CN219042078U - Integrated circuit expansion bonding pad - Google Patents

Integrated circuit expansion bonding pad Download PDF

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Publication number
CN219042078U
CN219042078U CN202223430143.5U CN202223430143U CN219042078U CN 219042078 U CN219042078 U CN 219042078U CN 202223430143 U CN202223430143 U CN 202223430143U CN 219042078 U CN219042078 U CN 219042078U
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China
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bonding pad
main body
pad main
integrated circuit
rod
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CN202223430143.5U
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Chinese (zh)
Inventor
杨美琳
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Hebei Zhanfan Electronic Technology Co ltd
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Hebei Zhanfan Electronic Technology Co ltd
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Abstract

The present utility model relates to the field of computers, and in particular, to an integrated circuit extension pad. The integrated circuit expansion bonding pad comprises a bonding pad main body, a fixing component and an ash removal component, wherein the fixing component is located on the bonding pad main body and comprises concave rods and reinforcing strips, the concave rods which are fixedly connected are arranged on clamping grooves on two sides of the bonding pad main body, and the reinforcing strips which are fixedly connected are arranged between the bottoms of the concave rods. According to the integrated circuit expansion bonding pad provided by the utility model, the concave rod is matched with the reinforcing strip during installation, so that the bonding pad main body is suspended, when the bonding pad main body is vibrated, the force of vibration can be reduced by the spring between the concave rod and the bonding pad main body, meanwhile, the heat dissipation capacity of the bonding pad main body can be increased due to the suspended installation of the bonding pad main body, the problem that the bonding pad main body is easily damaged due to vibration after being installed is avoided, and the protection of the bonding pad main body by the device is effectively improved.

Description

Integrated circuit expansion bonding pad
Technical Field
The present utility model relates to the field of computers, and in particular, to an integrated circuit extension pad.
Background
A computer is a modern electronic computing machine for high-speed computing, and with the development of the computer, the computer plays a vital role in the development of various industries, and even some enterprises are completely separated from the computer;
what determines the operation speed of the computer is various integrated circuits of the computer, and in the process of mounting the integrated circuits, expansion pads are required, and the pads are basic constituent units of surface mount assembly, and are used for forming pad patterns of a circuit board.
Most of the prior bonding pads are attached to the inner wall of the mounting structure during mounting, so that the prior bonding pads are easy to damage when receiving vibration, and the problem of computer use is caused.
Accordingly, there is a need to provide a new integrated circuit extension pad that addresses the above-described issues.
Disclosure of Invention
In order to solve the technical problems, the utility model provides an integrated circuit expansion bonding pad.
The integrated circuit expansion bonding pad provided by the utility model comprises:
the bonding pad comprises a bonding pad body, wherein clamping grooves are formed in two sides of the bonding pad body;
the fixing assembly is positioned on the bonding pad main body and comprises concave rods and reinforcing strips, the concave rods which are fixedly connected are arranged on clamping grooves on two sides of the bonding pad main body, and a plurality of reinforcing strips which are fixedly connected are arranged between the bottoms of the concave rods;
the ash removal assembly is positioned on the bonding pad main body.
Preferably, limit holes are formed in four corners of the bonding pad main body, and a storage groove is formed in one side of the top of the bonding pad main body.
Preferably, the ash removal subassembly includes gag lever post, installation pole and brush, install the gag lever post of swivelling joint in the spacing downthehole of being close to storage tank one end in the pad main part, and fixed connection's installation pole is installed at the top of gag lever post, fixed connection's brush is installed to the bottom of installation pole.
Preferably, the fixing assembly further comprises a spring, the concave rod is provided with a groove, and a plurality of springs fixedly connected are arranged between the inner top wall and the inner bottom wall of the groove of the concave rod and the bonding pad main body.
Preferably, the ash removal assembly further comprises a limiting plate, the bottom end of the limiting rod is provided with the limiting plate which is fixedly connected, and part of the limiting plate is made of rubber.
Preferably, the brush is located in the accommodating groove, and the width of the mounting rod is larger than that of the accommodating groove.
Compared with the related art, the integrated circuit expansion bonding pad provided by the utility model has the following beneficial effects:
1. when the bonding pad is installed, the concave rod is matched with the reinforcing strip to install the bonding pad body in a suspended mode, when the bonding pad body is vibrated, the spring between the concave rod and the bonding pad body can reduce the vibration force, meanwhile, as the bonding pad body is installed in a suspended mode, the heat dissipation capacity of the bonding pad body can be improved, the problem that the bonding pad body is easy to damage due to vibration after being installed is avoided, and the protection of the bonding pad body is effectively improved.
2. According to the utility model, when more dust is on the bonding pad main body, the mounting rod is used for lifting the limiting rod upwards, so that the hairbrush is taken out from the storage groove, then the mounting rod and the hairbrush rotate along the limiting rod, and in the rotating process of the mounting rod and the hairbrush, the dust on the surface of the bonding pad main body can be wiped by the hairbrush, so that the bonding pad main body is prevented from being covered by dust due to longer service time, the use of the bonding pad main body is influenced, and the service life of the bonding pad main body is effectively prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an integrated circuit pad according to a preferred embodiment of the present utility model;
FIG. 2 is a schematic diagram of an integrated circuit expansion pad according to another embodiment of the present utility model;
FIG. 3 is a schematic view of the fastening assembly shown in FIG. 1;
FIG. 4 is an enlarged partial schematic view of the fastening assembly of FIG. 3;
FIG. 5 is a schematic view of the ash removal assembly of FIG. 1;
fig. 6 is a schematic structural view of the pad body shown in fig. 1.
Reference numerals in the drawings: 1. a pad body; 11. a clamping groove; 12. a limiting hole; 13. a storage groove; 2. a fixing assembly; 21. a concave rod; 22. a spring; 23. reinforcing strips; 3. an ash removal component; 31. a limit rod; 32. a mounting rod; 33. a brush; 34. and a limiting plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the embodiments of the present utility model, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate an azimuth or a positional relationship based on that shown in the drawings, or an azimuth or a positional relationship in which the product of the present utility model is conventionally put when used, it is merely for convenience of describing the present utility model and simplifying the description, and it does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
Furthermore, the terms "horizontal," "vertical," "overhang" and the like, if any, do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Specific implementations of the utility model are described in detail below in connection with specific embodiments.
Referring to fig. 1 to 6, an integrated circuit extension pad provided in an embodiment of the present utility model includes: a bonding pad main body 1, a fixing component 2 and an ash cleaning component 3.
In the embodiment of the present utility model, referring to fig. 1 and 6, two sides of the pad body 1 are provided with clamping grooves 11, four corners of the pad body 1 are provided with limiting holes 12, and one side of the top of the pad body 1 is provided with a receiving groove 13.
It should be noted that: the pad main part 1 is the main part of integrated circuit extension pad, can install the integrated circuit, draw-in groove 11 and concave type pole 21 cooperation, can more conveniently install concave type pole 21 in pad main part 1 mountain, has four spacing holes 12 on the pad main part 1, and one of them spacing hole 12 is used for installing gag lever post 31, and other three spacing holes 12 can be with the bolt cooperation, installs fixedly to pad main part 1, puts brush 33 in accomodating inslot 13, can avoid falling into more dust on the brush 33, still can provide the mounted position for brush 33 simultaneously, avoids brush 33 to influence pad main part 1.
In the embodiment of the present utility model, referring to fig. 2, 3 and 4, the fixing component 2 is located on the pad body 1, and the fixing component 2 includes a concave rod 21 and a reinforcing strip 23, the clamping grooves 11 on two sides of the pad body 1 are respectively provided with the concave rod 21 that is fixedly connected, a plurality of reinforcing strips 23 that are fixedly connected are installed between the bottoms of the concave rods 21, the fixing component 2 further includes a spring 22, the concave rod 21 is provided with a groove, and a plurality of springs 22 that are fixedly connected are installed between the inner top wall and the inner bottom wall of the groove of the concave rod 21 and the pad body 1.
It should be noted that: when this pad main part 1 is installed, with concave type pole 21 card through its recess on draw-in groove 11 of pad main part 1, later concave type pole 21 and reinforcement strip 23 cooperation, with the unsettled installation of pad main part 1, when pad main part 1 received vibrations, spring 22 between concave type pole 21 and the pad main part 1 can reduce the power of vibrations, simultaneously because pad main part 1 is unsettled installation, can increase its heat dispersion, improved the protectiveness of the device to pad main part 1 simultaneously.
In the embodiment of the present utility model, referring to fig. 1 and 5, the ash removal component 3 is located on the pad body 1, the ash removal component 3 includes a limiting rod 31, a mounting rod 32 and a brush 33, the limiting hole 12 on the pad body 1 near one end of the storage slot 13 is provided with the rotationally connected limiting rod 31, the top of the limiting rod 31 is provided with the fixedly connected mounting rod 32, the bottom of the mounting rod 32 is provided with the fixedly connected brush 33, the ash removal component 3 further includes a limiting plate 34, the bottom end of the limiting rod 31 is provided with the fixedly connected limiting plate 34, part of the limiting plate 34 is made of rubber material, the brush 33 is located in the storage slot 13, and the width of the mounting rod 32 is greater than the width of the storage slot 13.
It should be noted that: when the dust on the pad body 1 is more, the mounting rod 32 is used to lift the limit rod 31 upwards, so that the brush 33 is taken out from the storage groove 13, then the mounting rod 32 and the brush 33 are rotated along the limit rod 31, the dust on the surface of the pad body 1 can be wiped by the brush 33 in the rotating process of the mounting rod 32 and the brush 33, after the dust on the surface of the pad body 1 is cleaned, the mounting rod 32 and the brush 33 are rotated again, the brush 33 is rotated to the upper side of the storage groove 13, then the mounting rod 32 is lowered through the limit rod 31, and the brush 33 is retracted into the storage groove 13.
The working principle of the integrated circuit expansion bonding pad provided by the utility model is as follows:
firstly, an integrated circuit is welded on a bonding pad main body 1, then the bonding pad main body 1 is prepared to be installed, a concave rod 21 is clamped on a clamping groove 11 of the bonding pad main body 1 through a groove of the concave rod, then the concave rod 21 is matched with a reinforcing strip 23, the bonding pad main body 1 is mounted in a suspension manner, then a bolt is mounted in a limit hole 12 on the bonding pad main body 1, the bonding pad main body 1 is mounted at a designated mounting position by using the bolt, the whole bonding pad main body 1 is mounted in a case of a computer, and the integrated circuit is abutted with other electronic elements of the electronic computer, so that the bonding pad main body can be normally used;
when the bonding pad main body 1 is vibrated, the spring 22 between the concave rod 21 and the bonding pad main body 1 can reduce the vibration force, and meanwhile, as the bonding pad main body 1 is mounted in a suspended manner, the heat dissipation capacity of the bonding pad main body can be improved, and meanwhile, the protection of the bonding pad main body 1 by the device is improved;
meanwhile, when more dust is on the pad main body 1, the mounting rod 32 is used for lifting the limiting rod 31 upwards, the hairbrush 33 is taken out of the storage groove 13, then the mounting rod 32 and the hairbrush 33 are rotated along the limiting rod 31, the dust on the surface of the pad main body 1 can be wiped by the hairbrush 33 in the rotating process of the mounting rod 32 and the hairbrush 33, after the dust on the surface of the pad main body 1 is cleaned, the mounting rod 32 and the hairbrush 33 are rotated again, the hairbrush 33 is rotated to the upper side of the storage groove 13, then the mounting rod 32 is lowered through the limiting rod 31, and the hairbrush 33 is retracted into the storage groove 13.
The circuits and control involved in the present utility model are all of the prior art, and are not described in detail herein.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims (6)

1. An integrated circuit extension pad, comprising:
the bonding pad comprises a bonding pad main body (1), wherein clamping grooves (11) are formed in two sides of the bonding pad main body (1);
the fixing assembly (2), the fixing assembly (2) is located on the bonding pad main body (1), the fixing assembly (2) comprises concave rods (21) and reinforcing strips (23), the concave rods (21) which are fixedly connected are arranged on clamping grooves (11) on two sides of the bonding pad main body (1), and a plurality of reinforcing strips (23) which are fixedly connected are arranged between the bottoms of the concave rods (21);
the ash removal assembly (3), ash removal assembly (3) are located on the bonding pad main body (1).
2. The integrated circuit extension pad according to claim 1, wherein limit holes (12) are formed in four corners of the pad body (1), and a receiving groove (13) is formed in one side of the top of the pad body (1).
3. The integrated circuit expansion bonding pad according to claim 1, wherein the ash removal assembly (3) comprises a limiting rod (31), a mounting rod (32) and a brush (33), the limiting rod (31) which is connected in a rotating way is arranged in a limiting hole (12) which is close to one end of the storage groove (13) on the bonding pad main body (1), the mounting rod (32) which is connected in a fixed way is arranged at the top of the limiting rod (31), and the brush (33) which is connected in a fixed way is arranged at the bottom of the mounting rod (32).
4. The integrated circuit extension pad according to claim 1, wherein the fixing component (2) further comprises a spring (22), the concave rod (21) is provided with a groove, and a plurality of fixedly connected springs (22) are arranged between the inner top wall and the inner bottom wall of the groove of the concave rod (21) and the pad main body (1).
5. The integrated circuit expansion bonding pad according to claim 3, wherein the ash removal assembly (3) further comprises a limiting plate (34), the bottom end of the limiting rod (31) is provided with the limiting plate (34) fixedly connected, and part of the limiting plate (34) is made of rubber.
6. An integrated circuit extension pad according to claim 3, characterized in that the brush (33) is located in the receiving groove (13) and the mounting bar (32) has a width greater than the width of the receiving groove (13).
CN202223430143.5U 2022-12-21 2022-12-21 Integrated circuit expansion bonding pad Active CN219042078U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223430143.5U CN219042078U (en) 2022-12-21 2022-12-21 Integrated circuit expansion bonding pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223430143.5U CN219042078U (en) 2022-12-21 2022-12-21 Integrated circuit expansion bonding pad

Publications (1)

Publication Number Publication Date
CN219042078U true CN219042078U (en) 2023-05-16

Family

ID=86285788

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223430143.5U Active CN219042078U (en) 2022-12-21 2022-12-21 Integrated circuit expansion bonding pad

Country Status (1)

Country Link
CN (1) CN219042078U (en)

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