CN219106185U - Material receiving device capable of rapidly solving riveting of semiconductors - Google Patents
Material receiving device capable of rapidly solving riveting of semiconductors Download PDFInfo
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- CN219106185U CN219106185U CN202320049922.6U CN202320049922U CN219106185U CN 219106185 U CN219106185 U CN 219106185U CN 202320049922 U CN202320049922 U CN 202320049922U CN 219106185 U CN219106185 U CN 219106185U
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Abstract
The embodiment of the application discloses receiving device for rapidly solving semiconductor riveting, comprising: a frame formed with a plane for placing the material tape; the blanking unit is arranged on the frame, moves along the vertical direction of the plane, performs blanking on the edges of the material strips on the plane, and enables the edges of the material strips, which are away from each other, to be formed with connecting parts capable of being mutually riveted. When blanking unit and plane contact, blanking unit die-cuts the edge of material area, and the edge that the material area deviates from each other after the die-cut is formed with the connecting portion that can rivet together, when adjacent material area needs to be connected together, links together through adjacent connecting portion, realizes that the material area can rivet together and assemble together, can conveniently realize later stage's operation, avoids taking place because of the undersize of material area leads to the situation that can not use, has saved the material, has saved manufacturing cost to a great extent.
Description
Technical Field
The embodiment of the application relates to the technical field of semiconductor receiving devices, in particular to a receiving device capable of rapidly solving semiconductor riveting.
Background
The LED bracket is a base seat of the LED lamp bead before packaging, on the basis of the LED bracket, the chip is fixed and welded with the positive electrode and the negative electrode, and then the LED lamp bead is packaged and formed once by packaging glue. A plurality of conductive brackets are processed on the material belt copper plate to serve as conductive terminals (the conductive terminals still belong to a part of the material belt copper plate at the moment), then the conductive terminals are put into an injection molding machine to be molded into a plastic main body, a plastic tray is used for receiving materials after the LED brackets are molded in an injection mode, then the next procedure is carried out to cut or bend, when the material belt is bent or cut to be more than one meter, the material belt left is only treated as waste due to the fact that the length is insufficient in subsequent operation, the waste of resources is easily caused, and the production cost is easily increased.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art or related art.
Therefore, the utility model provides a receiving device for rapidly solving the problem of semiconductor riveting.
In view of this, according to a first aspect of embodiments of the present application, a receiving device for rapidly solving riveting of a semiconductor is provided, including:
a frame formed with a plane for placing the material tape;
the blanking unit is arranged on the frame, moves along the vertical direction of the plane, performs blanking on the edges of the material strips on the plane, and enables the edges of the material strips, which are away from each other, to be formed with connecting parts capable of being mutually riveted.
In a possible embodiment, the receiving device for rapidly solving the riveting of the semiconductor further comprises:
and the riveting unit is arranged on the frame, moves along the vertical direction of the plane, presses and rivets the material belts which are provided with the connecting parts and are adjacent to the plane, and enables the adjacent material belts to be riveted and connected together through the connecting parts.
In one possible embodiment, the direction of the punching unit to the riveting unit is a first direction;
the receiving device for rapidly solving the riveting of the semiconductor further comprises:
the conveying unit is arranged on the plane, and the material belt is arranged on the conveying unit, so that the material belt moves along the first direction.
In a possible embodiment, a positioning mechanism is arranged between the material belt and the transmission unit, so that the material belt is detachably arranged on the transmission unit.
In one possible embodiment, the positioning mechanism comprises:
the first positioning components are equidistantly arranged on the transmission unit;
the second positioning component is arranged on the material belt and is connected with the first positioning component in a matched mode.
In a possible embodiment, the connection portion includes:
the first connecting part is arranged at the first edge of the material belt;
the second connecting portion is arranged at the second edge of the material belt, and the first connecting portion and the second connecting portion of the adjacent material belt are riveted with each other.
In one possible embodiment, the first connecting portion and the second connecting portion are equally spaced apart from each other at the edge of the material tape.
In a possible embodiment, the blanking unit comprises:
the blanking main body is arranged on the frame and moves along the vertical direction of the plane;
the cutting part is arranged on the blanking main body, and cuts out connecting parts capable of being mutually riveted along with the edges of the material strips, which are mutually deviated along with the movement of the blanking main body.
In a possible embodiment, the cutting member is detachably mounted to the blanking body at an end thereof close to the plane.
In one possible embodiment, the riveting unit comprises:
the driving main body is arranged on the rack and moves along the vertical direction of the plane;
and the riveting component is detachably arranged at one end of the driving main body near the plane, and is used for pressing and riveting the material strips which are provided with the connecting parts and are adjacent to the plane along with the movement of the driving main body, so that the adjacent material strips are riveted and connected together through the connecting parts.
Compared with the prior art, the utility model at least comprises the following beneficial effects: the utility model provides a quick material receiving device who solves semiconductor riveting includes frame and blanking unit, wherein the frame is formed with the plane and can places the material area, blanking unit sets up in the frame, blanking unit has been along placing the planar vertical direction in material area and has moved in the during operation, when blanking unit and plane contact, blanking unit die-cuts the edge in material area, the edge that the material area deviates from each other after the die-cut is formed with the connecting portion that can rivet together, when adjacent material area needs to link together, link together through adjacent connecting portion, realize that the material area can rivet the equipment together, can conveniently realize the operation in later stage, avoid leading to the situation emergence that can not use because of the material area size is undersized, save the material, production cost has been saved in the very big degree.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures.
In the drawings:
FIG. 1 is a schematic block diagram of a receiving device for fast solving semiconductor riveting according to an embodiment of the present application;
fig. 2 is a schematic view of an angle of a transmission unit according to an embodiment of the present application.
The correspondence between the reference numerals and the component names in fig. 1 to 2 is:
100-frames, 200-blanking units, 300-riveting units, 400-transmission units, 500-connecting parts, 600-positioning mechanisms and 700-material belts;
210-blanking a main body, 220-cutting a part;
310-driving body, 320-staking part;
510-first connection, 520-second connection;
610-first positioning member, 620-second positioning member.
Detailed Description
In order to better understand the technical solutions described above, the technical solutions of the embodiments of the present application are described in detail below through the accompanying drawings and the specific embodiments, and it should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of the present application, and not limit the technical solutions of the present application, and the embodiments of the present application and the technical features in the embodiments of the present application may be combined with each other without conflict.
As shown in fig. 1 and fig. 2, according to a first aspect of an embodiment of the present application, a receiving device for quickly solving riveting of a semiconductor is provided, including: a frame 100 formed with a plane on which the tape 700 is placed; the punching unit 200 is disposed on the frame 100, and moves in a direction perpendicular to the plane to punch edges of the material tape 700 located on the plane, so that the edges of the material tape 700 facing away from each other are formed with connecting portions 500 capable of being mutually riveted.
The utility model provides a quick material receiving device who solves semiconductor riveting includes frame 100 and blanking unit 200, wherein frame 100 is formed with the plane and can places material area 700, blanking unit 200 sets up in frame 100, blanking unit 200 is along placing the planar vertical direction of material area 700 and moving, blanking unit 200 die-cuts the edge of material area 700 when blanking unit 200 and plane contact, the edge that die-cuts back material area 700 deviates from each other is formed with connecting portion 500 that can rivet together, when adjacent material area 700 needs to link together, link together through adjacent connecting portion 500, realize that material area 700 can carry out the riveting equipment together, can conveniently realize the operation in later stage, avoid taking place because of the condition that material area 700 size is too little and lead to can not use, save the material, greatly saved manufacturing cost.
In the prior art, after the LED bracket is injection molded, a plastic tray is used for receiving materials, then the next procedure is performed for cutting or bending, when the material belt 700 is bent or cut, and more than one meter is left, the rest material belt 700 can only be used for waste treatment due to the condition that the length is insufficient for subsequent operation, so that the waste of resources is easily caused, and the production cost is increased; compared with the processing of bending or cutting the material belt 700 in the transmission technology, the quick-solving material receiving device provided by the embodiment of the application can utilize the blanking unit 200 to mutually match with the plane of the frame 100, move along the vertical direction of the plane of the frame 100 through the blanking unit 200, die-cut the material belt 700 in the plane, the edges of the material belt 700, which are mutually deviated, are formed with the connecting parts 500 capable of mutually riveting, the die-cut material belt 700 can be riveted together through the connecting parts 500, the splicing of the material belt 700 is realized, the later operation can be conveniently realized, the utilization rate of the material belt 700 is greatly improved, the situation that the material belt 700 cannot be used due to undersize is avoided, the material is saved, and the production cost is further reduced.
As shown in fig. 1 and 2, in some examples, the receiving device for rapidly solving the riveting of the semiconductor further includes: the riveting unit 300 is disposed on the frame 100, moves along the vertical direction of the plane, and performs press riveting on the material strips 700 adjacent to the plane and formed with the connection parts 500, so that the adjacent material strips 700 are riveted and connected together by the connection parts 500.
In this technical scheme, the receiving device for fast solving the riveting of the semiconductor further comprises a riveting unit 300 arranged on the frame 100, the riveting unit 300 moves along the vertical direction of the plane formed by the frame 100 during operation, the material strips 700 with connecting portions 500 formed by punching of the punching unit 200 are placed on the plane of the frame 100, the edges of the adjacent material strips 700 are attached to each other, the connecting portions 500 of the adjacent two material strips 700 are placed in a superposition manner, when the riveting unit 300 moves towards the plane, the connecting portions 500 of the adjacent two material strips 700 are extruded by the riveting unit 300 and the plane, so that riveting is realized, the adjacent material strips 700 are spliced and riveted together, the length of the material strips 700 is increased, the later operation can be conveniently realized, the utilization rate of the material strips 700 is greatly improved, the occurrence of unusable conditions caused by undersize of the material strips 700 is avoided, the material is saved, and the production cost is further reduced.
It can be appreciated that, in combination with the foregoing, when the blanking unit 200 and the flat matching die-cut material strip 700 are used, the die-cut material strip 700 is taken out from the blanking unit 200 through manual operation, and then is manually placed on the flat surface of the frame 100 of the riveting unit 300, so that convenience is provided for the subsequent operation of the riveting unit 300, and the working efficiency of the riveting unit 300 is improved.
As shown in fig. 1 and 2, in some examples, the direction of the blanking unit 200 toward the clinching unit 300 is a first direction; the receiving device for rapidly solving the riveting of the semiconductor further comprises: the conveying unit 400 is disposed on the plane, and the material belt 700 is disposed on the conveying unit 400 to move the material belt 700 along the first direction.
In this embodiment, the blanking unit 200 and the riveting unit 300 are both disposed on the frame 100, wherein the direction of the blanking unit 200 to the riveting unit 300 is a first direction; and the receiving device for rapidly solving the riveting of the semiconductor further comprises a transmission unit 400 arranged on the surface of the frame 100, the transmission unit 400 is optionally used but not limited to a conveyor belt, the material belts 700 can be sequentially placed on the transmission unit 400, when the transmission unit 400 works, the material belts 700 positioned on the transmission unit 400 can be enabled to move along a first direction, the material belts 700 firstly pass through the blanking unit 200 and then move towards the riveting unit 300 through the transmission unit, when the material belts 700 are positioned on the blanking unit 200 through the transmission unit 400, the edges of the material belts 700 are punched through the blanking unit 200, the connecting parts 500 are formed on the edges of the material belts 700, the punched material belts 700 can move along the first direction through the transmission unit 400, when the blanking unit 200 is removed, the adjacent material belts 700 are manually placed, the edges of the adjacent material belts 700 are placed in a laminating mode, the connecting parts 500 of the two material belts 700 are overlapped and are placed, the material belts 700 are driven by the transmission unit 400 to move to the riveting unit 300 through the transmission belt source 400, the riveting unit 300 is used for connecting the adjacent material belts 700, the material belts 700 are conveniently increased in size, the production period is avoided, and the material consumption is greatly reduced.
As shown in fig. 1 and 2, in some examples, a positioning mechanism 600 is disposed between the material belt 700 and the conveying unit 400, so that the material belt 700 is detachably disposed on the conveying unit 400.
In this technical scheme, be equipped with positioning mechanism 600 between material area 700 and the transmission unit 400, can make the stable installation at transmission unit 400 of material area 700 through positioning mechanism 600, when material area 700 carried to blanking unit 200 and riveting unit 300 department through transmission unit 400, can ensure blanking unit 200 and riveting unit 300 during operation, the condition that the skew takes place can not appear in material area 700 that is in transmission unit 400, avoids producing the waste material, improves work efficiency to a great extent, reduction in production cost.
As shown in fig. 1 and 2, in some examples, the positioning mechanism 600 includes: the first positioning members 610 are equidistantly disposed on the transmission unit 400; the second positioning member 620 is disposed on the material belt 700, and the second positioning member 620 is connected with the first positioning member 610 in a matching manner.
In this technical solution, the positioning mechanism 600 includes a first positioning member 610 disposed on the transmission unit 400, where the first positioning member 610 is optionally but not limited to a positioning protrusion, and is fixed on the transmission unit 400 at equal intervals, and meanwhile, the positioning mechanism 600 further includes a second positioning member 620 disposed on the material belt 700, where the second positioning member 620 is optionally but not limited to a positioning hole, and penetrates through the material belt 700, and the second positioning member 620 is detachably and cooperatively connected with the first positioning member 610, and the positioning mechanism 600 limits the material belt 700 from displacing relative to the transmission unit 400, so as to avoid affecting the work of the blanking unit 200 and the riveting unit 300, avoid generating waste materials, greatly improve the working efficiency, and reduce the production cost.
As shown in fig. 2, in some examples, the connection 500 includes: a first connection portion 510 disposed at a first edge of the material tape 700; the second connecting portion 520 is disposed at a second edge of the material strip 700, and the first connecting portion 510 and the second connecting portion 520 adjacent to the material strip 700 are riveted with each other.
In this technical scheme, connect not 500 and include first connecting portion 510 and second connecting portion 520, first connecting portion 510 and second connecting portion 520 set up respectively in the edge that material area 700 kept away from each other, wherein first connecting portion 510 and second connecting portion 520 can be respectively riveting arch and riveting sunken, adjacent material area 700 accessible marginal first connecting portion 510 and second connecting portion 520 riveting link together, and then realize that two adjacent material areas 700 riveting link together, the length of material area 700 has been increased, can conveniently realize the operation of later stage, greatly promoted the utilization ratio of material area 700, avoid leading to the situation emergence that can not use because of material area 700 undersize, save the material, and then reduced manufacturing cost.
As shown in fig. 2, in some examples, the first connection portion 510 and the second connection portion 520 are equally spaced apart from the edge of the material strip 700.
In this technical scheme, first connecting portion 510 and second connecting portion 520 equidistance set up in the edge of material area 700, and adjacent material area 700 edge equidistance sets up first connecting portion 510 and second connecting portion 520, can make adjacent material area 700 under the effect of connecting unit 500, and the edge all links to each other, can guarantee the stability that adjacent material area 700 is connected, guarantees product quality, avoids appearing product quality problem in later operation, and then has improved production efficiency, reduction in production cost.
As shown in fig. 1 and 2, in some examples, the blanking unit 200 includes: a blanking body 210 provided to the frame 100 and moving in a direction perpendicular to the plane; the cutting member 220 is disposed on the blanking body 210, and cuts out the mutually-riveted connecting portions 500 along with the movement of the blanking body 210, which cuts out the edges of the material strips 700 facing away from each other.
In this technical solution, the blanking unit 200 includes a blanking main body 210 and a cutting member 220, where the blanking main body 210 is disposed on the frame 100, and optionally but not limited to hydraulic driving is performed to move the blanking main body 210, the cutting unit 220 is mounted on one end of the blanking main body 210 near a plane, the cutting unit 220 is provided with a fixed shape near a plane direction formed by the frame 100, where the shape is a shape of a connecting portion 500, and when the blanking main body 210 works, the blanking main body 210 works to drive the cutting unit 220 to move together to cut a material strip 700 on the plane formed by the frame 100, so as to implement cutting of the material strip 700 on the plane of the frame 100 by the blanking unit 200.
In some examples, the cutting member 220 is detachably mounted to an end of the blanking body 210 near the plane.
In this technical solution, the cutting member 220 may be detachably mounted on the blanking main body 210 by a bolt, and when the shape of the cutting member 220 is selected according to the actual situation, the size and shape of the cutting member 220 can be changed, thereby improving the practicability.
As shown in fig. 1 and 2, in some examples, the staking unit 300 includes: a driving body 310 provided to the frame 100 and moving in a direction perpendicular to the plane; and the riveting component 320 is detachably mounted at one end of the driving body 310 near the plane, and moves along with the driving body 310 to press and rivet the material strips 700 which are formed with the connecting parts 500 and are adjacent to the plane, so that the adjacent material strips 700 are riveted and connected together through the connecting parts 500.
In this technical solution, the riveting unit 300 includes a driving main body 310 and a riveting component 320, where the driving main body 310 is disposed on the stand 100, and optionally but not limited to, pneumatic driving is used to drive the driving main body 310 to move, and the riveting component 320 is installed at one end of the driving main body 310 near the plane, when the driving main body 310 works, the driving main body 310 works to drive the riveting component 320 to move together, so as to punch and rivet the material strip 700 on the plane formed by the stand 100, and realize that the riveting unit 300 performs punching and riveting on the material strip 700 on the plane of the stand 100.
From the above description of the embodiments, it will be apparent to those skilled in the art that the present application may be implemented by means of software plus necessary general hardware platforms, or may be implemented by hardware.
In the present utility model, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more, unless expressly defined otherwise. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or units referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. The utility model provides a quick receiving device who solves semiconductor riveting which characterized in that includes:
a frame formed with a plane for placing the material tape;
the blanking unit is arranged on the frame, moves along the vertical direction of the plane, performs blanking on the edges of the material strips on the plane, and enables the edges of the material strips, which are away from each other, to be formed with connecting parts capable of being mutually riveted.
2. The quick semiconductor riveting solution receiving apparatus of claim 1, further comprising:
and the riveting unit is arranged on the frame, moves along the vertical direction of the plane, presses and rivets the material belts which are provided with the connecting parts and are adjacent to the plane, and enables the adjacent material belts to be riveted and connected together through the connecting parts.
3. The receiving device for rapidly solving semiconductor riveting according to claim 2, wherein,
the direction of the blanking unit to the riveting unit is a first direction;
the receiving device for rapidly solving the riveting of the semiconductor further comprises:
the conveying unit is arranged on the plane, and the material belt is arranged on the conveying unit, so that the material belt moves along the first direction.
4. The receiving device for rapidly solving semiconductor riveting according to claim 3, wherein,
and a positioning mechanism is arranged between the material belt and the transmission unit, so that the material belt is detachably arranged on the transmission unit.
5. The quick semiconductor riveting solution receiving apparatus of claim 4, wherein the positioning mechanism comprises:
the first positioning components are equidistantly arranged on the transmission unit;
the second positioning component is arranged on the material belt and is connected with the first positioning component in a matched mode.
6. The receiving device for rapidly solving semiconductor riveting according to claim 1, wherein the connecting portion comprises:
the first connecting part is arranged at the first edge of the material belt;
the second connecting portion is arranged at the second edge of the material belt, and the first connecting portion and the second connecting portion of the adjacent material belt are riveted with each other.
7. The receiving device for quick semiconductor riveting according to claim 6, wherein the first connecting portion and the second connecting portion are equally spaced apart from each other at the edge of the tape.
8. The receiving device for rapidly solving riveting of semiconductors according to claim 1, wherein the blanking unit comprises:
the blanking main body is arranged on the frame and moves along the vertical direction of the plane;
the cutting part is arranged on the blanking main body, and cuts out connecting parts capable of being mutually riveted along with the edges of the material strips, which are mutually deviated along with the movement of the blanking main body.
9. The quick semiconductor riveting solution receiving apparatus of claim 8, wherein the cutting member is detachably mounted at an end of the blanking body near the plane.
10. The receiving device for rapidly solving semiconductor riveting according to claim 2, wherein the riveting unit comprises:
the driving main body is arranged on the rack and moves along the vertical direction of the plane;
and the riveting component is detachably arranged at one end of the driving main body near the plane, and is used for pressing and riveting the material strips which are provided with the connecting parts and are adjacent to the plane along with the movement of the driving main body, so that the adjacent material strips are riveted and connected together through the connecting parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320049922.6U CN219106185U (en) | 2023-01-04 | 2023-01-04 | Material receiving device capable of rapidly solving riveting of semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320049922.6U CN219106185U (en) | 2023-01-04 | 2023-01-04 | Material receiving device capable of rapidly solving riveting of semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219106185U true CN219106185U (en) | 2023-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320049922.6U Active CN219106185U (en) | 2023-01-04 | 2023-01-04 | Material receiving device capable of rapidly solving riveting of semiconductors |
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| Country | Link |
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| CN (1) | CN219106185U (en) |
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- 2023-01-04 CN CN202320049922.6U patent/CN219106185U/en active Active
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