CN219017403U - Capacitance-inductance dual-function device - Google Patents
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- CN219017403U CN219017403U CN202222826159.1U CN202222826159U CN219017403U CN 219017403 U CN219017403 U CN 219017403U CN 202222826159 U CN202222826159 U CN 202222826159U CN 219017403 U CN219017403 U CN 219017403U
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Abstract
The utility model relates to a capacitance-inductance dual-function device. The capacitive-inductive dual-function device comprises a plurality of capacitive layers, a plurality of inductive layers, a metal electrode and an end electrode, wherein a circuit correspondingly formed is formed by connecting a capacitor and an inductor in parallel and has preset impedance; and laminating a plurality of capacitor layers and a plurality of inductors to form a laminated structure, printing the metal electrodes on the capacitor layers and the inductors, and forming the terminal electrodes on two sides of the laminated structure formed by pressing the capacitor layers and the inductors. The utility model relates to a capacitance-inductance dual-function device, which belongs to a miniature low-power energy storage device.
Description
Technical Field
The utility model relates to the technical field of electronic devices, in particular to a capacitance-inductance dual-function device.
Background
In a low-power microcircuit, in order to meet the demands of small volume, low power, and further space saving, it is necessary to implement LC resonance circuits in a smaller volume.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: the capacitive-inductive dual-function device solves the problem that the capacitance and the inductance body in the existing LC resonance circuit cannot meet the requirements of the miniature circuit on volume and power.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the capacitive-inductive dual-function device comprises a plurality of capacitive layers, a plurality of inductive layers, a metal electrode and an end electrode, wherein a circuit correspondingly formed is formed by connecting a capacitor and an inductor in parallel and has preset impedance; laminating a plurality of capacitance layers and a plurality of inductors to form a laminated structure; the metal electrodes are printed on the capacitance layer and the inductance layer; and forming the terminal electrodes on two sides of the laminated layer formed by pressing the capacitor layers and the inductor layers.
Preferably, the capacitance layer is a cast film made of dielectric ceramics and epoxy resin; the inductance layer is a casting film made of soft magnetic metal alloy powder and epoxy resin.
Preferably, the metal electrode on the inductance layer penetrates through two sides of the device and is exposed outside the device, and the metal electrode on the capacitance layer is exposed on each side of the device only on one side.
In some embodiments, the upper and lower metal electrodes of each capacitor layer of the multi-layer capacitor layer extend respectively and are exposed to different sides of the capacitor layer, and the staggered edges are exposed; each capacitor layer is printed with a metal electrode on one side; the difference between the metal electrode and the edge of the capacitance layer is 0.2-8mm at one side of the capacitance layer where the metal electrode does not leak out of the device.
In some embodiments, the capacitive layer thickness is 0.03-0.5mm; the thickness of the inductance layer is 0.03-0.5mm; the shape of the capacitance layer and the inductance layer are matched; the metal electrode is an adhesion thin layer formed by printing metal slurry on the surface of the capacitance layer or the inductance layer; the capacitance-inductance dual-function device is a miniature low-power energy storage device.
In some embodiments, the metal electrode on the inductance layer is connected with two sides of the inductance layer in a straight line or bending and winding way; the coverage area of the metal electrode on the capacitance layer is relatively large, one side of the metal electrode extends to one side of the capacitance layer to be exposed, and the other side of the metal electrode is different from the edge of the other side of the capacitance layer by a preset distance.
In some embodiments, according to the capacitance principle of the capacitive device, the metal electrode on the capacitive layer is arranged such that the coverage area on the capacitive layer is equivalent to the effective area of the capacitive layer material; according to the inductance principle of the inductance layer, the metal electrode on the inductance layer is arranged so that the coverage area on the inductance layer is smaller than the effective area of the inductance layer material.
In some embodiments, the metal electrode is a low temperature electrode that cures at low temperature to form an electrode; the metal electrode is an electrode formed by printing one of silver-palladium slurry, cu slurry and Ni slurry; and polishing two sides of the laminated device formed by laminating the capacitor layers and the inductor layers to expose the metal electrode so as to form a terminal electrode.
In some embodiments, a silver plating layer is formed on the terminal electrode.
In some embodiments, a capacitive-inductive dual function device having a predetermined capacitance and inductance at a predetermined frequency is obtained by circuit design of the capacitive-inductive dual function device and/or adjusting materials of the capacitive layer and the inductive layer.
By adopting the technical scheme, the utility model has the following technical effects:
the utility model makes the capacitor-inductor into a device, which is connected with the LC inductor in parallel after being connected into the circuit, and can meet the impedance requirement at the beginning of circuit design by adjusting the inductance and the capacity of the device, thereby having potential application value in filter circuits and logic circuits; the LC resonant circuit is particularly suitable for a low-power miniature circuit, well meets the requirements of small volume and low power and further saves space, and can be realized under a smaller volume.
The present utility model will be described in further detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a capacitor layer (with electrodes) in a capacitor-inductor dual-function device according to an embodiment of the present utility model, wherein fig. 1 (a) shows a top surface of the capacitor and fig. 1 (b) shows a bottom surface of the capacitor.
Fig. 2 is a schematic diagram of a capacitor laminated layer structure in a capacitor-inductor dual-function device according to an embodiment of the present utility model.
Fig. 3 is a schematic structural diagram of an inductance layer (with electrodes) in a capacitive-inductive dual-function device according to an embodiment of the present utility model.
Fig. 4 is a schematic structural diagram of an inductance layer (with electrodes) in a capacitive-inductive dual-function device according to another embodiment of the present utility model.
Fig. 5 is a schematic diagram of a stacked layer structure of a capacitive-inductive dual-function device according to an embodiment of the present utility model.
Fig. 6 is a circuit diagram of a capacitive-inductive dual function device in accordance with an embodiment of the present utility model.
Detailed Description
It should be noted that, without conflict, the embodiments and features of the embodiments in the present application may be combined with each other, and the present utility model will be further described in detail with reference to the drawings and the specific embodiments.
Referring to fig. 1 to 6, the capacitive-inductive dual-function device of the present utility model may be a laminated structure formed by laminating a plurality of capacitive layers 1 and a plurality of inductive layers 2. And metal paste is printed between two layers in the laminated layer and on the surfaces of the uppermost layer and the lowermost layer to form metal electrodes, and terminal electrodes are formed on two sides of the device. Wherein, the capacitance layer 1 is a casting film made of dielectric ceramic material and epoxy resin; the inductance layer 2 is a casting film made of soft magnetic metal alloy powder and epoxy resin. The thickness of the casting film of each capacitor layer 1 can be 0.03-0.5mm, and the thickness of the casting film of the inductance layer 3 can be 0.03-0.5mm, and the middle metal electrodes 2 and 4 are screen printing metal electrodes, preferably silver-palladium electrodes. The inductance and the capacitance layer are connected in parallel, the electrodes at the two ends of the inductance layer 3 are exposed out of the device, and each electrode of the capacitance layer 1 is exposed out of one side (or one end) at each side, so that a parallel structure of the capacitance-inductance layer is formed. The utility model makes the capacitor-inductor into a device, which is connected with the LC inductor in parallel after being connected into the circuit, and can meet the impedance requirement of the circuit by adjusting the inductance and the capacity of the device, thereby having potential application value in the filter circuit and the logic circuit. The capacitive-inductive dual-function device is suitable for a low-power miniature circuit, well meets the requirements of small volume and small power and further saves space, and can realize an LC resonance circuit in a smaller volume. The utility model relates to a capacitance-inductance dual-function device, which belongs to a miniature low-power energy storage device.
The circuit formed by electrically connecting the capacitor layers 1, the inductor layers 2, the metal electrodes and the terminal electrodes is shown in fig. 6, and the capacitor and the inductor are connected in parallel and have preset series impedance. The capacity and the inductance under different frequencies can be obtained by adjusting the circuit design and the material change of the capacitance layer and the inductance layer. The circuit design comprises the aspects of size, lamination mode, lamination quantity and the like, and the material adjustment of the capacitance layer and the inductance layer comprises the adjustment of the selected material types, the adjustment of the material proportion and the like. The overall size of the capacitor-inductor dual-function device, the lamination mode and lamination number of the capacitor layer 1 and the inductor layer 2, and the like can be adjusted and determined according to actual requirements, performances and circuit designs.
In some non-limiting examples, the capacitive-inductive dual function device is cube shaped with a length < 30mm, a width < 30mm, and a thickness less than 2mm; the length of the metal electrode of the capacitor layer is 28mm, the width is 30mm, the thickness is 0.5mm, the length of the metal electrode of the inductor layer is 30mm, the width is 10mm, and the thickness is 0.5mm.
The capacitor layer 1 is a casting film capacitor layer A with the thickness of 0.03-0.5mm formed by dissolving, stirring, casting and semi-solidifying a dielectric ceramic material, epoxy resin (for example, 8:2), a curing agent (for example, epoxy resin: curing agent=1:1) and a proper amount of solvent. The capacitance metal electrode 2 on the dielectric ceramic film is an electrode with a smaller length-width ratio, the coverage area of the electrode is large, each layer of dielectric ceramic single-sided brush electrode can brush the electrode on the upper surface or the lower surface of the dielectric ceramic layer, the metal electrodes on the upper surface and the lower surface preferably keep the same area, the two sides are separated by 0.2-2mm distance, and the two sides of the electrode are separated by 0.2-2mm after lamination.
The inductance layer 3 is a casting film inductance B with the thickness formed by dissolving, stirring, casting and semi-solidifying soft magnetic metal alloy powder, epoxy resin (for example, 8:2), curing agent (for example, epoxy resin: curing agent=1:1) and a proper amount of solvent; the metal electrode 4 on the soft magnetic metal layer can adopt an electrode with a relatively large length-width ratio, and the electrode can adopt a foldback shape to increase the electrode path area, and the length of the electrode penetrates through the whole device.
The metal electrodes 2 and 4 are respectively manufactured on the capacitor film and the inductor film by using metal paste through screen printing or transfer printing technology to form a parallel circuit mode, and finally, the capacitor-inductor dual-function device is formed through hot pressing lamination. The metal electrode 4 on the inductance layer is connected with two sides of the device and is exposed outside the device, and the metal electrode 4 on the inductance layer 3 can be connected with two sides of the whole device in a straight line or bending and winding way. The metal electrode on the capacitive layer is exposed on only one side on each side of the device. The upper and lower metal electrodes 2 of each capacitor layer 1 of the multi-layer capacitor layer are respectively extended and exposed to different sides of the capacitor layer, and the staggered edges are exposed. The metal electrode 2 of the capacitor layer is printed on one side. The metal electrode 2 on the capacitor layer has a relatively large coverage area on the capacitor layer, and one side of the metal electrode extends to one side of the device to be exposed, and the other side of the metal electrode is separated from the other side edge of the device by a predetermined distance, for example, 0.2-8mm. According to the capacitance principle of the capacitance device, the coverage area of the metal electrode 2 on the capacitance layer is equivalent to the effective area of the capacitance layer material, and the area of the metal electrode on the inductance layer is smaller than the effective area of the inductance layer material.
The capacitor layer 1 is A, the inductor layer 2 is B, and the internal lamination of the capacitor-inductor dual-function device can be arranged and laminated by adopting, but not limited to, AABBAABBAA …, AABBAABB …, AAABBAAABBAAA … and other modes, and the lamination can be hot-pressed and solidified by adopting a flat plate hot press.
The circuit diagram of the capacitor-inductor dual-function device obtained by the utility model refers to fig. 6, and the capacitor C and the inductor L are connected in parallel and have the impedance Rs.
The utility model discloses a capacitor-inductor dual-function device, which is prepared by compounding ceramic powder and metal powder with thermosetting epoxy resin respectively based on preparation methods of casting, printing and pressing, and forming a dielectric ceramic film (capacitor layer) with uniform thickness and a high-permeability soft magnetic film (inductor layer) with uniform thickness through casting. Dissolving, stirring and casting the dielectric ceramic material, epoxy resin, curing agent and solvent to form a casting film capacitor layer A with the thickness of 0.03-0.5mm; and dissolving, stirring, casting and semi-solidifying the soft magnetic metal alloy powder and the epoxy resin to form the casting film inductance layer B with the thickness of 0.03-0.5 mm. Wherein, the stirring mode in the dissolving process is one or more of magnetic stirring, high-speed dispersion, centrifugal dispersion, ball milling dispersion or three-roller grinding dispersion. The temperature of the casting machine can be selected to be 60-100 ℃ according to the different epoxy resins, the casting speed is 1-2m/min, and the casting gap can be adjusted to be 0.1-1mm according to the viscosity of the slurry and the types of the epoxy resins.
The utility model also provides a manufacturing method of the capacitor-inductor dual-function device, which comprises the following steps:
step one, providing dielectric ceramic casting slurry and magnetically soft alloy slurry: the dielectric ceramic casting slurry is prepared by uniformly mixing dielectric ceramic, epoxy resin, curing agent and solvent according to a preset proportion; the soft magnetic alloy slurry is prepared by uniformly mixing soft magnetic metal powder, epoxy resin, a curing agent and a solvent according to a preset proportion;
step two, casting to manufacture a casting film capacitance layer and a casting film inductance layer: the prepared dielectric ceramic slurry and soft magnetic alloy slurry are respectively manufactured into films with uniform thickness by adopting a tape casting machine, and the bottom film is a PET bottom film with a release agent;
step three, printing metal electrodes on the casting film capacitor layer and the casting film inductor layer respectively;
fourth, pressing: laminating a plurality of casting film capacitor layers with metal electrodes and a plurality of casting film inductance layers with metal electrodes in a parallel connection mode, and hot-pressing in a hot press to completely solidify epoxy resin in the capacitor layers;
and step four, manufacturing a terminal electrode, thereby obtaining the capacitance-inductance dual-function device of any embodiment.
Wherein, manufacturing dielectric ceramic casting slurry: uniformly mixing the dielectric ceramic, epoxy resin, a curing agent and a solvent according to a certain proportion, wherein the dielectric ceramic material is selected from one or more of BaTiO3, aCu3Ti4O12, (Ba, sr) TiO3 and TiO 2; the epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, polyphenol F epoxy resin, phenol glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin and glycidyl epoxy resin; adding a certain amount of solvent for dissolution, and uniformly stirring to obtain dielectric ceramic casting slurry; as a non-limiting example, the dielectric ceramic tape casting slurry is obtained by uniformly mixing the dielectric ceramic material with the epoxy resin in a ratio of 8:2, the curing agent (e.g., epoxy resin: curing agent=1:1), and an appropriate amount of solvent.
And (3) preparing soft magnetic alloy slurry: uniformly mixing soft magnetic metal powder and epoxy resin according to a certain proportion, wherein the soft magnetic metal powder is selected from one or more of FeSiAl polycrystalline powder, fe-Ni alloy powder, feSiCr polycrystalline powder, hydroxy iron powder, mnZn ferrite and NiZn ferrite. The epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, polyphenol glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin and glycidyl epoxy resin; mixing soft magnetic metal powder and epoxy resin according to a certain proportion, adding a certain amount of (diluent) solvent for dissolution, adjusting the viscosity of the slurry to 2000cps, and uniformly stirring to obtain soft magnetic alloy slurry. As a non-limiting example, a soft magnetic alloy paste is prepared from soft magnetic metal alloy powder and epoxy 8:2, a curing agent (e.g., epoxy: curing agent=1:1), and an appropriate amount of solvent.
Casting: the prepared dielectric ceramic slurry and soft magnetic alloy slurry are respectively manufactured into films with uniform thickness by adopting a casting machine, and the gap of the casting machine can be set to be 0.1-1mm and the speed is 0.5-3m/min. The bottom film adopts PET bottom film with release agent, and the drying temperature of a curtain coating machine drying channel is 60-140 ℃. A dielectric ceramic film (capacitance layer) having a uniform thickness and a high permeability soft magnetic film (inductance layer) having a uniform thickness are formed by casting.
Printing: cutting the prepared dielectric ceramic film and soft magnetic alloy film into a certain shape respectively, preparing a capacitor metal electrode 2 and an inductor metal electrode 4 at the upper part of the film by adopting a screen printing or transfer printing mode, wherein the metal electrode slurry adopts a low-temperature curing electrode material, and preferably, one or more of Ag-Pd slurry, cu slurry and Ni slurry are selected; the metal electrode 2 or 4 with a certain shape is printed on the capacitance layer 1 and the inductance layer 3 according to the design requirement, the metal electrode is a low-temperature electrode, and the electrode can be formed by solidification at a low temperature.
Pressing: laminating the capacitor layer and the inductor layer in parallel, and hot-pressing and laminating in a hot press to completely solidify epoxy resin therein, wherein the hot-pressing temperature is 100-200 ℃ and the pressure is 6-12 tons.
Manufacturing an end electrode: and taking out the laminated device after hot pressing, polishing, exposing the end electrode by polishing, and then plating silver on the end electrode to obtain the capacitor-inductor parallel dual-function device.
In the manufactured capacitor-inductor parallel dual-function device, an inductor and a capacitor layer are connected in parallel, electrodes at two ends of the inductor layer 3 are exposed out of the device, and each electrode of the capacitor layer 1 is exposed out of one side (or one end) at each side, so that a capacitor-inductor layer parallel structure is formed. The electrodes on the dielectric ceramic film are electrodes with smaller length-width ratio, the coverage area of the electrodes is large, each layer of dielectric ceramic is provided with a single-sided brush electrode, the metal electrodes on the upper surface or the lower surface of the laminated dielectric ceramic layers keep the same area, and the two sides are separated by 0.2-2mm distance, so that the two sides of the laminated dielectric ceramic layers are separated by 0.2-2mm; the electrode of the soft magnetic metal layer is an electrode with a relatively large length-to-width ratio, the electrode can adopt a folded shape to increase the path area of the electrode, and the length of the electrode penetrates through the whole device. In the lamination structure of the capacitance layer and the inductance layer in the capacitance-inductance parallel dual-function device, the capacitance layer 1 is A, the inductance layer 2 is B, and the following steps can be adopted: the arrangement and lamination modes of AABBAABBAA …, AABBAABBBB …, AAABBAAABBAAA … and the like can be selected according to the required capacitance, impedance and inductance, and a flat plate hot press is adopted to carry out hot pressing at 100-150 ℃ for curing, and the curing reaction time and pressure are adjusted according to the type of the epoxy resin used.
By way of non-limiting example, reference is made to the examples of capacitive layers, inductive layers, and capacitive-inductive parallel dual function devices shown in fig. 1-5. The capacitor layer 1 shown in fig. 1 (a) is, for example, a square with a thickness of 120mm by 120mm, and the metal electrode 2 of the capacitor layer is formed by printing metal electrode paste on the upper surface of the capacitor layer to form a rectangle with a thickness of 120mm by 120mm, wherein the metal electrode 2 is aligned with the right edge and is 8mm different from the left edge of the upper surface of the capacitor layer. In fig. 1 (b), the lower surface of the capacitor layer 1 is formed into a rectangle 112mm by 120mm by metal electrode paste printing, and the metal electrode 2 is 8mm different from the right side edge of the lower surface of the capacitor layer and aligned with the left side edge. The capacitance layer metal electrode 2 has a large coverage area on the surface of the capacitance layer and a small aspect ratio. The multilayer capacitor layers 1 were laminated, and each capacitor layer had a thickness of 0.1mm and the electrode layer had a thickness of 0.03mm, referring to fig. 2. And a metal electrode 2 is arranged between each two capacitance layers, and the metal electrodes positioned on the upper and lower sides of each capacitance layer are aligned with the left side edge and the right side edge of the capacitance layer in a staggered way, so that series connection among multiple capacitance layers is formed.
The inductance layer 3 shown in fig. 3 is a square with a length of 120mm, a rectangular metal electrode 4 with a length of 40 mm x 120 x mm is formed in the middle, and the left and right sides (ends) of the metal electrode 4 are aligned with the two sides (ends) of the inductance layer, so that the length-width ratio is large. In another example, referring to fig. 4, the metal electrode 4 has a bent shape with a width of 20mm, an interval between adjacent bent portions of 8mm and a length of more than 120mm, so that the aspect ratio of the electrode is larger, and both ends (sides) are aligned with both ends (sides) of the inductance layer 3.
The stacked structure of the inductance layer and the electrode layer is shown as a capacitance-inductance parallel dual-function device in fig. 5, four layers of capacitance stacks are arranged at the lower part, four layers of inductance layers are arranged at the upper part, a layer of metal electrode is arranged between each layer to form a stacked structure of AAAABBBB …, only one side edge metal electrode of each layer of capacitance layer is exposed, two side edges metal electrode of each inductance layer are exposed to form a parallel circuit of capacitance and inductance, and the whole has resistance Rs.
The experimental methods described in the following examples are all conventional methods unless otherwise specified; the reagents and materials, unless otherwise specified, are commercially available.
Example 1
Ceramic slurry and soft magnetic metal slurry are respectively prepared:
the ceramic slurry adopts BaTiO as the main body 3 Powder, wherein the epoxy resin adopts E41 epoxy resin, the addition amount of the curing agent is 50 percent (epoxy resin: curing agent=1:1, the same applies below), the solvent adopts acetone solvent, the solid content is 40 percent, and the BaTiO is the same as the epoxy resin 3 And treeLipid 7: and 3, stirring in a planetary ball milling mode, wherein the ball-material ratio is 3:1, the rotating speed is 200rpm, and the time is 12 hours. The curing agent is the epoxy resin curing agent in the prior art, and the following is the same.
The main body of the soft magnetic metal paste adopts FeSiAl alloy amorphous powder with granularity of 5 mu m, the epoxy resin adopts E41 epoxy resin, the addition amount of a curing agent is 50%, the solvent adopts acetone solvent, the solid content is 40%, and the soft magnetic alloy powder and E418:2 are stirred by a stirrer at the stirring rotating speed of 60rpm for 12 hours.
Respectively casting the ceramic slurry and the soft magnetic alloy slurry by using a casting machine, wherein the thickness of a casting film is about 100 mu m, the length of a drying channel of the casting machine is 8m, the temperature of the drying channel is 60 ℃, and the speed of the casting machine is 1m/min; the knife edge gap of the casting machine is 350 mu m.
Cutting the dried dielectric ceramic film and soft magnetic metal film into small pieces, wherein each small piece comprises a plurality of capacitors and inductors, each capacitor and each inductor are respectively subjected to screen printing, and two (upper surface or lower surface) metal electrodes of the dielectric ceramic film are respectively staggered by 0.2mm (opposite side edges). The metal electrodes with two side edges aligned are formed in the middle of the soft magnetic metal film. The printing electrode adopts a low-temperature metal electrode to carry out screen printing, the screen mesh number is 300 meshes, the baking temperature is 60 ℃, and the baking time is 5min.
Laminating and hot-pressing the dielectric ceramic film (with electrode layer on upper or lower surface) and soft magnetic alloy film in parallel in a flat plate hot press at 150 deg.C and 6t.
Cutting the laminated and pressed multilayer film to obtain a plurality of capacitance-inductance parallel dual-function devices, polishing end electrodes, plating copper on the end electrodes to obtain the capacitance-inductance dual-function devices, and measuring 20.72 mu F@100kHz, 222.25mΩ@100kHz and 10nH@100kHz of capacitance after device testing.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.
Claims (9)
1. A capacitive-inductive dual function device, characterized by: the capacitance-inductance dual-function device comprises a plurality of capacitance layers, a plurality of inductance layers, a metal electrode and an end electrode, wherein a circuit correspondingly formed is formed by connecting a capacitance and an inductance in parallel and has preset impedance; laminating a plurality of capacitance layers and a plurality of inductors to form a laminated structure; the metal electrodes are printed on the capacitance layer and the inductance layer; and forming the terminal electrodes on two sides of the laminated layer formed by pressing the capacitor layers and the inductor layers.
2. The capacitive-inductive dual-function device of claim 1, wherein: the capacitance-inductance dual-function device is a miniature low-power energy storage device.
3. The capacitive-inductive dual-function device of claim 1, wherein: the metal electrode on the inductance layer penetrates through two sides of the device and is exposed out of the device, and the metal electrode on the capacitance layer is exposed on one side at each side of the device.
4. A capacitive-inductive dual function device as claimed in claim 3, characterized in that: the upper and lower metal electrodes of each capacitor layer of the multi-layer capacitor layer extend respectively and are exposed at different sides of the capacitor layer, and the staggered edges are exposed; each capacitor layer is printed with a metal electrode on one side; the difference between the metal electrode and the edge of the capacitance layer is 0.2-8mm at one side of the capacitance layer where the metal electrode does not leak out of the device.
5. The capacitive-inductive dual-function device of claim 1, wherein: the thickness of the capacitance layer is 0.03-0.5mm; the thickness of the inductance layer is 0.03-0.5mm; the shape of the capacitance layer and the inductance layer are matched; the metal electrode is an adhesion thin layer formed by printing metal slurry on the surface of the capacitance layer or the inductance layer; the capacitance-inductance dual-function device is a miniature low-power energy storage device.
6. The capacitive-inductive dual-function device of claim 1, wherein: the metal electrode on the inductance layer is communicated with the two sides of the inductance layer along a straight line or in a bending and winding way; the coverage area of the metal electrode on the capacitance layer is relatively large, one side of the metal electrode extends to one side of the capacitance layer to be exposed, and the other side of the metal electrode is different from the edge of the other side of the capacitance layer by a preset distance.
7. The capacitive-inductive dual-function device of claim 1, wherein: according to the capacitance principle of the capacitance device, the metal electrode on the capacitance layer is arranged so that the coverage area on the capacitance layer is equivalent to the effective area of the capacitance layer material; according to the inductance principle of the inductance layer, the metal electrode on the inductance layer is arranged so that the coverage area on the inductance layer is smaller than the effective area of the inductance layer material.
8. The capacitive-inductive dual-function device of claim 1, wherein: the metal electrode is a low-temperature electrode, and is solidified at low temperature to form an electrode; the metal electrode is an electrode formed by printing one of silver-palladium slurry, cu slurry and Ni slurry; and polishing two sides of the laminated device formed by laminating the capacitor layers and the inductor layers to expose the metal electrode so as to form a terminal electrode.
9. The capacitive-inductive dual-function device of claim 1, wherein: and a silver plating layer is formed on the terminal electrode.
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