CN219066839U - High heat conduction pouring sealant electronic device - Google Patents
High heat conduction pouring sealant electronic device Download PDFInfo
- Publication number
- CN219066839U CN219066839U CN202221358609.2U CN202221358609U CN219066839U CN 219066839 U CN219066839 U CN 219066839U CN 202221358609 U CN202221358609 U CN 202221358609U CN 219066839 U CN219066839 U CN 219066839U
- Authority
- CN
- China
- Prior art keywords
- light guide
- guide piece
- pouring sealant
- electronic device
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Planar Illumination Modules (AREA)
Abstract
The utility model provides a high-heat-conductivity pouring sealant electronic device, which comprises a shell, a light guide piece, a light source, an adhesive layer and pouring sealant, wherein the light guide piece is arranged in the shell; the light source is arranged on the light guide piece, and the emergent surface of the light source faces the light guide piece; the adhered layer is arranged between the light guide piece and the light source; the pouring sealant is arranged in the shell, and the pouring sealant is arranged in the light guide piece and the light source. According to the technical scheme, the adhesive layer is arranged between the light guide piece and the light source, and the light beam of the light source is transmitted to the light guide piece through the adhesive layer, so that normal transmission of the light beam under the whole encapsulation of the pouring sealant with poor light guide performance is realized; thereby simplifying the manufacturing process and reducing the encapsulation cost.
Description
Technical Field
The utility model relates to the technical field of pouring sealant equipment, in particular to a high-heat-conductivity pouring sealant electronic device.
Background
The pouring sealant has the function of mechanically protecting the LED components, has excellent electrical performance and repairability, and is always favored by the LED industry. At present, in the process of manufacturing the pouring sealant LED electronic product, a single-layer or multi-layer way is generally adopted for pouring. When a single-layer pouring sealant is used for pouring, a transparent or semitransparent pouring sealant is needed, the heat conductivity coefficient cannot meet the requirement, and the pouring sealant with higher heat conductivity coefficient cannot meet the transparency requirement, so that the knife light effect is poor; when the multilayer pouring sealant is used for pouring, two materials are needed to be added for colloid processing, the process is complex, and the cost is increased.
Disclosure of Invention
The utility model mainly aims to provide a high-heat-conductivity pouring sealant electronic device, and aims to solve the technical problems of complex process and high cost when an LED element is used for pouring sealant in the prior art.
In order to achieve the above purpose, the utility model provides a high heat conduction pouring sealant electronic device, which comprises a shell, a light guide piece, a light source, an adhesive layer and pouring sealant, wherein the light guide piece is arranged in the shell; the light source is connected with the light guide piece through the adhesive layer, and the emergent surface of the light source faces the light guide piece; the pouring sealant is arranged in the shell, and the pouring sealant is arranged in the light guide piece and the light source.
Optionally, the shell comprises a bottom plate and side plates, and the side plates are arranged around the edge of the bottom plate; the light guide piece is arranged on the bottom plate, and the light guide piece is mutually perpendicular to the bottom plate.
Optionally, an installation through hole is formed in the bottom plate, one end of the light guide member is arranged in the installation through hole, and the other end extends towards one side away from the bottom plate.
Optionally, the number of the mounting through holes is multiple, and the plurality of the mounting through holes are arranged on the bottom plate at intervals;
the number of the light guide pieces is multiple, and each light guide piece is arranged on each mounting through hole in a one-to-one correspondence mode.
Optionally, the light source includes a circuit board and a plurality of LED beads, the plurality of LED beads are arranged on the circuit board at intervals, and the circuit board is flip-chip mounted on the light guide member;
each LED lamp bead is arranged on each light guide piece in one-to-one correspondence, and an adhesive layer is arranged between each LED lamp bead and the corresponding light guide piece.
Optionally, the adhesive layer comprises one or more of epoxy resin, polypropylene adhesive and organic silica gel, wherein one surface of the adhesive layer is adhered to the light source, and the other surface of the adhesive layer is adhered to the light guide;
or the adhesive layer is jelly colloid coated on the light guide piece.
Optionally, the transparent double-sided tape or the translucent double-sided tape has a thickness of greater than or equal to 0.01mm.
Optionally, the pouring sealant is a high-heat-conductivity pouring sealant.
Optionally, the thermal conductivity coefficient of the pouring sealant is greater than or equal to 0.6Wm/K.
Optionally, the pouring sealant is a non-transparent material product.
According to the technical scheme, the adhesive layer is arranged between the light guide piece and the light source, and the light beam of the light source is transmitted to the light guide piece through the adhesive layer, so that normal transmission of the light beam under the whole encapsulation of the pouring sealant with poor light guide performance is realized; thereby simplifying the manufacturing process and reducing the encapsulation cost.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device with a high thermal conductivity pouring sealant according to the present utility model.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present utility model.
Referring to fig. 1, the high thermal conductivity pouring sealant 50 electronic device provided by the utility model comprises a housing 10, a light guide 20, a light source 40, an adhesive layer 30 and a pouring sealant 50, wherein the light guide 20 is arranged in the housing 10; the light source 40 is connected with the light guide member 20 through an adhesive layer, and the emergent surface of the light source 40 faces the light guide member 20; the pouring sealant 50 is disposed in the housing 10, and the pouring sealant 50 is disposed over the light guide 20 and the light source 40.
In the assembly, the light guide 20 is first mounted in the housing 10, the adhesive layer 30 may be adhered to the end surface of the light guide 20, or the adhesive layer 30 may be adhered to the light emitting surface of the light source 40, and after the adhesive layer 30 is adhered, the light emitting surface of the light source 40 is adhered to the end surface of the light guide 20. When the light source 40 is turned on, the light beam is emitted from the light emitting surface of the light source 40 to the light guide 20, and the light beam is guided out of the housing 10 by the light guide 20. After the light guide 20 and the adhesive layer 30 are mounted, the potting adhesive 50 is injected into the housing 10 until the potting adhesive 50 covers the light guide 20 and the light source 40, and finally, the light guide 20 and the light source 40 are potted in the housing 10 by heating or curing with a UV lamp. Isolating the contact between the water and the outside, thereby achieving the protection effect, preventing dust and water from entering, and prolonging the service life of the equipment.
In the above process, the adhesive layer 30 may be made of a material with good light transmittance, for example, the adhesive layer may include one or more of epoxy resin, polypropylene adhesive, and organic silica gel, so as to ensure that the light beam emitted by the light source 40 can enter the light guide 20 through the adhesive layer 30. In the bonding process, one surface of the adhesive layer 30 may be first bonded to the light source 40, or may be wire bonded to the light guide 20, and then the other surface may be bonded. Alternatively, the adhesive layer 30 may be a jelly-like gel, which is smeared on the light guide 20, and then the light source 40 is pressed against the adhesive layer 30. The thickness of the adhesive layer 30 may be set to be greater than or equal to 0.01mm to ensure the reliability of the connection between the light source 40 and the light guide 20. In this embodiment, the adhesive layer 30 with a thickness of 0.01mm is used for adhering, so that, in addition to the precondition of ensuring the connection reliability between the light guide member 20 and the light source 40, the light beam can be prevented from being emitted from the side surface of the adhesive layer 30, and the light guide effect between the light source 40 and the light guide member 20 is ensured. In addition, the adhesive layer 30 may be made of other materials, such as glue. The area of the adhesive layer 30 is the same as the end face of the light guide 20, no special dispensing is required, the production process is further simplified, and the production cost is reduced.
Meanwhile, the potting adhesive 50 may be made of a non-light-transmitting material, and the light beams emitted by the light source 40 are reflected and then all emitted into the light guide 20 through the adhesive layer 30, so as to improve the light transmittance between the light source 40 and the light guide 20. In addition, the potting adhesive 50 made of a non-light-transmitting material can be a colloid with a higher heat conductivity coefficient. The heat conductivity coefficient of the pouring sealant 50 in the embodiment is greater than or equal to 0.6Wm/K, and is the high heat conductivity pouring sealant 50.
Specifically, the housing 10 includes a bottom plate 11 and a side plate 12, and the side plate 12 is disposed around the edge of the bottom plate 11; the light guide 20 is disposed on the bottom plate 11, and the light guide 20 is perpendicular to the bottom plate 11. The side plates 12 are disposed around the edges of the bottom plate 11 to form a groove-like structure having a receiving cavity therein for mounting the light guide 20 and the light source 40. Wherein, the side opposite to the bottom plate 11 is opened, the light guide 20 and the light source 40 may be mounted on the bottom plate 11 through the opening, and the pouring sealant 50 may be poured into the housing 10 from the opened side. The shape of the base plate 11 may be circular, square or other regular shape, irregular shape, etc. The side plates 12 extend along the edges of the bottom plate 11, so as to form a groove-shaped structure with one surface being open with the bottom plate 11. In this embodiment, the side plates 12 are vertically connected with the bottom plate 11, and in addition, a certain angle may be formed between the side plates 12 and the bottom plate 11, so long as it is ensured that the corresponding pouring sealant 50 can be injected into the housing 10 to cover the light guide 20 and the light source 40. The bottom plate 11 and the side plates 12 may be integrally formed, so as to further improve rigidity of the housing 10 and ensure stability in use.
Specifically, the bottom plate 11 is provided with a mounting through hole 111, one end of the light guide 20 is disposed in the mounting through hole 111, and the other end extends toward a side facing away from the bottom plate 11. In order to ensure the light guiding effect of the light guiding member 20, the bottom plate 11 is provided with a mounting through hole 111, and the light guiding member 20 is inserted into the mounting through hole 111. The shape of the mounting through hole 111 is adapted to the cross-sectional shape of the light guide member 20, and an interference fit manner may be adopted between the light guide member 20 and the mounting through hole 111, so as to ensure the stability of the light guide member 20 on the bottom plate 11. And also can prevent leakage during the introduction of the potting adhesive 50. The light guide 20 is penetrated from the installation through hole 111 to communicate with the outside, thereby trying to guide the light beam out of the housing 10.
Specifically, the number of the mounting through holes 111 is plural, and the plurality of mounting through holes 111 are arranged on the bottom plate 11 at intervals; the number of the light guide members 20 is plural, and each light guide member 20 is disposed on each of the mounting through holes 111 in a one-to-one correspondence. In this embodiment, a plurality of the mounting through holes 111 may be mounted on the base plate 11, where the mounting through holes 111 may be arranged in a matrix distribution manner, or the mounting through holes 111 may be mounted at specific positions. I.e. the size of the space between any two adjacent mounting through holes 111 may be different. In addition, the areas of the mounting through holes 111 may be different from each other.
Correspondingly, the light source 40 includes a circuit board 42 and a plurality of LED beads, the LED beads are disposed on the circuit board 42 at intervals, and the circuit board 42 is flip-chip mounted on the light guide 20; wherein, every LED lamp pearl one-to-one sets up on each light guide 20, every LED lamp pearl with correspond between the light guide 20 all be equipped with paste layer 30. According to design requirements, one LED lamp bead is arranged on the circuit board 42 corresponding to each position of the light guide members 20. After the circuit board 42 is processed, the circuit board 42 is flip-chip mounted on the light guide member 20, i.e. the surface on which the LED lamp beads are mounted is arranged towards the light guide member 20. Thereby attaching the LED lamp beads to the light guide 20. In the process of preparing the circuit board 42, the adhesive layer 30 may be adhered to the LED beads in advance, or may be adhered to the light guide 20.
According to the technical scheme, the adhesive layer 30 is arranged between the light guide piece 20 and the light source 40, and the light beam of the light source 40 is transmitted to the light guide piece 20 through the adhesive layer 30, so that normal transmission of the light beam under the whole encapsulation of the pouring sealant 50 with poor light guide performance is realized; thereby simplifying the manufacturing process and reducing the encapsulation cost.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. The utility model provides a high heat conduction pouring sealant electron device which characterized in that, high heat conduction pouring sealant electron device includes:
a housing;
the light guide piece is arranged in the shell;
the light source is connected with the light guide piece through the adhesive layer, and the emergent surface of the light source faces the light guide piece;
the pouring sealant is arranged in the shell, and the pouring sealant is used for penetrating through the light guide piece and the light source.
2. The high thermal conductivity pouring sealant electronic device of claim 1, wherein the housing comprises:
a bottom plate;
the side plates are arranged and are arranged around the edge of the bottom plate;
the light guide piece is arranged on the bottom plate, and the light guide piece is mutually perpendicular to the bottom plate.
3. The electronic device of claim 2, wherein the base plate is provided with a mounting through hole, one end of the light guide member is disposed in the mounting through hole, and the other end extends toward a side facing away from the base plate.
4. The electronic device of claim 3, wherein the number of mounting through holes is plural, and the plurality of mounting through holes are arranged on the bottom plate at intervals;
the number of the light guide pieces is multiple, and each light guide piece is arranged on each mounting through hole in a one-to-one correspondence mode.
5. The electronic device of claim 1, wherein the light source comprises a circuit board and a plurality of LED beads, the plurality of LED beads are arranged on the circuit board at intervals, and the circuit board is flip-chip mounted on the light guide;
each LED lamp bead is arranged on each light guide piece in one-to-one correspondence, and an adhesive layer is arranged between each LED lamp bead and the corresponding light guide piece.
6. The electronic device of any one of claims 1-5, wherein the adhesive layer is one of epoxy, polypropylene, and silicone, and wherein one side of the adhesive layer is adhered to the light source and the other side is adhered to the light guide;
or the adhesive layer is jelly colloid coated on the light guide piece.
7. The electronic device of claim 6, wherein the adhesive layer has a thickness greater than or equal to 0.01mm.
8. The high thermal conductivity potting adhesive electronic device of any one of claims 1 to 5, wherein the potting adhesive is a high thermal conductivity potting adhesive.
9. The high thermal conductivity pouring sealant electronic device according to claim 8, wherein the heat conductivity coefficient of the pouring sealant is greater than or equal to 0.6Wm/K.
10. The electronic device of claim 8, wherein the encapsulant is a non-transparent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221358609.2U CN219066839U (en) | 2022-06-01 | 2022-06-01 | High heat conduction pouring sealant electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221358609.2U CN219066839U (en) | 2022-06-01 | 2022-06-01 | High heat conduction pouring sealant electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219066839U true CN219066839U (en) | 2023-05-23 |
Family
ID=86343926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221358609.2U Active CN219066839U (en) | 2022-06-01 | 2022-06-01 | High heat conduction pouring sealant electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219066839U (en) |
-
2022
- 2022-06-01 CN CN202221358609.2U patent/CN219066839U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107178711B (en) | LED module, manufacturing method thereof and lamp | |
| JP6627543B2 (en) | Waterproof lamp | |
| US20180190881A1 (en) | Phosphor plate assembly, led package structure, and method for manufacturing led package structure | |
| JP2016162830A (en) | Light-emitting device | |
| CN216957371U (en) | Marker lamp panel and fire-fighting emergency marker lamp | |
| CN219066839U (en) | High heat conduction pouring sealant electronic device | |
| JP5456077B2 (en) | LED module, manufacturing method thereof, and LED channel letter including LED module | |
| JP2011049253A (en) | Led unit and method for manufacturing the same | |
| CN211181486U (en) | L ED display module and display screen | |
| CN214745320U (en) | Lighting module | |
| CN215215820U (en) | LED line lamp that water-proof effects is good and resistant buckling | |
| CN114864568A (en) | Packaging structure and display device | |
| CN213339709U (en) | Composite copper foil | |
| CN114709320A (en) | Tiled display device | |
| CN210607244U (en) | Packaging support, packaging body and display | |
| CN210831506U (en) | LED lamp with good heat dissipation effect | |
| JP2004134414A (en) | Package structure of surface mount light emitting diode and method for manufacturing the same | |
| CN211232622U (en) | LED ceiling lamp | |
| CN110925635A (en) | Lamp strip sealing adhesive structure | |
| CN212181862U (en) | Stainless steel glass composite panel and emergency marker lamp | |
| KR200146639Y1 (en) | Led dot matrix module | |
| CN214223034U (en) | Light emitting device and vehicle | |
| CN220930897U (en) | Flexible linear light-emitting module | |
| CN218001375U (en) | LED marker lamp with double-layer backlight structure | |
| CN210891146U (en) | Lamp strip sealing adhesive structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |