CN219144129U

CN219144129U - Vacuum equipment for manufacturing semiconductor chip

Info

Publication number: CN219144129U
Application number: CN202222950193.XU
Authority: CN
Inventors: 程天然
Original assignee: Shanghai Hangye Vacuum Equipment Technology Co ltd
Current assignee: Shanghai Hangye Vacuum Equipment Technology Co ltd
Priority date: 2022-11-07
Filing date: 2022-11-07
Publication date: 2023-06-06
Anticipated expiration: 2032-11-07

Abstract

The utility model is applicable to the technical field of semiconductor chip manufacturing, and discloses a semiconductor chip manufacturing vacuum device which comprises a vacuum manufacturing device body, wherein a hinge is arranged on the right side of the surface of the vacuum manufacturing device body, a box door is arranged on the hinge, a cleaning shell is arranged on the right side of the vacuum manufacturing device body, an air inlet pipe is arranged at the top of the cleaning shell, a fan is arranged in the air inlet pipe, a placing groove is formed in the vacuum manufacturing device body, wheel grooves are formed in the left side of the placing groove, two groups of wheel grooves are formed in the wheel grooves, a sliding groove is formed in the right side of the placing groove, a sliding plate and a stabilizing rod are arranged in the sliding groove, and a thread groove is formed in the middle of the sliding plate. According to the utility model, the placing plate is arranged in the vacuum manufacturing equipment and is arranged on the moving mechanism, so that a convenient and fast taking effect can be formed on the material in the process of taking the semiconductor material, and the convenience in use is greatly improved.

Description

Vacuum equipment for manufacturing semiconductor chip

Technical Field

The utility model is applicable to the technical field of semiconductor chip manufacturing, and particularly relates to vacuum equipment for manufacturing a semiconductor chip.

Background

At present, semiconductor chips are manufactured into semiconductor devices capable of realizing certain functions by etching and wiring on semiconductor sheets, and common semiconductor chips comprise silicon chips, gallium arsenide, germanium and the like;

when the semiconductor material enters the vacuum equipment, the material needs to be manually taken, the internal space of the vacuum equipment is limited, the semiconductor material is inconvenient to place and take, the uniform placement of the material cannot be ensured, a cleaning mechanism is not needed before the material is placed into the vacuum equipment, and the quality of the semiconductor material manufacture can be influenced by the tiny broken or dust remained on the surface of the semiconductor, so that the problems in the prior art are solved.

Disclosure of Invention

The utility model provides a vacuum device for manufacturing a semiconductor chip, which solves the problems in the background technology.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a semiconductor chip makes vacuum equipment, includes vacuum manufacturing equipment body, vacuum manufacturing equipment body surface's right side is provided with the hinge, and installs the chamber door on the hinge, vacuum manufacturing equipment body's right side is provided with the clearance shell, the top of clearance shell is provided with the intake pipe, and the internally mounted of intake pipe has the fan, the standing groove has been seted up to the inside of vacuum manufacturing equipment body, the wheel groove has been seted up in the left side of standing groove inside, and the wheel groove has seted up two sets of, the spout has been seted up on the right side of standing groove inside, and the spout embeds slide and firm pole, the screw groove has been seted up at the middle part of slide, the lateral wall of slide is fixed with the board of placing, and places the board and be provided with two sets of, the both ends of placing the board left side all are provided with the bull stick, the outside of bull stick is provided with the bearing, and the bull stick passes through the bearing and connects with the gyro wheel, vacuum manufacturing equipment body inner wall back's right side is provided with the motor, the motor shaft of motor runs through in the inside of spout, and is provided with the lead screw on the motor shaft of motor relatively.

Preferably, the screw rod is located in the threaded groove, and the screw rod is matched with the threaded size of the threaded groove and forms a rotating mechanism.

Preferably, the two ends of the stabilizing rod are respectively fixed with the two sides of the inner wall of the chute, and the stabilizing rod penetrates through the inside of the sliding plate.

Preferably, the outer wall of the rotating rod is fixedly butted with the inner wall of the bearing, the outer ring wall of the bearing is fixedly butted with the inner part of the roller, and the roller is positioned in the wheel groove.

Preferably, the cleaning tank is arranged on the surface of the cleaning shell, the air outlet is arranged at the bottom end of the cleaning tank, and the top end of the cleaning tank is communicated with the bottom end of the air inlet pipe.

Preferably, a switch is arranged on the left side of the vacuum manufacturing equipment body, and the switch is electrically connected with the motor and the fan.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the placing plate is arranged in the vacuum manufacturing equipment and is arranged on the moving mechanism, so that a convenient and fast taking effect can be formed on the material in the process of taking the semiconductor material, and the convenience in use is greatly improved.

2. According to the utility model, the cleaning shell is arranged on the right side of the vacuum manufacturing equipment, and can be used for flushing away tiny residues and dust remained on the surface of the material before the material is placed, so that the material is tidy, and the quality of the semiconductor material during production is improved.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a vacuum apparatus for manufacturing semiconductor chips according to the present utility model;

fig. 2 is a schematic diagram of a placement groove structure of a vacuum apparatus for manufacturing semiconductor chips according to the present utility model;

fig. 3 is a schematic diagram of the internal structure of a chute of a vacuum apparatus for manufacturing semiconductor chips according to the present utility model;

fig. 4 is a schematic view of a placement plate structure of a vacuum apparatus for manufacturing semiconductor chips according to the present utility model;

fig. 5 is a schematic diagram of a motor structure of a vacuum apparatus for manufacturing semiconductor chips according to the present utility model;

fig. 6 is a schematic view of a cleaning shell structure of a vacuum apparatus for manufacturing semiconductor chips according to the present utility model.

In the figure: 1. a vacuum manufacturing apparatus body; 2. a door; 3. a switch; 4. a hinge; 5. a placement groove; 6. a chute; 7. placing a plate; 8. a screw rod; 9. a slide plate; 10. a thread groove; 11. a stabilizing rod; 12. wheel grooves; 13. a rotating rod; 14. a bearing; 15. a roller; 16. cleaning the shell; 17. cleaning the groove; 18. an exhaust port; 19. an air inlet pipe; 20. a blower; 21. and a motor.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be fixedly connected, disposed, or detachably connected, disposed, or integrally connected, disposed, for example; the types of the electric appliances provided in the present utility model are just references, and the specific meanings of the above terms in the present utility model can be understood by those skilled in the art according to specific situations by replacing different types of electric appliances having the same functions according to actual use situations.

Referring to fig. 1-6, a semiconductor chip makes vacuum equipment, including vacuum manufacturing equipment body 1, the right side on vacuum manufacturing equipment body 1 surface is provided with hinge 4, and installs chamber door 2 on the hinge 4, vacuum manufacturing equipment body 1's right side is provided with clearance shell 16, clearance shell 16's top is provided with intake pipe 19, and intake pipe 19's internally mounted has fan 20, standing groove 5 has been seted up to vacuum manufacturing equipment body 1's inside, wheel groove 12 has been seted up in the left side of standing groove 5, and wheel groove 12 has seted up two sets of, spout 6 has been seted up on the right side of standing groove 5 inside, and spout 6 embeds slide 9 and firm pole 11, thread groove 10 has been seted up at the middle part of slide 9, slide 9's lateral wall is fixed with placing plate 7, and placing plate 7 is provided with two sets of, placing plate 7 left both ends all are provided with bull stick 13, the outside of bull stick 13 is provided with bearing 14, and bull stick 13 is through bearing 14 and gyro wheel 15 butt joint, vacuum manufacturing equipment body 1's inside is provided with

bull stick

21, and 21 is provided with 21 in the inside the motor shaft 21 in the motor shaft 21 of motor shaft 1, and can take out in the big run-through the setting up in the quick-through the material, and take the big in the setting up in the quick-change device of the material, take the material is convenient and easy to carry out in the setting up in the place in the material, and take place in the big process.

In this embodiment, the screw rod 8 is located inside the thread groove 10, the screw rod 8 is matched with the thread size of the thread groove 10, and forms a rotation mechanism, and when the screw rod 8 rotates, the driving slide plate 9 moves based on the inside of the slide groove 6, so as to drive the placement plate 7 to move.

In this embodiment, the two ends of the stabilizing rod 11 are respectively fixed to two sides of the inner wall of the chute 6, the stabilizing rod 11 penetrates through the interior of the sliding plate 9, and the stabilizing rod 11 ensures the stability of the sliding plate 9 in the sliding process.

In this embodiment, the outer wall of the rotating rod 13 is fixedly abutted with the inner wall of the bearing 14, and the outer ring wall of the bearing 14 is fixedly abutted with the inside of the roller 15, the roller 15 is located inside the wheel groove 12, the roller 15 ensures the stability of the placing plate 7 during the placing process, and ensures the lubricity of the placing plate 7 during the moving process of the placing plate 7.

In this embodiment, the cleaning tank 17 is provided on the surface of the cleaning shell 16, the exhaust port 18 is provided at the bottom end of the cleaning tank 17, and the top end of the cleaning tank 17 is communicated with the bottom end of the air inlet pipe 19, which is favorable for blowing off the impurities remained on the surface of the semiconductor material, and improves the efficiency of the whole material production.

In this embodiment, a switch 3 is disposed on the left side of the vacuum manufacturing apparatus body 1, and the switch 3 is electrically connected to the motor 21 and the fan 20.

The utility model is used when: when the chamber door 2 begins, when taking the material, switch 3 starts motor 21 work, motor 21 drives lead screw 8 and rotates in the screw groove 10 of seting up in slide 9, slide 9 will slide on this moment based on two sets of firm poles 11, drive slide 9 and remove based on the inside of spout 6, finally drive place the outside that board 7 shifted out vacuum manufacturing equipment body 1, place the board 7 and remove the in-process, the gyro wheel 15 that the board 7 was installed through bearing 14 to bull stick 13 outer wall will be located the inside slip of wheel groove 12, guarantee to place the stability that board 7 supported and the slip efficiency when sliding, thereby the material on the board 7 of being convenient for is taken fast, the convenience of improvement use, before putting into new material simultaneously, put into the inside of clearance shell 16 with the material by clearance groove 17, switch 3 starts fan 20 in the intake pipe 19, fan 20 produces wind-force and will blow the material, thereby carry out the flushing away with the remaining tiny impurity and dust on material surface, guarantee the quality when material is put into vacuum manufacturing equipment body 1 processing, and is simple in design, practicality.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a semiconductor chip manufacturing vacuum equipment, its characterized in that, including vacuum manufacturing equipment body (1), the right side on vacuum manufacturing equipment body (1) surface is provided with hinge (4), and installs chamber door (2) on hinge (4), the right side of vacuum manufacturing equipment body (1) is provided with clearance shell (16), the top of clearance shell (16) is provided with intake pipe (19), and the internally mounted of intake pipe (19) has fan (20), standing groove (5) have been seted up to the inside of vacuum manufacturing equipment body (1), wheel groove (12) have been seted up on the left side of standing groove (5) inside, and wheel groove (12) have been seted up two sets of, spout (6) have been seted up on the right side of standing groove (5) inside, and spout (6) are built-in slide (9) and firm pole (11), threaded groove (10) have been seted up at the middle part of slide (9), the lateral wall of slide (9) is fixed with placing plate (7), and placing plate (7) are provided with two sets of, place plate (7) left side sets of wheel groove (7), wheel groove (12) have wheel groove (12) and two sets of wheel groove (12), the inside left side of standing plate (5) has wheel groove (1), wheel groove (1) has, and the bull stick (13) has through bearing (13) to connect outside (13) to roll bar (13), the vacuum manufacturing equipment is characterized in that a motor (21) is arranged on the right side of the back of the inner wall of the vacuum manufacturing equipment body (1), a motor shaft of the motor (21) penetrates through the chute (6), and a screw rod (8) is arranged on the motor shaft of the motor (21).

2. A semiconductor chip manufacturing vacuum device according to claim 1, characterized in that the screw (8) is located inside the screw groove (10), the screw (8) being adapted to the screw size of the screw groove (10) and constituting a rotation mechanism.

3. The vacuum equipment for manufacturing semiconductor chips according to claim 1, wherein two ends of the stabilizing rod (11) are respectively fixed with two sides of the inner wall of the chute (6), and the stabilizing rod (11) penetrates through the interior of the sliding plate (9).

4. A semiconductor chip manufacturing vacuum apparatus according to claim 1, wherein the outer wall of the rotating rod (13) is fixedly butted with the inner wall of the bearing (14), and the outer ring wall of the bearing (14) is fixedly butted with the inside of the roller (15), and the roller (15) is positioned inside the wheel groove (12).

5. The vacuum equipment for manufacturing semiconductor chips according to claim 1, wherein the cleaning shell (16) has a cleaning groove (17) formed on the surface thereof, an exhaust port (18) is formed at the bottom end of the cleaning groove (17), and the top end of the cleaning groove (17) is communicated with the bottom end of the air inlet pipe (19).

6. A semiconductor chip manufacturing vacuum apparatus according to claim 1, wherein a switch (3) is provided on the left side of the vacuum apparatus body (1), and the switch (3) is electrically connected to a motor (21) and a blower (20).