CN219106134U

CN219106134U - Mounting and dismounting and heat dissipation structure of PGA packaging detector

Info

Publication number: CN219106134U
Application number: CN202320014078.3U
Authority: CN
Inventors: 曹儿方; 王耀辉; 李敏敏; 杨坤
Original assignee: Xi'an Questyle Aviation Optoelectronics Technology Co ltd
Current assignee: Xi'an Questyle Aviation Optoelectronics Technology Co ltd
Priority date: 2023-01-04
Filing date: 2023-01-04
Publication date: 2023-05-30
Anticipated expiration: 2033-01-04

Abstract

The utility model discloses an installation, disassembly and heat dissipation structure of a PGA (PGA package) detector, which relates to the technical field of detector installation, in particular to an installation, disassembly and heat dissipation structure of a PGA package detector. The design has solved the installation and the dismantlement design of the many contact pins chip of PGA encapsulation, and design simple operation is convenient, guarantees that the chip is complete, and the contact pin is not warp, and under the prerequisite of PCB atress, can fix the chip position, realizes the good contact of chip and base, and the chip back is dispelled the heat with the structure contact, can realize the convenient dismantlement of PCB. Frequent installation, debugging and disassembly in the initial stage of product development are facilitated.

Description

Mounting and dismounting and heat dissipation structure of PGA packaging detector

Technical Field

The utility model relates to the technical field of detector installation, in particular to an installation, disassembly and heat dissipation structure of a PGA (PGA package) detector.

Background

The PGA packaging technology is called (Pin Grid Array Package) and the Chinese meaning is called pin grid array packaging technology, and a plurality of square array pins are arranged inside and outside a chip packaged by the technology, and each square array pin is arranged at a certain distance along the periphery of the chip and can form a circle according to the number of pins. When mounting, the chip is inserted into a special PGA socket. The large area array camera has the characteristic of large capture range, is widely applied to industries such as railways, liquid crystal screens, glass and the like, and the CMOS chip pins packaged by the PGA are arranged on two sides of the bottom surface of the chip according to an array, and has the characteristics of high resolution, high sensitivity, low power consumption and low dark current, and is widely applied to large area array imaging detectors. Such chips are currently available on the market without ready attachment and detachment tools. Because the cooperation of chip pin and socket is very tight, and chip surface area of contact is limited, bare-handed direct mount hardly guarantees that all pins of chip and chip base fully contact, also can not guarantee the depth of parallelism of chip imaging surface installation simultaneously, and direct dismantlement also can lead to chip pin bending or surface damage. Therefore, the chip mounting and dismounting structure is designed in cooperation with the chip practical application, so that each contact pin of the chip can be protected from deformation and damage, the completeness of the mounting base and the PCB is ensured, the relative positions of the chip and the mounting base can be fixed, and the chip mounting and dismounting structure is easy and convenient to detach and debug.

Such chips are currently available on the market without ready attachment and detachment tools. Because the cooperation of chip pin and socket is very tight, and chip surface area of contact is limited, bare-handed direct mount hardly guarantees that all pins of chip and chip base fully contact, also can not guarantee the depth of parallelism of chip imaging surface installation simultaneously, and direct dismantlement also can lead to chip pin bending or surface damage. Therefore, the chip mounting and dismounting structure is designed in cooperation with the chip practical application, so that each contact pin of the chip can be protected from deformation and damage, the completeness of the mounting base and the PCB is ensured, the relative positions of the chip and the mounting base can be fixed, and the chip mounting and dismounting structure is easy and convenient to detach and debug.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides an installation, disassembly and heat dissipation structure of a PGA (PGA package) detector, which solves the problems in the prior art.

(II) technical scheme

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides an installation dismantlement and heat radiation structure of PGA encapsulation detector, including mounting structure, mounting structure comprises preceding shell, chip casting die and rubber circle, the internally mounted of preceding shell has PCB, PCB's inside welding has the chip base, threaded hole has been seted up at the four corners of PCB, the inside rotation of threaded hole is connected with first installation double-screw bolt, PCB installs the inside at preceding shell through first installation double-screw bolt, the mounting groove has been seted up to the inside of chip casting die, the rubber circle is placed in the inside of mounting groove, the inside at the chip base is placed to the chip, the mounting hole has been seted up at the four corners of chip casting die, the inside of mounting hole is provided with the second mounting screw, the chip casting die is in the same place with preceding shell through mounting screw.

Optionally, a supporting beam is arranged in the middle of the front shell, the supporting beam is mutually abutted with the chip, and heat-conducting silicone grease is smeared at the contact position of the supporting beam and the chip.

Optionally, the installation four corners of preceding shell are boss form, and the installation screw hole in preceding shell four corners looks adaptation with the position of PCB mounting hole.

Optionally, the end face of the front shell is provided with a positioning mounting hole, and the end face of the front shell and the surface of the PCB are provided with a first pin mark.

Optionally, the number of the positioning mounting holes on the end face of the front shell is two, and the positioning mounting holes are distributed on two sides of the end face of the front shell.

Optionally, pins are arranged on the outer surface of the chip, and the chip pins and the PCB pin numbers correspond to each other.

(III) beneficial effects

The utility model provides an installation, disassembly and heat dissipation structure of a PGA packaging detector, which has the following beneficial effects:

1. by adopting the design scheme of the chip pressing part and the front shell, the chip pressing part can vertically press the chip into the chip base, so that the chip pins and the chip socket are ensured to be in good contact. The design of the supporting beam of the front shell ensures that the back of the chip is well contacted with the structure, ensures the parallelism between the imaging surface of the chip and the mounting surface of the structure, and plays the role of contact heat dissipation.

2. And the mounting mode of the four-corner screws of the chip pressing piece. And (3) sequentially tightening each screw by adopting a diagonal tightening mode, and performing cyclic operation until the screws cannot be continuously tightened. The diagonal tightening mode is adopted to ensure the uniform stress on the surface of the chip, and the phenomenon that pins are bent or the back of the chip is inclined in the installation process due to uneven stress of the chip caused by single-side tightening is prevented. The chip pins can be ensured to be gradually moved and inserted into the chip base by tightening one circle in sequence, and the other pins are prevented from being inclined or damaged due to large displacement of one side of the chip in the stress process of the chip.

3. And (3) designing the distance between the back surface of the chip and the surface of the PCB. In order to ensure that the back of the chip is fully contacted with the front shell supporting beam and the PCB is well contacted with the front shell structure after the chip is mounted in the base, the structure designs and calculates the length dimension of the contact pin of the chip inserted into the base. The length of the pins for which the chip is fully inserted into the submount can be determined by the chip manual, the submount manual, and the actual test. In the actual design process, the tolerance of-0.2 to-0.3 mm is adopted, so that the PCB is in good contact with the front shell structure and cannot be stressed and deformed under the condition that the back surface of the chip is in full contact with the front shell supporting beam. The problem that the back of the chip cannot be contacted with the supporting cross beam under the condition that the chip is completely inserted into the base because the distance between the back of the chip and the surface of the PCB is too small is avoided, and the PCB is fixed by the four-corner studs to generate stress deformation; the data transmission is affected by the fact that the chip cannot be in good contact with the base due to the fact that the distance between the back surface of the chip and the surface of the PCB is too large.

4. Front shell boss design convenient for PCB disassembly. The front shell PCB mounting hole is provided with a boss which is contacted with the PCB four corner mounting holes, other parts are suspended, when the chip and the PCB are disassembled, the suspended edges of the PCB can be pried by using a straight screwdriver respectively, and the heat dissipation cross beam plays a limiting role on the chip, so that the PCB can be separated from the chip by utilizing the lever principle. The design has the advantage of preventing the PCB or the chip from being scratched and damaged by forcibly disassembling the PCB or the chip by adopting a hard device when the PCB is completely contacted with the surface of the structure.

Drawings

FIG. 1 is a schematic diagram of a chip pin structure according to the present utility model;

FIG. 2 is a schematic view of the structure of the front shell of the present utility model;

FIG. 3 is a schematic view of a die pressing member according to the present utility model;

FIG. 4 is a schematic diagram of a chip mounting structure according to the present utility model

FIG. 5 is a schematic cross-sectional view of a chip according to the present utility model

FIG. 6 is a schematic view of the anti-reflection structure of the front shell of the present utility model.

In the figure: 1. a pin; 2. a chip; 3. a support beam; 4. a front shell; 5. a mounting groove; 6. a chip pressing member; 7. installing a stud; 8. a PCB; 10. a chip base; 11. a pin number I; 12. positioning the mounting hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1 to 6, the present utility model provides the following technical solutions: the utility model provides a PGA encapsulation detector's installation dismantlement and heat radiation structure, including mounting structure, mounting structure comprises preceding shell 4, chip casting die 6 and rubber circle, the internally mounted of preceding shell 4 has PCB8, the inside welding of PCB8 has chip base 10, the mounting hole has been seted up at the four corners of PCB8, the inside rotation of mounting hole is connected with first installation double-screw bolt 7, PCB8 installs in the inside of preceding shell 4 through first installation double-screw bolt 7, mounting groove 5 has been seted up in the inside of chip casting die 6, the rubber circle is placed in the inside of mounting groove 5, chip 2 is placed in the inside of chip base 10, the mounting hole has been seted up at the four corners of chip casting die 6, the inside of mounting hole is provided with the second mounting screw, chip casting die 6 is in the same place with preceding shell 4 through the mounting screw, the middle part of preceding shell 4 is provided with supporting beam 3, supporting beam 3 and chip 2 butt each other, the position that supporting beam 3 contacted with chip 2 has smeared heat conduction silicone grease, the four mounting corners of the front shell 4 are in a boss form, the mounting threaded holes at the four corners of the front shell 4 are matched with the positions of the mounting holes of the PCB8, the end face of the front shell 4 is provided with positioning mounting holes 12, the end face of the front shell 4 and the surface of the PCB8 are provided with a first pin mark 11, the positions of the positioning mounting holes 12 on the end face of the front shell 4 are two, the positioning mounting holes are distributed on the two sides of the end face of the front shell 4, the outer surface of the chip 2 is provided with pins 1, the pins 1 of the chip 2 and the pins 1 of the PCB8 are mutually corresponding in number, the chip pressing piece 6 and the front shell 4 are adopted, the chip pressing piece 6 can vertically press the chip 2 into the chip base 10, the pins 1 of the chip 2 are well contacted with the sockets of the chip 2, the back of the chip 2 is well contacted with the structure by the design of the supporting cross beam 3 of the front shell 4, the parallelism of the imaging surface of the chip 2 and the structure mounting surface is guaranteed, and the purpose of heat dissipation by contact is achieved, the mounting mode of four-corner screws of the chip pressing piece 6 sequentially tightens all screws in a circle by adopting a diagonal tightening mode, and circularly operates until the screws cannot be continuously tightened, the stress on the surface of the chip 2 can be guaranteed to be uniform by adopting the diagonal tightening mode, the phenomenon that the pins 1 are bent or the back of the chip 2 is inclined in the mounting process due to uneven stress on one side is prevented, the pins 1 of the chip 2 are gradually and slightly displaced and inserted into a chip base 10 by tightening in turn, the situation that one side of the chip 2 is greatly displaced to enable other pins 1 to incline or be damaged in the process of stressing the chip 2 is prevented, the back of the chip 2 is prevented from being in full contact with a front shell 4 supporting cross beam 3, the PCB8 is well in contact with the front shell 4 structure after the chip 2 is mounted in the base, the structure designs and calculates the length of pins of the chip 2 inserted into the base, the length of the pins of the chip 2 can be determined through a chip 2 manual, the base manual and actual test, the length of-0.2 to 0.3mm in the actual design process can be guaranteed, and the tolerance can be guaranteed to be completely contacted with the front shell 2 and the front shell 4, and the front shell 2 cannot be deformed and completely in contact with the front shell 4 due to the fact that the back of the chip 2 is well contacted with the front shell 4, and the front shell 4 is not completely contacted with the front shell 4, and the front shell 2 cannot be deformed, and the front shell 2 is completely is prevented from being deformed, and the front shell 2 is completely and deformed, and the front shell 2 is not completely and the front shell is completely and contacted with the front shell 4; because the chip 2 back and PCB8 surface distance size is too big to make chip 2 and base can not good contact influence data transmission, make things convenient for the design of preceding shell 4 boss that PCB8 was dismantled, preceding shell 4PCB8 mounting hole department design boss and PCB8 four corners mounting hole contact, other parts are unsettled, when dismantling chip 2 and PCB8, can use the straight bottle opener to pry the unsettled edge of PCB8 respectively, heat dissipation crossbeam plays spacing effect to chip 2, can separate PCB8 and chip 2 with the lever principle like this, the fish tail and the damage that PCB8 or chip 2 caused to PCB8 and chip 2 are dismantled by force to the adoption stereoplasm device when the benefit of design can prevent PCB8 and structural surface to contact completely.

When the chip pressing device is used, the chip pressing device 6 and the front shell 4 are matched, the chip pressing device 6 can vertically press the chip 2 into the chip base 10, and good contact between the pins 1 of the chip 2 and the socket of the chip 2 is ensured. The design of the supporting cross beam 3 of the front shell 4 ensures that the back surface of the chip 2 is well contacted with the structure, ensures the parallelism of the imaging surface of the chip 2 and the mounting surface of the structure, and achieves the purpose of contact heat dissipation, and the mounting mode of four-corner screws of the chip pressing piece 6 is realized. And (3) sequentially tightening each screw by adopting a diagonal tightening mode, and performing cyclic operation until the screws cannot be continuously tightened. The stress on the surface of the chip 2 can be guaranteed to be uniform by adopting a diagonal tightening mode, and the phenomenon that the pins 1 are bent or the back of the chip 2 is inclined in the installation process due to uneven stress of the chip 2 caused by single-side tightening is prevented. The pins 1 of the chip 2 can be ensured to be gradually moved and inserted into the chip base 10 by tightening one circle in sequence, and the other pins 1 are prevented from being inclined or damaged due to large displacement on one side of the chip 2 in the stress process of the chip 2, and the distance between the back of the chip 2 and the surface of the PCB8 is designed. To ensure that the back of the chip 2 is fully in contact with the front housing 4 supporting beam 3 and that the PCB8 is in good structural contact with the front housing 4 after the chip 2 is mounted in the chassis, the structure designs and calculates the pin length dimension of the chip 2 inserted into the chassis. The length of the pins of the chip 2 fully inserted into the cradle can be determined by the chip 2 manual, the cradle manual and the actual test. In the actual design process, the tolerance of-0.2 to-0.3 mm is adopted, so that the PCB8 is in good contact with the front shell 4 without stress deformation under the condition that the back surface of the chip 2 is in complete contact with the front shell 4 supporting beam 3. The situation that the back of the chip 2 cannot be contacted with the supporting beam 3 under the condition that the chip 2 is completely inserted into the base and the PCB8 is fixed by four-corner studs to generate stress deformation due to the fact that the distance between the back of the chip 2 and the surface of the PCB8 is undersized is prevented; the distance between the back surface of the chip 2 and the surface of the PCB8 is oversized, so that the chip 2 and the base cannot be in good contact to influence data transmission, and the boss design of the front shell 4 for facilitating the disassembly of the PCB8 is facilitated. The front shell 4PCB8 mounting hole department designs boss and PCB8 four corners mounting hole contact, and other parts are unsettled, when dismantling chip 2 and PCB8, can use a word bottle opener to pry the unsettled edge of PCB8 respectively, and the heat dissipation crossbeam plays spacing effect to chip 2, utilizes lever principle can separate PCB8 and chip 2 like this. The design has the advantage of preventing the PCB8 or the chip 2 from being scratched and damaged by forcibly disassembling the PCB8 or the chip 2 by adopting a hard device when the PCB8 is completely contacted with the structural surface.

The working principle and the beneficial effects of the utility model are as follows: the design has solved the installation and the dismantlement design of the many contact pins chip 2 of PGA encapsulation, and design simple operation is convenient, guarantees that chip 2 is complete, and the contact pin is not warp, and under the prerequisite of PCB8 atress, can fix chip 2 position, realizes the good contact of chip 2 and base, and the chip 2 back is dispelled the heat with the structure contact, can realize the convenient dismantlement of PCB 8. Frequent installation, debugging and disassembly in the initial stage of product development are facilitated.

The present utility model is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present utility model and the inventive concept thereof, can be replaced or changed within the scope of the present utility model.

Claims

1. The utility model provides an installation dismantlement and heat radiation structure of PGA encapsulation detector, includes mounting structure, its characterized in that: the mounting structure comprises preceding shell (4), chip casting die (6) and rubber circle, the internally mounted of preceding shell (4) has PCB (8), the inside welding of PCB (8) has chip base (10), the mounting hole has been seted up in the four corners of PCB (8), the inside rotation of mounting hole is connected with first installation double-screw bolt (7), the inside at preceding shell (4) is installed through first installation double-screw bolt (7) to PCB (8), mounting groove (5) have been seted up to the inside of chip casting die (6), the inside at mounting groove (5) is placed to the rubber circle, the inside at chip base (10) is placed to chip (2), the mounting hole has been seted up in the four corners of chip casting die (6), the inside of mounting hole is provided with the second mounting screw, chip casting die (6) are in the same place with preceding shell (4) through the mounting screw.

2. The structure for mounting, dismounting and heat dissipation of a PGA package socket of claim 1, wherein: the middle part of preceding shell (4) is provided with supporting beam (3), and supporting beam (3) and chip (2) butt each other, and heat conduction silicone grease has been paintd to the position of supporting beam (3) and chip (2) contact.

3. The structure for mounting, dismounting and heat dissipation of a PGA package socket of claim 1, wherein: the four mounting corners of the front shell (4) are in boss forms, and the mounting threaded holes at the four corners of the front shell (4) are matched with the positions of the mounting holes of the PCB (8).

4. The structure for mounting, dismounting and heat dissipation of a PGA package socket of claim 1, wherein: the end face of the front shell (4) is provided with a positioning and mounting hole (12), and the end face of the front shell (4) and the surface of the PCB (8) are provided with a first pin mark (11).

5. The structure for mounting, dismounting and heat dissipation of a PGA package socket of claim 1, wherein: the number of the positioning mounting holes (12) on the end face of the front shell (4) is two, and the positioning mounting holes are distributed on two sides of the end face of the front shell (4).

6. The structure for mounting, dismounting and heat dissipation of a PGA package socket of claim 1, wherein: the outer surface of the chip (2) is provided with pins (1), and the pins (1) of the chip (2) and the pins (1) of the PCB (8) are numbered correspondingly.