CN219068498U

CN219068498U - PCB warp processing apparatus

Info

Publication number: CN219068498U
Application number: CN202222857190.1U
Authority: CN
Inventors: 王显亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-05-23
Anticipated expiration: 2032-10-28

Abstract

The utility model discloses a PCB warp processing device, which relates to the technical field of PCB production and processing, and comprises a working assembly, wherein supporting assemblies are arranged at two ends of the upper surface of the working assembly, a processing assembly is fixedly connected between the two supporting assemblies, the processing assembly comprises a fixed seat and a second heating block, the second heating block is uniformly and electrically connected to the bottom surface of the fixed seat at equal distance, and four corners of the upper surface of the fixed seat are fixedly connected with electric telescopic rods. The utility model has the advantages of being convenient for improving the leveling efficiency of the warped PCB by arranging the processing component, solves the problems that the existing PCB warping processing device generally places the PCB on a workbench and directly acts on the surface of the warped PCB by using the related flattening structure when the related warped PCB is leveled, and the method needs to continuously press the PCB for a long time to shape the warped PCB without rebound again and has certain limitation in use.

Description

PCB warp processing apparatus

Technical Field

The utility model relates to the technical field of PCB production and processing, in particular to a PCB warping processing device.

Background

The printed circuit board, also called a printed circuit board, is a provider for electric connection of electronic components, and is represented by a multi-purpose PCB, and the warping of the PCB can bring a plurality of troubles in use, for example, the warping of the PCB can lead to incapability of mounting SMT electronic components, poor contact between the electronic components and printed circuit welding spots, or the cutting of some feet after mounting the electronic components can not cut the feet or can cut the substrate, and the bonding pads of some parts of the wave soldering base board can not contact the soldering tin surface and can not be soldered with tin. Therefore, the PCB which generates warpage in the processing process needs to be flattened by using a related processing device, but the PCB has the following defects in actual use:

at present, when the existing PCB warping processing device is used for flattening the PCB with relevant warping, the PCB is usually placed on a workbench, and the relevant flattening structure is used for directly acting on the surface of the warped PCB.

The foregoing is not necessarily a prior art, and falls within the technical scope of the inventors.

Disclosure of Invention

In order to solve the problems, the utility model aims to provide a PCB warping processing device,

in order to achieve the above purpose, the utility model provides a PCB warp processing device, which comprises a working assembly, wherein two ends of the upper surface of the working assembly are provided with supporting assemblies, a processing assembly is fixedly connected between the two supporting assemblies, the processing assembly comprises a fixing seat and a second heating block, the second heating block is uniformly and electrically connected to the bottom surface of the fixing seat at equal distance, and four corners of the upper surface of the fixing seat are fixedly connected with electric telescopic rods.

In one example, the working assembly comprises a workbench and rectangular grooves, wherein the rectangular grooves are uniformly and equidistantly arranged on the upper surface of the workbench, and the bottom surface of each rectangular groove is electrically connected with a first heating block; by the first heating piece that sets up, be convenient for heat the one side of warp PCB board, by the rectangular channel that sets up, be convenient for carry out structural fixing to first heating piece.

In one example, the upper part of the two side surfaces of the rectangular groove is provided with rectangular openings in a penetrating way, the total number of the rectangular grooves is nine, and the total number of the rectangular openings is twelve; the rectangular opening is arranged, so that the PCB after leveling treatment is convenient to take.

In one example, four corners of the bottom surface of the workbench are fixedly connected with supporting feet, the bottom surfaces of the supporting feet are fixedly connected with gaskets, and the total number of the supporting feet and the gaskets is four; the support legs and the gaskets are arranged, so that the workbench is supported stably.

In one example, the support assembly comprises a support plate and a top plate, wherein two ends of the bottom surface of the top plate are fixedly connected between the upper end surfaces of the support plates, and the total number of the support plates is four; by the roof that sets up, be convenient for carry out structural support to the processing component.

In one example, through holes are formed in the middle of two ends of the upper surface of the top plate in a penetrating manner, and the total number of the through holes is four; through holes are formed, so that the electric telescopic rod can be conveniently penetrated and fixed.

The PCB warping processing device provided by the utility model has the following beneficial effects:

the utility model has the advantages of being convenient for improving the leveling efficiency of the warped PCB by arranging the processing component, solves the problems that the existing PCB warping processing device generally places the PCB on a workbench and directly acts on the surface of the warped PCB by using the related flattening structure when the related warped PCB is leveled, and the method needs to continuously press the PCB for a long time to shape the warped PCB without rebound again and has certain limitation in use.

The working assembly is arranged, so that the utility model has the advantage of being convenient for leveling a plurality of warped PCB boards at one time, and solves the problems that the existing PCB board warping processing device can not ensure that the space between the PCB boards is enough, and the flattening structure can not ensure that the PCB boards are not extruded when being pressed, thereby leading the scrapping of the PCB boards and having certain limitation in use when the flattening structure is used for leveling a plurality of PCB boards.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

fig. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a schematic view of a support assembly according to the present utility model.

FIG. 3 is a schematic view of a processing assembly according to the present utility model.

Fig. 4 is a schematic structural diagram of the working assembly of the present utility model.

In the figure: 100. a working assembly; 110. a work table; 111. rectangular grooves; 112. a rectangular opening; 120. a support leg; 130. a gasket; 140. a first heating block; 200. a support assembly; 210. a support plate; 220. a top plate; 221. a through hole; 300. a processing assembly; 310. a fixing seat; 320. a second heating block; 330. an electric telescopic rod.

Detailed Description

In order to more clearly illustrate the general inventive concept, a detailed description is given below by way of example with reference to the accompanying drawings.

In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. In the description of the present specification, the description with reference to the terms "one aspect," "some aspects," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the aspect or example is included in at least one aspect or example of the present utility model. In this specification, the schematic representations of the above terms are not necessarily for the same scheme or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more aspects or examples.

Referring to fig. 1-4, an embodiment of the utility model provides a PCB warp processing device, which includes a working assembly 100, wherein two ends of an upper surface of the working assembly 100 are provided with supporting assemblies 200, a processing assembly 300 is fixedly connected between the two supporting assemblies 200, the processing assembly 300 includes a fixing seat 310 and a second heating block 320, the second heating block 320 is uniformly and electrically connected to a bottom surface of the fixing seat 310 at equal distance, and four corners of the upper surface of the fixing seat 310 are fixedly connected with electric telescopic rods 330; the working assembly 100 comprises a working table 110 and a rectangular groove 111, wherein the rectangular groove 111 is uniformly and equidistantly arranged on the upper surface of the working table 110, and the bottom surface of the rectangular groove 111 is electrically connected with a first heating block 140; rectangular openings 112 are formed in the middle upper portions of the two side surfaces of the rectangular groove 111 in a penetrating manner, the total number of the rectangular grooves 111 is nine, and the total number of the rectangular openings 112 is twelve; the four corners of the bottom surface of the workbench 110 are fixedly connected with the supporting legs 120, the bottom surface of the supporting legs 120 is fixedly connected with the gaskets 130, and the total number of the supporting legs 120 and the gaskets 130 is four;

specifically, when the warped PCB needs to be leveled, the warped PCB is only required to be placed on the first heating block 140 in the rectangular groove 111, and then the electric telescopic rod 330 is controlled to be extended through the external control end, so that the fixing seat 310 is driven to descend, the second heating block 320 on the fixing seat 310 descends along with the fixing seat 310, so that pressure is applied to the warped PCB, the warped PCB can be leveled and plastic in a short time under the action of the first heating block 140 and the second heating block 320, and a plurality of warped PCBs are placed in the rectangular groove 111, so that extrusion among the plurality of PCBs during flattening can be effectively avoided, and the PCB is scrapped.

As shown in fig. 2, the support assembly 200 includes a support plate 210 and a top plate 220, wherein two ends of the bottom surface of the top plate 220 are fixedly connected between the upper end surfaces of the support plate 210, and the total number of the support plates 210 is four; through holes 221 are formed in the middle of the two ends of the upper surface of the top plate 220 in a penetrating manner, and the total number of the through holes 221 is four; specifically, the electric telescopic rod 330 is fixed in the through hole 221, so that the processing assembly 300 and the supporting assembly 200 can be structurally connected.

In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.

The foregoing is merely exemplary of the present utility model and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are to be included in the scope of the claims of the present utility model.

Claims

1. The utility model provides a PCB board warpage processing apparatus, its characterized in that, including work subassembly (100), work subassembly (100) upper surface both ends are provided with supporting component (200), and fixedly connected with processing component (300) between two supporting component (200), processing component (300) include fixing base (310) and second heating piece (320), and the even electric connection of second heating piece (320) equidistance is in fixing base (310) bottom surface, four corner fixedly connected with electric telescopic handle (330) of fixing base (310) upper surface.

2. The device for processing the warpage of the PCB board according to claim 1, wherein the working assembly (100) comprises a working table (110) and a rectangular groove (111), the rectangular groove (111) is uniformly and equidistantly arranged on the upper surface of the working table (110), and the bottom surface of the rectangular groove (111) is electrically connected with a first heating block (140).

3. The device for processing the warpage of the PCB according to claim 2, wherein the rectangular openings (112) are formed in the upper middle portions of the two side surfaces of the rectangular groove (111) in a penetrating manner, the total number of the rectangular grooves (111) is nine, and the total number of the rectangular openings (112) is twelve.

4. The device for processing the warpage of the PCB according to claim 2, wherein four corners of the bottom surface of the workbench (110) are fixedly connected with supporting legs (120), the bottom surfaces of the supporting legs (120) are fixedly connected with gaskets (130), and the total number of the supporting legs (120) and the gaskets (130) is four.

5. The PCB board warpage processing apparatus of claim 1, wherein the supporting assembly (200) comprises a supporting plate (210) and a top plate (220), and two ends of the bottom surface of the top plate (220) are fixedly connected between the upper end surfaces of the supporting plate (210), and the total number of the supporting plates (210) is four.

6. The device for processing the warpage of the PCB according to claim 5, wherein through holes (221) are formed in the middle of two ends of the upper surface of the top plate (220), and the total number of the through holes (221) is four.