CN219107472U

CN219107472U - Middle frame assembly and electronic product

Info

Publication number: CN219107472U
Application number: CN202223085025.5U
Authority: CN
Inventors: 周岩
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2022-11-21
Filing date: 2022-11-21
Publication date: 2023-05-30
Anticipated expiration: 2032-11-21

Abstract

The disclosure relates to a middle frame assembly and an electronic product. The middle frame assembly comprises: the middle frame is provided with a battery compartment; the main board is arranged on the middle frame; and the first electronic component and the second electronic component are arranged on the main board, and the second electronic component is arranged in the battery compartment and is connected with the main board. In the electronic product, part of electronic components in the electronic product are arranged in the battery compartment of the electronic product, the available space of the battery compartment can be fully utilized, the occupied space of the part of electronic components to the main board can be reduced, and the selectable space of other electronic components on the main board is increased.

Description

Middle frame assembly and electronic product

Technical Field

The disclosure relates to the technical field of electronic products, in particular to a middle frame assembly and an electronic product.

Background

Along with the development of science and technology, electronic products such as smart phones and tablet computers are rapidly popularized, so that the development of society is greatly promoted by the electronic products, and the life of people is also facilitated. The electronic components such as the sensor are important components in the electronic product, and the sensor can be an acceleration sensor, a magnetic force sensor, a gravity sensor, a barometric pressure sensor, a gyroscope sensor, a temperature sensor and the like.

In general, when designing an electronic product such as a mobile phone, electronic components such as a sensor are mounted on a main board of the electronic product, and the main board is mounted on a center of the electronic product.

Disclosure of Invention

In order to overcome the problems in the related art, the present disclosure provides a middle frame assembly and an electronic product.

According to a first aspect of embodiments of the present disclosure, there is provided a middle frame assembly comprising: the middle frame is provided with a battery compartment; the main board is arranged on the middle frame; and the first electronic component and the second electronic component are arranged on the main board, and the second electronic component is arranged in the battery compartment and is connected with the main board.

In some embodiments, a mounting groove is formed on the middle frame, and the main board is accommodated in the mounting groove.

In some embodiments, the second electronic component is electrically connected to the motherboard via a flexible circuit board.

In some embodiments, the second electronic components are configured in a plurality, and the plurality of second electronic components are electrically connected with the main board through the flexible circuit board.

In some embodiments, the second electronic components are two and are respectively disposed at two ends of the top of the battery compartment.

In some embodiments, the flexible circuit board includes: one end of the connecting section is connected with the main board; and the two ends of the installation section in the length direction are respectively connected with the two second electronic components, and the middle area of the installation section in the length direction is connected with the other end of the connection section.

In some embodiments, the middle frame assembly comprises: the battery is arranged on the middle frame and is accommodated in the battery compartment; the second electronic component is arranged on the back side surface of the battery.

In some embodiments, the back side of the battery compartment is open, the battery compartment comprising: a bottom wall and a peripheral side wall provided on an outer peripheral edge of the bottom wall and extending toward a back side; wherein the second electronic component is arranged on the bottom wall and/or the peripheral side wall.

In some embodiments, the second electronic component is one or more of an acceleration sensor, a gravity sensor, a magnetic sensor, a gyroscope sensor, a temperature sensor, and an barometric pressure sensor.

According to a second aspect of embodiments of the present disclosure, there is provided an electronic product, comprising: the center assembly of the first aspect.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: in the electronic product, part of electronic components in the electronic product are arranged in the battery compartment of the electronic product, the available space of the battery compartment can be fully utilized, the occupied space of the part of electronic components to the main board can be reduced, and the selectable space of other electronic components on the main board is increased.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a perspective view of a center assembly, according to an exemplary embodiment.

FIG. 2 is a schematic diagram of a midframe assembly, according to an example embodiment.

Reference numerals:

1. a middle frame assembly; 11. a middle frame; 111. a battery compartment; 112. a mounting groove; 118. a bottom wall; 119. a peripheral sidewall;

12. a main board; 13. a second electronic component; 14. a flexible circuit board; 141. a connection section; 142. and (5) a mounting section.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the disclosure as detailed in the scope of the claims.

Along with the development of science and technology, electronic products such as smart phones and tablet computers are rapidly popularized, so that the development of society is greatly promoted by the electronic products, and the life of people is also facilitated. Electronic components such as a sensor are an important component in electronic products, and in general, when designing electronic products such as mobile phones, the electronic components such as the sensor are mounted on a main board of the electronic products, and the main board is mounted on a middle frame of the electronic products.

Currently, small-sized, small-screen cell phones are becoming increasingly popular. As the size of the mobile phone becomes smaller, the motherboard of the mobile phone becomes smaller. Electronic components such as a sensor are usually arranged on a main board of the mobile phone, and the setting positions of the electronic components such as the sensor on the main board are more and more difficult to select due to the fact that the main board is smaller. Therefore, when electronic components such as a sensor are arranged on the main board, the arrangement positions of the electronic components such as the sensor are limited by the layout of the main board, and the development trend of electronic products such as mobile phones towards miniaturized designs is not facilitated.

In addition, when selecting the installation position of an electronic component such as a sensor on a motherboard, there is a demand for surrounding components and surrounding environment at the installation position. For example, when the electronic component is a magnetic force sensor, the magnetic force sensor is required to be far away from magnetic force components such as a receiver; when the electronic component is a barometric sensor, the barometric sensor is generally required to be far away from a heat source and a stress area, a screw hole and the like.

In summary, the electronic products such as mobile phones gradually tend to be miniaturized, and finding a suitable location for disposing electronic components in the electronic products such as mobile phones is one of the problems to be solved by those skilled in the art.

In order to solve the above technical problems, embodiments according to the present disclosure provide a middle frame assembly and an electronic product.

Fig. 1 is a perspective view of a center assembly, according to an exemplary embodiment. FIG. 2 is a schematic diagram of a midframe assembly, according to an example embodiment.

As shown in fig. 1, the present disclosure provides a center frame assembly 1. Wherein the middle frame assembly 1 may comprise a middle frame 11. The middle frame 11 may be a metal middle frame, such as a metal of magnesium alloy, stainless steel, or the like. The present disclosure is not limited to this, and may be a plastic middle frame, a glass middle frame, a ceramic middle frame, or the like. The middle frame 11 may further include a frame (not shown), a rear cover (not shown), and electronic components (not shown) disposed on the middle frame 11. For example, the electronic component may be a circuit board, a processor, a sensor, a camera, a flash, a microphone, or the like, but is not limited thereto.

In some embodiments, the middle frame assembly 1 may further include a battery (not shown) that may be provided on the middle frame 11. The battery may be a lithium ion battery, for example, a nickel lithium battery (LiNiO ₂ ) Nickel-cobalt lithium battery (LiNi) _0.8 Co _0.2 O ₂ ) Lithium manganese battery (LiMn) ₂ O ₄ ) Ternary battery (LiNi) _0.3 Co _0.3 Mn _0.3 O ₂ ) Lithium ion batteries such as lithium iron phosphate (LFP) batteries, but the present disclosure is not limited thereto and may be other types of batteries. The battery may be square in shape, but the present disclosure is not limited thereto, and may be cylindrical, button-shaped, wound, laminated, or the like.

In some embodiments, the middle frame 11 may be provided with a battery compartment 111, and the battery may be accommodated in the battery compartment 111. The battery compartment 111 may have a square shape, but the present disclosure is not limited thereto, and may be circular, rectangular, oval, or other polygonal shape. The shape of the battery compartment 111 may be selected according to the shape of the battery. For example, when the battery is square in shape, the battery compartment 111 may also be square in shape. Conversely, when the battery is circular in shape, for example, the battery compartment 111 may also be circular in shape. Likewise, the shape of the battery may be selected according to the shape of the battery compartment 111.

In some embodiments, the middle frame assembly 1 may further include a main board 12, and the main board 12 may be disposed on the middle frame 11. The main board 12 may be a central main circuit board constituting a complex electronic system, and main circuits, chips, sensors, interfaces, plug-ins, etc. of the electronic products may be disposed on the main board 12. In the present disclosure, the shape of the main plate 12 may be square, but the present disclosure is not limited thereto, and may be circular, rectangular, elliptical, or other polygonal shape. In the present disclosure, the main board 12 may be disposed at any position on the middle frame 11 suitable for accommodating the main board 12.

In some embodiments, the middle frame 11 may be provided with a mounting groove 112, and the motherboard 12 may be accommodated in the mounting groove 112. The shape of the main plate 12 may be selected according to the shape of the mounting groove 112. For example, when the mounting groove 112 is square in shape, the main plate 12 may also be square in shape, and conversely, for example, when the mounting groove 112 is circular in shape, the main plate 12 may also be circular in shape.

In the present disclosure, the shape of the mounting groove 112 is not particularly limited and may have a square shape, but the present disclosure is not limited thereto and may be a circular shape, a rectangular shape, an elliptical shape, or other polygonal shape. The shape of the mounting groove 112 may be selected according to the shape of the main board 12 mounted on the mounting groove 112. For example, when the main plate 12 is square, the mounting groove 112 may be square, and conversely, when the main plate 12 is circular, the mounting groove 112 may be circular. Therefore, the mounting groove 112 not only can accommodate the main board 12, but also can limit the main board 12, so that the main board 12 is more stably mounted.

In some embodiments, the middle frame assembly 1 may further include a first electronic component (not shown in the figures), which may be disposed on the motherboard 12. In the present disclosure, the number of first electronic component settings is not particularly limited.

In the present disclosure, the first electronic component may be one or more of a central processing unit (central processing unit, abbreviated as CPU), a Memory (Memory), a double rate synchronous dynamic random access Memory (Double Data Rate Synchronous Dynamic Random Access Memory, abbreviated as DDR SDRAM), a Camera (Camera or Webcam), a radio frequency circuit, and a motor. However, the present disclosure is not limited thereto, and the first electronic component may be other electronic components.

In the present disclosure, the first electronic component may be disposed on the main board 12, but the present disclosure is not limited thereto, and the first electronic component may be disposed at other positions. In the present disclosure, the manner of disposing the first electronic component on the motherboard 12 is not particularly limited, and the first electronic component may be disposed on the motherboard 12 by soldering or the like, for example, but the present disclosure is not limited thereto, and the first electronic component may be disposed on the motherboard 12 by other manners.

In some embodiments, the middle frame assembly 1 may further include a second electronic component 13, and the second electronic component 13 may be disposed in the battery compartment 111 and connected to the main board 12. The second electronic component 13 may be a sensor, which is an important component of an electronic product such as a mobile phone.

For example, the magnetic sensor can measure resistance change to determine magnetic field intensity, and when in use, the mobile phone needs to be shaken to accurately judge, and most of the magnetic sensor is applied to compass and map navigation. The gravity sensor can be realized through a piezoelectric effect, can be used for switching the horizontal screen and the straight screen, and can transmit data and move in the game through the induction of the horizontal direction when being applied to the games such as racing games, so as to rotate the driving direction in the games, and the like. The action principle of the acceleration sensor is the same as that of the gravity sensor, but the acceleration direction is determined through three dimensions, so that the power consumption is low and the precision is low. The method can be applied to the mobile phone and used for counting steps, judging the direction of the mobile phone and the like.

In some embodiments, the second electronic component 13 may be one or more of an acceleration sensor, a gravity sensor, a magnetic sensor, a gyro sensor, a temperature sensor, and an air pressure sensor. Since the number of the second electronic components 13 is not particularly limited in the present disclosure, when the number of the second electronic components 13 is plural, the plural second electronic components 13 may each be one type of sensor. For example, when the number of the second electronic components 13 is two, the two second electronic components 13 may each be an acceleration sensor.

Likewise, when the number of the second electronic components 13 is plural, the plural second electronic components 13 may be different types of sensors. For example, when the number of the second electronic components 13 is two, the two second electronic components 13 may be one of the gravity sensors and the other of the gravity sensors.

The present disclosure is not limited thereto and the second electronic component 13 may be other electronic components.

The second electronic component 13 may be disposed in the battery compartment 111, so that the occupied space of the second electronic component 13 on the motherboard 12 may be reduced, thereby increasing the usage space of the motherboard 12 and further increasing the selectivity of the disposed position of the first electronic component on the motherboard 12. In the present disclosure, the connection manner of the second electronic component 13 and the motherboard 12 is not particularly limited.

As known in the related art, when selecting the location of the second electronic component 13, such as a sensor, on the motherboard 12, there is a requirement for surrounding components and surrounding environment of the location. In the present disclosure, by disposing the second electronic component 13 within the battery compartment 111, certain specific requirements may be met, thereby better performing the function of the second electronic component 13.

Specifically, when the second electronic component 13 is a magnetic force sensor, the second electronic component 13 is disposed in the battery compartment 111, that is, the magnetic force sensor is disposed in the battery compartment 111. In the case of providing the magnetic force sensor, it is generally required that the magnetic force sensor be remote from a magnetic force member such as a receiver, and the like, which is satisfied when the magnetic force sensor is provided in the battery compartment 111.

In the present disclosure, the manner of disposing the second electronic component 13 in the battery compartment 111 is not particularly limited. For example, the second electronic component 13 may be fixed in the battery compartment 111 by an adhesive connection, but the present disclosure is not limited thereto, and the second electronic component 13 may be provided in the battery compartment 111 by other means.

In other embodiments, the second electronic component 13 may also be arranged on the back side of the battery. In the present disclosure, the method of disposing the second electronic component 13 on the back side of the battery is not particularly limited, and for example, the second electronic component 13 may be fixed on the back side of the battery by an adhesive connection method, but the present disclosure is not limited thereto, and the second electronic component 13 may be disposed on the back side of the battery by other methods.

In the present disclosure, the number of second electronic components 13 provided is not particularly limited. For example, in some embodiments, the second electronic component 13 may be configured in a plurality.

In the present disclosure, the position where the second electronic component 13 is disposed in the battery compartment 111 is not particularly limited. For example, in some embodiments, as shown in fig. 1, the back side of the battery compartment 111 is open, and the battery compartment 111 may include: the bottom wall 118 and a peripheral side wall 119 provided on the outer peripheral edge of the bottom wall 118 and extending toward the back side, and the second electronic component 13 is provided on the bottom wall 118 of the battery compartment 111 and/or the peripheral side wall 119 of the battery compartment 111.

It should be noted that, since the number of the second electronic components 13 provided is not particularly limited in the present disclosure, the second electronic components 13 may be provided on the bottom wall 118 of the battery compartment 111, and the second electronic components 13 may also be provided on the peripheral side wall 119 of the battery compartment 111. When the number of the second electronic components 13 is two or more, a part of the second electronic components 13 may be disposed on the bottom wall 118 of the battery compartment 111, and another part of the second electronic components 13 may be disposed on the peripheral side wall 119 of the battery compartment 111. Of course, the second electronic component 13 may also be disposed at other suitable locations within the battery compartment 111.

Since the present disclosure does not limit the number of the second electronic components 13 and the positions provided in the battery compartment 111. As shown in fig. 1 and 2, in some embodiments, the second electronic components 13 may be two and respectively disposed at two ends of the top of the battery compartment 111. The second electronic component 13 is disposed on top of the battery compartment 111 to more easily connect the second electronic component 13 with the main board 12.

In some embodiments, the second electronic component 13 may be electrically connected to the motherboard 12 through a flexible circuit board 14. The flexible circuit board 14 (flexible printed circuit, abbreviated as FPC) is simply called a flexible circuit board, which is also called a "flexible circuit board" or a "flexible circuit board, a flexible circuit board. The flexible circuit board 14 is a flexible printed circuit board made of polyimide or mylar as a base material, which has high reliability and is excellent.

In the present disclosure, the flexible circuit board 14 also includes a soft and hard structural board, and a partial region of the flexible circuit board 14 may be a hard circuit board.

In the present disclosure, the flexible circuit board 14 may be a conventional flexible circuit board, or may be a special flexible board such as a Chip On Flex (COF) or a Chip On Plastic (COP), which is not specifically limited in this disclosure.

In the present disclosure, the flexible circuit board 14 may be any shape, such as a rectangle, a diamond, a trapezoid, a circle, or any irregular shape, which is not particularly limited in this disclosure. As shown in fig. 1 and 2, in particular embodiments of the present disclosure, the flexible circuit board 14 is configured in a "T" shaped configuration.

Note that, since the number of the second electronic components 13 provided is not particularly limited in the present disclosure, when the second electronic components 13 are configured in plural, the plural second electronic components 13 may be electrically connected to the main board 12 through the flexible circuit board 14.

As shown in fig. 1 and 2, in some embodiments, the flexible circuit board 14 may include a connection section 141 and a mounting section 142. One end of the connection section 141 is connected to the motherboard 12, two ends of the installation section 142 in the length direction are connected to the two second electronic components 13, and an intermediate area of the installation section 142 in the length direction is connected to the other end of the connection section 141. In the present disclosure, the connection section 141 and the mounting section 142 of the flexible circuit board 14 may be integrally formed. In the present disclosure, the connection manner of the flexible circuit board 14, the second electronic component 13, and the motherboard 12 is not particularly limited.

In some embodiments, the flexible circuit board 14 may be electrically connected to the motherboard 12 through a connector. The connector may be a zero insertion force (zero insertion force, abbreviated as ZIF) connector or a Board To Board (BTB) connector. However, the present disclosure is not limited thereto, and in the present disclosure, the type of the connector is not particularly limited.

For example, the second electronic component 13 may be connected to the flexible circuit board 14, and the flexible circuit board 14 connected to the second electronic component 13 may be connected to the main board 12 through a BTB connector, thereby realizing the connection of the second electronic component 13 to the main board 12.

Based on the same conception, the embodiment of the present disclosure also provides an electronic product (not shown in the drawings). Wherein the electronic product may comprise a middle frame assembly 1.

The electronic product of the present disclosure may be a mobile phone (e.g., a smart phone or a foldable mobile phone), but the present disclosure is not limited thereto, and may also be a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, a wearable device such as a wristwatch, a wristband, etc.

In summary, according to an exemplary embodiment of the present disclosure, a center frame assembly 1 is provided. Wherein, the middle frame assembly 1 may include: the middle frame 11, the middle frame 11 can be provided with a battery compartment 111; a main board 12, wherein the main board 12 can be arranged on the middle frame 11; and a first electronic component and a second electronic component 13, the first electronic component may be disposed on the main board 12, and the second electronic component 13 may be disposed in the battery compartment 111 and connected to the main board 12.

As can be seen from the above structure, in the present disclosure, the part of electronic components in the electronic product is disposed in the battery compartment 111 of the electronic product, so that the available space of the battery compartment 111 can be fully utilized, the occupied space of the part of electronic components on the motherboard 12 can be reduced, and the selectable space of other electronic components on the motherboard 12 is increased.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. A center assembly, comprising:

the middle frame is provided with a battery compartment;

the main board is arranged on the middle frame; and

the first electronic component is arranged on the main board, and the second electronic component is arranged in the battery compartment and is connected with the main board.

2. The middle frame assembly of claim 1, wherein the frame assembly comprises a frame assembly,

the middle frame is provided with an installation groove, and the main board is accommodated in the installation groove.

3. The middle frame assembly of claim 1, wherein the frame assembly comprises a frame assembly,

the second electronic component is electrically connected with the main board through a flexible circuit board.

4. The middle frame assembly of claim 3, wherein,

the second electronic components are configured in a plurality, and the second electronic components are electrically connected with the main board through the flexible circuit board.

5. The middle frame assembly of claim 4, wherein the frame assembly comprises a frame assembly,

the number of the second electronic components is two, and the second electronic components are respectively arranged at two ends of the top of the battery bin.

6. The middle frame assembly of claim 5, wherein the frame assembly comprises,

the flexible circuit board includes:

one end of the connecting section is connected with the main board;

and the two ends of the installation section in the length direction are respectively connected with the two second electronic components, and the middle area of the installation section in the length direction is connected with the other end of the connection section.

7. The mullion assembly of claim 1, comprising:

the battery is arranged on the middle frame and is accommodated in the battery compartment;

the second electronic component is arranged on the back side surface of the battery.

8. The middle frame assembly of claim 1, wherein the frame assembly comprises a frame assembly,

the back side of the battery compartment is open, and the battery compartment comprises: a bottom wall and a peripheral side wall provided on an outer peripheral edge of the bottom wall and extending toward a back side; wherein the method comprises the steps of

The second electronic component is arranged on the bottom wall and/or the peripheral side wall.

9. The middle frame assembly of claim 1, wherein the frame assembly comprises a frame assembly,

the second electronic component is one or more of an acceleration sensor, a gravity sensor, a magnetic force sensor, a gyroscope sensor, a temperature sensor and an air pressure sensor.

10. An electronic product, comprising:

the mullion assembly of any one of claims 1 to 9.