CN219016506U

CN219016506U - Spherical packaged chip detection device

Info

Publication number: CN219016506U
Application number: CN202223407431.9U
Authority: CN
Inventors: 缪华秋
Original assignee: Suzhou Jinggong Machinery Technology Co ltd
Current assignee: Suzhou Jinggong Machinery Technology Co ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-05-12
Anticipated expiration: 2032-12-16

Abstract

The application relates to the technical field of chip detection, in particular to a spherical packaging chip detection device, which comprises a fixing plate; a plurality of cavities are formed in the fixing plate, and each cavity corresponds to the position of the spherical pin at the bottom of the packaged chip one by one; a rectangular cavity communicated with the cavity is further formed in the fixing plate, and a conductive block is arranged in the rectangular cavity and is in contact with a corresponding pin of the PCB; a conductive liquid is arranged in the cavity; and a sphere is also arranged in the cavity in a floating way, and the packaged chip is pressed to enable the spherical pins to be in contact with the sphere. The chip is difficult to damage, abrasion is reduced, and service life is prolonged.

Description

Spherical packaged chip detection device

Technical Field

The application relates to the technical field of chip detection, in particular to a spherical packaging chip detection device.

Background

Chips refer to silicon wafers containing integrated circuits therein, often used as part of computers or other devices, as carriers for integrated circuits; with the development of integrated circuit technology, the packaging requirements for integrated circuits are more stringent; the ball-shaped pin grid array packaging technology is a high-density surface assembly packaging technology, pins are distributed in a ball-shaped array at the bottom of the package, and the packaging technology is mostly adopted by a main board control chip set at present; since the chip packaging technology relates to the function of the product, the chip packaging technology needs to be tested after packaging the chip so as to meet the use requirement.

At present, the spherical packaging chip is detected by using an elastic probe, the probe is fixed by placing two layers of needle plates at the bottom of the chip, one end of the probe is contacted with the PCB, and the other end of the probe is connected with the contact point of the chip, so that an electrifying path is formed for detection.

In view of the above related art, the inventor considers that it is necessary to develop a ball-shaped packaged chip detection device, which is not easy to damage a chip, reduces abrasion, and improves service life.

Disclosure of Invention

In order to solve the technical problem, the application provides a spherical packaged chip detection device which has the advantages of being difficult to damage a chip, reducing abrasion and prolonging service life.

In order to achieve the above purpose, the technical scheme of the utility model is as follows: ball-shaped package chip detection device, it includes:

a fixing plate;

a plurality of cavities are formed in the fixing plate, and each cavity corresponds to the position of the spherical pin at the bottom of the packaged chip one by one;

a rectangular cavity communicated with the cavity is further formed in the fixing plate, and a conductive block is arranged in the rectangular cavity and is in contact with a corresponding pin of the PCB;

a conductive liquid is arranged in the cavity; and a sphere is also arranged in the cavity in a floating way, and the packaged chip is pressed to enable the spherical pins to be in contact with the sphere.

According to the technical scheme, the traditional method for detecting the contact between the needle head and the spherical pin at the bottom of the packaging chip by conducting the probe and the PCB is changed into the method for detecting the contact between the ball body and the spherical pin at the bottom of the packaging chip by arranging the ball body, wherein the ball body is arranged in liquid with a conducting function in a floating mode, the liquid is communicated with a conducting block, the conducting block is electrified in contact with the corresponding pin of the PCB, the spherical pin at the bottom of the packaging chip is contacted with the ball body by pressing the packaging chip, and the ball body and the spherical pin at the bottom of the packaging chip are large in contact area, so that the packaging chip is not easy to damage, abrasion is reduced, service life is prolonged, the spherical surface is an arc-shaped surface, the contact surface with the spherical pin at the bottom of the packaging chip is wider, and detection is more accurate.

As a preferable scheme of the application, the conducting block is in threaded connection in the rectangular cavity, and a sealing piece is arranged between the conducting block and the cavity.

The technical scheme is realized, and the sealing piece is arranged to enhance the sealing performance, so that the connection between the conductive block and the cavity is tighter, and the leakage of liquid in the cavity is avoided.

As a preferred aspect of the present application, the sealing member includes a sealing ring disposed on the conductive block and surrounding the bottom of the cavity.

The sealing ring has the advantages that the technical scheme is realized, the sealing ring is high in corrosion resistance and not easy to age, is convenient to maintain, has good sealing performance and the effect of preventing liquid leakage in a certain temperature range under the working pressure, and can automatically improve the sealing performance along with the increase of the pressure.

As a preferred scheme of this application, still include the base, offer the spacing hole with cavity position one-to-one on the base, spacing hole supplies spherical pin to pass and contact with the spheroid.

As a preferred scheme of this application, the standing groove that is used for placing the base has been seted up at the fixed plate top, be provided with the spring with the base butt in the standing groove, the screw thread is provided with the bolt that is located the standing groove edge on the fixed plate, screws the bolt makes the head compress tightly the position that the base is used for prescribing a limit to the base.

According to the technical scheme, the base is supported to a certain height through the jacking force of the spring, then the bolts are screwed to the same height to limit the position of the base, and the spherical pins at the bottoms of the packaged chips with different depths are kept at a certain initial distance from the sphere by adjusting the position height of the base.

As a preferred scheme of this application, still include the direction subassembly, the direction subassembly is including setting up the guide post in the standing groove, still includes the guiding hole of setting on the base, the guide post corresponds the setting with the guiding hole.

Realize above-mentioned technical scheme, set up the effect of direction subassembly and make the guide post and the cooperation of direction Kong Jingzhun, make the base fix a position fast and be connected with the standing groove is stable.

As a preferred scheme of this application, still include and stop the subassembly, stop the subassembly and stop the seat including setting up the stop in the standing groove, still including setting up the stop hole on the base, stop the seat and stop the hole and correspond the setting.

According to the technical scheme, when the base descends to the lowest height, the height of the base from the placing groove is controlled through the stopping seat, so that the spherical pins at the bottom of the packaged chip placed on the base are at a certain initial distance from the sphere, the spherical pins are prevented from directly touching the sphere, and the detection is inaccurate.

As a preferred scheme of this application, the bottom of fixed plate can be dismantled and be connected with the bottom plate, be provided with the PCB board of being connected with the conducting block on the bottom plate.

The technical scheme is realized, the PCB is a supporting body of the electronic components, is a carrier for electrically connecting the electronic components with each other, and is connected with the conductive block to form a circuit.

In summary, the beneficial technical effects of the present application are: through injecting conductive liquid in the cavity to and float in the cavity and set up the spheroid, it is electrically conductive with the pin contact of PCB board through the conducting block, press the spherical pin of encapsulation chip messenger bottom and spheroid contact and detect, because the sphere is big and the sphere is convex with encapsulation chip contact with the area of contact of encapsulation chip, be difficult to cause the damage to encapsulation chip, reduce wearing and tearing, improved life.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of a ball-packaged chip inspection device;

FIG. 2 is an exploded view of a ball-packaged chip inspection device;

FIG. 3 is a cross-sectional view of a ball-packaged chip inspection device;

FIG. 4 is an enlarged view at A in FIG. 3;

reference numerals: 1. a fixing plate; 2. a cavity; 3. a rectangular cavity; 4. a liquid; 5. a conductive block; 6. a sphere; 7. a seal ring; 8. a base; 9. a limiting hole; 10. a placement groove; 11. a spring; 12. a guide assembly; 121. a guide post; 122. a guide hole; 13. stopping seat; 14. a bottom plate; 15. a PCB board; 16. and (5) a bolt.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-4.

Referring to fig. 1 and fig. 2, for the spherical packaged chip detection device disclosed in this application embodiment, including fixed plate 1, standing groove 10 has been seted up at the top of fixed plate 1, is provided with base 8 in the standing groove 10, and standing groove 10 and base 8 are octagon design, and packaged chip places on base 8, has seted up the spacing hole 9 that the spherical pin that supplies packaged chip bottom passed on the base 8, has seted up a plurality of cavitys 2 in fixed plate 1, and cavity 2 and the position one-to-one in spacing hole 9.

Referring to fig. 2 and 3, a conductive liquid 4 is disposed in the cavity 2, a ball 6 disposed above the liquid 4 is disposed in the cavity 2, the ball pins at the bottom of the packaged chip are pressed to pass through the limiting holes 9 and contact with the ball 6 for detection, the diameter of the ball 6 is smaller than the inner diameter of the cavity 2, in an initial state, the ball 6 is in a floating state on the liquid 4 due to the floating force of the liquid 4, and in an initial state, the ball 6 contacts with the inner wall of the cavity 2 when floating upwards, so that the tightness is enhanced, and evaporation of the liquid 4 is effectively avoided.

Referring to fig. 3 and 4, a rectangular cavity 3 communicating with the cavity 2 is further provided in the fixing plate 1, a conductive block 5 is provided in the rectangular cavity 3, in this embodiment, a material of the conductive block 5 includes silver, copper or a metal semiconductor material, but is not limited thereto, a bottom plate 14 is detachably connected to a bottom of the fixing plate 1, a PCB board 15 is provided on the bottom plate 14, the PCB board 15 is connected with the conductive block 5 to form a circuit, and when the package chip is pressed to make a ball pin at the bottom contact with the ball 6, a detection operation can be performed on the package chip. The conducting block 5 is in threaded connection in the rectangular cavity 3, the conducting block 5 can be screwed out to replace the liquid 4 in the cavity 2 and the ball 6 is taken out, a sealing piece is arranged between the conducting block 5 and the cavity 2, the sealing piece comprises a sealing ring 7 arranged on the conducting block 5 and encircling the bottom of the cavity 2, the sealing effect is enhanced, and leakage of the liquid 4 in the cavity 2 is prevented.

Referring to fig. 2, a placement groove 10 for placing the base 8 is formed in the top of the fixing plate 1, springs 11 are arranged in the placement groove 10, the springs 11 are symmetrically arranged in the placement groove 10 in pairs and respectively abut against the base 8, the fixing plate further comprises bolts 16 arranged on the fixing plate 1, the bolts 16 are distributed at the edge of the placement groove 10 at equal distances, the position of the base 8 can be adjusted under the cooperation of the springs 11 and the bolts 16, the base 8 is supported to a certain height through the jacking force of the four springs 11, and the four bolts 16 are screwed to the same height to limit the position of the base 8 and are used for adjusting the initial distance between the packaged chip and the ball 6.

Referring to fig. 2, the fixing plate 1 is further provided with a guide assembly 12, the base 8 can be quickly installed in the fixing plate 1, the guide assembly 12 comprises a guide post 121 arranged in the placing groove 10 and a guide hole 122 formed in the base 8 and corresponding to the guide post 121, the fixing plate further comprises a stopping assembly, the stopping assembly comprises a stopping seat 13 arranged in the placing groove 10 and a stopping hole formed in the base 8 and corresponding to the stopping seat 13, the stopping seat 13 is matched with the stopping hole, the height of the base 8 from the placing groove 10 is controlled, and the initial distance between a spherical pin and a sphere of a packaged chip is limited.

The implementation principle of the spherical packaging chip detection device in the embodiment of the application is as follows: through setting up cavity 2 in fixed plate 1, pour into electrically conductive liquid 4 in cavity 2 and float and set up spheroid 6 in cavity 2, under the initial condition, spheroid 6 is the state of floating, through the cooperation of spring 11 and bolt 16, inject the position of base 8, adjust the initial distance between encapsulation chip and the spheroid 6, press the spherical pin of encapsulation chip messenger's bottom and spheroid 6 contact, the circular telegram is connected to the PCB board 15 on rethread conducting block 5 and bottom plate 14 and is detected the encapsulation chip, detect the mode in this embodiment uses spheroid 6 to detect the encapsulation chip, because sphere surface and spherical pin area are great and the sphere is convex, be difficult for causing the damage to the encapsulation chip, wear has been reduced, and a service life has been improved, thereby when having solved among the traditional detection mode with the probe needle head detection, because the needle head of probe is more sharp-pointed, when contacting with the pin of chip, in addition, the extrusion under external force, the area of probe is little, also receive easily and cause the contact failure, lead to the problem of low precision is detected.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. Ball encapsulation chip detection device, its characterized in that: comprising the following steps:

a fixed plate (1);

a plurality of cavities (2) are formed in the fixing plate (1), and each cavity (2) corresponds to the positions of the spherical pins at the bottom of the packaged chip one by one;

a rectangular cavity (3) communicated with the cavity (2) is further formed in the fixed plate (1), a conductive block (5) is arranged in the rectangular cavity (3), and the conductive block (5) is in contact with corresponding pins of the PCB (15);

a conductive liquid (4) is arranged in the cavity (2); a sphere (6) is also arranged in the cavity (2) in a floating way, and the packaging chip is pressed to enable the spherical pins to be in contact with the sphere (6).

2. The ball-packaged chip testing device according to claim 1, wherein: the conducting block (5) is in threaded connection in the rectangular cavity (3), and a sealing piece is arranged between the conducting block (5) and the cavity (2).

3. The ball-packaged chip testing device according to claim 2, wherein: the sealing element comprises a sealing ring (7) which is arranged on the conductive block (5) and surrounds the bottom of the cavity.

4. The ball-packaged chip testing device according to claim 1, wherein: the ball-shaped pin socket further comprises a base (8), wherein limiting holes (9) corresponding to the positions of the cavities (2) one by one are formed in the base (8), and the limiting holes (9) are used for the ball-shaped pins to penetrate through to contact with the balls (6).

5. The ball-packaged chip testing device according to claim 1, wherein: the top of the fixed plate (1) is provided with a placing groove (10) for placing the base (8), a spring (11) which is abutted to the base (8) is arranged in the placing groove (10), the fixed plate (1) is provided with a bolt (16) positioned at the edge of the placing groove (10) in a threaded manner, and the head of the bolt (16) is tightly pressed on the base (8) to limit the position of the base (8).

6. The ball-packaged chip test device according to claim 5, wherein: the novel guide assembly comprises a base, and is characterized by further comprising a guide assembly (12), wherein the guide assembly (12) comprises a guide column (121) arranged in the placing groove (10), and further comprises a guide hole (122) arranged on the base, and the guide column (121) and the guide hole (122) are correspondingly arranged.

7. The ball-packaged chip test device according to claim 5, wherein: the automatic stop device is characterized by further comprising a stop assembly, the stop assembly comprises a stop seat (13) arranged in the placing groove (10), and a stop hole arranged on the base (8), and the stop seat (13) and the stop hole are correspondingly arranged.

8. The ball-packaged chip testing device according to claim 1, wherein: the bottom of the fixed plate (1) is detachably connected with a bottom plate (14), and the PCB (15) is arranged on the bottom plate (14).