CN218997640U - Consumption-free laminating type high-heat-dissipation bus duct - Google Patents
Consumption-free laminating type high-heat-dissipation bus duct Download PDFInfo
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- CN218997640U CN218997640U CN202221897851.7U CN202221897851U CN218997640U CN 218997640 U CN218997640 U CN 218997640U CN 202221897851 U CN202221897851 U CN 202221897851U CN 218997640 U CN218997640 U CN 218997640U
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- bus duct
- heat
- air inlet
- plate
- air
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a non-consumption type laminating high-heat-dissipation bus duct; the heat-dissipation device comprises a bus duct, wherein a bonding plate is arranged at the heat-dissipation end of the bus duct, air inlet grooves capable of changing air speed are symmetrically arranged at the air inlet end of the surface of the bonding plate, a plurality of air inlets are linearly arranged in a whole row on the air inlet grooves, a heat-conducting plate is arranged in the bonding plate, the bus duct is arranged on the surface of the heat-conducting plate, fins are symmetrically arranged on the surface of the bonding plate, extra electric energy consumption is not needed as a whole, the whole can be powered in a relatively stable state through a triple heat-dissipation method, and the whole service life is greatly prolonged.
Description
Technical Field
The utility model relates to the technical field of bus duct equipment, in particular to a non-consumption type laminating type high-heat-dissipation bus duct.
Background
The bus duct is a closed metal device composed of copper and aluminum bus columns and is used for distributing larger power for each element of the dispersion system. Increasingly, wires and cables have been replaced in the field of low-voltage indoor power transmission mains engineering.
The utility model discloses a compact bus duct, which comprises an aluminum alloy left side plate and an aluminum alloy right side plate, wherein a conductive row is arranged in a groove cavity formed by the inner sides of the aluminum alloy left side plate and the aluminum alloy right side plate, two groups of conductive bus bars are arranged at two ends of the conductive row, an aluminum alloy upper cover plate is fixed at the top of the aluminum alloy left side plate and the aluminum alloy right side plate through upper cover plate rivets, and an aluminum alloy lower cover plate is fixed at the top of the aluminum alloy left side plate and the aluminum alloy right side plate through lower cover plate rivets. The utility model has compact and beautiful appearance, small volume, space saving, strong corrosion resistance, high mechanical degree, capability of meeting the requirement of large-span installation, good tightness, suitability for any severe installation place, low bus temperature rise, small energy consumption and strong current carrying capacity.
The compact bus duct has the following defects when in use: 1. when the bus duct is used, the whole bus duct is compact in internal structure, and only depends on the aluminum alloy left side plate and the aluminum alloy right side plate to radiate outwards, so that the phase heat is slowly radiated, the bus duct is used for a long time, the heat radiation and the heat generation do not form a direct proportion, the heat can directly act on the conductive bars, the whole service life can be prolonged, and therefore, the bus duct with strong self heat radiation capacity is needed.
Disclosure of Invention
The utility model aims to provide a non-consumption type laminating type high-heat-dissipation bus duct so as to solve the problems in the background technology.
In order to solve the technical problems, the utility model provides the following technical scheme: the bus duct heat dissipation device comprises a bus duct, wherein a bonding plate is arranged at the heat dissipation end of the bus duct, and air inlet grooves capable of changing air speed are symmetrically arranged at the air inlet end of the surface of the bonding plate.
Preferably, the air inlet groove is provided with a plurality of air inlets in a linear array.
Preferably, the bonding plate is internally provided with a heat-conducting plate, and the bus duct is arranged on the surface of the heat-conducting plate.
Preferably, fins are symmetrically arranged on the surface of the attaching plate.
Preferably, the surface of the attaching plate is provided with a discharge port.
Preferably, the air inlet is integrally in a shape of a circular truncated cone, and the diameter of the circular truncated cone is gradually reduced from the outer side to the inner side of the attaching plate.
Preferably, the heat conductive plate is made of copper.
Compared with the prior art, the utility model has the beneficial effects that:
when the air conditioner is used, one side of the laminating plate is installed on one side of the wall body, after the mounting is finished, a part of heat generated by the bus can be dissipated to the outside through the bus duct shell, a part of heat is conducted through the inside of the heat conducting plate, the air in the laminating plate is heated, the heated air volume is expanded, the air density is small, the weight is light, the air rises, the air is discharged outwards through the discharge port, the air pressure in the laminating plate is lowered, the air with relatively low temperature is pressed into the laminating plate through the air inlet, the air inlet is in a round table shape, the diameter of the round table in the laminating plate is gradually reduced from the outside, the air volume is continuously compressed in the compression process, the air temperature is further lowered, heat is dissipated, the inside is cooled through the air inlet when the air blows, and the part of heat is dissipated to the outside through the heat radiation mode under the effect of the fins, the whole service life is greatly prolonged, and the whole air conditioner can be ensured to be in a relatively stable state.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of a partial enlarged structure within the range A of FIG. 1 according to an embodiment of the present utility model;
fig. 3 is a schematic view illustrating an internal structure of a bonding plate according to an embodiment of the present utility model.
In the figure: 1. bus duct; 2. bonding plates; 3. a discharge port; 4. an air inlet; 5. an air inlet groove; 6. a heat conductive plate; 7. and (5) fins.
Detailed Description
In order to solve the problem conveniently, the embodiment of the utility model provides a non-consumption type laminating type high-heat-dissipation bus duct. The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present embodiment provides a non-consumption type laminated bus duct with high heat dissipation: including bus duct 1, bus duct 1 radiating end is provided with laminating board 2, laminating board 2 surface air inlet end symmetry is provided with can change the air inlet groove 5 of wind speed, be the linear array of being provided with a plurality of air intakes 4 on the air inlet groove 5, laminating board 2 inside is provided with heat conduction board 6, bus duct 1 sets up in heat conduction board 6 surfaces, air intake 4 wholly is the round platform shape, and reduces gradually to laminating board 2 inside round platform diameter from the outside, laminating board 2 surface is provided with discharge port 3.
In this embodiment, wholly when using, install veneer 2 one side in leaning on wall body one side, after the installation, the heat that the generating of generating line partly can be dispelled to the external world through bus duct 1 casing, a portion heat wants the inside conduction of veneer 2 through heat-conducting plate 6, will heat the inside air of veneer 2 like this, the air heated volume will expand, the air density is little, light in weight, the air rises, outwards discharge through discharge port 3, thereby make veneer 2 inside atmospheric pressure become low, the atmosphere is impressed the inside veneer 2 with the air of temperature relatively lower through air intake 4, because air intake 4 wholly is the round platform shape, and by outside to the inside round platform diameter of veneer 2 reduce gradually, like this at the in-process that the air got into, the air volume is constantly compressed, further reduce the air temperature in the compression process, and then dispel the heat, and also can cool down inside when having the wind to blow, heat-conducting plate 6 is made by copper.
Referring to fig. 1-3, the present embodiment provides a non-consumption type laminated bus duct with high heat dissipation: fins 7 are symmetrically arranged on the surface of the attaching plate 2.
In this embodiment, part of heat is radiated to the outside through the heat radiation mode under the effect of the fins 7, so that the overall heat radiation efficiency is further increased.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a no consumption formula laminating formula high heat dissipation bus duct, includes bus duct (1), its characterized in that: the bus duct (1) radiating end is provided with laminating board (2), laminating board (2) surface air inlet end symmetry is provided with air inlet groove (5) that can change the wind speed, be on air inlet groove (5) and be a plurality of air intakes (4) of linear array, laminating board (2) inside is provided with heat-conducting plate (6), bus duct (1) set up in heat-conducting plate (6) surface, laminating board (2) surface is provided with discharge port (3).
2. The non-consumable conformable high heat dissipating bus duct of claim 1, wherein: fins (7) are symmetrically arranged on the surface of the attaching plate (2).
3. The non-consumable conformable high heat dissipating bus duct of claim 1, wherein: the air inlet (4) is integrally in a round table shape, and the diameter of the round table in the laminating plate (2) is gradually reduced from the outer side.
4. The non-consumable conformable high heat dissipating bus duct of claim 1, wherein: the heat conducting plate (6) is made of copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221897851.7U CN218997640U (en) | 2022-07-22 | 2022-07-22 | Consumption-free laminating type high-heat-dissipation bus duct |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221897851.7U CN218997640U (en) | 2022-07-22 | 2022-07-22 | Consumption-free laminating type high-heat-dissipation bus duct |
Publications (1)
Publication Number | Publication Date |
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CN218997640U true CN218997640U (en) | 2023-05-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202221897851.7U Active CN218997640U (en) | 2022-07-22 | 2022-07-22 | Consumption-free laminating type high-heat-dissipation bus duct |
Country Status (1)
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CN (1) | CN218997640U (en) |
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2022
- 2022-07-22 CN CN202221897851.7U patent/CN218997640U/en active Active
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