CN219117611U - Copper-dissolving type copper electroplating equipment adopting insoluble anode - Google Patents

Copper-dissolving type copper electroplating equipment adopting insoluble anode Download PDF

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CN219117611U
CN219117611U CN202320226876.2U CN202320226876U CN219117611U CN 219117611 U CN219117611 U CN 219117611U CN 202320226876 U CN202320226876 U CN 202320226876U CN 219117611 U CN219117611 U CN 219117611U
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copper
dissolving
insoluble anode
plating
cavity
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王庆浩
樊雄
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Dongguan Tongxin New Material Co ltd
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Dongguan Tongxin New Material Co ltd
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Abstract

The utility model discloses copper-dissolving type copper electroplating equipment adopting an insoluble anode, which comprises a plating tank body, a liquid storage tank, an upper liquid pump, a filter and the insoluble anode, wherein a copper dissolving device and a copper dissolving pump are arranged on the liquid storage tank; a plurality of electrolytic copper is arranged in the copper dissolving cavity, and the solution cavity is connected with the liquid storage tank through a copper dissolving pump; a copper ion detector is arranged on the upper liquid pipe. The utility model adopts the copper plating of the insoluble anode and adopts the plating liquid chemical dissolution electrolytic copper to supplement copper ions, can greatly reduce the oxygen absorption on the surface of the anode, and greatly reduces the decomposition amount of the additive, thereby ensuring the purity of the plating liquid and the feasibility of industrial production, and the whole equipment has simpler realization structure and high effectiveness and reliability.

Description

Copper-dissolving type copper electroplating equipment adopting insoluble anode
Technical Field
The utility model relates to the technical field of chemical electroplating equipment, in particular to copper electroplating equipment.
Background
In the electrolytic copper plating industry, sulfate copper plating is one of the most dominant electroplating processes, and a phosphorus copper anode is commonly used in the traditional art. Since electrolytic copper produces copper powder when dissolved, resulting in low utilization, anodes containing phosphorus element (0.6-0.8%) are commonly used in anodes. However, the anode can generate a small amount of black insoluble substances of cuprous phosphide in the dissolution process, and the plating solution can still be polluted. Therefore, the anode titanium basket is required to be sleeved with an anode bag so as to improve the purity of the plating solution, but the mode still can treat the symptoms and the root causes, and the plating layer still is easy to generate the defects of burr points, pocks and the like. The industry has started to use insoluble anodic copper plating, and copper ion replenishment adopts a mode of adding copper oxide into a solution. However, in the mode, the copper plating additive adopting polyethylene glycol and polyether as carriers can be quickly oxidized and decomposed in the plating solution due to oxygen absorption of an insoluble anode, and the stability of the plating solution can not meet the requirements of industrial application, so that the popularization and the application of the copper plating additive are restricted.
Disclosure of Invention
The utility model aims to solve the technical problem of providing the copper-dissolving type electrolytic copper plating equipment which adopts the insoluble anode and has the advantages of simple structure, higher requirements on the purity of plating solution and industrial production and high practicability.
In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides an adopt insoluble anode's copper-melting formula electro-coppering equipment, including plating cell body, reservoir, go up liquid pump, filter and insoluble anode, insoluble anode passes through conductive shaft and conductive carbon brush and installs in plating cell body, goes up liquid pump and reservoir connection, and the filter passes through last liquid pipe and goes up liquid pump connection, and plating cell body and filter connection, its characterized in that: the copper dissolving tank is internally provided with a copper dissolving device and a copper dissolving pump, the copper dissolving device comprises a copper dissolving tank, a baffle plate which is fully distributed with through holes is arranged in the copper dissolving tank, the baffle plate divides the copper dissolving tank into an upper part and a lower part, the upper part is a copper dissolving cavity, and the lower part is a solution cavity; a plurality of electrolytic copper is arranged in the copper dissolving cavity, and the solution cavity is connected with the liquid storage tank through a copper dissolving pump; a copper ion detector is arranged on the upper liquid pipe.
Further, the electrolytic copper is uniformly arranged in the copper dissolving cavity, and the electrolytic copper can be in various shapes such as copper balls, copper blocks or copper corners.
Further, copper dissolving walls are arranged around the copper dissolving cavity, and the copper dissolving walls are clung to the inner wall of the copper dissolving groove.
Further, a copper-dissolving overflow port is arranged at the upper part of the copper-dissolving tank, and the copper-dissolving cavity is in butt joint with the liquid storage tank through the copper-dissolving overflow port.
Further, the insoluble anode comprises a titanium plate structure at the upper part and a titanium net structure at the lower part, and the upper part and the lower part are connected into an integral structure; the titanium mesh structure of the two insoluble anodes is curved towards the middle in opposite directions, and the workpiece is positioned between the two insoluble anodes.
Further, the titanium mesh structure is provided with meshes with diamond structures, and the sizes of the meshes are 4-10mm; an iridium tantalum coating with the thickness of 10-20um is coated on the insoluble anode.
Further, plating solution overflow ports are respectively arranged at the positions close to the two ends of the plating tank body, and the Shi Ducao body is in butt joint with the liquid storage tank through the plating solution overflow ports.
Further, an exhaust gas collecting box is arranged on the side wall of the plating tank body, and the inner side of the exhaust gas collecting box is communicated with the Shi Ducao body; an exhaust pipe is arranged on the outer side of the exhaust collection box, and the exhaust collection box is connected with a fan through the exhaust pipe to enable the exhaust collection box to form negative pressure.
The utility model adopts the copper plating of the insoluble anode and adopts the plating liquid chemical dissolution electrolytic copper to supplement copper ions, can greatly reduce the oxygen absorption on the surface of the anode, and greatly reduces the decomposition amount of the additive, thereby ensuring the purity of the plating liquid and the feasibility of industrial production, and the whole equipment has simpler realization structure and high effectiveness and reliability.
Drawings
FIG. 1 is a diagram of the overall structure of the present utility model;
FIG. 2 is a diagram showing the structure of the copper dissolving device and the copper dissolving pump;
FIG. 3 is an exploded view of the interior of the copper dissolver;
fig. 4 is a diagram showing a structure of the combination of the insoluble anode and the workpiece.
In the figure, 1 is a plating tank body, 11 is an exhaust gas collecting box, 12 is an exhaust gas pipe, 13 is a plating solution overflow port, 2 is a liquid storage tank, 3 is an upper liquid pump, 31 is an upper liquid pipe, 32 is a copper ion detector, 4 is a copper dissolving pump, 5 is a filter, 6 is a copper dissolving device, 61 is a copper dissolving tank, 62 is a copper dissolving wall, 63 is electrolytic copper, 64 is a partition plate, 65 is a copper dissolving overflow port, 7 is a conductive carbon brush, 8 is a conductive shaft, 9 is an insoluble anode, and 10 is a workpiece.
Detailed Description
In this embodiment, referring to fig. 1-4, the copper-dissolving type copper electroplating apparatus using an insoluble anode includes a plating tank body 1, a liquid storage tank 2, an upper liquid pump 3, a filter 5, and an insoluble anode 9, wherein the insoluble anode 9 is installed in the plating tank body 1 through a conductive shaft 8 and a conductive carbon brush 7, the upper liquid pump 3 is connected with the liquid storage tank 2, the filter 5 is connected with the upper liquid pump 3 through an upper liquid pipe 31, and the plating tank body 1 is connected with the filter 5; the liquid storage tank 2 is also provided with a copper dissolving device 6 and a copper dissolving pump 4, the copper dissolving device 6 comprises a copper dissolving tank 61, a baffle plate 65 which is fully distributed with through holes is arranged in the copper dissolving tank 61, the baffle plate 65 divides the interior of the copper dissolving tank 61 into an upper part and a lower part, the upper part is a copper dissolving cavity, and the lower part is a solution cavity; a plurality of electrolytic copper 63 are arranged in the copper dissolving cavity, and the solution cavity is connected with the liquid storage tank 2 through a copper dissolving pump 4; a copper ion detector 32 is provided on the upper liquid pipe 31.
The electrolytic copper 63 is uniformly arranged in the copper dissolving cavity, the electrolytic copper 63 can be in various shapes such as copper balls, copper blocks or copper corners, and the embodiment adopts the copper balls.
Copper dissolving walls 62 are arranged around the copper dissolving cavity, and the copper dissolving walls 62 are tightly attached to the inner wall of the copper dissolving tank 61.
A copper-dissolving overflow port 65 is arranged at the upper part of the copper-dissolving tank 61, and the copper-dissolving cavity is in butt joint with the liquid storage tank 2 through the copper-dissolving overflow port 65.
The insoluble anode 9 comprises a titanium plate structure 91 at the upper part and a titanium net structure 92 at the lower part, and the upper part and the lower part are connected into an integral structure; the titanium mesh structure 92 of the two insoluble anodes is curved toward the middle toward the opposite arc, and the workpiece 10 is located between the two insoluble anodes 9.
The titanium mesh structure 92 is provided with meshes with diamond structures, and the sizes of the meshes are 4-10mm; an iridium tantalum coating with the thickness of 10-20um is coated on the insoluble anode 9.
Plating solution overflow ports 13 are respectively arranged at the positions close to two ends of the plating tank body 1, the plating tank body 1 is in butt joint with the liquid storage tank 2 through the plating solution overflow ports 13, and excessive plating solution flows back to the liquid storage tank 2 through the plating solution overflow ports 13.
An exhaust gas collecting box 11 is arranged on the side wall of the plating tank body 1, and the inner side of the exhaust gas collecting box 11 is communicated with the Shi Ducao body 1; an exhaust pipe 12 is arranged outside the exhaust collection box 11, and the exhaust collection box is connected with a fan through the exhaust pipe 12 to enable the exhaust collection box to form negative pressure so as to discharge the product exhaust gas in the plating tank body 1 in the electroplating process.
The working process comprises the following steps: 1. the workpiece 10 is hoisted into the plating tank body 1, the plating solution is pressed into the filter 5 through the liquid feeding pump 3, and the plating solution enters the plating tank body 1 after being filtered. When the plating solution submerges the workpiece 15, the current is turned on and copper ions are reduced at the surface of the cathode workpiece.
Cathode reaction: cu (Cu) 2+ +2e＝Cu
Since a large amount of ferric ions and ferrous ions exist in the plating solution, but the reduction potential of the ferric ions is much lower than that of copper ions and hydrogen ions, the ferric ions and the ferrous ions cannot be reduced on the surface of the cathode;
2. the anode (insoluble anode 9) is subjected to oxidation reaction, ferrous oxide ions are taken as a main material, and electrolytic water reaction is taken as an auxiliary material;
anode reaction: fe (Fe) 2+ -e＝Fe 3+ (Main reaction)
H 2 O-2e＝2H + +O 2 (auxiliary reaction)
The surface of the anode has oxygen evolution side reaction, so that the oxidation reaction of oxygen and ferrous ions also occurs:
2Fe 2+ +1/2O 2 +2H + ＝2Fe 3+ +H 2 O
when the flow of the plating solution is larger, ferrous ions in the plating solution have more contact opportunities with the anode, the higher the reaction ratio of the ferrous ions oxidized into ferric ions at the anode is, the less oxygen evolution reaction is;
3. the concentration of ferric ions near the anode is gradually increased along with the continuous operation of the liquid feeding pump 3, and overflows to flow back into the liquid storage tank 2 along with the flow of the plating solution through the plating solution overflow port 13;
4. as electroplating proceeds: the copper ion concentration in the plating solution is gradually reduced (copper sulfate concentration is gradually reduced), the ferrous ion concentration is also gradually reduced, and the ferric ion concentration is gradually increased. Meanwhile, in the cathode reaction, the potential of ferric ions reduced to ferrous ions is far lower than that of cupric ions reduced to metallic copper, so that the reaction of ferric ions reduced to ferrous ions does not exist in the cathode reaction; unless by changing the process conditions (too high current density, too low cathode movement speed, too low bath agitation capacity, too low bath temperature, too low copper ion concentration or too high iron ion concentration, or using very high complexing additives), it is possible to reduce the ferric ions, causing a very large concentration change;
5. as the plating proceeds, the copper ions gradually decrease, and when the copper ion concentration is lower than the set lower limit, the plating solution passes through the copper ion detector 32 on the upper liquid pipe 31 to detect that the copper ion concentration is too low. The copper ion detector 32 transmits a concentration signal to a controller (PLC), the PLC sends a command to enable the copper dissolution pump 4 to work, plating solution is injected into a solution cavity at the bottom of the copper dissolution device 6 at a high speed, then is sprayed into the copper dissolution cavity through a through hole of a partition plate 64 above the solution cavity, and when electrolytic copper 63 contacts with the newly injected solution, the following reaction occurs:
Cu+2Fe 3+ ＝Cu 2+ +2Fe 2+ main reaction
Since the solution is also rich in oxygen (the anode will have a small amount of oxygen uptake and dissolve in the bath), the oxidation reaction of copper will also occur:
Cu+O 2 ＝2CuO
CuO+2H + ＝Cu 2+ +H 2 O；
6. as the reaction continues, the concentration of copper ions and ferrous ions in the solution gradually increases, and the concentration of ferric ions gradually decreases. When the concentration of copper ions is higher than the set upper limit, the PLC sends out a command to stop the copper dissolving pump 4;
7. the loading capacity of the electrolytic copper 63 in the copper dissolver 6 is related to factors such as the size of the electrolytic copper 63, plating current, flow rate of a copper dissolving pump, content of trivalent chromium iron ions and the like, and the smaller the size of the electrolytic copper (ball and angle), the larger the surface area and the larger the dissolution speed; the larger the plating current, the larger the required load; the greater the flow rate of the copper dissolving pump 4, the higher the ferric content, the faster the electrolytic copper 63 dissolves.
Practical tests prove that under the copper dissolution mode, the maximum dissolution efficiency of the copper balls can reach 3g/kg. For example, if the copper balls are loaded at 800kg, the amount of copper ions dissolved per hour is 2400g, i.e., the amount of copper ions required for current consumption of 2020A can be satisfied.
The foregoing detailed description of the utility model has been presented for purposes of illustration and description, but is not intended to limit the scope of the utility model, i.e., the utility model is not limited to the details shown and described.

Claims (9)

1. The utility model provides an adopt insoluble anode's copper-melting formula electro-coppering equipment, including plating cell body, reservoir, go up liquid pump, filter and insoluble anode, insoluble anode passes through conductive shaft and conductive carbon brush and installs in plating cell body, goes up liquid pump and reservoir connection, and the filter passes through last liquid pipe and goes up liquid pump connection, and plating cell body and filter connection, its characterized in that: the copper dissolving tank is internally provided with a copper dissolving device and a copper dissolving pump, the copper dissolving device comprises a copper dissolving tank, a baffle plate which is fully distributed with through holes is arranged in the copper dissolving tank, the baffle plate divides the copper dissolving tank into an upper part and a lower part, the upper part is a copper dissolving cavity, and the lower part is a solution cavity; a plurality of electrolytic copper is arranged in the copper dissolving cavity, and the solution cavity is connected with the liquid storage tank through a copper dissolving pump; a copper ion detector is arranged on the upper liquid pipe.
2. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 1, wherein: the electrolytic copper is uniformly arranged in the copper dissolving cavity.
3. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 2, wherein: the electrolytic copper adopts copper balls, copper blocks or copper corners.
4. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 1, wherein: copper dissolving walls are arranged around the copper dissolving cavity and cling to the inner wall of the copper dissolving groove.
5. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 1, wherein: the upper part of the copper dissolving tank is provided with a copper dissolving overflow port, and the copper dissolving cavity is in butt joint with the liquid storage tank through the copper dissolving overflow port.
6. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 1, wherein: the insoluble anode comprises a titanium plate structure at the upper part and a titanium net structure at the lower part, and the upper part and the lower part are connected into an integral structure; the titanium mesh structure of the two insoluble anodes is curved towards the middle in opposite directions.
7. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 6, wherein: the titanium mesh structure is provided with meshes with diamond structures, and the sizes of the meshes are 4-10mm; an iridium tantalum coating with the thickness of 10-20um is coated on the insoluble anode.
8. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 1, wherein: plating solution overflow ports are respectively arranged at the positions close to two ends of the plating tank body, and the Shi Ducao body is in butt joint with the liquid storage tank through the plating solution overflow ports.
9. The copper-dissolving electrolytic copper plating apparatus using an insoluble anode according to claim 1, wherein: the side wall of the plating tank body is provided with an exhaust gas collecting box, and the inner side of the exhaust gas collecting box is communicated with a Shi Ducao body; an exhaust pipe is arranged on the outer side of the exhaust collection box, and the exhaust collection box is connected with a fan through the exhaust pipe to enable the exhaust collection box to form negative pressure.
CN202320226876.2U 2023-02-13 2023-02-13 Copper-dissolving type copper electroplating equipment adopting insoluble anode Active CN219117611U (en)

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CN202320226876.2U CN219117611U (en) 2023-02-13 2023-02-13 Copper-dissolving type copper electroplating equipment adopting insoluble anode

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Application Number Priority Date Filing Date Title
CN202320226876.2U CN219117611U (en) 2023-02-13 2023-02-13 Copper-dissolving type copper electroplating equipment adopting insoluble anode

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CN219117611U true CN219117611U (en) 2023-06-02

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