CN218993727U - Cooling device - Google Patents

Abstract

The utility model relates to the technical field of cable welding, in particular to a cooling device, which comprises: the novel water storage device comprises a main body and a forming block, wherein a guide chute and a water storage tank are arranged on the main body, the forming block is slidably arranged on the inner side of the guide chute, a motor is arranged on the main body, a positive and negative threaded rod is connected with a rotating shaft of the motor, and the positive and negative threaded rod is in threaded connection with the forming block. According to the utility model, the cooling liquid is conveyed to the inner side of the cooling cavity by the water pump to cool the forming blocks, so that the solidification of welding cables between the forming blocks can be accelerated; the cooling effect of the cooling liquid on the forming block can be maintained by cooling the cooling liquid through the arrangement of the cooling ports, the cooling fins and the semiconductor refrigerating fins.

Description

Cooling device

Technical Field

The utility model relates to the technical field of cable welding, in particular to a cooling device.

Background

In the existing cable connection, the two cables are connected by welding in most of the methods adopted at present. Because the copper core of cable has stronger heat conductivity, the temperature is high when the butt fusion heat heats, and the heat at butt fusion position can be transmitted towards the both ends of cable through the copper core, and the insulating layer at high temperature with the cable both ends burns out easily and loses insulating effect.

At present, workers use an air circulation mode, adopt a cold air blower to radiate heat aiming at two ends of a welding part, and prevent an insulating layer from being overheated and damaged. However, the heat dissipation effect using the cold air blower is general, and the worker is required to hold the cold air blower for continuous air blowing and heat dissipation, which consumes time and labor.

For example, grant publication number CN 213125008U discloses a post-cable-fusion cooling device including a base plate, a mobile unit, and a mounting assembly; the utility model discloses a cooling device for a cable weld, including bottom plate, heat insulating board, L-shaped fixing frame, heat insulating board, cooling device, cooling efficiency and cooling efficiency.

The above-mentioned patent and prior art have presented the same technical problem, and when cooling to the butt fusion position, the cooling effect is general.

To this end, we propose a cooling device that solves the above mentioned problems.

Disclosure of Invention

The utility model aims to provide a cooling device for solving the problem of poor cooling effect after cable welding.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a cooling device, comprising: the novel water storage device comprises a main body and a forming block, wherein a guide chute and a water storage tank are arranged on the main body, the forming block is slidably arranged on the inner side of the guide chute, a motor is arranged on the main body, a positive and negative threaded rod is connected with a rotating shaft of the motor, and the positive and negative threaded rod is in threaded connection with the forming block.

Preferably, the inside cooling chamber that is provided with of shaping piece, thereby cooling down the shaping piece to its inside cable fusion department of cooling down is intake to cooling down intracavity portion.

Preferably, the water pump is symmetrically arranged in the water storage tank, the water outlet of the water pump is connected with the first temperature-resistant spring pipe, and one end joint of the first temperature-resistant spring pipe is connected with the cooling cavity.

Preferably, the lower end of the cooling cavity is connected with a second temperature-resistant spring pipe through a joint, and one end of the second temperature-resistant spring pipe is connected with the water storage tank.

Preferably, the inner wall of the water storage tank is symmetrically provided with heat dissipation openings, and the heat dissipation openings are used for air circulation and heat dissipation in the water storage tank.

Preferably, the bottom of the water storage tank is provided with a mounting opening, a semiconductor refrigerating sheet is mounted on the inner side of the mounting opening, the semiconductor refrigerating sheet is in contact with cooling liquid to cool the cooling liquid, the lower end of the semiconductor refrigerating sheet is connected with a positioning cover, the semiconductor refrigerating sheet is positioned by being abutted upwards along the mounting opening through the positioning cover, and the positioning cover is in threaded connection with the inner side of the mounting opening.

Preferably, a sealing ring is arranged on the inner wall of the mounting opening, the sealing ring is connected with the semiconductor refrigerating sheet, and the joint of the semiconductor refrigerating sheet and the mounting opening is sealed through the sealing ring.

Preferably, the main body is provided with a radiating fin, the radiating fin is positioned outside the water storage tank, and the radiating fin absorbs the heat of the cooling liquid in the water storage tank to radiate outwards.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the cooling liquid is conveyed to the inner side of the cooling cavity by the water pump to cool the forming blocks, so that the solidification of the welding cables between the forming blocks can be accelerated.

2. According to the utility model, the cooling liquid can be cooled by the arrangement of the radiating ports, the radiating fins and the semiconductor refrigerating fins, so that the cooling effect of the cooling liquid on the forming block is maintained.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a cross-sectional view of the overall structure of the present utility model;

in the figure: 1 main body, 10 cooling fins, 11 guide grooves, 12 water storage grooves, 13 motors, 14 positive and negative threaded rods, 15 cooling ports, 16 mounting ports, 17 semiconductor refrigerating sheets, 18 positioning covers, 19 sealing rings, 2 forming blocks, 21 cooling cavities, 3 water pumps, 31 first temperature-resistant spring tubes and 32 second temperature-resistant spring tubes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1 and 2, a cooling device is shown, comprising: the novel plastic forming device comprises a main body 1 and a forming block 2, wherein a guide chute 11 and a water storage groove 12 are arranged on the main body 1, the forming block 2 is slidably arranged on the inner side of the guide chute 11, a motor 13 is arranged on the main body 1, a positive and negative threaded rod 14 is connected with a rotating shaft of the motor 13, the positive and negative threaded rod 14 is in threaded connection with the forming block 2, and the motor 13 drives the positive and negative threaded rod 14 to rotate so as to drive the forming block 2 to move along the guide chute 11.

The inside cooling chamber 21 that is provided with of shaping piece 2, thereby cooling down shaping piece 2 and thereby cooling down its inside cable fusion department of cooling down the inside water that intakes of chamber 21.

The water pump 3 is symmetrically installed in the water storage tank 12, a water outlet of the water pump 3 is connected with a first temperature-resistant spring tube 31, and one end joint of the first temperature-resistant spring tube 31 is connected with the cooling cavity 21.

The lower end of the cooling cavity 21 is connected with a second temperature-resistant spring tube 32 through a joint, one end of the second temperature-resistant spring tube 32 is connected with the water storage tank 12, and the first temperature-resistant spring 31 and the second temperature-resistant spring 32 can stretch along with the movement of the forming block 2.

The device is used when: after the cable is welded, the water pump 3 runs to convey cooling water in the water storage tank 12 into the cooling cavity 21 through the first temperature-resistant spring tube 31, then the cooling cavity 21 is discharged from the second temperature-resistant spring tube 32, cooling liquid continuously enters the inner side of the cooling cavity 21 to cool the forming block 2 through circulation, and the cable positioned in the forming block 2 is formed by rapid fixed phone.

Example 2

Referring to fig. 1 and 2, this embodiment further describes example 1, in which a cooling device includes: the novel plastic molding machine comprises a main body 1 and a molding block 2, wherein a guide chute 11 and a water storage groove 12 are arranged on the main body 1, the molding block 2 is slidably arranged on the inner side of the guide chute 11, a motor 13 is arranged on the main body 1, a positive and negative threaded rod 14 is connected with a rotating shaft of the motor 13, and the positive and negative threaded rod 14 is in threaded connection with the molding block 2.

The inner wall symmetry of catch basin 12 sets up the thermovent 15, and the setting of thermovent 15 is used for the inside circulation of air heat dissipation of catch basin 12.

The bottom of the water storage tank 12 is provided with a mounting opening 16, a semiconductor refrigerating sheet 17 is mounted on the inner side of the mounting opening 16, the semiconductor refrigerating sheet 17 is in contact with cooling liquid to cool the cooling liquid, the lower end of the semiconductor refrigerating sheet 17 is connected with a positioning cover 18, the semiconductor refrigerating sheet 17 is positioned by being abutted upwards along the mounting opening 16 through the positioning cover 18, and the positioning cover 18 is in threaded connection on the inner side of the mounting opening 16.

The inner wall of the mounting opening 16 is provided with a sealing ring 19, the sealing ring 19 is connected with the semiconductor refrigerating sheet 17, and the joint of the semiconductor refrigerating sheet 17 and the mounting opening 16 is sealed through the sealing ring 19.

The main body 1 is provided with the cooling fins 10, the cooling fins 10 are positioned outside the water storage groove 12, and the cooling fins 10 absorb the heat of the cooling liquid in the water storage groove 12 and radiate the heat outwards.

In this embodiment, the cooling liquid in the water storage tank 12 is cooled by the semiconductor cooling plate 17, the heat absorption and dissipation of the cooling fin 10 and the ventilation and heat exchange of the cooling port 15 can well cool the cooling liquid, and the cooling effect of the cooling liquid on the forming block 2 is maintained.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. A cooling device, comprising:

main part (1) and shaping piece (2), be provided with direction spout (11) and catch basin (12) on main part (1), direction spout (11) inboard slip is provided with shaping piece (2), install motor (13) on main part (1), the rotation axis of motor (13) is connected with positive and negative threaded rod (14), positive and negative threaded rod (14) threaded connection shaping piece (2).

2. A cooling device according to claim 1, wherein: a cooling cavity (21) is arranged in the forming block (2).

3. A cooling device according to claim 1, wherein: the water storage tank (12) is internally and symmetrically provided with a water pump (3), a water outlet of the water pump (3) is connected with a first temperature-resistant spring tube (31), and one end joint of the first temperature-resistant spring tube (31) is connected with a cooling cavity (21).

4. A cooling device according to claim 2, characterized in that: the lower end of the cooling cavity (21) is connected with a second temperature-resistant spring tube (32) through a joint, and one end of the second temperature-resistant spring tube (32) is connected with the water storage tank (12).

5. A cooling device according to claim 1, wherein: and heat dissipation ports (15) are symmetrically arranged on the inner wall of the water storage groove (12).

6. A cooling device according to claim 1, wherein: the bottom of the water storage tank (12) is provided with a mounting opening (16), a semiconductor refrigerating sheet (17) is mounted on the inner side of the mounting opening (16), the lower end of the semiconductor refrigerating sheet (17) is connected with a positioning cover (18), and the positioning cover (18) is in threaded connection with the inner side of the mounting opening (16).

7. A cooling device according to claim 6, wherein: the inner wall of the mounting opening (16) is provided with a sealing ring (19), and the sealing ring (19) is connected with the semiconductor refrigerating sheet (17).

8. A cooling device according to claim 1, wherein: the main body (1) is provided with a radiating fin (10).

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