CN219112863U

CN219112863U - Anode copper die

Info

Publication number: CN219112863U
Application number: CN202320007673.4U
Authority: CN
Inventors: 余慧燕; 叶声仔; 刘俊辉
Original assignee: Jiangxi Jinye Datong Technology Co ltd
Current assignee: Jiangxi Jinye Datong Technology Co ltd
Priority date: 2023-01-03
Filing date: 2023-01-03
Publication date: 2023-06-02
Anticipated expiration: 2033-01-03

Abstract

The utility model discloses an anode copper die which comprises an upper die and a lower die, wherein the lower die is arranged below the upper die, supporting plates are arranged on two sides of the bottom surface of the lower die, a bottom plate is arranged on the bottom surface of the supporting plate, and a cooling box is arranged on the top surface of the bottom plate. According to the utility model, the first water pump is started, the first water pump conveys the cooling liquid in the cooling box to the cooling channel through the first liquid suction pipe, so that the upper die and the lower die can be effectively cooled, the second water pump is started to convey the cooling liquid in the cooling channel to the cooling box again through the second liquid suction pipe, so that the cooling liquid can be cooled circularly, and the used cooling liquid is cooled again through the semiconductor refrigerating sheet in the cooling box, so that the cooling liquid can be kept in a low-temperature state, the cooling effect between the upper die and the lower die is conveniently improved, the cooling time of the cooling liquid is shortened, and the production efficiency of the cooling liquid is favorably improved.

Description

Anode copper die

Technical Field

The utility model relates to the technical field of dies, in particular to an anode copper die.

Background

The conventional production process of the electrolytic large polar plate uses a large-ear large anode plate as an anode. The anode ear mainly plays roles of supporting and suspending the anode and conducting electricity in the electrolysis process, does not react and consume with electrolyte in the actual production process, and returns to the furnace for remelting with the anode scrap directly after the period, so as to reduce the production cost of returning to the furnace, reduce metal loss and save energy consumption. At present, three materials of a cast iron mold, a cast steel mold and a copper mold are mainly used for casting the copper anode plate.

The current China patent with the publication number of CN214977680U discloses a casting forming die for a copper anode plate, and the technical scheme is characterized in that: comprising the following steps: the casting mold comprises a lower mold plate, a mold cavity, an upper mold plate and an exhaust hole, wherein the upper mold plate is fixedly connected to the upper mold plate through a clamping connection, the center of the top surface of the lower mold plate is provided with the mold cavity, the top surface of the lower mold plate is far away from three sides of an ear part of a copper anode plate, overflow grooves are formed in the top surface of the lower mold plate, and exhaust grooves are formed between the overflow grooves.

The prior art scheme among the above-mentioned has following defect, and above-mentioned technical scheme is through closing the hot plate, lets in the cooling oil in the cooling channel, carries out quick cooling to the foundry goods, but just cools off it through letting in the cooling oil in the cooling channel in the above-mentioned technical scheme, has the problem of being inconvenient for cooling down the mould circulation, and cooling time is long, reduces its production efficiency easily.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides an anode copper die which has the advantages of convenience in circulating cooling of the die, short cooling time and high production efficiency, thereby solving the problems in the prior art.

(II) technical scheme

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an anode copper mould, includes mould and lower mould, the below of going up the mould is equipped with the lower mould, and the bottom surface both sides of lower mould are equipped with the backup pad, the bottom surface of backup pad is equipped with the bottom plate, and the top surface of bottom plate is equipped with the cooling tank, the bottom upper surface mounting of cooling tank has the semiconductor refrigeration piece, cooling channel has been seted up to the inside of lower mould, and one side surface that one end of cooling channel passed through the lower mould is equipped with first connecting pipe, one end that one end of cooling channel passed through the lower mould is equipped with the second connecting pipe, one side surface mounting of backup pad has first water pump, and first water pump is connected with the cooling tank through first liquid suction pipe, first water pump is connected with first connecting pipe through first transfer line, the opposite side surface mounting of backup pad has the second water pump, and the second water pump is connected with the second connecting pipe through the second liquid suction pipe, the second water pump is connected with the cooling tank through the second liquid suction pipe.

Preferably, slots are formed in two sides of the top surface of the lower die, plug-in columns are arranged in two sides of the bottom surface of the upper die, and one ends of the plug-in columns extend to the inside of the slots.

Preferably, the plug-in post is matched with the slot.

Preferably, positioning bolts penetrate through two sides of the top surface of the upper die, connecting blocks are arranged on two side surfaces of the lower die, positioning holes are formed in the top surfaces of the connecting blocks, and one ends of the positioning bolts extend to the inside of the positioning holes.

Preferably, the positioning bolt is in threaded connection with the positioning hole.

Preferably, a gate is arranged at the middle position of the top surface of the upper die.

Preferably, a filling pipe is arranged on one side surface of the cooling box, and a liquid level observation strip is arranged on the front end surface of the cooling box.

Preferably, the cooling tank is filled with a cooling liquid.

(III) beneficial effects

Compared with the prior art, the utility model provides the anode copper die which has the following beneficial effects:

(1) According to the utility model, the first water pump is started, the first water pump conveys the cooling liquid in the cooling box to the cooling channel through the first liquid suction pipe, so that the upper die and the lower die can be effectively cooled, the second water pump is started to convey the cooling liquid in the cooling channel to the cooling box again through the second liquid suction pipe, the cooling liquid can be cooled circularly, the semiconductor refrigerating sheet in the cooling box cools the used cooling liquid again, the cooling liquid can be kept in a low-temperature state, the cooling effect between the upper die and the lower die is conveniently improved, the cooling time of the cooling liquid is shortened, and the production efficiency of the cooling liquid is favorably improved.

(2) According to the utility model, the plug-in column on the bottom surface of the upper die is plugged into the slot on the top surface of the lower die, and one end of the positioning bolt extends into the positioning holes on the connecting blocks on the two side surfaces of the lower die by rotating the positioning bolt on the upper die, so that the upper die and the lower die can be effectively clamped and fixed, loose offset between the upper die and the lower die during casting is prevented, the stability between the upper die and the lower die is improved, the defects during use are reduced, and the processing quality of the upper die and the lower die is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an overall schematic view of an anodic copper mold according to the present utility model;

FIG. 2 is an enlarged A view of an anode copper mold according to the present utility model;

FIG. 3 is a front view of an anode copper mold according to the present utility model;

fig. 4 is a schematic diagram of a connection block structure of an anode copper mold according to the present utility model.

Legend description:

1. an upper die; 2. a lower die; 3. a gate; 4. a cooling channel; 5. a first connection pipe; 6. a first water pump; 7. a support plate; 8. a bottom plate; 9. a cooling box; 10. a semiconductor refrigeration sheet; 11. a second water pump; 12. a second connection pipe; 13. positioning bolts; 14. a connecting block; 15. positioning holes; 16. a plug-in column; 17. a slot; 18. and (5) a liquid level observation strip.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, an anode copper mold comprises an upper mold 1 and a lower mold 2, wherein the lower mold 2 is arranged below the upper mold 1, support plates 7 are arranged at two sides of the bottom surface of the lower mold 2, a bottom plate 8 is arranged on the bottom surface of the support plates 7, a cooling box 9 is arranged on the top surface of the bottom plate 8, a semiconductor refrigerating sheet 10 is arranged on the upper surface of the bottom end of the cooling box 9, a cooling channel 4 is arranged in the lower mold 2, one end of the cooling channel 4 penetrates through one side surface of the lower mold 2 and is provided with a first connecting pipe 5, one end of the cooling channel 4 penetrates through the other side surface of the lower mold 2 and is provided with a second connecting pipe 12, one side surface of the support plates 7 is provided with a first water pump 6, the first water pump 6 is connected with the cooling box 9 through a first liquid suction pipe, the first water pump 6 is connected with the first connecting pipe 5 through the first transfer line, the opposite side surface mounting of backup pad 7 has second water pump 11, and second water pump 11 is connected with second connecting pipe 12 through the second drawing liquid pipe, second water pump 11 is connected with cooling tank 9 through the second transfer line, wherein through opening second water pump 11, the second water pump 11 carries the cooling liquid in the cooling channel 4 to cooling tank 9 through the second transfer line again, can circulate and cool it, wherein the cooling liquid after to using through the semiconductor refrigeration piece 10 in cooling tank 9 cools down the cooling liquid again for the cooling liquid can keep low temperature state, is convenient for improve the cooling effect to between upper mould 1 and the lower mould 2, has shortened its cooling time, is favorable to improving its production efficiency.

In one embodiment, slots 17 are formed in two sides of the top surface of the lower die 2, inserting columns 16 are arranged in two sides of the bottom surface of the upper die 1, one end of each inserting column 16 extends to the inside of each slot 17, and the upper die 1 and the lower die 2 can be effectively limited through the matched use of the inserting columns 16 and the slots 17, so that stability between the upper die 1 and the lower die 2 is improved conveniently.

In one embodiment, the post 16 mates with the slot 17 to facilitate insertion of the post 16 into the slot 17.

In one embodiment, the positioning bolts 13 are arranged on two sides of the top surface of the upper die 1 in a penetrating manner, the connecting blocks 14 are arranged on two side surfaces of the lower die 2, the positioning holes 15 are formed in the top surfaces of the connecting blocks 14, one ends of the positioning bolts 13 extend to the inner parts of the positioning holes 15, one ends of the positioning bolts 13 extend to the positioning holes 15 in the connecting blocks 14 on two side surfaces of the lower die 2 through rotating the positioning bolts 13 on the upper die 1, so that the upper die 1 and the lower die 2 can be effectively clamped and fixed, loose offset between the upper die 1 and the lower die 2 during casting is prevented, and stability between the upper die 1 and the lower die 2 is improved.

In one embodiment, the positioning bolt 13 is in threaded connection with the positioning hole 15, so as to improve the stability of the positioning bolt 13 in the positioning hole 15.

In one embodiment, a gate 3 is provided at a position intermediate the top surface of the upper die 1, wherein casting can be performed in the molding cavity between the upper die 1 and the lower die 2 by use of the gate 3.

In one embodiment, a filling pipe is arranged on one side surface of the cooling tank 9, a liquid level observing strip 18 is arranged on the front end surface of the cooling tank 9, wherein the liquid level in the cooling tank 9 can be observed through the use of the liquid level observing strip 18, and when the liquid level is observed to be low, the cooling liquid can be filled into the cooling tank 9 through the filling pipe.

In one embodiment, the cooling tank 9 is filled with a cooling liquid.

In one embodiment, the control panel control circuit is implemented by simple programming by those skilled in the art, and is only used without modification, and thus the control mode and circuit connection will not be described in detail.

Working principle:

during the use, through peg graft spliced pole 16 on the upper mould 1 bottom surface with slot 17 on the lower mould 2 top surface, the positioning bolt 13 on the rethread pivoted upper mould 1, make the one end of positioning bolt 13 extend to in the locating hole 15 on the connecting block 14 on the lower mould 2 both sides surface, can effectively press from both sides tightly fixedly between upper mould 1 and the lower mould 2, prevent to take place not hard up skew between upper mould 1 and the lower mould 2 when casting, stability between upper mould 1 and the lower mould 2 has been improved, the drawback when having reduced, be favorable to improving its processingquality, wherein open first water pump 6, first water pump 6 carries the coolant liquid in the cooling tank 9 through first infusion tube into cooling channel 4, can cool down between upper mould 1 and the lower mould 2 effectively, wherein through opening second water pump 11, coolant liquid in the cooling channel 4 carries cooling tank 9 once more through the second infusion tube, can circulate and cool down it, wherein use the semiconductor chip 10 in the cooling tank 9 to cooling liquid again, the cooling tank 2 has been kept low temperature, can be convenient for cooling down the cooling tank 2, the cooling efficiency is improved, the production efficiency is convenient for it is improved, and the cooling effect is shortened between the cooling tank 2.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. An anode copper mould comprises an upper mould (1) and a lower mould (2), it is characterized in that a lower die (2) is arranged below the upper die (1), and the two sides of the bottom surface of the lower die (2) are provided with supporting plates (7), the bottom surface of the supporting plates (7) is provided with a bottom plate (8), and the top surface of the bottom plate (8) is provided with a cooling box (9), the upper surface of the bottom end of the cooling box (9) is provided with a semiconductor refrigerating sheet (10), a cooling channel (4) is arranged in the lower die (2), and one end of the cooling channel (4) penetrates through one side surface of the lower die (2) and is provided with a first connecting pipe (5), one end of the cooling channel (4) penetrates through the other side surface of the lower die (2) and is provided with a second connecting pipe (12), a first water pump (6) is arranged on one side surface of the supporting plate (7), and the first water pump (6) is connected with the cooling box (9) through a first liquid suction pipe, the first water pump (6) is connected with the first connecting pipe (5) through a first infusion tube, a second water pump (11) is arranged on the other side surface of the supporting plate (7), and the second water pump (11) is connected with the second connecting pipe (12) through a second liquid suction pipe, the second water pump (11) is connected with the cooling box (9) through a second infusion tube.

2. Anode copper mold according to claim 1, characterized in that the slots (17) are provided on both sides of the top surface of the lower mold (2), the plug posts (16) are provided on both sides of the bottom surface of the upper mold (1), and one end of the plug posts (16) extends into the slots (17).

3. An anode copper mould according to claim 2, characterized in that the plug-in stud (16) is matched to the socket (17).

4. The anode copper die according to claim 1, wherein positioning bolts (13) are arranged on two sides of the top surface of the upper die (1) in a penetrating manner, connecting blocks (14) are arranged on two side surfaces of the lower die (2), positioning holes (15) are formed in the top surface of each connecting block (14), and one end of each positioning bolt (13) extends to the inside of each positioning hole (15).

5. An anode copper mould according to claim 4, characterized in that the positioning bolt (13) is screwed with the positioning hole (15).

6. Anode copper mould according to claim 1, characterized in that a gate (3) is provided in the middle of the top surface of the upper mould (1).

7. Anode copper mould according to claim 1, characterized in that a side surface of the cooling box (9) is provided with a filler pipe, and a front end surface of the cooling box (9) is provided with a liquid level observation bar (18).

8. Anode copper mould according to claim 1, characterized in that the cooling tank (9) is filled with a cooling liquid.