the first bearing surface 312a matches the bottom edge of the small-sized wafer to be tested, and the first positioning protrusions 311a completely abut against the left and right sides of the small-sized wafer to be tested. The second positioning component is adapted to the wafer 8 to be tested (hereinafter referred to as a large-sized wafer to be tested) with relatively large lateral dimensions, so that the second bearing surface 312b matches the bottom edge of the large-sized wafer to be tested, and the second positioning protrusions 311b completely abut against the left and right sides of the large-sized wafer to be tested. Thus, the same carrier 200 is commonly used for the wafers 8 to be tested with different specifications, which is helpful for improving the versatility of the wafer carrier 1.

In addition, by setting the height of the two first positioning protrusions 311a to be H1 compared to the carrier 200, the height of the second bearing surface 312b to be H2 compared to the carrier 200 is H1. Ltoreq.h2, and further optionally, H1 < H2. The positioning heights of the positioning components to the wafer 8 to be measured are different, so that the first positioning component can be prevented from jacking up the wafer to be measured with a large size, the positioning failure of the second positioning component to the wafer to be measured with a large size is avoided, and the first positioning component is prevented from contacting with the middle part of the wafer to be measured with a large size, so that the wafer is polluted.

Since the two positioning members of each positioning assembly generally contact edges of the wafer 8 to be tested in a certain direction, for example, in this embodiment, the two positioning members contact edges of the wafer 8 to be tested on both sides, in order to further improve the stability of the positioning assembly for supporting the wafer 8 to be tested, in an embodiment, the positioning assembly may further include a supporting protrusion 320, where the supporting protrusion 320 may be located between the two positioning members and used for supporting the wafer 8 to be tested. The supporting protrusions 320 may be provided at edges of the wafer 8 to be measured in other directions, for example, at edges of the wafer 8 to be measured at the front side or the rear side as shown in fig. 6.

In addition, referring to fig. 4, in one embodiment, one of the movable joints of the cavity 120 and the carrier 200 is provided with a sliding slot 410 extending along the front-rear direction, and the other one is provided with a sliding block 420, and the sliding block 420 is slidably connected with the sliding slot 410. The sliding groove 410 is disposed on the inner wall of the cavity 120, and the sliding block 420 is fixed on the carrier 200. The chute 410 may be disposed at any location of the channel 120, such as at one or more of the lower, left, and right walls of the channel 120. The sliding connection cooperation of the sliding groove 410 and the sliding block 420 helps to provide an accurate moving path for the back and forth linear reciprocating movement of the carrier 200, and the sliding connection between the sliding block 420 and the sliding groove 410 is utilized to replace the direct contact between the carrier 200 and the cavity 120, so that the movable contact area is reduced, and the friction damping is reduced.

In a further aspect, a blocking member may be disposed at the front and rear ends of the sliding slot 410, respectively, for limiting the sliding block 420 from being separated from the sliding slot 410, i.e. limiting the carrier 200 from being completely separated from the base 100.

Of course, the combination of the sliding groove 410 and the sliding block 420 in the above scheme may be replaced by a combination of a roller and a rolling mating surface, so as to realize rolling connection and mating between the carrier 200 and the base 100, and further reduce friction damping therebetween.

Referring to fig. 4 to 5, in an embodiment, the cavity 120 is provided with a connecting member near a cavity wall of each opening, and the carrier 200 is correspondingly provided with a docking member 521, so that when the carrier 200 moves to approach any opening, the docking member 521 is fixedly connected with the corresponding connecting member. In this way, when the carrier 200 moves to two limit positions (i.e., a position sufficiently close to the first opening 111 and a position sufficiently close to the second opening 112) relative to the base 100, the docking member 521 is connected to the corresponding side connecting member, so as to lock the carrier 200 at the limit position, thereby facilitating the entering operation, the detecting operation and the removing operation of the wafer 8 to be tested.

The schemes of the connecting piece and the butt piece 521 are various, for example, one of the connecting piece and the butt piece 521 is an elastic buckle, the other is a buckle slot, and the two are mutually buckled and fixed when approaching; or one of the connecting piece and the butt piece 521 is a suction disc piece, and the other is a suction surface which is smooth and flat, and the two pieces are mutually sucked and fixed when approaching; alternatively, the connecting member and the butt-joint member 521 are adhesive members with certain adhesive strength, such as velcro, and the two members are adhered and fixed to each other when approaching.

In this embodiment, one of the connecting member and the docking member 521 is a magnetic attachment member, and the other is a magnetic mating member. The magnetic absorption part can be a common magnet or an electromagnet capable of being controlled by on-off, and the magnetic matching part is of a structure made of iron, cobalt and nickel materials. Specifically, the connection members may be a first connection member 511 and a second connection member 512, respectively. The base 100 may have a protruding portion 510 near the first opening 111 and a protruding portion 510 near the second opening 112, and the carrier 200 has a corresponding protruding portion 520 near the rear end, a first connecting member 511 is disposed on the protruding portion 510 near the first opening 111, and a second connecting member 512 is disposed on the protruding portion 510 near the second opening. When the carrier 200 is in the initial state, that is, the engaging protrusion 520 is sufficiently close to the abutting protrusion 510 at the first opening 111, the abutting member 521 is magnetically fixed with the first connecting member 511; when the carrier 200 completes the removal stroke, that is, the engaging protrusion 520 is sufficiently close to the abutting protrusion 510 at the second opening 112, the abutting member 521 is magnetically fixed with the second connecting member 512.

In addition, referring to fig. 1 to 3, in an embodiment, the wafer carrier 1 further includes a cover plate 600, where the cover plate 600 is movably covered on the opening to enable the opening to be opened and closed. Specifically, a cover 600 may be disposed for each of the first opening 111 and the second opening 112, or only the first opening 111 or the second opening 112 may be provided with the cover 600 according to actual needs. The cover plate 600 can at least partially close the cavity 120 when covering the opening, protect the cavity 120, or purposefully reduce the intensity of light in the cavity 120. When the cover plate 600 is opened, the communication between the cavity 120 and the external environment can be realized, so that the wafer 8 to be tested can be moved in and out more easily.

And/or in an embodiment, the carrier 200 is provided with a recess 210 corresponding to each opening, and the recess 210 is disposed in communication with the adjacent opening. The recess 210 may be a groove formed on the carrier 200, or may be a through hole penetrating the carrier 200. The avoidance recess 210 may be disposed corresponding to the first opening 111, and may form an avoidance space for a user to operate by hand, or pick up a pick up component of a mechanical mechanism to pick up the wafer 8 to be tested, fully move into the cavity 120, and be disposed on the carrier 200.

Before the wafer 8 to be tested is handled and moved into the chamber 120 via the first opening 111, the wafer 8 to be tested needs to be obtained from a set area (hereinafter referred to as a stocker station). The stock station may be provided on other components than the wafer carrier 1 or, as in the present embodiment, on the wafer carrier 1.

Specifically, referring to fig. 1 to 3, in an embodiment, an installation location 130 for installing the wafer cassette may be disposed on an outer wall of any side of the base 100, where the installation location 130 forms the above-mentioned material storage station. The wafer cassette is generally used for accommodating wafers 8 to be tested. By arranging the mounting position 130 on the outer wall of the seat body 100, the cavity 120 in the seat body 100 provides a space for the wafer 8 to be tested to linearly move, so that the wafer box and the wafer 8 to be tested can be fully separated, and an operation space is reserved.

Further, in an embodiment, the wafer carrier 1 further includes a positioning block 140, where the positioning block 140 is disposed corresponding to an edge or a corner of the mounting position 130, so as to perform stop positioning on a corresponding portion of the wafer cassette located in the mounting position 130. Referring to fig. 1 to 2, when the mounting position 130 is adapted to the shape of the wafer cassette, the positioning block 140 may be disposed at the corner and extend along the two sides to form the first blocking arm 141 and the second blocking arm 142, respectively. The positioning baffle 140 is detachably connected with the base 100, specifically, for example, at least one of the first baffle arm 141 and the second baffle arm 142 is provided with a connecting hole 143, the base 100 is provided with a matching hole, and the connecting hole 143 and the matching hole are sequentially connected through a screw connector to detachably connect the positioning baffle 140 to the base 100. Thus, by providing a positioning block 140, the two sides of the wafer cassette can be simultaneously stopped and positioned in the corresponding directions.

Still further, in one embodiment, the positioning block 140 is movably disposed in a direction toward and away from the mounting location 130. For example, the connecting hole 143 and/or the mating hole are/is configured as an elongated hole, and the extending direction of the elongated hole is consistent with the extending direction of the corresponding side edge of the first blocking arm 141 and/or the second blocking arm 142 at the location, so that the positioning blocking member 140 can be used for wafer cassettes with different sizes and specifications.

In addition, one of the positioning pins 150 and the positioning holes can be arranged on the mounting position 130, and the positioning pin 150 and the positioning hole are matched with the other positioning pin 150 and the positioning hole on the wafer box, so that the positioning effect on the wafer box is further enhanced, and the detachable connection of the wafer box on the mounting position 130 is facilitated.

Based on any of the above embodiments, the present utility model further provides a material device, where the material device includes the wafer carrier 1 as described above and the detection mechanism as described above, where the detection mechanism is disposed on the base, and the detection mechanism is configured to detect the wafer to be tested when the carrier performs the removal stroke. It should be noted that, the detailed structure of the wafer carrier 1 in the material device may refer to the embodiment of the wafer carrier 1 described above, and will not be described herein again; because the material device of the present application uses the wafer carrier 1, embodiments of the material device of the present application include all technical solutions of all embodiments of the wafer carrier 1, and the achieved technical effects are identical, and are not described in detail herein.

In practical application, the detection mechanism can form a component of the wafer carrier, and can also be matched with the wafer carrier to be applied to the material device.

The inspection mechanism may perform any suitable inspection item on the wafer 8 to be inspected, for example, performing appearance inspection on the wafer 8 to be inspected in a wafer manufacturing link, performing electrical performance inspection on the wafer 8 to be inspected in a wafer sealing link, and so on. It will be appreciated that the inspection mechanism may be located at any location on the frame 100 and may perform the desired inspection of the wafer 8 to be inspected at any node during the removal stroke of the carrier 200, depending on the inspection item.

Specifically, for example, the detecting mechanism may be configured to dynamically detect when the carrier 200 drives the wafer 8 to be detected to move out of the way; or the detecting mechanism may be configured to perform static detection when the carrier 200 drives the wafer 8 to be detected to move out of a certain preset position during the travel; or the detecting mechanism may be configured, without limitation, to detect the wafer 8 to be detected in the process of separating the wafer 8 to be detected from the carrier 200 after the carrier 200 drives the wafer 8 to be detected to complete the removal process.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A wafer carrier, comprising:

2. The wafer carrier of claim 1, wherein a line direction between two of the openings is a front-to-back direction;

3. The wafer carrier of claim 2, wherein the bearing surface comprises a guide surface disposed proximate the opening, the guide surface being disposed progressively obliquely proximate the carrier in a direction proximate the corresponding opening; and/or the number of the groups of groups,

4. The wafer carrier of claim 2 or 3, wherein a plurality of said positioning assemblies are provided, a first spacing is formed between two of said positioning protrusions of each of said positioning assemblies, said first spacing of each of said positioning assemblies being disposed differently;

5. The wafer carrier of claim 1, wherein a line direction between two of the openings is a front-to-back direction;

6. The wafer carrier of claim 1, wherein the chamber channels each have a connector disposed on a wall thereof adjacent each of the openings, the carrier being correspondingly provided with a docking member for connection with the corresponding connector when the carrier is moved to adjacent any of the openings.

7. The wafer carrier of claim 6, wherein one of the connector and the docking member is a magnetic attachment member and the other is a magnetic mating member.

8. The wafer carrier of claim 1, further comprising a cover plate movably covering the opening to enable movement to open and close the opening; and/or the number of the groups of groups,

9. The wafer carrier of claim 1, wherein an outer wall of one side of the housing is provided with mounting locations for mounting wafer cassettes;

10. A material device, comprising:

the wafer carrier of any one of claims 1 to 9; the method comprises the steps of,