CN219087638U - ICT test equipment machine case - Google Patents
ICT test equipment machine case Download PDFInfo
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- CN219087638U CN219087638U CN202223037437.1U CN202223037437U CN219087638U CN 219087638 U CN219087638 U CN 219087638U CN 202223037437 U CN202223037437 U CN 202223037437U CN 219087638 U CN219087638 U CN 219087638U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model provides an ICT test equipment cabinet, which comprises a cabinet body, wherein the cabinet body is sequentially provided with a drive installation area, a detection area and a host installation area from top to bottom; the detection area is provided with first cabinet doors in a front-back symmetrical mode, and ventilation windows are symmetrically arranged on two sides of the detection area; the front and rear sides of the host installation area are symmetrically provided with second cabinet doors, and the two sides of the host installation area are symmetrically provided with first air outlets; the ventilation window is connected with a heat dissipation device; the first exhaust outlet is connected with a first exhaust device; and one side of the first air outlet is provided with a heat conduction component. According to the utility model, the first exhaust device is connected with the heat conduction assembly in a matched manner through the ventilation window, and the second exhaust device can meet the heat dissipation requirements of different functional areas, ensure that the temperature inside the equipment cabinet is maintained in a reasonable range, ensure the long-time high-efficiency detection accuracy and efficiency, and improve the service life of the equipment.
Description
Technical Field
The utility model relates to the technical field of metal plate cabinets, in particular to an ICT test equipment cabinet.
Background
ICT is an automatic on-line tester, and is a test device for the production of a printed circuit board assembly necessary for modern electronic enterprises. ICT application range is wide, and measurement accuracy is high, and it is clear to the problem instruction that detects, is a standard test means, and even the ordinary workman of electronic technology level handles the PCBA that has problems also very easily. The ICT test mainly detects the open circuit, short circuit and welding condition of all parts of the PCBA by the test points of the PCB contacted by the test probes, and can be divided into open circuit test, short circuit test, resistance test, capacitance test, diode test, triode test, field effect tube test, missing package of other general and special components such as IC pin test, incorrect package, parameter value deviation, welding spot continuous welding, circuit board open circuit and other faults, and accurately tells a user which component or point the open circuit is located at through a printer or screen display.
In order to meet the requirements of accurate and efficient detection, the components of the ICT test must be guaranteed to operate normally. For the precision test component, the continuous rise of the temperature of the detection environment can not only influence the service life of the detection equipment, but also influence the detection accuracy and the detection efficiency. ICT test equipment machine case of prior art, because the inner space is limited, when detecting the long-time high-efficient operation of part, can lead to the inside high temperature that produces of test equipment machine case because the environment heat continuously improves, and just through the radiating through-hole that the machine case set up, can't fine satisfy radiating requirement, influence accuracy and the detection efficiency of detection.
Disclosure of Invention
In view of the above, the present utility model provides an ICT test equipment chassis to solve the problems existing in the prior art.
The technical scheme of the utility model is as follows:
the ICT test equipment case is characterized by comprising a case body, wherein the case body is sequentially provided with a drive installation area, a detection area and a host installation area from top to bottom; the detection area is provided with first cabinet doors in a front-back symmetrical mode, and ventilation windows are symmetrically arranged on two sides of the detection area;
the front and rear sides of the host installation area are symmetrically provided with second cabinet doors, and the two sides of the host installation area are symmetrically provided with first air outlets;
the ventilation window is connected with a heat dissipation device;
the first exhaust outlet is connected with a first exhaust device;
and one side of the first air outlet is provided with a heat conduction component.
The drive installation area, the detection area and the host installation area are respectively connected with a lifting component, a detection component, a host and a power module of ICT test equipment in the prior art.
According to the utility model, the ventilation window is connected with the heat dissipation device, so that the heat exchange speed between the area and the outside can be effectively increased; the first exhaust device and the heat conduction component are respectively arranged in the host installation area, so that heat in the internal area can be effectively conducted to the outside, and heat accumulation in the area is avoided; the second exhaust device is arranged in the drive installation area, so that reasonable heat dissipation is provided, and normal operation of equipment is ensured.
Further, second air outlets are symmetrically arranged on two sides of the driving installation area.
Further, the second exhaust outlet is connected with a second exhaust device.
Preferably, the first exhaust device and the second exhaust device may be implemented by using devices such as an exhaust heat dissipation fan in the prior art.
Further, the heat dissipating device comprises a heat exchanging plate, wherein the middle area of the heat exchanging plate is a cold conducting area, and a heat conducting area is arranged at the outer side of the cold conducting area; the semiconductor cooling device comprises a semiconductor cooling module, a heat dissipation module and an exhaust module, wherein one side of the semiconductor cooling module is connected with a cold conduction area in a bonding mode, one side of the heat dissipation module is connected with the heat conduction area in a bonding mode, and the other side of the heat dissipation module faces the exhaust module.
According to the heat dissipation device, on one hand, the semiconductor refrigeration module is used for refrigerating and cooling the upper part of the operation box through the cold conduction area of the heat exchange plate, on the other hand, the heat conduction area is used for rapidly transferring heat through the heat dissipation module and rapidly discharging the heat through the exhaust module at one end, so that rapid cooling is achieved.
Further, the heat dissipation module comprises a heat dissipation plate, and the heat dissipation plate is an annular heat dissipation plate, so that heat dissipation efficiency can be improved.
Further, heat conducting columns are symmetrically arranged on one side of the heat radiating plate, and one end of each heat conducting column faces the exhaust module. The heat exchange rate can be rapidly improved by the action of the heat conducting column.
Preferably, the exhaust module is a radiator fan.
Further, the heat conduction assembly comprises a first sealing connection plate layer, a heat conduction layer, a condensation layer and a second sealing connection plate layer which are sequentially connected, a vacuum cavity is arranged in the middle of the heat conduction layer, and a cooling liquid layer is arranged in the vacuum cavity.
Further, the condensation layer comprises a condensation panel and a condensation backboard which are sequentially connected; the condensing panel faces the vacuum chamber.
Furthermore, the vein-shaped capillary structures are arranged on the surface of the condensation panel, and through the arrangement of the vein-shaped capillary structures, a special liquid reflux channel can be formed on the condensation layer, so that the cooling liquid reflux is changed from disorder to order, the low speed is changed into high speed, and the heat conduction efficiency is effectively improved.
Preferably, the heat conduction layer is a superconductive hexagonal graphene layer, so that heat dissipation and heat exchange capacity can be effectively improved.
According to the heat conduction assembly, heat is absorbed rapidly through the heat conduction layer, liquid of the cooling liquid layer absorbs heat through gasification, the condensation layer floating to the cold end condenses into liquid to release heat, the liquid flows back to the vacuum cavity of the hot end under the capillary action of the condensation layer, and heat conduction is performed rapidly in a circulating and reciprocating mode through gas-liquid conversion. Can carry out quick heat conduction at the curb plate of box, realize cooling to the cabinet inside.
Further, one side of the driving installation area is connected with a display module support, preferably, the display module support is a foldable display module support, and through the arrangement, the display module support is used for installing display equipment.
According to the utility model, the first exhaust device is connected with the heat conduction assembly in a matched manner through the ventilation window, and the second exhaust device can meet the heat dissipation requirements of different functional areas, ensure that the temperature inside the equipment cabinet is maintained in a reasonable range, ensure the long-time high-efficiency detection accuracy and efficiency, and improve the service life of the equipment.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present utility model;
FIG. 2 is a schematic diagram of an embodiment of the present utility model;
FIG. 3 is a schematic view of a partial structure of an embodiment of the present utility model;
FIG. 4 is a schematic view of a partial structure of an embodiment of the present utility model;
FIG. 5 is a schematic view of a partial structure of an embodiment of the present utility model;
FIG. 6 is a schematic diagram of a partial structure of an embodiment of the present utility model;
fig. 7 is a schematic partial structure of an embodiment of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
The ICT test equipment case is characterized by comprising a case body 10, wherein the case body is sequentially provided with a drive installation area 1, a detection area 2 and a host installation area 3 from top to bottom; the detection area is provided with first cabinet doors 21 in a front-back symmetrical mode, and ventilation windows 22 are symmetrically arranged on two sides of the detection area;
the front and back of the host installation area are symmetrically provided with second cabinet doors 31, and the two sides of the host installation area are symmetrically provided with first air outlets 32;
the ventilation window is connected with a heat dissipation device 4;
the first exhaust outlet is connected with a first exhaust device (not labeled);
and one side of the first air outlet is provided with a heat conduction component 5.
The drive installation area, the detection area and the host installation area are respectively connected with a lifting component, a detection component, a host and a power module of ICT test equipment in the prior art.
According to the utility model, the ventilation window is connected with the heat dissipation device, so that the heat exchange speed between the area and the outside can be effectively increased; the first exhaust device and the heat conduction component are respectively arranged in the host installation area, so that heat in the internal area can be effectively conducted to the outside, and heat accumulation in the area is avoided; the second exhaust device is arranged in the drive installation area, so that reasonable heat dissipation is provided, and normal operation of equipment is ensured.
Further, second air outlets 11 are symmetrically arranged on two sides of the driving installation area.
Further, the second exhaust outlet is connected with a second exhaust device (not labeled).
Preferably, the first exhaust device and the second exhaust device may be implemented by using devices such as an exhaust heat dissipation fan in the prior art.
Further, the heat dissipating device 4 includes a heat exchanging plate 41, a middle area of the heat exchanging plate is a heat conducting area 411, and a heat conducting area 412 is arranged at an outer side of the heat conducting area; the semiconductor refrigeration device further comprises a semiconductor refrigeration module 42, a heat dissipation module 43 and an exhaust module 44, wherein one side of the semiconductor refrigeration module is connected with the cold conduction area in a bonding mode, one side of the heat dissipation module is connected with the heat conduction area in a bonding mode, and the other side of the heat dissipation module faces the exhaust module.
According to the heat dissipation device, on one hand, the semiconductor refrigeration module is used for refrigerating and cooling the upper part of the operation box through the cold conduction area of the heat exchange plate, on the other hand, the heat conduction area is used for rapidly transferring heat through the heat dissipation module and rapidly discharging the heat through the exhaust module at one end, so that rapid cooling is achieved.
Further, the heat dissipation module includes a heat dissipation plate 431, which is an annular heat dissipation plate, so as to improve heat dissipation efficiency.
Further, heat conducting columns 432 are symmetrically arranged on one side of the heat dissipation plate, and one end of each heat conducting column faces the exhaust module. The heat exchange rate can be rapidly improved by the action of the heat conducting column.
Preferably, the exhaust module is a radiator fan.
Further, the heat conduction assembly comprises a first sealing connection plate layer 51, a heat conduction layer 52, a condensation layer 53 and a second sealing connection plate layer 54 which are sequentially connected, a vacuum cavity 55 is arranged in the middle of the heat conduction layer, and a cooling liquid layer 56 is arranged in the vacuum cavity.
Further, the condensation layer includes a condensation panel 531 and a condensation back plate 532 connected in sequence; the condensing panel faces the vacuum chamber.
Furthermore, the vein-shaped capillary structures are arranged on the surface of the condensation panel, and through the arrangement of the vein-shaped capillary structures, a special liquid reflux channel can be formed on the condensation layer, so that the cooling liquid reflux is changed from disorder to order, the low speed is changed into high speed, and the heat conduction efficiency is effectively improved.
Preferably, the heat conduction layer is a superconductive hexagonal graphene layer, so that heat dissipation and heat exchange capacity can be effectively improved.
According to the heat conduction assembly, heat is absorbed rapidly through the heat conduction layer, liquid of the cooling liquid layer absorbs heat through gasification, the condensation layer floating to the cold end condenses into liquid to release heat, the liquid flows back to the vacuum cavity of the hot end under the capillary action of the condensation layer, and heat conduction is performed rapidly in a circulating and reciprocating mode through gas-liquid conversion. Can carry out quick heat conduction at the curb plate of box, realize cooling to the cabinet inside.
Further, a display module holder 12 is connected to one side of the driving installation area, and preferably, the display module holder is a foldable display module holder, and through this arrangement, is used for installing a display device.
According to the utility model, the first exhaust device is connected with the heat conduction assembly in a matched manner through the ventilation window, and the second exhaust device can meet the heat dissipation requirements of different functional areas, ensure that the temperature inside the equipment cabinet is maintained in a reasonable range, ensure the long-time high-efficiency detection accuracy and efficiency, and improve the service life of the equipment. It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art. It should be noted that technical features not described in detail in the present utility model may be implemented by any prior art.
Claims (10)
1. The ICT test equipment case is characterized by comprising a case body, wherein the case body is sequentially provided with a drive installation area, a detection area and a host installation area from top to bottom; the detection area is provided with first cabinet doors in a front-back symmetrical mode, and ventilation windows are symmetrically arranged on two sides of the detection area;
the front and rear sides of the host installation area are symmetrically provided with second cabinet doors, and the two sides of the host installation area are symmetrically provided with first air outlets;
the ventilation window is connected with a heat dissipation device;
the first exhaust outlet is connected with a first exhaust device;
and one side of the first air outlet is provided with a heat conduction component.
2. The ICT test equipment cabinet of claim 1, wherein the two sides of the drive installation area are symmetrically provided with second air outlets.
3. The ICT test device case of claim 2 wherein the second exhaust port is connected to a second exhaust means.
4. The ICT test equipment chassis of claim 1, wherein the heat dissipating device comprises a heat exchanging plate, a middle area of the heat exchanging plate is a heat conducting area, and a heat conducting area is arranged outside the heat conducting area; the semiconductor cooling device comprises a semiconductor cooling module, a heat dissipation module and an exhaust module, wherein one side of the semiconductor cooling module is connected with a cold conduction area in a bonding mode, one side of the heat dissipation module is connected with the heat conduction area in a bonding mode, and the other side of the heat dissipation module faces the exhaust module.
5. The ICT test device case of claim 4 wherein the heat dissipation module comprises a heat dissipation plate, the heat dissipation plate being an annular heat dissipation plate.
6. The ICT test equipment cabinet of claim 5, wherein one side of the heat dissipation plate is symmetrically provided with heat conduction columns, and one end of each heat conduction column faces the exhaust module.
7. The ICT test equipment cabinet of claim 1, wherein the heat conducting assembly comprises a first sealing connection plate layer, a heat conducting layer, a condensation layer and a second sealing connection plate layer which are sequentially connected, a vacuum cavity is arranged in the middle of the heat conducting layer, and a cooling liquid layer is arranged in the vacuum cavity.
8. The ICT test device case of claim 7 wherein the condensation layer comprises a condensation face plate, a condensation back plate connected in sequence; the condensing panel faces the vacuum chamber.
9. The ICT test device case of claim 8 wherein the condensation panel surface is configured with a vein-like capillary structure.
10. The ICT test device case of claim 1 wherein one side of the drive mounting area is connected to a display module support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223037437.1U CN219087638U (en) | 2022-11-15 | 2022-11-15 | ICT test equipment machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223037437.1U CN219087638U (en) | 2022-11-15 | 2022-11-15 | ICT test equipment machine case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219087638U true CN219087638U (en) | 2023-05-26 |
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ID=86388244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223037437.1U Active CN219087638U (en) | 2022-11-15 | 2022-11-15 | ICT test equipment machine case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219087638U (en) |
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2022
- 2022-11-15 CN CN202223037437.1U patent/CN219087638U/en active Active
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