CN219143408U

CN219143408U - Computer cooling mechanism

Info

Publication number: CN219143408U
Application number: CN202223139585.4U
Authority: CN
Inventors: 郝冰; 黄佳文; 李聪
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-11-25
Filing date: 2022-11-25
Publication date: 2023-06-06
Anticipated expiration: 2032-11-25

Abstract

The utility model provides a computer heat dissipation mechanism, which relates to the technical field of computers and comprises a heat dissipation fan, wherein one end of the heat dissipation fan is fixedly connected with a heat dissipation assembly, and the heat dissipation fan comprises a heat dissipation frame, a motor, a mounting frame and a temperature sensor. According to the utility model, the motor drives the blades to rotate for heat dissipation, the heat conducting fins can increase the contact area, the heat conducting paste is filled between the adjacent heat conducting fins, the heat conducting paste filled between the heat conducting fins can replace air with low heat conductivity, the heat resistance is reduced, the heat conducting performance of the heat dissipation mechanism is enhanced, when the temperature of the heat conducting fins reaches a certain value, the elastic connecting rods are driven to move downwards by hydraulic driving, so that the plurality of dust-proof fins are driven to rotate downwards, the flow area of the heat dissipation grooves is increased, the computer is accelerated to dissipate heat outwards, when the computer is not used at high frequency, the dust-proof fins are driven to rotate upwards by hydraulic driving, the flow area of the heat dissipation grooves is reduced, the heat dissipation of the computer is not hindered, meanwhile, the effective dust prevention is realized, and the use effect of the heat dissipation mechanism is enhanced.

Description

Computer cooling mechanism

Technical Field

The utility model relates to the technical field of computers, in particular to a computer heat dissipation mechanism.

Background

The integrated circuits are used in a large number in computer components, the high temperature of the computer not only can cause unstable operation of the system and shortened service life, but also can cause burning of certain components in the computer, the high temperature is caused in the computer, and the radiator is used for absorbing the heat and then radiating the heat into or out of a case so as to ensure that the temperature of the computer components is normal.

In the prior art, for example, the Chinese patent number is: CN216596147U 'a computer chip heat dissipation mechanism', comprising a computer casing, wherein the computer casing is internally provided with a water circulation refrigeration mechanism, an exhaust refrigeration mechanism and a water cooling liquid exchange structure, the water circulation refrigeration mechanism comprises: the water cooling liquid containing cavity, the water cooling pipe, the refrigerating cavity, the radiating fin, the chip, the motor, the gear pump and the drainage gear, wherein the chip is fixedly installed inside the computer shell, the water cooling liquid containing cavity is arranged inside the computer shell in a hollow mode, and the water cooling liquid containing cavity is connected with the refrigerating cavity and the gear pump through the water cooling pipe.

However, most of the heat dissipation mechanisms of the computer at present are generally composed of a heat dissipation fan and a heat conduction strip, the heat conduction strip and the fan lead out heat from the heat dissipation holes outwards, when the internal components of the computer are used at high frequency, the heat dissipation mode is low in performance and cannot reach the heat dissipation standard, especially in summer, the heat dissipation effect is worse due to the mode that the external temperature is high, the work of the computer is seriously influenced, and even the service life of the computer is influenced due to the fact that related components are damaged at high temperature.

Disclosure of Invention

The utility model aims to solve the problems that most of the existing heat dissipation mechanisms of computers are generally composed of heat dissipation fans and heat conduction strips, the heat conduction strips and the fans lead heat out from heat dissipation holes, when internal components of the computers are used at high frequency, the heat dissipation modes are smaller, the performance of the heat dissipation modes is lower, the heat dissipation standards cannot be met, particularly, the heat dissipation effect is poorer in the mode of higher external temperature in summer, the work of the computers is seriously influenced, and even related components are damaged due to high temperature, and the service life of the computers is influenced.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a computer cooling mechanism, includes radiator fan, radiator fan's one end fixedly connected with radiator module, radiator fan includes heat dissipation frame, motor, mounting bracket and temperature sensor, the inboard annular array of mounting bracket is provided with a plurality of conducting strip, the top of mounting bracket and temperature sensor's bottom fixed connection, radiator module includes heating panel, movable rod, dust sheet and controller, the one end fixed mounting of top one side and the controller of heating panel, the radiating groove has been evenly seted up in one side of heating panel, the both ends of movable rod are rotated with the bottom of radiating groove and are connected, just the outside of movable rod and the one end fixed connection of dust sheet, the top both ends symmetry fixedly connected with hydraulic drive of heating panel, the both ends symmetry of dust sheet is provided with the elastic connection pole.

Preferably, the top of the elastic connecting rod is movably connected with the bottom of the hydraulic drive, and the inner side of the hydraulic drive is fixedly connected with one end of the controller.

Preferably, four mounting rods are symmetrically and fixedly connected to two ends of the heat dissipation plate, and the inner side of the heat dissipation frame is fixedly mounted with one end of the motor.

Preferably, a plurality of blades are uniformly arranged on the outer side of one end of the motor, and four mounting plates are symmetrically and fixedly connected to the two ends of the mounting frame.

Preferably, one end of the mounting plate is provided with a mounting hole in a penetrating mode, and one end of the mounting rod is movably connected with the inner side of the mounting hole.

Preferably, one end of the mounting frame is fixedly connected with one end of the heat dissipation frame, and one end of the motor is provided with a connecting wire.

Compared with the prior art, the utility model has the advantages and positive effects that:

1. in the utility model, the motor drives the plurality of blades to rotate for heat dissipation, the heat in the computer is led out to the direction of the heat dissipation plate through the heat conduction sheets, the contact area of the plurality of annular array heat conduction sheets can be increased, the heat conduction paste is filled between the adjacent heat conduction sheets, the heat conduction paste is a pasty material with good heat conductivity, the heat conduction paste filled between the heat conduction sheets can replace air with low heat conductivity, the heat resistance is reduced, and the heat conduction performance of the heat dissipation mechanism is enhanced.

2. According to the utility model, the heat radiation assembly is arranged, the temperature sensor can detect the temperature of the heat conducting fin, when the temperature of the heat conducting fin reaches a certain value, the temperature sensor can transmit the signal to the controller, the controller controls the hydraulic drive to be started, the hydraulic drive drives the elastic connecting rod to move downwards, so that the plurality of dust-proof sheets are driven to rotate downwards, the flow area of the heat radiation groove is increased, the computer is accelerated to radiate outwards, when the computer is not used at high frequency, the controller controls the dust-proof sheets to rotate upwards through the hydraulic drive, the flow area of the heat radiation groove is reduced, the computer is not hindered to radiate, meanwhile, the computer can effectively prevent dust, and the use effect of the computer heat radiation mechanism is enhanced.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipation mechanism of a computer according to the present utility model;

fig. 2 is a schematic diagram of a rear structure of a heat dissipating fan of a computer heat dissipating mechanism according to the present utility model;

FIG. 3 is an exploded view of a heat dissipating fan of a heat dissipating mechanism of a computer according to the present utility model;

fig. 4 is a schematic structural diagram of a heat dissipating component of a heat dissipating mechanism of a computer according to the present utility model;

fig. 5 is a partial side view of a heat dissipating assembly of a heat dissipating mechanism of a computer according to the present utility model.

Legend description: 1. a heat radiation fan; 2. a heat dissipation assembly; 11. a heat dissipation frame; 12. a motor; 13. a blade; 14. a connecting wire; 15. a mounting frame; 16. a mounting plate; 17. a temperature sensor; 18. a heat conductive sheet; 19. a mounting hole; 21. a heat dissipation plate; 22. a heat sink; 23. a movable rod; 24. a dust-proof sheet; 25. a mounting rod; 26. a controller; 27. an elastic connecting rod; 28. and (5) hydraulically driving.

Detailed Description

In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.

In embodiment 1, as shown in fig. 1-5, the utility model provides a computer heat dissipation mechanism, which comprises a heat dissipation fan 1, wherein one end of the heat dissipation fan 1 is fixedly connected with a heat dissipation component 2, the heat dissipation fan 1 comprises a heat dissipation frame 11, a motor 12, a mounting frame 15 and a temperature sensor 17, a plurality of heat conducting fins 18 are annularly arranged on the inner side of the mounting frame 15 in an array manner, the contact area of the plurality of heat conducting fins 18 can be increased, heat conducting paste is filled between the adjacent heat conducting fins 18, the heat conducting paste is a pasty material with good heat conductivity, the heat conducting paste filled between the heat conducting fins 18 can replace air with low heat conductivity to reduce heat resistance, the top of the mounting frame 15 is fixedly connected with the bottom of the temperature sensor 17, the heat dissipation component 2 comprises a heat dissipation plate 21, a movable rod 23, a dust-proof fin 24 and a controller 26, one side of the top of the heat dissipation plate 21 is fixedly installed with one end of the controller 26, the radiating plate 21's one side runs through evenly and has offered radiating groove 22, the both ends of movable rod 23 are rotated with the bottom of radiating groove 22 and are connected, and the outside of movable rod 23 and the one end fixed connection of dust guard 24, the symmetrical fixedly connected with hydraulic drive 28 in top both ends of radiating plate 21, the both ends symmetry of dust guard 24 is provided with elastic connection pole 27, when the heat conducting strip 18 temperature reaches certain numerical value, temperature sensor 17 can be with this signal transmission to controller 26, the miniature hydraulic drive 28 at both ends are opened in the control of controller 26, the telescopic link bottom and the topmost of hydraulic drive 28 bottom obtain elastic connection pole 27 swing joint, hydraulic drive 28 passes through the telescopic link and drives elastic connection pole 27 and move downwards, thereby drive a plurality of dust guard 24 and rotate downwards, increase radiating groove 22's flow area.

As shown in fig. 1, 4 and 5, the top of the elastic connecting rod 27 is movably connected with the bottom of the hydraulic drive 28, the inner side of the hydraulic drive 28 is fixedly connected with one end of the controller 26, the adjacent dust-proof sheets 24 are connected through the elastic connecting rod 27, and the elastic connecting rod 27 has elasticity and can be rotatably connected with the connecting part of the dust-proof sheets 24.

As shown in fig. 1 and 4, four mounting bars 25 are symmetrically and fixedly connected to both ends of the heat dissipation plate 21, the inner side of the heat dissipation frame 11 is fixedly mounted to one end of the motor 12, and the heat dissipation frame 11 is used for fixing the motor 12 and the blades 13.

As shown in fig. 1-4, a plurality of blades 13 are uniformly arranged on the outer side of one end of a motor 12, four mounting plates 16 are symmetrically and fixedly connected to two ends of a mounting frame 15, the motor 12 can drive the plurality of blades 13 to rotate for heat dissipation, and heat in a computer can be led out to the direction of a heat dissipation plate 21 through a heat conducting fin 18.

As shown in fig. 1 to 4, one end of the mounting plate 16 is provided with a mounting hole 19 in a penetrating manner, one end of the mounting rod 25 is movably connected with the inner side of the mounting hole 19, and the four mounting rods 25 and the mounting hole 19 on the inner side of the heat dissipation plate 21 are fixedly connected by using bolts and threads.

As shown in fig. 1 to 3, one end of the mounting frame 15 is fixedly connected with one end of the heat dissipation frame 11, one end of the motor 12 is provided with a connection wire 14, the mounting frame 15 is used for fixing a plurality of heat conduction fins 18, and the mounting plate 16 is used for fixing the heat dissipation fan 1 on the heat dissipation plate 21.

The application method and the working principle of the device are as follows: the heat radiation mechanism consists of a heat radiation fan 1 and a heat radiation component 2, when the heat radiation fan 1 is installed, four installation rods 25 and installation holes 19 on the inner side of a heat radiation plate 21 are required to be fixedly connected by screw threads, a controller 26 on the inner side of the heat radiation plate 21 and a temperature sensor 17 on the top of a mounting rack 15 can be connected in a wireless mode, a connecting wire 14 can connect a motor 12 with a computer, the motor 12 can drive a plurality of blades 13 to rotate for heat radiation, heat in the computer can be led out to the direction of the heat radiation plate 21 through heat conducting fins 18, finally, heat in the computer is radiated outwards through heat radiating grooves 22, the CPU temperature is quickly conducted to the heat conducting fins 18, the contact area of the plurality of annular heat conducting fins 18 can be increased, heat conducting paste is filled between the adjacent heat conducting fins 18, the heat conducting paste is a paste material with good heat conductivity, the heat conducting paste filled between the heat conducting fins 18 can replace air with low heat conductivity, heat resistance is reduced, and the heat conducting performance of the heat radiation mechanism is enhanced;

simultaneously, a plurality of radiating grooves 22 are uniformly formed in the radiating plate 21, the temperature sensor 17 at the top of the mounting frame 15 can detect the temperature of the heat conducting fin 18, when the temperature of the heat conducting fin 18 reaches a certain value, the temperature sensor 17 can transmit signals to the controller 26, the controller 26 controls to open the miniature hydraulic drive 28 at two ends, the adjacent dust conducting fins 24 are connected through the elastic connecting rods 27, the elastic connecting rods 27 are elastic and can be in rotary connection with the connecting positions of the dust conducting fins 24, the bottom of the telescopic rod at the bottom of the hydraulic drive 28 and the top of the telescopic rod are movably connected with the elastic connecting rods 27, the hydraulic drive 28 drives the elastic connecting rods 27 to move downwards through the telescopic rod, so that the plurality of dust conducting fins 24 are driven to rotate downwards, the flow area of the radiating grooves 22 is increased, and accordingly computer heat dissipation outwards is accelerated, meanwhile, when the computer is not used at high frequency, the controller 26 controls the dust conducting fins 24 to rotate upwards through the hydraulic drive 28, the flow area of the radiating grooves 22 is reduced, and the computer is not hindered, and meanwhile, the computer can be effectively dustproof.

The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model will still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A computer heat dissipation mechanism, comprising a heat dissipation fan (1), characterized in that: one end fixedly connected with radiator fan (1) radiator module (2), radiator fan (1) is including heat dissipation frame (11), motor (12), mounting bracket (15) and temperature sensor (17), the inboard annular array of mounting bracket (15) is provided with a plurality of conducting strip (18), the top of mounting bracket (15) and the bottom fixed connection of temperature sensor (17), radiator module (2) include heating panel (21), movable rod (23), dust guard (24) and controller (26), one end fixed mounting of top one side of heating panel (21) and controller (26), heat dissipation groove (22) have been evenly seted up in one side run through of heating panel (21), the both ends of movable rod (23) are connected with the bottom rotation of heat dissipation groove (22), just the outside of movable rod (23) and the one end fixed connection of dust guard (24), the top both ends symmetry fixedly connected with hydraulic drive (28) of heating panel (21), the both ends symmetry of dust guard (24) are provided with elastic connection pole (27).

2. A computer heat dissipation mechanism as defined in claim 1, wherein: the top of the elastic connecting rod (27) is movably connected with the bottom of the hydraulic drive (28), and the inner side of the hydraulic drive (28) is fixedly connected with one end of the controller (26).

3. A computer heat dissipation mechanism as defined in claim 1, wherein: four mounting rods (25) are symmetrically and fixedly connected to two ends of the radiating plate (21), and the inner side of the radiating frame (11) is fixedly mounted with one end of the motor (12).

4. A computer heat dissipation mechanism as recited in claim 3, wherein: a plurality of blades (13) are uniformly arranged on the outer side of one end of the motor (12), and four mounting plates (16) are symmetrically and fixedly connected to the two ends of the mounting frame (15).

5. A computer heat dissipation mechanism as defined in claim 4, wherein: one end of the mounting plate (16) is provided with a mounting hole (19) in a penetrating mode, and one end of the mounting rod (25) is movably connected with the inner side of the mounting hole (19).

6. A computer heat dissipation mechanism as defined in claim 1, wherein: one end of the mounting frame (15) is fixedly connected with one end of the radiating frame (11), and one end of the motor (12) is provided with a connecting wire (14).