CN219139473U

CN219139473U - Inner cavity heat dissipation type axial flow pump

Info

Publication number: CN219139473U
Application number: CN202223200475.4U
Authority: CN
Inventors: 王斌; 朱逊; 朱军
Original assignee: Gaoyou Changhe Pumps Co ltd
Current assignee: Gaoyou Changhe Pumps Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-06-06
Anticipated expiration: 2032-11-30

Abstract

The utility model relates to the technical field of axial flow pumps, and discloses an inner cavity heat dissipation type axial flow pump, which comprises an axial flow pump body, wherein a supporting plate is fixedly arranged on the outer wall of the axial flow pump body, a water cooling assembly is fixedly arranged at the bottom of the axial flow pump body, and an air cooling assembly is fixedly arranged at the bottom of the water cooling assembly. This inner chamber heat dissipation formula axial-flow pump is cooled down for the inside condensate of condensate box through the semiconductor fin, then drive the fan through the motor and rotate and make the air flow, cool down for the heat conduction board for the semiconductor fin can keep on working and can not overheat, at the inside hot air of radiator case by the baffle isolation, and blow the air at the fan, then the hot air is discharged from the air vent of radiator case inside, play the effect of cooling down for the semiconductor fin heating end, make the semiconductor fin can be better keep on working, keep apart cold and hot air simultaneously, and discharge the hot air to the radiator case outside.

Description

Inner cavity heat dissipation type axial flow pump

Technical Field

The utility model relates to the technical field of axial flow pumps, in particular to an inner cavity heat dissipation type axial flow pump.

Background

The axial flow pump is a pump which uses the acting force of the blades of the rotary impeller to the liquid to make the liquid transfer along the axial direction, and has several types of vertical, horizontal, inclined and through-flow, the impeller of the axial flow pump is generally equipped with 2-7 blades, and the impeller is rotated in the circular tubular pump shell, and the pump shell on the upper portion of the impeller is equipped with fixed guide vanes for eliminating the rotary motion of the liquid, making it become axial motion, and converting the kinetic energy of the rotary motion into pressure energy.

Chinese patent publication No. CN213088350U discloses an axial flow pump. The purpose is to solve current axial-flow pump and is the water inlet from its bottom, inhales the mud piece easily, and it does not possess filtering capability simultaneously, and to the different circumstances of aquatic impurity in addition, its application ability is limited. The axial flow pump comprises a pipe body provided with at least one water inlet and at least one water outlet, wherein the water inlet is positioned on the side surface of the bottom of the pipe body, and the water outlet is positioned on the side surface above the pipe body; a motor which is fixedly connected with the pipe body and is coaxial with the pipe body is arranged above the pipe body, the motor comprises a motor shaft positioned in the pipe body, and the motor shaft is provided with fixedly connected blades; the motor comprises a shaft seat, wherein the shaft seat is positioned at the shaft center of the bottom of the pipe body, and the end part of the motor shaft is movably connected with the shaft seat.

In this application it was found that this patent has at least the following problems: the cooling effect on the axial flow pump is poor, the damage of the axial flow pump is easily caused by the higher temperature after the axial flow pump continuously works, the whole service life of the axial flow pump is influenced, and therefore the axial flow pump can be improved.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides an inner cavity heat dissipation type axial flow pump, which has the advantages of cooling the axial flow pump and the like, and solves the problem that the axial flow pump is easy to damage due to higher temperature after the axial flow pump continuously works.

(II) technical scheme

In order to achieve the purposes of cooling an axial flow pump and the like, the utility model provides the following technical scheme:

the inner cavity heat dissipation type axial flow pump comprises an axial flow pump body, wherein a supporting plate is fixedly arranged on the outer wall of the axial flow pump body, a water cooling assembly is fixedly arranged at the bottom of the axial flow pump body, and an air cooling assembly is fixedly arranged at the bottom of the water cooling assembly;

the air cooling assembly comprises a heat dissipation shell, the heat dissipation shell is fixedly arranged at the bottom of the outer wall of the axial flow pump body, a partition plate is fixedly arranged on the inner wall of the heat dissipation shell, a bearing is fixedly arranged on the inner wall of the partition plate, a motor output shaft is fixedly arranged in the bearing, a fan is fixedly arranged at one end of the motor output shaft, a semiconductor radiating fin is fixedly arranged at one end of the partition plate, and a heat conducting plate is fixedly arranged at the bottom of the semiconductor radiating fin.

Preferably, the mounting piece is installed to the motor outer wall, and the through-hole has been seted up to the mounting piece inside, the screw is installed to the mounting piece screw thread that runs through the motor inside the heat dissipation shell, can conveniently install and dismantle the motor, conveniently carries out the change of motor.

Preferably, the other end of the partition plate, which is far away from the shell, is fixedly arranged on one side of the semiconductor radiating fin, and the partition plate is used for isolating heat generated by the semiconductor radiating fin.

Preferably, the inside air vent that has seted up of heat dissipation shell, air vent quantity is six, and six air vents are along the vertical central line symmetric distribution in heat dissipation shell both sides wall of heat dissipation shell, and the air vent is convenient for the air flow.

Preferably, the water cooling assembly comprises a water cooling pipe, the water cooling pipe is fixedly arranged on two sides of the axial flow pump body, a condensate box is fixedly arranged at one end of the water cooling pipe, a circulating water pump is fixedly arranged on the outer wall of the water cooling pipe, a water tank is fixedly arranged at the bottom of the inner wall of the heat dissipation shell, and mounting plates are fixedly arranged on two sides of the outer wall of the water cooling pipe.

Preferably, the mounting plate is fixedly arranged at the top of the heat dissipation shell, the circulating water pump is fixedly arranged on the inner wall of the heat dissipation shell, and the circulating water pump is used for driving condensate liquid in the water cooling pipe to circularly move.

Preferably, water is filled in the water tank, condensate is filled in the condensate box, a stable pipe piece is fixedly arranged on the outer wall of the mounting plate, the stable pipe piece is fixedly arranged on the inner wall of the heat dissipation shell, and the water in the water tank naturally evaporates to reduce the air temperature.

(III) beneficial effects

Compared with the prior art, the utility model provides an inner cavity heat dissipation type axial flow pump, which has the following beneficial effects:

1. this inner chamber heat dissipation formula axial-flow pump is cooled down for the inside condensate of condensate box through the semiconductor fin, then drive the fan through the motor and rotate and make the air flow, cool down for the heat conduction board for the semiconductor fin can keep on working and can not overheat, at the inside hot air of radiator case by the baffle isolation, and blow the air at the fan, then the hot air is discharged from the air vent of radiator case inside, play the effect of cooling down for the semiconductor fin heating end, make the semiconductor fin can be better keep on working, keep apart cold and hot air simultaneously, and discharge the hot air to the radiator case outside.

2. This inner chamber heat dissipation formula axial-flow pump drives the condensate that is cooled down and contacts the outer wall of axial-flow pump body for the axial-flow pump body cooling from the water cooling pipe through starting circulating water pump for the inside low temperature operating condition that keeps of axial-flow pump body, the purpose of cooling down for the heat-conducting plate also can be played to the air conditioning that evaporates when the level of water tank inside, cools down for the axial-flow pump body, ensures that the axial-flow pump body can not overheat, ensures the continuous operation of axial-flow pump body.

Drawings

Fig. 1 is a schematic diagram of a front view structure of an axial flow pump with a heat dissipation type inner cavity according to the present utility model;

FIG. 2 is a schematic cross-sectional view of an axial flow pump with heat dissipation in an inner cavity according to the present utility model;

fig. 3 is a schematic sectional view of a portion of an axial flow pump with heat dissipation in an inner cavity according to the present utility model.

In the figure: 1. an air cooling assembly; 2. a water cooling assembly; 3. an axial flow pump body; 4. a support sheet; 11. a heat dissipation housing; 12. a motor; 13. a partition plate; 14. a fan; 15. a semiconductor heat sink; 16. a heat conductive plate; 17. a bearing; 21. a water tank; 22. a water-cooled tube; 23. a mounting plate; 24. a stabilizing piece; 25. a condensate box; 26. and (3) a circulating water pump.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, in a first embodiment:

the utility model provides an inner chamber heat dissipation type axial-flow pump, includes axial-flow pump body 3, axial-flow pump body 3 outer wall fixed mounting has backing sheet 4, axial-flow pump body 3 bottom fixed mounting has water-cooling module 2, water-cooling module 2 bottom fixed mounting has forced air cooling subassembly 1, forced air cooling subassembly 1 and water-cooling module 2 all locate axial-flow pump body 3 bottom;

the air cooling assembly 1 comprises a heat radiation shell 11, wherein the heat radiation shell 11 is fixedly arranged at the bottom of the outer wall of an axial flow pump body 3, a partition plate 13 is fixedly arranged on the inner wall of the heat radiation shell 11, a bearing 17 is fixedly arranged on the inner wall of the partition plate 13, an output shaft of a motor 12 is fixedly arranged in the bearing 17, the model number Y80M1-2 of the motor 12 is realized, a fan 14 is fixedly arranged at one end of the output shaft of the motor 12, a semiconductor radiating fin 15 is fixedly arranged at one end of the partition plate 13, the model number TEC1-12703 is realized, the heat radiation is realized by the fan 14 on a heating surface of the semiconductor radiating fin 15, and a heat conducting plate 16 is fixedly arranged at the bottom of the semiconductor radiating fin 15.

Further, the mounting plate is mounted on the outer wall of the motor 12, through holes are formed in the mounting plate, screws are mounted on the mounting plate penetrating through the motor 12 in the heat dissipation shell 11, the other end of the partition plate 13, far away from the shell 11, is fixedly mounted on one side of the semiconductor heat dissipation plate 15, the number of the air holes is six in the heat dissipation shell 11, and the six air holes are symmetrically distributed on two side walls of the heat dissipation shell 11 along the vertical center line of the heat dissipation shell 11.

Referring to fig. 1-3, in a second embodiment:

the water cooling assembly 2 comprises a water cooling pipe 22, the water cooling pipe 22 is fixedly arranged on two sides of the body of the axial flow pump 3, a condensate box 25 is fixedly arranged at one end of the water cooling pipe 22, a circulating water pump 26 is fixedly arranged on the outer wall of the water cooling pipe 22, the model number of the circulating water pump 26 is 15SG1.8-10, a water tank 21 is fixedly arranged at the bottom of the inner wall of the heat dissipation shell 11, water inside the water tank 21 naturally evaporates to generate natural reduction of temperature, and a mounting plate 23 is fixedly arranged on two sides of the outer wall of the water cooling pipe 22.

Furthermore, the mounting plate 23 is fixedly mounted on the top of the heat dissipation housing 11, the circulating water pump 26 is fixedly mounted on the inner wall of the heat dissipation housing 11, the water tank 21 is filled with water, the condensate box 25 is filled with condensate, the stabilizing piece 24 is fixedly mounted on the outer wall of the mounting plate 23, and the stabilizing piece 24 is fixedly mounted on the inner wall of the heat dissipation housing 11.

Working principle: firstly, the semiconductor cooling fin 15 cools the condensate in the condensate box 25, then the motor 12 drives the fan 14 to rotate so that air flows, the heat conducting plate 16 is cooled, the semiconductor cooling fin 15 can continuously work without overheating, then the circulating water pump 26 is started to drive the cooled condensate to contact the outer wall of the axial flow pump body 3 from the water cooling pipe 22 so as to cool the axial flow pump body 3, the inside of the axial flow pump body 3 is kept in a low-temperature working state, cold air generated by evaporation during the horizontal state in the water tank 21 can also serve the purpose of cooling the heat conducting plate 16, hot air in the heat radiating shell 11 is isolated by the partition plate 13, the fan 14 blows air, and then the hot air is discharged from a vent hole in the heat radiating shell 11.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An inner cavity heat dissipation type axial flow pump comprises an axial flow pump body (3), and is characterized in that: the axial flow pump comprises an axial flow pump body (3), wherein a supporting sheet (4) is fixedly arranged on the outer wall of the axial flow pump body (3), a water cooling assembly (2) is fixedly arranged at the bottom of the axial flow pump body (3), and an air cooling assembly (1) is fixedly arranged at the bottom of the water cooling assembly (2);

the air cooling assembly (1) comprises a heat dissipation shell (11), the heat dissipation shell (11) is fixedly arranged at the bottom of the outer wall of the axial flow pump body (3), a partition plate (13) is fixedly arranged on the inner wall of the heat dissipation shell (11), a bearing (17) is fixedly arranged on the inner wall of the partition plate (13), a motor (12) output shaft is fixedly arranged in the bearing (17), a fan (14) is fixedly arranged at one end of the motor (12) output shaft, a semiconductor radiating fin (15) is fixedly arranged at one end of the partition plate (13), and a heat conducting plate (16) is fixedly arranged at the bottom of the semiconductor radiating fin (15).

2. An intracavity heat sink type axial flow pump as claimed in claim 1 wherein: the motor is characterized in that the outer wall of the motor (12) is provided with a mounting plate, a through hole is formed in the mounting plate, and a screw is arranged in the heat dissipation shell (11) penetrating through the mounting plate of the motor (12) in a threaded manner.

3. An intracavity heat sink type axial flow pump as claimed in claim 1 wherein: the other end of the partition plate (13) far away from the shell (11) is fixedly arranged on one side of the semiconductor radiating fin (15).

4. An intracavity heat sink type axial flow pump as claimed in claim 1 wherein: the heat dissipation shell (11) is internally provided with six air holes, and the six air holes are symmetrically distributed on two side walls of the heat dissipation shell (11) along the vertical center line of the heat dissipation shell (11).

5. An intracavity heat sink type axial flow pump as claimed in claim 1 wherein: the water cooling assembly (2) comprises water cooling pipes (22), the water cooling pipes (22) are fixedly arranged on two sides of the axial flow pump body (3), condensate boxes (25) are fixedly arranged at one ends of the water cooling pipes (22), circulating water pumps (26) are fixedly arranged on the outer walls of the water cooling pipes (22), a water tank (21) is fixedly arranged at the bottom of the inner wall of the heat dissipation shell (11), and mounting plates (23) are fixedly arranged on two sides of the outer walls of the water cooling pipes (22).

6. An intracavity heat sink type axial flow pump as set forth in claim 5 wherein: the mounting plate (23) is fixedly arranged at the top of the heat dissipation shell (11), and the circulating water pump (26) is fixedly arranged on the inner wall of the heat dissipation shell (11).

7. An intracavity heat sink type axial flow pump as set forth in claim 5 wherein: the water tank (21) is internally filled with water, the condensate box (25) is internally filled with condensate, the outer wall of the mounting plate (23) is fixedly provided with a stabilizing piece (24), and the stabilizing piece (24) is fixedly arranged on the inner wall of the heat dissipation shell (11).