CN219027772U - Die carrier - Google Patents
Die carrier Download PDFInfo
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- CN219027772U CN219027772U CN202223362489.6U CN202223362489U CN219027772U CN 219027772 U CN219027772 U CN 219027772U CN 202223362489 U CN202223362489 U CN 202223362489U CN 219027772 U CN219027772 U CN 219027772U
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- Prior art keywords
- die holder
- die
- pressing plate
- etching
- lower die
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- 239000000463 material Substances 0.000 claims abstract description 77
- 238000005530 etching Methods 0.000 claims abstract description 45
- 238000003825 pressing Methods 0.000 claims abstract description 40
- 238000004080 punching Methods 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/04—Centering the work; Positioning the tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The application discloses die carrier includes: an upper die holder, an upper pressing plate and a lower die holder; the upper pressing plate is connected to the bottom of the upper die holder, and the lower end face of the upper pressing plate is used for installing an etching die; the lower die holder is correspondingly arranged below the upper die holder and is used for bearing materials; the thickness of the boss is larger than that of the etching die, so that when the die is assembled, an uncut height is reserved between the etching die and the lower die holder, and the uncut height is equal to the thickness difference between the boss and the etching film. The die carrier can ensure that materials are not cut excessively, and the service life of the etching die can be prolonged.
Description
Technical Field
The application relates to the field of die cutting, in particular to a die frame.
Background
In the related art, the die cutting of the multi-layer material is usually realized through a die for flat plate die cutting, or a certain depth is cut for a single-layer thicker material, when the die cutting depth needs to be adjusted, the die cutting is realized through adjusting the height of the upper bottom plate of the lower die holder, but the over cutting is easily caused due to the instability of the operation process of the machine, so that the die cutting effect is influenced; and the height of the bottom plate needs to be adjusted in a long time, thus delaying production and processing.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a die carrier, which can ensure that materials are not cut excessively and can prolong the service life of the etching die.
The mould frame according to the embodiment of the first aspect of the utility model comprises: an upper die holder, an upper pressing plate and a lower die holder; the upper pressing plate is connected to the bottom of the upper die holder, and the lower end face of the upper pressing plate is used for installing an etching die; the lower die holder is correspondingly arranged below the upper die holder and is used for bearing materials; the upper pressing plate is provided with a boss on the lower end face or the upper end face of the lower die holder, and the thickness of the boss is larger than that of the etching die, so that when the die is assembled, an uncut height is reserved between the etching die and the lower die holder, and the uncut height is equal to the thickness difference between the boss and the etching film.
The mould frame provided by the embodiment of the utility model has at least the following beneficial effects: the die frame comprises an upper die holder, an upper pressing plate and a lower die holder, wherein the upper pressing plate is connected to the bottom of the upper die holder, the lower die holder is arranged below the upper pressing plate corresponding to the upper pressing plate, and the bottom of the upper pressing plate is used for mounting an etching die, so that materials on the lower die holder can be die-cut into corresponding shapes by the etching die at the bottom of the upper die holder; the lower end of the upper pressing plate or the upper end face of the lower die holder is provided with a boss, and the thickness of the boss is larger than that of the etching die, so that the boss is positioned between the upper pressing plate and the lower die holder in the die assembly process of the upper die holder and the lower die holder, and the thickness of the etching die can only be die-cut to a certain height, but the residual height of the thickness difference of the boss and the etching die cannot be die-cut; specifically, in this embodiment, the boss is disposed at the bottom of the upper pressing plate, when the upper pressing plate moves downward along with the upper die holder, the boss is larger than the etching die, so that the boss is firstly abutted against the lower die holder, and a certain height of the etching die from the upper end surface of the lower die holder cannot be abutted against the lower die holder, so that an uncut height between the etching die and the lower die holder is formed, the uncut height is equal to the thickness difference between the boss and the etching die, and the die-cut depth of the etching die is the difference between the thickness of the material and d, so that the material can be ensured not to be overdevened by setting the boss, the etching die can be protected, the service life of the etching die can be prolonged, and the height adjustment duration of the lower die holder can be shortened.
According to some embodiments of the utility model, limiting plates are arranged on the two sides of the lower die holder along the width direction of the material feeding, a feeding position is formed between the bottom of the limiting plates and the upper end face of the lower die holder, so that the material is limited at the feeding position, a first avoiding groove is formed in the bottom of the upper pressing plate, and the first avoiding groove and the limiting plates are correspondingly adapted.
According to some embodiments of the utility model, the bottom of the limiting plate on both sides is provided with a limiting step to limit the width direction of the material.
According to some embodiments of the utility model, the material feeding device further comprises a first fastener, the lower die holder is provided with a threaded hole, the limiting plate is provided with a through hole corresponding to the threaded hole, and the first fastener is connected to the lower die holder through the through hole and the threaded hole in a threaded manner and is used for limiting the width direction of the material.
According to some embodiments of the utility model, the top of the first fastener protrudes out of the upper end surface of the limiting plate, a second avoidance groove is formed in the bottom of the first avoidance groove, and the second avoidance groove is correspondingly matched with the first fastener.
According to some embodiments of the utility model, a plurality of punches are arranged at the bottom of the upper pressing plate, the punches are located at two sides of the material running width direction and used for punching positioning holes at two sides of the material, and the lower die holder is provided with a plurality of first avoidance holes corresponding to the punches.
According to some embodiments of the utility model, a plurality of positioning pins are arranged at the bottom of the upper pressing plate, the positioning pins are positioned at two sides of the material running width direction and used for positioning the material, a plurality of second avoidance holes corresponding to the positioning pins are arranged on the lower die holder, and the punch and the positioning pins are sequentially arranged along the material running direction of the material.
According to some embodiments of the utility model, the limiting plate is provided with a plurality of third avoidance holes, and the third avoidance holes respectively correspond to the first avoidance holes and the second avoidance holes.
According to some embodiments of the utility model, an elastic member is connected between the upper die holder and the upper platen, so that the upper platen is elastically connected to the upper die holder.
According to some embodiments of the utility model, guide structures are arranged on the bottom of the upper die holder and the lower die holder, and the upper pressing plate is provided with a through hole, so that the upper die holder, the upper pressing plate and the lower die holder vertically correspond when the die is closed.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The utility model is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic view of a structure of an embodiment of the present utility model at a certain angle;
FIG. 2 is a schematic view of another embodiment of the present utility model;
fig. 3 is a schematic structural view of a third angle according to an embodiment of the present utility model.
Reference numerals:
100. an upper die holder; 200. an upper press plate; 210. a boss; 220. a first avoidance groove; 230. a second avoidance groove; 240. a punch; 250. a positioning needle; 300. a lower die holder; 310. a limiting plate; 311. a third avoidance hole; 320. a first fastener; 330. a first avoidance hole; 340. a second avoidance hole; 400. etching the mold; 500. an elastic member; 600. a guide structure; 610. a guide post; 620. and a guide hole.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that references to orientation descriptions, such as directions of up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical solution.
In the description of the present application, a description with reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The mold frame according to an embodiment of the present utility model is described below with reference to fig. 1 to 3.
As shown in fig. 1, the scaffold according to an embodiment of the present utility model includes: an upper die holder 100, an upper platen 200, and a lower die holder 300; the upper pressing plate 200 is connected to the bottom of the upper die holder 100, and the lower end surface of the upper pressing plate 200 is used for installing the etching die 400; the lower die holder 300 is correspondingly arranged below the upper die holder 100 and is used for bearing materials; wherein, the lower end surface of the upper platen 200 or the upper end surface of the lower die holder 300 is provided with a boss 210, and the thickness of the boss 210 is greater than that of the etching die 400, so that when the die is closed, an uncut height is left between the etching die 400 and the lower die holder 300, and the uncut height is equal to the thickness difference between the boss 210 and the etching film.
It can be understood that the die carrier comprises an upper die holder 100, an upper pressing plate 200 and a lower die holder 300, wherein the upper pressing plate 200 is connected to the bottom of the upper die holder 100, the lower die holder 300 is arranged below the upper pressing plate 200 corresponding to the upper pressing plate 200, the bottom of the upper pressing plate 200 is used for installing an etching die 400, and therefore materials on the lower die holder 300 can be die-cut into corresponding shapes by the etching die 400 at the bottom of the upper die holder 100; the lower end of the upper platen 200 or the upper end surface of the lower die holder 300 is provided with a boss 210, and the thickness of the boss 210 is greater than that of the etching die 400, so that the boss 210 is positioned between the upper platen 200 and the lower die holder 300 in the process of die assembly of the upper die holder 100 and the lower die holder 300, and the thickness of the etching die 400 can only be die-cut by a certain height, but cannot be die-cut by the rest height of the thickness difference between the boss 210 and the etching die 400; specifically, in this embodiment, the boss 210 is disposed at the bottom of the upper platen 200, when the upper platen 200 moves downward with the upper die holder 100, since the thickness of the boss 210 is greater than that of the etching die 400, the boss 210 is first abutted against the lower die holder 300, and the upper end surface of the etching die 400 is still at a certain height from the lower die holder 300, so that an uncut height between the etching die 400 and the lower die holder 300 is formed, the uncut height is equal to the thickness difference between the boss 210 and the etching die 400, and the uncut height is d, so that the die-cut depth of the etching die 400 is the difference between the thickness of the material and d.
It should be appreciated that in other embodiments, the boss 210 may be disposed on the upper end surface of the lower die holder 300, so that after the upper die holder 100 moves down with the upper platen 200, the boss 210 contacts the upper platen 200 during die assembly, and the thickness of the etching die 400 is smaller than that of the boss 210, so that the etching die 400 is spaced from the upper end surface of the lower die holder 300, and thus the material cannot be cut through the lower die holder 300.
It can be appreciated that the two sides of the lower die holder 300 along the width direction of the material running, which are respectively provided with a limiting plate 310, a material running level is formed between the bottom of the limiting plate 310 and the upper end surface of the lower die holder 300, so that the material is limited to the material running level, the bottom of the upper pressing plate 200 is provided with a first avoiding groove 220, and the first avoiding groove 220 and the limiting plate 310 are correspondingly adapted. For example, as shown in fig. 1 to 2, in the present embodiment, two sides of the upper end surface of the lower die holder 300 along the width direction of the material feeding are provided with limiting plates 310, and a feeding level is formed between the bottom of the limiting plates 310 and the upper end surface of the lower die holder 300, so as to avoid that the material is carried up by the etching die 400 or other punching components and separated from the lower die holder 300 in the process of feeding along the feeding level along with the die cutting, so as to limit the material in the height direction; in addition, the bottom of the upper pressing plate 200 is provided with the first avoiding groove 220, and the first avoiding groove 220 is correspondingly matched with the limiting plate 310, so that the limiting plate 310 can be accommodated in the first avoiding groove 220 during die assembly, and die cutting of the etching die 400 is not affected.
It can be appreciated that the bottom of the limiting plates 310 on both sides are provided with limiting steps to limit the width direction of the material. For example, in this embodiment, the bottom of the limiting plate 310 on two sides of the lower die holder 300 along the width direction of the material feeding is provided with limiting steps, and the limiting steps are arranged at the bottom of the limiting plate 310, so that the limiting steps on the bottoms of the limiting plates 310 on two sides play a role in limiting the width direction of the material feeding, and prevent the die cutting position offset caused by the material offset.
It can be understood that the lower die holder 300 further includes a first fastener 320, a threaded hole is formed in the lower die holder 300, a through hole corresponding to the threaded hole is formed in the limiting plate 310, and the first fastener 320 is connected to the lower die holder 300 through the through hole and the threaded hole in a threaded manner and is used for limiting the width direction of the material. For example, as shown in fig. 1 to 2, in the present embodiment, a threaded hole is provided on the lower die holder 300, a through hole is provided on the limiting plate 310, the through hole corresponds to the threaded hole, and the first fastener 320 sequentially passes through the through hole and the threaded hole to lock the limiting plate 310 on the lower die holder 300; meanwhile, the first fastening pieces 320 at two sides along the width direction of the material can limit the width direction of the material, so that die cutting offset caused by material offset is prevented.
It can be appreciated that the top of the first fastening member 320 protrudes from the upper end surface of the limiting plate 310, and the bottom of the first avoidance groove 220 is provided with a second avoidance groove 230, and the second avoidance groove 230 is correspondingly matched with the first fastening member 320. For example, as shown in fig. 1 to 2, in this embodiment, since the top of the first fastener 320 protrudes from the upper end surface of the limiting plate 310, in order to avoid interference, a second avoidance groove 230 adapted to the first fastener 320 is also provided at the bottom of the first avoidance groove 220, so that during the mold clamping process, the top of the first fastener 320 can be accommodated in the second avoidance groove 230, thereby avoiding interference between the first fastener 320 and the upper platen 200.
It can be understood that the bottom of the upper platen 200 is provided with a plurality of punches 240, the punches 240 are located at two sides of the width direction of the material, so as to punch positioning holes at two sides of the material, and the lower die holder 300 is provided with a plurality of first avoiding holes 330 corresponding to the punches 240. For example, as shown in fig. 1 to 2, in the present embodiment, a plurality of punches 240 are disposed at the bottom of the upper platen 200, the punches 240 are located at two sides of the width direction of the material, so as to punch positioning holes on two sides of the material, and a first avoidance hole 330 corresponding to the punch 240 is disposed on the upper end surface of the lower die holder 300, so that after the punch 240 punches the positioning hole of the material, interference between the bottom end of the punch 240 and the lower die holder 300 is prevented, and the lower die holder 300 performs the avoidance function on the punch 240 through the first avoidance hole 330.
It can be understood that the bottom of the upper pressing plate 200 is provided with a plurality of positioning pins 250, the positioning pins 250 are located at two sides of the material running width direction, so as to be used for positioning the material, the lower die holder 300 is provided with a plurality of second avoiding holes 340 corresponding to the positioning pins 250, and the punch 240 and the positioning pins 250 are sequentially arranged along the material running direction of the material. For example, as shown in fig. 1 to 2, in this embodiment, a plurality of positioning pins 250 are disposed at the bottom of the lower platen, the positioning pins 250 are located at two sides of the upper platen 200, the lower die holder 300 is provided with second avoiding holes 340 corresponding to the positioning pins 250, so that positioning of the material is achieved by passing the positioning pins 250 through the positioning holes of the material, die cutting accuracy is improved, interference between the positioning pins 250 and the lower die holder 300 is avoided by avoiding the second avoiding holes 340, the punch 240 and the positioning pins 250 are sequentially arranged along the feeding direction of the material, and thus positioning of the material can be achieved by passing the positioning pins 250 through the positioning holes after the punch 240 punches out the positioning holes of the material.
Specifically, the outer diameter of the positioning needle 250 is gradually increased from the bottom end to the top, so that the positioning needle 250 can conveniently realize the deviation correcting effect on the material in the process of downwards penetrating through the positioning hole of the material, the straightness of material feeding is ensured, and the accuracy of the die cutting position is improved.
It can be appreciated that the limiting plate 310 is provided with a plurality of third avoidance holes 311, and the plurality of third avoidance holes 311 respectively correspond to the first avoidance holes 330 and the second avoidance holes 340. For example, as shown in fig. 1 to 2, in this embodiment, a plurality of third avoidance holes 311 are provided on the limiting plate 310, and the third avoidance holes 311 are divided into two types corresponding to the first avoidance holes 330 and the second avoidance holes 340, so that after the punch 240 sequentially passes through the third avoidance holes 311 and the first avoidance holes 330 to punch the material, the limiting plate 310 can limit the material on the lower die holder 300, and prevent the material from being carried up by the punch 240; after the positioning needle 250 sequentially passes through the third avoidance hole 311 and the second avoidance hole 340, the limiting plate 310 can also limit the material on the lower die holder 300, so as to prevent the material from being carried up by the positioning needle 250.
It can be appreciated that the elastic member 500 is connected between the upper die holder 100 and the upper platen 200 so that the upper platen 200 is elastically connected to the upper die holder 100. For example, as shown in fig. 3, in the present embodiment, an elastic member 500 is connected between the upper platen 200 and the upper die holder 100, so that the upper platen 200 is elastically connected to the bottom of the upper die holder 100, that is, in the process of pressing down the upper die holder 100, the impact force of the lower platen on the material can be reduced through the buffering action of the elastic member 500.
It can be appreciated that the guide structures 600 are provided on the bottom of the upper die holder 100 and the lower die holder 300, and the upper platen 200 is provided with a via hole, so that the upper die holder 100, the upper platen 200 and the lower die holder 300 vertically correspond when die assembly is performed. For example, as shown in fig. 3, in the present embodiment, the bottom of the upper die holder 100 and the upper end surface of the lower die holder 300 are provided with guide structures 600, and the upper die holder 200 is provided with a via hole, so that the upper die holder 100, the upper die holder 200 and the lower die holder 300 can correspond in the vertical direction in the process of driving the upper die holder 200 to die-cut in the lower direction by the upper die holder 100.
Specifically, in the present embodiment, the bottom of the upper die holder 100 is provided with the guide post 610, the lower die holder 300 is provided with the guide hole 620 corresponding to the guide post 610, the via hole corresponds to the guide post 610, and in the process that the upper die holder 100 drives the upper platen 200 to perform downward die assembly, the guide post 610 is accommodated in the guide hole 620 after passing through the via hole, so that the upper die holder 100, the lower die holder 300 and the upper platen 200 can correspond to each other in the vertical direction, and the upper die holder 100 is prevented from shifting relative to the lower die holder 300 in the downward process.
It should be understood that, in other embodiments, the upper end surface of the lower die holder 300 may be provided with a guide post 610, and the upper die holder 100 is provided with a guide hole 620 corresponding to the guide post 610, and the via hole corresponds to the guide post 610, so that, during the process that the upper die holder 100 drives the upper platen 200 to descend, the guide post 610 sequentially passes through the via hole and the guide hole 620, so as to ensure the straightness of the lower die holder 300, the upper platen 200 and the upper die holder 100 in the vertical direction.
The embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made without conflict within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application.
Claims (10)
1. The die carrier, its characterized in that includes:
an upper die holder;
the upper pressing plate is connected to the bottom of the upper die holder, and the lower end face of the upper pressing plate is used for installing an etching die;
the lower die holder is correspondingly arranged below the upper pressing plate and is used for bearing materials; wherein,,
the upper pressing plate is characterized in that a boss is arranged on the lower end face of the upper pressing plate or the upper end face of the lower die holder, and the thickness of the boss is larger than that of the etching die, so that when the die is assembled, an uncut height is reserved between the etching die and the lower die holder, and the uncut height is equal to the thickness difference between the boss and the etching die.
2. The die carrier of claim 1, wherein limiting plates are arranged on the lower die holder along two sides of the width direction of the material, a material feeding position is formed between the bottom of the limiting plates and the upper end face of the lower die holder, so that the material is limited at the material feeding position, a first avoiding groove is formed in the bottom of the upper pressing plate, and the first avoiding groove is correspondingly matched with the limiting plates.
3. The mold frame according to claim 2, wherein the bottom of the limiting plates on both sides are provided with limiting steps to limit the width direction of the material.
4. The mold frame according to claim 2, further comprising a first fastener, wherein the lower mold base is provided with a threaded hole, the limiting plate is provided with a through hole corresponding to the threaded hole, and the first fastener is in threaded connection with the lower mold base through the through hole and the threaded hole and is used for limiting the width direction of the material.
5. The mold frame according to claim 4, wherein the top of the first fastener protrudes out of the upper end surface of the limiting plate, a second avoidance groove is formed in the bottom of the first avoidance groove, and the second avoidance groove is correspondingly matched with the first fastener.
6. The die carrier according to claim 2, wherein a plurality of punches are arranged at the bottom of the upper pressing plate, the punches are located at two sides of the material running in the width direction and used for punching positioning holes at two sides of the material, and the lower die holder is provided with a plurality of first avoiding holes corresponding to the punches.
7. The die carrier of claim 6, wherein a plurality of positioning pins are arranged at the bottom of the upper pressing plate, the positioning pins are located at two sides of the material running width direction and used for positioning the material, a plurality of second avoidance holes corresponding to the positioning pins are formed in the lower die holder, and the punch and the positioning pins are sequentially arranged along the material running direction of the material.
8. The scaffold of claim 7, wherein the limiting plate is provided with a plurality of third avoidance holes, and the plurality of third avoidance holes correspond to the first avoidance holes and the second avoidance holes, respectively.
9. The die carrier of claim 1, wherein an elastic member is connected between the upper die base and the upper platen, so that the upper platen is elastically connected to the upper die base.
10. The mold frame according to claim 9, wherein guide structures are provided on the bottom of the upper mold base and the lower mold base, and the upper press plate is provided with a via hole, so that the upper mold base, the upper press plate and the lower mold base vertically correspond when mold closing is performed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223362489.6U CN219027772U (en) | 2022-12-14 | 2022-12-14 | Die carrier |
| PCT/CN2023/119772 WO2024125018A1 (en) | 2022-12-14 | 2023-09-19 | Die frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223362489.6U CN219027772U (en) | 2022-12-14 | 2022-12-14 | Die carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219027772U true CN219027772U (en) | 2023-05-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223362489.6U Active CN219027772U (en) | 2022-12-14 | 2022-12-14 | Die carrier |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN219027772U (en) |
| WO (1) | WO2024125018A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024125018A1 (en) * | 2022-12-14 | 2024-06-20 | 深圳市领略数控设备有限公司 | Die frame |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101121650B1 (en) * | 2010-08-18 | 2012-03-09 | 윤지훈 | Press mold |
| CN106142213B (en) * | 2016-08-31 | 2018-01-23 | 天津日津科技股份有限公司 | A kind of cross cutting stamping line of general movable insert hardware die holder |
| CN206589045U (en) * | 2017-02-27 | 2017-10-27 | 东莞六淳智能科技有限公司 | A kind of equipment of quick mode transfer |
| CN107138624B (en) * | 2017-07-12 | 2019-02-19 | 苏州安洁科技股份有限公司 | A kind of hardware dies of synchronous punching press location hole and hot pressing radian |
| CN212312231U (en) * | 2020-04-26 | 2021-01-08 | 苏州世沃电子科技有限公司 | Height-limiting etching mold |
| CN213617124U (en) * | 2020-09-25 | 2021-07-06 | 广州市安旭特电子有限公司 | Die cutting processing jig |
| CN216884363U (en) * | 2021-12-23 | 2022-07-05 | 上海任虹精密机械有限公司 | Die cutting die preventing die cutting from being too deep |
| CN219027772U (en) * | 2022-12-14 | 2023-05-16 | 深圳市领略数控设备有限公司 | Die carrier |
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2022
- 2022-12-14 CN CN202223362489.6U patent/CN219027772U/en active Active
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2023
- 2023-09-19 WO PCT/CN2023/119772 patent/WO2024125018A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024125018A1 (en) * | 2022-12-14 | 2024-06-20 | 深圳市领略数控设备有限公司 | Die frame |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024125018A1 (en) | 2024-06-20 |
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