CN219065097U - Push-pull force testing device for semiconductor wafer bumps - Google Patents

Abstract

The utility model discloses a push-pull force testing device for a semiconductor wafer lug, which belongs to the technical field of semiconductor wafer testing and aims at the problems that the push-pull force testing can be carried out only on a single position of the semiconductor wafer lug, so that the testing range is easy to be small and the data is not real and accurate, and the push-pull force testing device comprises a working table, wherein a rotating disc is rotationally connected to the middle position of the top of the working table, a placing column is fixed to the middle position of the top of the rotating disc, fastening mechanisms are symmetrically arranged at the positions of two sides of the placing column, first rod grooves are symmetrically arranged at the positions of the surfaces of the top of the working table, which are positioned at two sides of the rotating disc, and second rod grooves which are symmetrically arranged at the positions of the top of the working table, which are positioned at one end of the first rod grooves; the utility model can synchronously exert push-pull force on two sides of the semiconductor wafer bump to play a test role, thereby facilitating a user to obtain accurate measurement data and facilitating the judgment of the quality of the semiconductor wafer bump.

Description

Push-pull force testing device for semiconductor wafer bumps

Technical Field

The utility model belongs to the technical field of semiconductor wafer testing, and particularly relates to a push-pull force testing device for a semiconductor wafer bump.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, various circuit element structures can be manufactured on the silicon wafer to form an integrated circuit product with specific electrical functions, the original material of the wafer is silicon, and the surface of a crust is useful and inexhaustible silicon dioxide, and a corresponding device is required to be used for carrying out push-pull force test on the silicon wafer in the process of manufacturing the semiconductor wafer so as to judge whether the product is qualified.

In the prior art, although the push-pull force testing device for the semiconductor wafer bump can play a role in basic push-pull force testing in the actual use process, push-pull force testing cannot be simultaneously carried out at the relative positions of two sides of the semiconductor wafer bump, and only a single position of the semiconductor wafer bump can be subjected to push-pull force testing, so that the testing range is small, data are not real and accurate enough, and errors exist in judgment of the semiconductor wafer bump by a user, and the use is not facilitated.

Therefore, a push-pull force testing device for a semiconductor wafer bump is needed, and the problems that in the prior art, only a single position of the semiconductor wafer bump can be subjected to push-pull force testing, so that the testing range is easy to be small and the data is not real and accurate are solved.

Disclosure of Invention

The present utility model is directed to a push-pull force testing device for semiconductor wafer bumps, which solves the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a push-pull force testing arrangement for semiconductor wafer lug, includes the workstation, the intermediate position department rotation at workstation top is connected with the rolling disc, the intermediate position department at rolling disc top is fixed with places the post, the both sides position department symmetry of placing the post is provided with fastening mechanism, first pole groove has been seted up to the position department symmetry that workstation top surface is located the rolling disc both sides, the second pole groove that is the symmetry setting has been seted up to the position department that the workstation top is located first pole groove one end, the inside rotation in first pole groove is connected with the second threaded rod, the both sides threaded connection of second threaded rod outer peripheral face has the thread bush, the top of thread bush is fixed with the connecting plate, two one side that the connecting plate is close to each other is fixed with the tensile tester, the inside rotation in second pole groove is connected with the dwang, the one end of dwang passes the second pole groove and extends to the inside in first pole groove in adjacent position, the other end of dwang passes the second pole groove and extends to the outside of workstation, the fixed cover of the opposite side of second pole outer peripheral face is equipped with first conical gear, the second conical gear extends to the inside conical gear of second conical gear portion between the second conical gear portion and the second conical gear portion.

In the scheme, it is to be noted that, fastening mechanism includes the mounting bracket, the mounting bracket is the U-shaped setting, the upper and lower both ends threaded connection of mounting bracket has the first threaded rod that is symmetrical distribution, and the one end that two adjacent position first threaded rods are close to each other is fixed with the grip block, one side that the mounting bracket kept away from each other is fixed with the pull ring.

It is further worth to say that the surface fixed of workstation bottom has the motor, the output of motor passes the workstation and extends to the one end position department of rolling disc, the outer peripheral face fixed cover that the motor output is located rolling disc one side is equipped with the circular gear.

It should be further noted that, the one end meshing of circular gear has the ring gear, the intermediate position of ring gear is in the periphery of rolling disc mutually fixed, the both sides position department at rolling disc top is run through and is inserted and is equipped with the bolt that is symmetrical distribution, slot has been seted up to the position department that the table top surface is located adjacent position bolt bottom, the bottom of bolt extends to the inside of adjacent position slot.

As a preferable implementation mode, the rotating rod extends out of the outer surface of the working table and is fixedly sleeved with a belt pulley, and a connecting belt is arranged at the middle position of the two belt pulleys.

As a preferable implementation mode, the two connecting plates are arranged at the opposite positions of the two sides of the top of the working table by taking the central line of the vertical direction of the front surface of the working table as a symmetrical shaft, and the two threaded sleeves are arranged at the opposite positions of the two sides of the top of the working table by taking the central line of the vertical direction of the front surface of the working table as a symmetrical shaft.

Compared with the prior art, the push-pull force testing device for the semiconductor wafer bump provided by the utility model at least comprises the following beneficial effects:

(1) The two opposite positions of the two sides of the semiconductor wafer lug are fixed through the fastening mechanism, the draw hook of the tension tester penetrates through the pull ring, and then one of the pull rods is rotated, so that the two screw sleeves can synchronously drive the two tension testers to move in the directions away from each other, the push-pull force can be synchronously applied to the two sides of the semiconductor wafer lug to play a test role, a user can obtain accurate measurement data, the quality of the semiconductor wafer lug is facilitated to be judged, and the practicability of the device is improved.

(2) Through the starter motor to make the meshing effect take place for rotary disk take place to rotate with the ring gear, thereby can the angle of accurate regulation semiconductor wafer lug after the test, so that its two other relative test positions test, can play fixed action to the rotary disk through extending the bolt to the inside of slot, thereby improved the device's convenience of use.

Drawings

FIG. 1 is a schematic perspective view of the present utility model in front view;

FIG. 2 is a schematic top view of the present utility model;

FIG. 3 is an enlarged schematic view of the structure shown at A in FIG. 2 in accordance with the present utility model;

FIG. 4 is a schematic view of a rear view of the present utility model;

FIG. 5 is an enlarged schematic view of the structure at B in FIG. 4 according to the present utility model;

fig. 6 is a schematic perspective view of the fastening mechanism of the present utility model.

In the figure: 1. a work table; 2. a rotating disc; 3. placing a column; 4. a fastening mechanism; 41. a mounting frame; 42. a first threaded rod; 43. a clamping plate; 44. a pull ring; 5. a first rod groove; 6. a connecting plate; 7. a tensile tester; 8. a second rod groove; 9. a rotating lever; 10. a belt pulley; 11. a connecting belt; 12. a gear ring; 13. a circular gear; 14. a second threaded rod; 15. a thread sleeve; 16. a first bevel gear; 17. a second bevel gear; 18. a motor; 19. a plug pin; 20. a slot.

Detailed Description

Referring to fig. 1-6, the utility model provides a push-pull force testing device for semiconductor wafer bumps, comprising a working table 1, a rotating disc 2 is rotatably connected at the middle position of the top of the working table 1, a placing column 3 is fixed at the middle position of the top of the rotating disc 2, fastening mechanisms 4 are symmetrically arranged at two sides of the placing column 3, first rod grooves 5 are symmetrically arranged at the positions of the two sides of the rotating disc 2 on the top surface of the working table 1, second rod grooves 8 which are symmetrically arranged at the positions of one end of the first rod grooves 5 on the top of the working table 1, second threaded rods 14 are rotatably connected in the first rod grooves 5, threaded sleeves 15 are connected at two sides of the outer peripheral surface of the second threaded rods 14, connecting plates 6 are fixed at the top of the threaded sleeves 15, pull force testers 7 are fixed at one side of the two connecting plates 6 which are close to each other, the inside of the second rod groove 8 is rotationally connected with a rotating rod 9, one end of the rotating rod 9 passes through the second rod groove 8 and extends to the inside of the first rod groove 5 at the adjacent position, the other end of the rotating rod 9 passes through the second rod groove 8 and extends to the outside of the working table 1, the other side of the outer peripheral surface of the second threaded rod 14 is fixedly sleeved with a first conical gear 16, the outer peripheral surface of the inner part of the rotating rod 9 extending to the second rod groove 8 is fixedly sleeved with a second conical gear 17, the first conical gear 16 is meshed and connected with the second conical gears 17 at the adjacent position, the opposite positions of two sides of the semiconductor wafer convex block are fixed through a fastening mechanism 4, a draw hook of the second threaded rod 14 passes through a draw ring 44, and then one of the rotating rods 9 is rotated, so that two thread sleeves 15 can synchronously drive two tension testers 7 to move away from each other, thus, the push-pull force can be synchronously applied to the two sides of the semiconductor wafer bump to play a test role.

Further, as shown in fig. 6, it is worth specifically explaining that the fastening mechanism 4 includes a mounting frame 41, the mounting frame 41 is U-shaped, the upper and lower both ends threaded connection of mounting frame 41 has a first threaded rod 42 that is symmetric distribution, the one end that two adjacent position first threaded rods 42 are close to each other is fixed with clamping disk 43, one side that mounting frame 41 kept away from each other is fixed with pull ring 44, through rotating two adjacent position first threaded rods 42, make first threaded rod 42 through with the cooperation effect between the screw structure between the adjacent position mounting frame 41 do extension motion to the direction that is close to each other, thereby drive two clamping disks 43 and contradict the surface at semiconductor wafer lug both ends, thereby fix semiconductor wafer lug both sides, pass pull ring 44 with the drag hook of tensile tester 7 again, thereby the tensile tester 7 of being convenient for drives fastening mechanism 4 motion.

Further, as shown in fig. 3, it is worth specifically explaining that the surface of the bottom of the working table 1 is fixed with a motor 18, the output end of the motor 18 passes through the working table 1 and extends to one end position of the rotating disc 2, the outer peripheral surface fixing sleeve of the output end of the motor 18 on one side of the rotating disc 2 is provided with a round gear 13, one end of the round gear 13 is meshed with a gear ring 12, the middle position of the gear ring 12 is fixed on the outer peripheral surface of the rotating disc 2, pins 19 which are symmetrically distributed are inserted through the two side positions of the top of the rotating disc 2, slots 20 are formed in the positions of the top surface of the working table 1, which are located at the bottoms of the pins 19 at the adjacent positions, the bottoms of the pins 19 extend to the inside of the slots 20 at the adjacent positions, and by starting the motor 18, the round gear 13 can rotate, so that the round gear 13 meshes with the gear ring 12, and the rotating disc 2 can rotate, and after testing, the angles of the semiconductor wafer bumps can be accurately adjusted, so that the other two opposite test pins can be tested, and then the pins 19 can play a fixing role in the rotating disc 2.

Further, as shown in fig. 1, it is worth specifically explaining that the rotating rod 9 extends out of the outer surface of the working table 1 and is fixedly sleeved with a belt pulley 10, a connecting belt 11 is arranged in the middle of the belt pulley 10, and one of the rotating rods 9 rotates to drive the belt pulley 10 in the adjacent position to rotate, so that the other belt pulley 10 can drive the other rotating rod 9 to rotate under the connection action of the connecting belt 11.

The scheme comprises the following working processes: in the practical use process, firstly, the semiconductor wafer bump is placed at the top of the placing column 3, then the fastening mechanism 4 is placed at the opposite positions of the two sides of the semiconductor wafer bump, and the two sides of the semiconductor wafer bump are positioned at the middle position of the mounting frame 41, then the first threaded rod 42 at two adjacent positions is rotated, so that the first threaded rod 42 extends to the direction close to each other under the cooperation of the thread structure between the mounting frame 41 at the adjacent positions, and the two clamping discs 43 are driven to abut against the surfaces of the two ends of the semiconductor wafer bump, so as to fix the two sides of the semiconductor wafer bump, and then the draw hook of the tension tester 7 passes through the pull ring 44, so that the tension tester 7 drives the fastening mechanism 4 to move, when the semiconductor wafer bump is required to be tested, the two sides of the adjacent positions are driven to rotate by rotating one of the rotating rods 9, the other belt pulley 10 can drive the other rotating rod 9 to rotate under the connection of the connecting belt 11, the two rotating rods 9 synchronously rotate, and the second bevel gears 17 at the adjacent positions are driven to rotate, the two bevel gears 17 at the adjacent positions abut against the surfaces of the two ends of the semiconductor wafer bump, and the two bevel gears 17 can move towards the opposite directions of the two adjacent positions of the two bevel gears 15 due to the mutual rotation of the two bevel gears 15, and the two bevel gears 15 can move towards the opposite directions of the opposite sides of the two adjacent bevel gears 15, so that the two bevel gears are driven by the two adjacent position test grooves are driven to move towards the opposite sides of the threaded grooves 15, and the opposite sides of the adjacent bevel gears 15, and the opposite to move opposite to each other side of the rotating direction of the adjacent bevel gears 5, the rotating rod 9 is reversely rotated, so that the tensile tester 7 can move towards the directions close to each other to perform thrust test, and accordingly, the test can be synchronously performed from the relative positions of the two sides of the semiconductor wafer bumps, and the test accuracy is improved.

The working process can be as follows: the two opposite positions of the two sides of the semiconductor wafer bump are fixed through the fastening mechanism 4, the draw hook of the tension tester 7 passes through the pull ring 44, and then one of the rotating rods 9 is rotated, so that the two threaded sleeves 15 can synchronously drive the two tension testers 7 to move away from each other, the push-pull force can be synchronously applied to the two sides of the semiconductor wafer bump to play a test role, a user can obtain accurate measurement data, the quality of the semiconductor wafer bump is facilitated to be judged, the motor 18 is started, the circular gear 13 and the gear ring 12 are meshed to enable the rotating disc 2 to rotate, the angle of the semiconductor wafer bump can be accurately adjusted after testing, the other two opposite test positions of the rotating disc 2 can be tested, the rotating disc 2 can be fixed through extending the bolts 19 to the inside of the slots 20, and the using convenience of the device is improved.

Further, as shown in fig. 4 and 6, it is worth specifically describing that the two connecting plates 6 are disposed at opposite positions on two sides of the top of the working table 1 with the center line of the front vertical direction of the working table 1 as a symmetry axis, and the two threaded sleeves 15 are disposed at opposite positions on two sides of the top of the working table 1 with the center line of the front vertical direction of the working table 1 as a symmetry axis, and the connecting plates 6 and the threaded sleeves 15 are symmetrically distributed, so that a user can conveniently pass the draw hook of the tensile tester 7 through the adjacent pull ring 44.

To sum up: the two opposite positions of the two sides of the semiconductor wafer bump are fixed through the fastening mechanism 4, the draw hook of the tension tester 7 passes through the pull ring 44, and then one of the rotating rods 9 is rotated, so that the two threaded sleeves 15 can synchronously drive the two tension testers 7 to move away from each other, the push-pull force can be synchronously applied to the two sides of the semiconductor wafer bump to play a test role, a user can obtain accurate measurement data, the quality of the semiconductor wafer bump is facilitated to be judged, the motor 18 is started, the circular gear 13 and the gear ring 12 are meshed to enable the rotating disc 2 to rotate, the angle of the semiconductor wafer bump can be accurately adjusted after testing, the other two opposite test positions of the rotating disc 2 can be tested, the rotating disc 2 can be fixed through extending the bolts 19 to the inside of the slots 20, and the using convenience of the device is improved.

The tensile tester 7 and the motor 18 can be purchased in the market, and the tensile tester 7 and the motor 18 are provided with power supplies, which are fully disclosed in the art, and therefore, the description is not repeated in the specification.

Claims (6)

1. The utility model provides a push-pull force testing arrangement for semiconductor wafer lug, includes work table (1), its characterized in that, the intermediate position department at work table (1) top rotates and is connected with rolling disc (2), the intermediate position department at rolling disc (2) top is fixed with spliced pole (3), the both sides position department symmetry of spliced pole (3) is provided with fastening mechanism (4), first pole groove (5) have been seted up to the position department symmetry that work table (1) top surface is located rolling disc (2) both sides, the second pole groove (8) that are the symmetry setting are seted up in the position department that are located first pole groove (5) top, the inside rotation of first pole groove (5) is connected with second threaded rod (14), the both sides threaded connection of second threaded rod (14) outer peripheral face has thread bush (15), the top of thread bush (15) is fixed with connecting plate (6), and two one side that connecting plate (6) are close to each other is fixed with tensile tester (7), the inside rotation of second pole groove (8) top is located first pole groove (5) one end department sets up second pole groove (9), second pole groove (9) are rotated and are connected with second pole groove (9) and extend to the outside groove (8) that extend to the outside of second pole groove (8), the other side of the outer peripheral surface of the second threaded rod (14) is fixedly sleeved with a first conical gear (16), the outer peripheral surface of the inner part of the rotating rod (9) extending to the second rod groove (8) is fixedly sleeved with a second conical gear (17), and the first conical gear (16) is meshed and connected with the second conical gear (17) at the adjacent position.

2. The push-pull force testing apparatus for semiconductor wafer bumps according to claim 1, wherein: the fastening mechanism (4) comprises a mounting frame (41), the mounting frame (41) is in a U-shaped arrangement, first threaded rods (42) which are symmetrically distributed are connected with the upper end and the lower end of the mounting frame (41) in a threaded mode, clamping discs (43) are fixed at one ends, close to each other, of the first threaded rods (42) at two adjacent positions, and pull rings (44) are fixed at one sides, far away from each other, of the mounting frame (41).

3. The push-pull force testing apparatus for semiconductor wafer bumps according to claim 1, wherein: the surface fixing of workstation (1) bottom has motor (18), the output of motor (18) passes workstation (1) and extends to the one end position department of rolling disc (2), the outer peripheral face fixed cover that motor (18) output is located rolling disc (2) one side is equipped with circular gear (13).

4. A push-pull force testing apparatus for semiconductor wafer bumps according to claim 3, wherein: one end meshing of circular gear (13) has ring gear (12), the intermediate position of ring gear (12) is in the periphery of rolling disc (2) and is fixed mutually, the both sides position department at rolling disc (2) top is run through and is inserted and is equipped with bolt (19) that are symmetric distribution, slot (20) have been seted up in the position department that the top surface of table (1) is located adjacent position bolt (19) bottom, the inside of extension to adjacent position slot (20) of bottom of bolt (19).

5. The push-pull force testing apparatus for semiconductor wafer bumps according to claim 1, wherein: the rotating rod (9) extends out of the working table (1), a belt pulley (10) is fixedly sleeved on the outer surface of the working table, and a connecting belt (11) is arranged at the middle position of the two belt pulleys (10).

6. The push-pull force testing apparatus for semiconductor wafer bumps according to claim 1, wherein: the two connecting plates (6) are arranged at the opposite positions of the two sides of the top of the working table (1) by taking the central line of the front vertical direction of the working table (1) as a symmetrical shaft, and the two threaded sleeves (15) are arranged at the opposite positions of the two sides of the top of the working table (1) by taking the central line of the front vertical direction of the working table (1) as a symmetrical shaft.

Images