CN219004936U

CN219004936U - Silicon wafer dicing machine with cleaning function

Info

Publication number: CN219004936U
Application number: CN202223481529.9U
Authority: CN
Inventors: 刘广
Original assignee: Zhuhai Lailian Photoelectricity Technology Co ltd
Current assignee: Zhuhai Lailian Photoelectricity Technology Co ltd
Priority date: 2022-12-24
Filing date: 2022-12-24
Publication date: 2023-05-12
Anticipated expiration: 2032-12-24

Abstract

The utility model discloses a silicon wafer dicing saw with a cleaning function, which comprises: the device comprises a scribing cabinet, an electric slide rail assembly, a supporting table and a laser; the electric slide rail assembly is connected in the scribing cabinet, the scribing cabinet is used as a bearing foundation, a supporting table is connected above the electric slide rail assembly, a laser is arranged above the supporting table, and the laser is arranged above the inside of the scribing cabinet. This silicon chip scribing machine of function is cleaned in area drives diaphragm downwardly moving through the telescopic link, makes sponge bottom surface and silicon chip surface parallel and level, then starts micro motor, drives the sponge and sweeps the silicon chip surface, can get off the broken bits clearance on silicon chip surface, through inserting two sets of L type picture peg inside the T type butt joint groove after, manual anticlockwise rotatory handle, can make two sets of L type picture peg remove to T type butt joint inslot portion both sides simultaneously, support in T type butt joint inslot to install the laser instrument in the inside top of scribing rack, during the dismantlement, clockwise rotation handle can, the installation is dismantled all more conveniently.

Description

Silicon wafer dicing machine with cleaning function

Technical Field

The utility model relates to the technical field of silicon wafer dicing machines, in particular to a silicon wafer dicing machine with a cleaning function.

Background

The silicon wafer dicing machine is used for cutting and dicing solar panels and thin metal sheets and comprises a grinding wheel dicing machine and a laser dicing machine, and the grinding wheel dicing machine has rough cutting surfaces and is easy to stretch off the cutting surfaces in the working process, so that most of the silicon wafer dicing machines can select the laser dicing machine under the condition of sufficient budget, and certain defects exist in the use of the existing laser silicon wafer dicing machine, such as;

the laser type silicon wafer dicing saw is different from the grinding wheel type silicon wafer dicing saw in that laser dicing refers to full cutting processing and grooving processing modes of sublimating and evaporating solids by focusing laser energy on a tiny area in extremely short time, belongs to the laser ablation processing technology, and belongs to non-contact processing without edge chipping, cutter abrasion and water pollution.

Disclosure of Invention

The utility model aims to provide a silicon wafer dicing saw with a cleaning function, which aims to solve the problems that after a silicon wafer is processed by a laser type silicon wafer dicing saw in the market, which is proposed by the background technology, the silicon wafer needs to be taken down and cleaned again, so that the production efficiency is reduced.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a silicon wafer dicing machine with cleaning function comprises: the device comprises a scribing cabinet, an electric slide rail assembly, a supporting table and a laser;

the electric slide rail assembly is connected in the scribing cabinet, the scribing cabinet is used as a bearing foundation, a supporting table is connected above the electric slide rail assembly, a laser is arranged above the supporting table, and the laser is arranged above the inside of the scribing cabinet.

Preferably, a T-shaped groove is formed in the supporting platform, a T-shaped plate is connected in a clamping mode in the T-shaped groove, a threaded rod is connected to the top end of the T-shaped plate, and a hexagonal nut is connected to the threaded rod in a threaded mode.

Preferably, the inside top of scribing rack is connected with the protection frame, the inside one side of protection frame is connected with the U type pole, sliding connection has the guide holder on the U type pole, guide holder one side is connected with the push pedal, the push pedal sets up in the protection frame.

Preferably, the push plate top is connected with micro motor, and micro motor has self-locking mechanism, and when stopping, unable rotation, micro motor output is connected with the gear, the meshing of gear top is connected with the pinion rack, pinion rack fixed connection is in the inside top of scribing rack.

Preferably, a penetrating plate is connected below the push plate, one end of the penetrating plate penetrates through a through groove to be connected with a telescopic rod, and the through groove is formed in the lower part inside the protective frame;

the transverse plate is connected to the tail end of the telescopic rod, and a sponge is connected below the transverse plate.

Preferably, the top end of the laser is connected with a square frame, one side of the inside of the square frame is connected with a bearing, a rotating shaft is connected in the bearing, one end of the rotating shaft is connected with a bidirectional threaded rod, the bidirectional threaded rod is rotationally connected in a supporting seat, and the supporting seat is connected on the bottom surface of the inside of the square frame.

Preferably, the two-way threaded rod is connected with a linkage plate in a threaded manner, one end of the linkage plate is connected with a sliding block, the sliding block is slidably connected in a sliding rail, and the sliding rail is connected to the inner wall of the rectangular frame.

Preferably, an L-shaped plugboard is connected above the linkage plate, the L-shaped plugboard is connected in a T-shaped butt joint groove in a clamping way, and the T-shaped butt joint groove is formed above the inside of the scribing cabinet;

the handle is connected with the other end of the rotating shaft.

Compared with the prior art, the utility model has the beneficial effects that: this silicon chip scribing machine of function is cleaned in area drives diaphragm downwardly moving through the telescopic link, makes sponge bottom surface and silicon chip surface parallel and level, then starts micro motor, drives the sponge and sweeps the silicon chip surface, can get off the broken bits clearance on silicon chip surface, insert T type butt joint inslot portion with two sets of L type picture peg later through two sets of L type picture peg, can make two sets of L type picture peg remove to T type butt joint inslot portion both sides simultaneously, support in T type butt joint inslot to install the laser instrument in the inside top of scribing rack, during the dismantlement, clockwise rotation handle can, the installation is dismantled all more conveniently, specific content is as follows:

1. after scribing is completed, a telescopic rod is started, the telescopic rod drives a transverse plate to move downwards, so that the height of the bottom surface of a sponge is equal to the horizontal height of a silicon wafer, then a micro motor is started, a push plate is driven to move along a protective frame, the sponge is made to sweep the upper surface of the silicon wafer, and broken slag on the upper surface of the silicon wafer is cleaned, so that the broken slag can be cleaned conveniently, and the production efficiency can be improved effectively;

2. the two groups of L-shaped plugboards are inserted into the T-shaped butt joint groove, then, the handle is rotated anticlockwise, the two groups of L-shaped plugboards simultaneously move towards the T-shaped butt joint groove until the L-shaped plugboards are propped against the inner side wall of the T-shaped butt joint groove, so that the laser is arranged above the inside of the scribing cabinet, when the laser is required to be disassembled, the handle is rotated clockwise, and compared with the traditional screw mounting mode, the mounting and the dismounting are more convenient.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of a pallet according to the present utility model;

FIG. 3 is a schematic view of a rectangular frame structure according to the present utility model;

FIG. 4 is an enlarged view of the structure of the portion A of the present utility model;

fig. 5 is an enlarged view of the structure of the portion B of the present utility model.

In the figure: 1. dicing the cabinet; 2. an electric slide rail assembly; 3. a support; 4. a laser; 5. a T-shaped groove; 6. t-shaped plates; 7. a threaded rod; 8. a hexagonal nut; 9. a protective frame; 10. a U-shaped rod; 11. a guide seat; 12. a push plate; 13. a micro motor; 14. a gear; 15. a toothed plate; 16. penetrating the board; 17. a through groove; 18. a telescopic rod; 19. a cross plate; 20. a sponge; 21. a square frame; 22. a bearing; 23. a rotating shaft; 24. a two-way threaded rod; 25. a support base; 26. a linkage plate; 27. a slide block; 28. a slide rail; 29. an L-shaped plugboard; 30. a T-shaped butt joint groove; 31. a handle.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: a silicon wafer dicing machine with cleaning function comprises: the device comprises a scribing cabinet 1, an electric slide rail assembly 2, a supporting table 3 and a laser 4;

the scribing cabinet 1 is connected with electronic slide rail assembly 2 in, and scribing cabinet 1 is as bearing the weight of basis, and electronic slide rail assembly 2 top is connected with saddle 3, and saddle 3 top is provided with laser instrument 4, and laser instrument 4 sets up in the inside top of scribing cabinet 1.

T-shaped grooves 5 are formed in the supporting table 3, T-shaped plates 6 are connected in the T-shaped grooves 5 in a clamping mode, threaded rods 7 are connected to the top ends of the T-shaped plates 6, hexagonal nuts 8 are connected to the threaded rods 7 in a threaded mode, the threaded rods 7 are pushed to move through unscrewing the hexagonal nuts 8, the threaded rods 7 are abutted to one side of a silicon wafer, and then the hexagonal nuts 8 are locked again to fasten the silicon wafer.

The inside top of scribing rack 1 is connected with protection frame 9, and protection frame 9 inside one side is connected with U type pole 10, and sliding connection has guide holder 11 on the U type pole 10, and guide holder 11 one side is connected with push pedal 12, and push pedal 12 sets up in protection frame 9, can carry out spacingly to push pedal 12 through U type pole 10 and guide holder 11 of both sides, prevents that push pedal 12 from being released protection frame 9.

The miniature motor 13 is connected to the push pedal 12 top, and miniature motor 13 has self-locking mechanism, when stopping, unable rotation, miniature motor 13 output is connected with gear 14, gear 14 top meshing is connected with pinion rack 15, pinion rack 15 fixed connection is in the inside top of scribing rack 1, drive diaphragm 19 through telescopic link 18 and move downwards, make sponge 20 bottom surface and silicon chip surface parallel and level, then start miniature motor 13, miniature motor 13 drives gear 14 rotatory, remove along pinion rack 15, and then drive push pedal 12 and remove, push pedal 12 drives sponge 20 and sweeps the silicon chip surface, can clear up the broken bits on silicon chip surface.

The push pedal 12 below is connected with the cross plate 16, and cross plate 16 one end is passed through logical groove 17 and is connected with telescopic link 18, and logical groove 17 is seted up in the inside below of protection frame 9, and diaphragm 19 connects at telescopic link 18 end, and diaphragm 19 below is connected with sponge 20, and sponge 20 is softer, when the silicon chip is swept, can not scratch the silicon chip surface.

The top end of the laser 4 is connected with a square frame 21, one side of the inside of the square frame 21 is connected with a bearing 22, a rotating shaft 23 is connected in the bearing 22, one end of the rotating shaft 23 is connected with a bidirectional threaded rod 24, the bidirectional threaded rod 24 is rotatably connected in a supporting seat 25, the supporting seat 25 is connected on the bottom surface of the inside of the square frame 21, after two groups of L-shaped plugboards 29 are inserted into a T-shaped butt joint groove 30, the handle 31 is manually rotated anticlockwise, so that the two groups of L-shaped plugboards 29 can simultaneously move towards two sides of the inside of the T-shaped butt joint groove 30 and abut against the inside of the T-shaped butt joint groove 30, and therefore the laser 4 is installed above the inside of the scribing cabinet 1, and when the laser is disassembled, the handle 31 is rotated clockwise, and the laser is convenient to install and disassemble.

The two-way threaded rod 24 is connected with a linkage plate 26 in a threaded manner, one end of the linkage plate 26 is connected with a sliding block 27, the sliding block 27 is slidably connected in a sliding rail 28, the sliding rail 28 is connected to the inner wall of the rectangular frame 21, and the linkage plate 26 is limited, so that the linkage plate 26 cannot rotate along with the rotation of the two-way threaded rod 24. The linkage plate 26 top is connected with L type picture peg 29, and L type picture peg 29 block is connected in T type butt joint groove 30, and T type butt joint groove 30 is seted up in the inside top of scribing rack 1, and handle 31 connects at the pivot 23 other end, through rotatory outside handle 31, can drive the rotation of inside two-way threaded rod 24 to can control the removal of two sets of L type picture pegs 29.

Working principle: as shown in fig. 1-5, when the silicon wafer dicing saw with cleaning function is used, a simple understanding is made on the device, firstly, two groups of L-shaped plugboards 29 are inserted into the T-shaped butting grooves 30, then, the handle 31 is rotated anticlockwise, the handle 31 drives the bidirectional threaded rod 24 to rotate through the rotating shaft 23, and because the bidirectional threaded rod 24 is in threaded connection with the two groups of linkage plates 26, and the two groups of linkage plates 26 are in sliding connection with the sliding rail 28 through the sliding blocks 27 at the respective end parts, when the bidirectional threaded rod 24 rotates anticlockwise, the two groups of linkage plates 26 move towards both sides of the rectangular frame 21 at the same time, and then, the two groups of L-shaped plugboards 29 are driven to move towards the inner grooves of the T-shaped butting grooves 30 at the same time until the L-shaped plugboards 29 are abutted against the inner side walls of the T-shaped butting grooves 30, so that the laser 4 is arranged above the inside of the dicing cabinet 1, and when disassembly is required, the handle 31 is rotated clockwise, compared with the traditional screw mounting mode, the mounting and dismounting are more convenient, secondly, a silicon wafer is placed on the supporting table 3, then the hexagonal nut 8 is unscrewed, the threaded rods 7 on two sides are pushed along the T-shaped grooves 5, the threaded rods 7 are propped against two sides of the silicon wafer, then the hexagonal nut 8 is locked again to clamp the silicon wafer, after the clamping is completed, the electric slide rail assembly 2 and the laser 4 are started, the electric slide rail assembly 2 drives the silicon wafer to move according to a preset program, in the moving process, the laser 4 etches the surface of the silicon wafer, after the dicing is completed, the telescopic rod 18 is started, the telescopic rod 18 drives the transverse plate 19 to move downwards, the height of the bottom surface of the sponge 20 is equal to the horizontal height of the upper surface of the silicon wafer, then the micro motor 13 is started, the micro motor 13 drives the gear 14 to rotate and simultaneously moves along the toothed plate 15, and then the push plate 12 is driven to move along the protection frame 9, the sponge 20 is made to sweep the upper surface of the silicon wafer, and the slag on the upper surface of the silicon wafer is cleaned, so that the slag is cleaned conveniently, the production efficiency can be effectively improved, and the content which is not described in detail in the specification belongs to the prior art which is known to the person skilled in the art.

Although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. A silicon wafer dicing machine with cleaning function comprises: the device is characterized by comprising a scribing cabinet (1), an electric slide rail assembly (2), a supporting table (3) and a laser (4);

the novel scribing machine is characterized in that an electric sliding rail assembly (2) is connected in the scribing machine cabinet (1), a supporting table (3) is connected above the electric sliding rail assembly (2), a laser (4) is arranged above the supporting table (3), and the laser (4) is arranged above the inside of the scribing machine cabinet (1).

2. The silicon wafer dicing saw with cleaning function according to claim 1, wherein: t-shaped grooves (5) are formed in the supporting table (3), T-shaped plates (6) are connected in the T-shaped grooves (5) in a clamping mode, threaded rods (7) are connected to the tops of the T-shaped plates (6), and hexagonal nuts (8) are connected to the threaded rods (7) in a threaded mode.

3. The silicon wafer dicing saw with cleaning function according to claim 1, wherein: the utility model discloses a wafer dicing machine, including wafer dicing rack, protection frame (9) are connected with to the inside top of wafer dicing rack (1), protection frame (9) inside one side is connected with U type pole (10), sliding connection has guide holder (11) on U type pole (10), guide holder (11) one side is connected with push pedal (12), push pedal (12) set up in protection frame (9).

4. A silicon wafer dicing saw with cleaning function according to claim 3, wherein: the micro-motor (13) is connected to the upper portion of the push plate (12), a gear (14) is connected to the output end of the micro-motor (13), a toothed plate (15) is connected to the upper portion of the gear (14) in a meshed mode, and the toothed plate (15) is fixedly connected to the upper portion inside the scribing cabinet (1).

5. A silicon wafer dicing saw with cleaning function according to claim 3, wherein: a penetrating plate (16) is connected below the push plate (12), one end of the penetrating plate (16) penetrates through a through groove (17) to be connected with a telescopic rod (18), and the through groove (17) is arranged below the inside of the protective frame (9);

the transverse plate (19) is connected to the tail end of the telescopic rod (18), and a sponge (20) is connected below the transverse plate (19).

6. The silicon wafer dicing saw with cleaning function according to claim 1, wherein: the laser device is characterized in that the top end of the laser device (4) is connected with a square frame (21), one side inside the square frame (21) is connected with a bearing (22), a rotating shaft (23) is connected in the bearing (22), one end of the rotating shaft (23) is connected with a bidirectional threaded rod (24), the bidirectional threaded rod (24) is rotationally connected in a supporting seat (25), and the supporting seat (25) is connected to the bottom surface inside the square frame (21).

7. The silicon wafer dicing saw with cleaning function according to claim 6, wherein: the bidirectional threaded rod (24) is connected with a linkage plate (26) in a threaded mode, one end of the linkage plate (26) is connected with a sliding block (27), the sliding block (27) is connected in a sliding rail (28) in a sliding mode, and the sliding rail (28) is connected to the inner wall of the square frame (21).

8. The silicon wafer dicing saw with cleaning function according to claim 7, wherein: an L-shaped plugboard (29) is connected above the linkage plate (26), the L-shaped plugboard (29) is connected in a T-shaped butt joint groove (30) in a clamping mode, and the T-shaped butt joint groove (30) is formed in the upper portion inside the scribing cabinet (1); a handle (31) connected to the other end of the rotating shaft (23).