CN219107829U

CN219107829U - Copper-depositing multistage rinsing equipment

Info

Publication number: CN219107829U
Application number: CN202223335567.3U
Authority: CN
Inventors: 郭红樟; 杨海燕; 唐雷; 陈明德; 熊紫竹; 张洪平; 郭燕; 何小兰
Original assignee: Sichuan Yilaiteng Electronic Technology Co ltd
Current assignee: Sichuan Yilaiteng Electronic Technology Co ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-05-30
Anticipated expiration: 2032-12-12

Abstract

The utility model discloses copper deposition multistage rinsing equipment, wherein a fixed clamping structure is arranged on the upper side of a door-shaped frame, a multistage rinsing structure is arranged on a base below the door-shaped frame, the fixed clamping structure comprises an electric sliding rail, the electric sliding rail is arranged on the lower side of an upper cross beam of the door-shaped frame, a first electric push rod is connected to the electric sliding rail in a sliding manner, a rotating motor is arranged at the output end of the first electric push rod, the middle part of the top of a cross plate is connected with the driving end of the rotating motor, and a clamping assembly for clamping a circuit board is arranged on the lower side of the cross plate; the multistage rinsing structure comprises a first rinsing tank, a second rinsing tank, a rinsing spray head, a filter, a suction pump and a conveying pipe. The rinsing effect is good, and the rinsing efficiency is high.

Description

Copper-depositing multistage rinsing equipment

Technical Field

The utility model relates to the technical field of copper deposition of high-frequency microwave circuit boards, in particular to copper deposition multistage rinsing equipment.

Background

Copper deposition is short for electroless copper plating, abbreviated as PTH, and refers to that a thin layer of chemical copper is deposited on a drilled non-conductive hole wall base material by a chemical method to serve as a substrate for electroplating copper at the back, and before the circuit board copper deposition operation, the circuit board is required to be rinsed, so that oil stains, fingerprints, oxides, hole dust and the like on the board surface are removed.

The existing rinsing structure comprises a plurality of stages of rinsing tanks, and different rinsing liquids, such as washing liquid, clean water and the like, are filled in different rinsing tanks. Then the clamped circuit board is rinsed step by step in a rinsing tank, and then is taken out, so that the simple rinsing is poor in cleaning effect.

Disclosure of Invention

In order to solve the technical problems, the utility model provides copper deposition multistage rinsing equipment which is good in rinsing effect.

The utility model is realized by the following technical scheme: the utility model provides a heavy copper multistage rinsing equipment, includes the base, is provided with a gate type frame above the base, its characterized in that, be provided with fixed clamp structure on the gate type frame upside, be provided with multistage rinsing structure on the base of gate type frame below, fixed clamp structure includes electronic slide rail, electronic slide rail installs in the downside of gate type frame entablature, first electric putter sliding connection is on electronic slide rail, and rotating motor installs in first electric putter output, and diaphragm top mid portion is connected with the rotating motor drive end, the downside of diaphragm is provided with the clamping assembly who is used for pressing from both sides the clamp circuit board;

the multi-stage rinsing structure comprises a rinsing tank, a rinsing spray head, a filter, a suction pump and a conveying pipe which are sequentially arranged from left to right; the rinsing spray heads are respectively arranged on the inner walls of the rinsing tanks and face the centers of the rinsing tanks, liquid outlet pipes are respectively arranged on the rinsing tanks and are connected with the filters, the filters are connected with the suction pump through pipelines, and the suction pump is connected with the rinsing spray heads through conveying pipes.

Preferably: the clamping assembly comprises two second electric push rods, two moving blocks, two guide grooves, a clamping frame, a fixed sucker and a return spring;

the two second electric putter are installed in diaphragm top surface both sides in opposite directions, two movable blocks are connected with two second electric putter output respectively, are provided with the guide way in the bottom surface of diaphragm, and multiunit clamping frame all with guide way sliding connection is provided with fixed sucking disc in the inboard of the lower extreme of every group clamping frame, is provided with reset spring between every group clamping frame, and two movable blocks link to each other with the clamping frame that is located the clamping frame of the outside group respectively.

Preferably: the rinsing tanks are a first rinsing tank and a second rinsing tank, and a plurality of rinsing spray heads are respectively connected with the inner walls of the first rinsing tank and the second rinsing tank in a rotating way.

Preferably: limiting blocks are arranged on the outer sides of the clamping frames of each group.

Preferably: the diameters of the first rinsing tank and the second rinsing tank are all larger than the maximum diameter of the transverse plate

Advantageous effects

The utility model provides copper deposition multistage rinsing equipment which has the following beneficial effects: this technical scheme adopts fixed clamp structure and multistage rinsing structure, presss from both sides tightly fixedly to a plurality of circuit boards through fixed clamp structure to can send into multistage rinsing structure inside with a plurality of fixed circuit boards, and rotate, a plurality of rinsing shower nozzles of cooperation multistage rinsing structure inside can carry out the circulation to the circuit board and spray the operation when the circuit board rotates, makes the cleaning performance better. Has the characteristics of convenient operation, good rinsing effect and the like.

Drawings

Fig. 1 is a schematic diagram of a front view structure of a copper deposition multistage rinsing device according to the present utility model.

Fig. 2 is a schematic diagram of a schematic sectional front view of a copper deposition multistage rinsing device according to the present utility model.

Fig. 3 is a schematic view of a partial front view structure of a copper deposition multistage rinsing device according to the present utility model.

In the figure: 1. the device comprises a base, 2, a door-shaped frame, 3, an electric sliding rail, 4, a first electric push rod, 5, a rotating motor, 6, a transverse plate, 7, a second electric push rod, 8, a moving block, 9, a guide groove, 10, a clamping frame, 11, a fixed sucker, 12, a return spring, 13, a first rinsing groove, 14, a second rinsing groove, 15, a rinsing spray head, 16, a filter, 17, a suction pump, 18, a conveying pipe, 19 and a limiting block.

Detailed Description

Example 1

Referring to fig. 1-3, a copper deposition multistage rinsing device comprises a base 1 and a gate-shaped frame 2, wherein the gate-shaped frame 2 is installed above the base 1, a fixed clamping structure is arranged on the upper side of the gate-shaped frame 2, and a multistage rinsing structure is installed on the base 1 below the gate-shaped frame.

The fixed clamping structure comprises an electric sliding rail 3, the electric sliding rail 3 is arranged on the lower side of an upper beam of the door-shaped frame 2, a first electric push rod 4 is slidably connected on the electric sliding rail 3, the first electric push rod 4 can slide left and right on the electric sliding rail, a rotating motor 5 is arranged at the output end of the first electric push rod 4, the middle part of the top of a transverse plate 6 is connected with the driving end of the rotating motor, and a clamping assembly for clamping a circuit board is arranged on the lower side of the transverse plate.

Preferably: the clamping assembly comprises a transverse plate 6, two second electric push rods 7, two moving blocks 8, two guide grooves 9, a clamping frame 10, a fixed sucker 11 and a return spring 12.

Two second electric putter 7 are installed in opposite directions in diaphragm 6 top surface both sides, and two movable blocks 8 are connected with two second electric putter 7 output respectively, are provided with guide way 9 in the bottom surface of diaphragm 6, and multiunit presss from both sides tight frame 10 and guide way 9 sliding connection, are provided with fixed sucking disc 11 in the inboard of the lower extreme of every group clamp frame 10, are provided with reset spring 12 between every group clamp frame 10. The two moving blocks 8 are each connected to one of the clamping frames of the outermost set of clamping frames 10.

In the use, firstly, place a plurality of circuit boards between every group clamping frame 10, afterwards, two second electric putter 7 operation is controlled, can drive the clamping frame 10 of the outermost side through two movable blocks 8 and lean towards the centre, and then can extrude clamping frame 10 step by step, and then can make the interval between a plurality of clamping frames 10 diminish, and extrude reset spring 12, afterwards, a plurality of clamping frames 10 cooperate fixed sucking disc 11, can two pair cooperation with circuit board clamp fixedly, then control electric slide rail 3 operation, drive a plurality of fixed circuit boards and remove multistage rinsing structure top, and control first electric putter 4 and rotating motor 5, can drive the circuit board through diaphragm 6 and stretch into multistage rinsing structure inside, and rotate, realized fixing and rinsing operation to a plurality of circuit boards, and after the use is finished, two second electric putter 7 reset, a plurality of reset springs 12 reset, can promote a plurality of clamping frames 10 and reset between two pairs.

The multi-stage rinse structure includes: a first rinsing tank 13, a second rinsing tank 14, several rinsing spray heads 15, two filters 16, two suction pumps 17 and two transfer pipes 18.

The first rinse tank 13 and the second rinse tank 14 each have a diameter larger than the maximum diameter of the cross plate 6.

The first rinsing tank 13 and the second rinsing tank 14 are arranged on the base 1 from left to right, a plurality of rinsing spray heads 15 are respectively arranged on the inner wall surfaces of the first rinsing tank 13 and the second rinsing tank 14 and face the center of the rinsing tank, the rinsing spray heads 15 are respectively connected with the inner walls of the first rinsing tank 13 and the second rinsing tank 14 in a rotating mode, and a plurality of rinsing spray head 15 angles can be adjusted. The first rinsing tank 13 and the second rinsing tank 14 are respectively provided with a liquid outlet pipe, the liquid outlet pipe is connected with a filter, the filter is connected with a suction pump 17 through a pipeline, and the suction pump is connected with a rinsing spray head 15 through a conveying pipe.

In the use, first potcher 13 and inside potcher 14 are full of the potcher, stretch into first potcher 13 inside after a plurality of fixed circuit boards, control suction pump 17 operation, draw the potcher from first potcher 13 inside, and spout through a plurality of rinse nozzle 15, and then can carry out the repeated rinsing operation to the circuit board in the rotation process, filter 16 can carry out the filtration operation to remaining impurity in the potcher, after the first cleaning is accomplished, remove the circuit board through electric slide rail 3, first electric putter 4 and rotating motor 5, and stretch into inside the second potcher 14, carry out the secondary rinsing.

In the specific implementation process, further, the outer side of each clamping frame 10 is provided with a limiting block 19, so that the clamping effect is prevented from being influenced by the close fit between the clamping frames 10 in the clamping process of the circuit board.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heavy copper multistage rinsing equipment, includes the base, is provided with a gate type frame above the base, its characterized in that, be provided with fixed clamp structure on the gate type frame upside, be provided with multistage rinsing structure on the base of gate type frame below, fixed clamp structure includes electronic slide rail, electronic slide rail installs in the downside of gate type frame entablature, first electric putter sliding connection is on electronic slide rail, and rotating motor installs in first electric putter output, and diaphragm top mid portion is connected with the rotating motor drive end, the downside of diaphragm is provided with the clamping assembly who is used for pressing from both sides the clamp circuit board;

2. The copper deposition multistage rinsing device of claim 1, wherein the clamping assembly comprises two second electric push rods, two moving blocks, two guide grooves, a clamping frame, a fixed sucker and a return spring;

3. The copper deposition multistage rinsing device according to claim 1, wherein the rinsing tanks are a first rinsing tank and a second rinsing tank, and the plurality of rinsing nozzles are respectively connected with the inner walls of the first rinsing tank and the second rinsing tank in a rotating manner.

4. The copper deposition multistage rinsing device according to claim 1, wherein limiting blocks are arranged on the outer sides of each group of clamping frames.

5. A copper deposition multistage rinsing apparatus according to claim 3, wherein the first and second rinse tanks each have a diameter greater than the maximum diameter of the diaphragm.