CN219063624U - Cold and hot fan - Google Patents
Cold and hot fan Download PDFInfo
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- CN219063624U CN219063624U CN202222382425.6U CN202222382425U CN219063624U CN 219063624 U CN219063624 U CN 219063624U CN 202222382425 U CN202222382425 U CN 202222382425U CN 219063624 U CN219063624 U CN 219063624U
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Abstract
The utility model provides a cooling and heating fan, which relates to the technical field of daily necessities and comprises: the semiconductor refrigerator comprises a power supply, a shell, a semiconductor refrigerating piece and an induced air assembly; the power supply is arranged on the side wall of the shell; the semiconductor refrigerating piece is arranged in the shell and divides the space in the shell into a cold air channel and a hot air channel, and a cold air outlet communicated with the cold air channel and a hot air outlet communicated with the hot air channel are formed in the top of the shell; an air inlet is formed in the bottom of the shell, and the air inducing component is arranged at the air inlet; the semiconductor refrigerating piece and the induced air component are electrically connected with the power supply. The power supply supplies power to the semiconductor refrigerating piece and the air inducing component, the air inducing component respectively introduces external air, the temperature is reduced to form cold air for users under the action of the semiconductor refrigerating piece, and similarly, the air introduced into the hot air passage is discharged after the temperature is increased to form hot air under the action of the semiconductor refrigerating piece for users to use.
Description
Technical Field
The utility model relates to the technical field of daily necessities, in particular to a cooling and heating fan.
Background
The fan means a tool for generating wind and taking cool in hot days. The electric fan is a device for generating air flow by electric drive, and the fan arranged in the electric fan rotates after being electrified, and the mechanical energy is converted into wind energy, so that natural wind is formed to achieve a cooling effect.
There is the thermantidote in the market at present, through placing the ice-cube in order to reach the purpose of cooling to the wind that the fan blown out in air outlet department, nevertheless need prepare a large amount of ice-cubes before using to can't make hot-blast heating when needs, especially when going out, under environment such as outdoor, open-air, can't be when the temperature is higher or lower effectually produce cold wind or hot-blast according to different needs, be difficult to satisfy people's demand.
Accordingly, it is an important technical problem to be solved by those skilled in the art to provide a fan capable of independently generating cold air or hot air in various environments.
Disclosure of Invention
The utility model aims to provide a cold and hot fan so as to solve the technical problem that cold air or hot air cannot be effectively generated according to different requirements when the temperature is higher or lower in the prior art.
The utility model provides a cooling and heating fan, comprising: the semiconductor refrigerator comprises a power supply, a shell, a semiconductor refrigerating piece and an induced air assembly; the power supply is arranged on the side wall of the shell; the semiconductor refrigerating piece is arranged in the shell and divides the space in the shell into a cold air channel and a hot air channel, and a cold air outlet communicated with the cold air channel and a hot air outlet communicated with the hot air channel are formed in the top of the shell; an air inlet is formed in the bottom of the shell, and the air inducing component is arranged at the air inlet; the semiconductor refrigerating piece and the induced air component are electrically connected with the power supply.
Further, the air conditioner further comprises an air cooling pipeline, wherein the air cooling pipeline is arranged at the top of the shell, and the air cooling pipeline is communicated with the air cooling pipeline.
Further, the hot air pipeline is arranged at the top of the shell, and the hot air pipeline is communicated with the hot air pipeline.
Further, the cold air pipeline and the warm air pipeline are reversely arranged.
Further, the cooling surface and the heating surface of the semiconductor cooling piece are both provided with heat dissipation pieces.
Further, the heat sink comprises a heat conductive plate and a plurality of heat dissipating studs; the heat conducting plates are arranged on two sides of the semiconductor refrigerating piece and are attached to the refrigerating surface and the heating surface of the semiconductor refrigerating piece; the heat dissipation columns are uniformly distributed on the heat conduction plate.
Further, the induced air component comprises a fan and a motor; the fan is arranged at the power end of the motor, and the motor is electrically connected with the power supply.
Further, the shell adopts an insulating shell.
Further, the power supply comprises a battery and a power switch; the power switch is arranged on the battery, and the power supply is connected with the semiconductor refrigerating piece and the induced air component through the power switch.
Further, the power supply further comprises a charging socket, and the charging socket is electrically connected with the battery.
The beneficial effects are that:
the utility model provides a cooling and heating fan, comprising: the semiconductor refrigerator comprises a power supply, a shell, a semiconductor refrigerating piece and an induced air assembly; the power supply is arranged on the side wall of the shell; the semiconductor refrigerating piece is arranged in the shell and divides the space in the shell into a cold air channel and a hot air channel, and a cold air outlet communicated with the cold air channel and a hot air outlet communicated with the hot air channel are formed in the top of the shell; an air inlet is formed in the bottom of the shell, and the air inducing component is arranged at the air inlet; the semiconductor refrigerating piece and the induced air component are electrically connected with the power supply.
Specifically, when in use, the power supply supplies power to the semiconductor refrigerating piece and the induced air component, after the semiconductor refrigerating piece operates, the heating surface and the refrigerating surface of the semiconductor refrigerating piece respectively supply heat and refrigerate, at the moment, the induced air component operates under the drive of the power supply, external air is respectively introduced into the cold air duct and the hot air duct, the air introduced into the cold air duct is discharged after passing through the semiconductor refrigerating piece, the temperature of the air is reduced to form cold air for a user under the action of the semiconductor refrigerating piece, and similarly, the air introduced into the hot air duct is discharged after the temperature is increased to form hot air under the action of the semiconductor refrigerating piece for the user to use.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a front view structure of a cooling and heating fan according to an embodiment of the present utility model;
fig. 2 is a schematic perspective view of a cooling and heating fan according to an embodiment of the present utility model;
fig. 3 is a schematic perspective view of the side view structure of fig. 2.
Icon:
100-power supply; 110-a power switch; 120-charging jack; 140-a housing;
200-cold air pipelines;
300-warm air pipeline;
400-induced air assembly; 410-an electric motor; 420-a fan;
500-semiconductor refrigerating element; 510-heat sink.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model will now be described in further detail with reference to specific examples thereof in connection with the accompanying drawings.
The cooling and heating fan provided in this embodiment, as shown in fig. 1-3, includes a power supply 100, a housing 140, a semiconductor refrigeration member 500, and an induced draft assembly 400; the power supply 100 is disposed on a sidewall of the housing 140; the semiconductor refrigeration member 500 is disposed in the housing 140 and divides the space in the housing 140 into a cold air duct and a hot air duct, and a cold air outlet communicating with the cold air duct and a hot air outlet communicating with the hot air duct are provided at the top of the housing 140; an air inlet is formed in the bottom of the housing 140, and the air inducing assembly 400 is disposed at the air inlet; the semiconductor refrigeration unit 500 and the induced draft assembly 400 are electrically connected to the power supply 100.
When the semiconductor refrigerator 500 and the induced air assembly 400 are powered by the power supply 100, after the semiconductor refrigerator 500 operates, the heating surface and the cooling surface of the semiconductor refrigerator 500 respectively supply heat and cool, at this time, the induced air assembly 400 operates under the drive of the power supply 100, external air is respectively introduced into the cold air duct and the hot air duct, the air introduced into the cold air duct is discharged after passing through the semiconductor refrigerator 500, the temperature of the air is reduced to form cold air for a user under the effect of the semiconductor refrigerator 500, and similarly, the air introduced into the hot air duct is discharged after the temperature is increased to form hot air under the effect of the semiconductor refrigerator 500 for the user to use.
Wherein, can set up parts such as handle, string rope in the surface of shell 140 and be used for carrying get, remove cold and hot fan, when going out to carry, can hang cold and hot fan and put in the car or carry and get cold and hot fan in order to carry cold and hot fan, make cold and hot fan portable when going out to, when environment such as open-air need use, the cold and hot fan of accessible setting is hung in positions such as tent, wall, makes cold and hot fan more convenient when using, easily fixes.
In this embodiment, the air conditioner further includes a cold air duct 200, the cold air duct 200 is disposed at the top of the housing 140, and the cold air duct 200 is in communication with the cold air duct.
The cold air pipeline 200 can discharge cold air discharged from the cold air outlet out of the shell 140 along the pipeline, and when the cold and hot fan is fixed in position and the cold and hot fan is needed to be used, the direction of the cold air pipeline 200 can be adjusted to adjust the direction of cold air blowing in, so that the cold air cooling device is very convenient to use.
In addition, in this embodiment, the cold air pipeline 200 adopts a bent pipe structure, and is connected with the housing 140 in a threaded connection manner, and when the air outlet direction is adjusted, the change of the air outlet direction can be completed only by rotating the cold air pipeline 200, and after the use, the cold air pipeline 200 can be disassembled to reduce the volume, so that the storage and the carrying are convenient.
In this embodiment, the air heating device further includes a warm air pipeline 300, the warm air pipeline 300 is disposed at the top of the housing 140, and the warm air pipeline 300 is in communication with the hot air path.
The warm air pipeline 300 can discharge the hot air discharged from the cool air outlet out of the casing 140 along the pipeline, and when the position of the cold and hot fan is fixed and the cold and hot fan needs to be used for heating, the direction of the warm air pipeline 300 can be adjusted to adjust the blowing direction of the hot air, so that the use is very convenient.
In addition, in this embodiment, the warm air pipeline 300 is the same as the cold air pipeline 200, adopts the structure of the bent pipe, is connected with the housing 140 in a threaded connection manner, and can change the air outlet direction only by rotating the warm air pipeline 300 when the air outlet direction is adjusted, and after the warm air pipeline 300 is used, the warm air pipeline 300 can be disassembled to reduce the whole volume of the cold and hot fan, so that the cold and hot fan is convenient to store and carry.
In this embodiment, the cold air line 200 is disposed opposite to the warm air line 300.
After the cold air pipeline 200 and the warm air pipeline 300 are reversely arranged, when the indoor cooling fan is used, the cold and hot fans can be arranged at the gates of the wall body, the window and the tent, and when the air is exhausted, one of the air exhausted from the two pipelines is exhausted indoors, the other air exhausted outdoors, so that the cooling or heating effect on the indoor air can not be influenced.
It should be noted that, in this embodiment, the cold air pipeline 200, the cold air channel and the cold air outlet are coated with green marks; the warm air pipeline 300, the hot air pipeline and the hot air outlet are coated with red marks, so that a user can clearly know the air outlet positions of cold air and warm air before using the warm air pipeline, and the warm air pipeline is more convenient to use.
In this embodiment, the cooling surface and the heating surface of the semiconductor cooling element 500 are both provided with a heat sink 510.
The heat dissipation member 510 can rapidly disperse the heat generated by the semiconductor refrigeration member 500 or the low temperature into the air around the heat dissipation member 510, and after the induced air assembly 400 introduces the external air into the housing 140, the heat dissipation member 510 can rapidly exchange the heat generated by the semiconductor refrigeration member 500 with the introduced external air, so that the introduced air is rapidly changed in temperature and then discharged out of the housing 140, thereby meeting the cooling or heating requirements of the user.
In this embodiment, the heat sink 510 includes a heat conductive plate and a plurality of heat dissipating studs; the heat conducting plates are arranged on two sides of the semiconductor refrigeration piece 500 and are attached to the refrigeration surface and the heating surface of the semiconductor refrigeration piece 500; the heat dissipation columns are uniformly distributed on the heat conduction plate.
In the process of radiating, the heat is conducted to each radiating column by the heat conducting plate, then the heat is dispersed through a large number of radiating columns, the heat is converted with the air around the radiating columns, and the more the radiating columns are, the faster the heat exchange speed is, and the faster the refrigerating and heating speeds of the cooling and heating fans are.
As an alternative embodiment, the heat sink 510 may be a multi-plate heat sink through which heat is dissipated to the air surrounding it.
In this embodiment, the induced draft assembly 400 includes a fan 420 and a motor 410; the fan 420 is disposed at a power end of the motor 410, and the motor 410 is electrically connected to the power source 100.
When the user uses the power supply 100, the motor 410 is started after the power supply is turned on, and the output end of the motor 410 rotates to drive the fan 420 to rotate together, so that the external air is introduced into the housing 140 from the air inlet, and is discharged after heat exchange through the semiconductor refrigerating element 500.
In this embodiment, two fans 420 are provided, and two fans 420 are respectively disposed at the bottoms of the cold air duct and the hot air duct, and when in use, the two fans 420 can be used independently, thereby achieving the effect of independent cooling or independent heating.
In this embodiment, the housing 140 is an insulated shell.
After the semiconductor refrigeration unit 500 exchanges heat with the air in the casing 140, the heat-insulating shell can effectively avoid the temperature loss in the casing 140, which results in the temperature loss of the air exhausted from the cold air pipeline 200 and the warm air pipeline 300.
In this embodiment, the power supply 100 includes a battery and a power switch 110; the power switch 110 is disposed on the battery, and the power supply 100 is connected to the semiconductor refrigerator 500 and the induced draft assembly 400 through the power switch 110.
After the power supply 100 is connected with the power supply switch 110, the power supply switch 110 is respectively connected with the semiconductor refrigeration piece 500 and the induced air component 400, and when the semiconductor refrigeration piece 500 and the induced air component 400 are controlled to be opened and closed by a user through the power supply switch 110, the user can realize the opening and closing of the cold and hot fans by only controlling the power supply switch 110, and the semiconductor refrigeration piece is very convenient to use.
In this embodiment, a positive-negative switch is further disposed on one side of the power switch 110, and when the cooling or heating state needs to be switched and the cooling and heating fan cannot be moved easily, the positive and negative poles of the power 100 can be switched by the positive-negative switch, so that the indoor pipeline can be switched to cooling or heating.
In this embodiment, the power supply 100 further includes a charging socket 120, and the charging socket 120 is electrically connected to the battery.
The user can charge the battery through the charging jack 120 so as to keep the state of the battery, and the cooling and heating fan can still be normally used when going out, and the battery can be used in a wired mode through connecting the charging jack 120 in an environment with an external power supply.
And, can set up solar cell panel and meet with the battery on the lateral wall of battery, under environment such as outdoor, open-air, the accessible solar cell panel charges the battery, makes cold and hot fan use more convenient.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the technical solutions according to the embodiments of the present utility model.
Claims (9)
1. A cooling and heating fan, comprising: a power supply (100), a housing (140), a semiconductor refrigeration piece (500) and an induced draft assembly (400);
the power supply (100) is arranged on the side wall of the shell (140);
the semiconductor refrigerating piece (500) is arranged in the shell (140) and divides the space in the shell (140) into a cold air channel and a hot air channel, and a cold air outlet communicated with the cold air channel and a hot air outlet communicated with the hot air channel are formed in the top of the shell (140);
an air inlet is formed in the bottom of the shell (140), and the air inducing component (400) is arranged at the air inlet;
the semiconductor refrigerating piece (500) and the induced air component (400) are electrically connected with the power supply (100);
still include cold air pipeline (200), cold air pipeline (200) set up the top of shell (140), cold air pipeline (200) with the air conditioning way is linked together.
2. The cooling and heating fan according to claim 1, further comprising a warm air line (300), the warm air line (300) being provided at a top of the housing (140), the warm air line (300) being in communication with the hot air line.
3. The cooling and heating fan according to claim 2, characterized in that the cold air line (200) is arranged opposite to the warm air line (300).
4. The cooling and heating fan according to claim 1, wherein the cooling surface and the heating surface of the semiconductor cooling member (500) are provided with heat dissipation members (510).
5. The cooling and heating fan according to claim 4, wherein the heat sink (510) comprises a heat conductive plate and a plurality of heat dissipating studs;
the heat conducting plates are arranged on two sides of the semiconductor refrigerating piece (500) and are attached to the refrigerating surface and the heating surface of the semiconductor refrigerating piece (500);
the heat dissipation columns are uniformly distributed on the heat conduction plate.
6. The cooling and heating fan according to claim 1, wherein the induced draft assembly (400) comprises a fan (420) and a motor (410);
the motor (410) is electrically connected with the power supply (100), and the fan (420) is arranged at the power end of the motor (410) so that the motor (410) drives the fan (420) to rotate.
7. The cooling and heating fan according to claim 1, characterized in that the housing (140) employs an insulating casing.
8. The cooling and heating fan according to any of claims 1-7, characterized in that the power supply (100) comprises a battery and a power switch;
the power switch (110) is arranged on the battery, and the semiconductor refrigerating piece (500) and the induced air component (400) are connected with the power supply (100) through the power switch (110).
9. The cooling and heating fan according to claim 8, wherein the power supply (100) further comprises a charging socket (120), the charging socket (120) being electrically connected with the battery.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222382425.6U CN219063624U (en) | 2022-09-07 | 2022-09-07 | Cold and hot fan |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222382425.6U CN219063624U (en) | 2022-09-07 | 2022-09-07 | Cold and hot fan |
Publications (1)
Publication Number | Publication Date |
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CN219063624U true CN219063624U (en) | 2023-05-23 |
Family
ID=86346733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202222382425.6U Active CN219063624U (en) | 2022-09-07 | 2022-09-07 | Cold and hot fan |
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CN (1) | CN219063624U (en) |
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2022
- 2022-09-07 CN CN202222382425.6U patent/CN219063624U/en active Active
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