CN218975888U - Wire waterproof structure and electronic device with same - Google Patents
Wire waterproof structure and electronic device with same Download PDFInfo
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- CN218975888U CN218975888U CN202223536673.8U CN202223536673U CN218975888U CN 218975888 U CN218975888 U CN 218975888U CN 202223536673 U CN202223536673 U CN 202223536673U CN 218975888 U CN218975888 U CN 218975888U
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- waterproof structure
- wire
- opening
- wire waterproof
- waterproof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
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- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Abstract
The utility model mainly discloses a wire waterproof structure and an electronic device with the same, wherein the wire waterproof structure mainly comprises a thin structure, an L-shaped concave groove, a first opening, a second opening and a containing space. The thin structure can deform along with the bending of the wire rod at the first opening, so that the sealing degree and the water resistance between the wire rod waterproof structure and the wire rod are increased, and the L-shaped concave groove is designed, so that the wire rod waterproof structure can be closely attached along with the deformation of the side plate of the electronic device shell, and the waterproof effect is improved. Further, the inner edge of the second opening of the wire waterproof structure comprises a flange so as to further increase the waterproof effect of the wire waterproof structure.
Description
Technical Field
The present utility model relates to a waterproof structure, and more particularly to a waterproof structure for accommodating various wires based on a design of a wire waterproof structure made of soft materials.
Background
With the popularization of various electronic products, the electronic products are increasingly applied, and the fields where the electronic products are used are more complex, wherein the electronic products are not lack of harsh environments such as humidity, raininess and the like. However, the electronic product is most afraid of being subjected to moisture to cause short circuit of the electronic component, thereby affecting the service condition of the electronic product and being even easy to damage, so that some waterproof designs are needed to be made on the electronic product.
The wire is a component which can be connected with an electronic device or a product such as a power supply, a telephone, a fax machine, a computer and the like so as to achieve the purpose of transmitting electronic signals or electric energy. Therefore, when the electronic product is assembled, the waterproof measure of the wire assembly is also very important, because if the waterproof protective measure is not done, water or moisture easily permeates into the electronic product through the gap between the wire and the electronic product shell, so that the electronic product is faulty or cannot be used.
Referring to fig. 7, in the conventional waterproof ring used when assembling wires in electronic products, a simple groove is formed only on the outer periphery of the waterproof ring and an opening with equal caliber is formed on the wire passing through the inlet and outlet of the waterproof ring, the simple groove is designed only for accommodating and mounting the side plate of the electronic product housing during assembly, the width of the groove needs to be adjusted corresponding to the thickness of the side plate of different electronic product housings, the design is quite inconsistent with economic benefit, and if the manufactured waterproof ring or the manufactured waterproof ring and the corresponding side plate have tolerance problems, gaps are generated during assembly, resulting in water seepage and failure or incapacity of using the electronic product. In addition, the conventional waterproof ring inlet and outlet has no additional waterproof design, and when the wire is bent, the inlet and outlet are easy to be extruded, so that gaps are generated between the wire and the periphery of the opening of the inlet and outlet, and another possibility of causing the failure of the electronic product due to water seepage is generated.
In view of this, in order to solve the above-mentioned problems of inconsistent economic benefit and water seepage generated during the assembly of electronic products, the present inventors have made intensive studies and have finally developed and completed the wire waterproof structure and the electronic device having the same.
Disclosure of Invention
The utility model mainly aims to provide a wire waterproof structure and an electronic device with the same, wherein the wire waterproof structure is a structure based on soft materials and mainly comprises a thin structure, an L-shaped concave groove, a first opening, a second opening and a containing space, wherein a wire penetrates through the wire waterproof structure sequentially through the first opening, the containing space and the second opening. The thin structure is designed to be thinner than the wall of other parts of the wire waterproof structure, so that the thin structure can deform along with the bending of the wire, thereby increasing the adhesion between the wire and the wire waterproof structure and enhancing the waterproof property. The L-shaped concave groove is arranged on the outer periphery of the wire waterproof structure in a surrounding mode, and is in an L-shaped concave design, so that the wire waterproof structure can be closely attached along with the deformation of a side plate of an electronic device shell during assembly, the waterproof effect of the wire waterproof structure is further improved, the L-shaped concave groove can accommodate and attach various side plates with different thicknesses, and the economic benefit of the electronic device assembly is further improved.
In order to achieve the above object, the present utility model provides an embodiment of a wire waterproof structure, which includes:
the thin structure is arranged at one end of the wire waterproof structure;
an L-shaped concave groove which is arranged around the outer periphery of the wire waterproof structure and is connected with the thin structure through a side wall;
the first opening is arranged at one end of the wire waterproof structure, which is provided with the thin structure;
the second opening is arranged at the other end of the wire waterproof structure, which is opposite to the thin structure; and
the accommodating space is arranged in the space between the first opening and the second opening in the wire waterproof structure;
wherein the thickness of the thin structure gradually thins towards the direction of the first opening;
the L-shaped concave groove is an L-shaped groove formed by concave inward towards the side wall of the wire waterproof structure and concave further towards the thin structure of the wire waterproof structure;
the wire rod penetrates through the wire rod waterproof structure through the first opening, the accommodating space and the second opening.
In an embodiment, the wire waterproof structure further includes a flange, the flange is disposed at the other end of the wire waterproof structure opposite to the thin structure and located at the inner edge of the second opening, and the protrusion of the flange is designed to enable the wire waterproof structure to be tightly attached to the wire through deformation of the flange at the inner edge of the second opening, so as to further enhance the waterproof effect of the wire waterproof structure.
In one embodiment, the L-shaped groove of the wire waterproof structure is used for accommodating and mounting a side plate of an electronic device shell and closely attaching to the side plate, wherein the electronic device is a power supply.
In one embodiment, the aperture of the first opening is smaller than the aperture of the second opening. In addition, the L-shaped concave groove can further comprise an L-shaped corner protruding inside the L-shaped concave groove, so that the sealing degree between the end part of the side plate and the L-shaped corner of the L-shaped concave groove is further increased, and the waterproof performance of the wire waterproof structure is enhanced.
In an embodiment, the wire waterproof structure can change the deformation of the wire waterproof structure by changing the material of the wire waterproof structure or changing the elastic coefficient of the wire waterproof structure, so as to enhance the waterproof effect.
In an embodiment, the wire waterproof structure is an integrally formed structure, and the wire waterproof structure is made of plastic, rubber, resin or silica gel material.
In one embodiment, the portion of the wire waterproof structure including the L-shaped concave groove is a hollow cylinder, and the portion including the flange is a hollow cone.
In a further embodiment, the present utility model provides an electronic device comprising the above wire waterproof structure, wherein the electronic device is a power supply or other electronic products requiring waterproof performance, such as industrial computers, automotive electronic devices, etc.
Drawings
FIGS. 1A and 1B are perspective views of an embodiment of a wire waterproof structure according to the present utility model;
FIGS. 2A and 2B are cross-sectional views of an embodiment of a wire waterproof structure according to the present utility model;
FIG. 3 is a schematic diagram of an embodiment of the wire waterproof structure of the present utility model before being combined with a wire;
FIG. 4 is a cross-sectional view of an embodiment of a wire waterproof structure and wire bonding of the present utility model;
FIG. 5 is a perspective view of an embodiment of the combination of the wire waterproof structure and the side plate of the housing of the electronic device;
FIG. 6 is a cross-sectional view of an embodiment of the wire waterproof structure of the present utility model combined with a wire and a side plate of an electronic device housing; and
FIG. 7 is a schematic diagram of the prior art.
Reference numerals illustrate:
100-wire waterproof structure
101 thin structure
102L-shaped concave groove
102b, bump
103 side wall
104 first opening
105 second opening
106 accommodating space
107 flange
200 wire rod
300 side plate
400 traditional waterproof ring
401 groove
402 opening(s)
Detailed Description
In order to more clearly describe the wire waterproof structure and the electronic device with the wire waterproof structure, the preferred embodiments of the present utility model will be described in detail below with reference to the drawings.
Referring to fig. 1A, fig. 1B, fig. 2A, fig. 2B, a perspective view and a cross-sectional view of an embodiment of a wire waterproof structure 100 according to the present utility model are shown. As shown in the figure, the wire waterproof structure 100 of the present embodiment includes a thin structure 101, an L-shaped concave groove 102, a first opening 104, a second opening 105, and a receiving space 106; the accommodating space 106 is a space for accommodating a wire, and the wire penetrates through the wire waterproof structure 100 through the first opening 104, the accommodating space 106 and the second opening 105, wherein the caliber of the first opening 104 is smaller than that of the second opening 105, and a portion of the wire waterproof structure 100 including the L-shaped concave groove 102 is a hollow cylinder, and a portion including the flange 107 is a hollow cone.
Referring to fig. 1A to fig. 2B, fig. 4 and fig. 7, the thin structure 101 is disposed at one end of the first opening 104 of the wire waterproof structure 100, and the thickness of the thin structure 101 is gradually thinned towards the direction of the first opening 104, and the gradually thinned structure design makes the thin structure 101 capable of being properly deformed along with the bending of a wire passing through the first opening 104, so that the wire waterproof structure 100 can maintain an optimal adhesion with the wire at any time at the first opening 104, and no gap is generated due to the bending of the wire, thereby reducing the adhesion and the waterproof property at the first opening 104. Therefore, the waterproof wire structure 100 of the thin structure 101 of the present utility model is not used for the electronic device, which is not degraded in waterproof performance due to bending of the wire, so that the electronic device can normally operate even in an extremely humid environment, and is not failed or cannot be used due to infiltration of moisture. However, the design of the thin structure 101 of the present utility model is not available in the conventional waterproof ring 400, so that when the wire is bent, a gap is easily generated between the opening 402 of the conventional waterproof ring 400 and the wire, thereby reducing the waterproof performance, and causing the malfunction or the non-use of the electronic device using the conventional waterproof ring 400.
Referring to fig. 1A to 2B, fig. 6 and fig. 7, the L-shaped groove 102 is an L-shaped groove formed by recessing inward in a direction toward the sidewall 103 of the wire waterproof structure 100 and further recessing inward in a direction toward the thin structure 101 of the wire waterproof structure 100, and the L-shaped groove 102 is disposed around the outer periphery of the wire waterproof structure 100. The design of the L-shaped concave groove 102 enables the wire waterproof structure 100 to be tightly attached along with the deformation of the side plate 300 of the electronic device shell, thereby further improving the waterproof effect of the wire waterproof structure 100. The L-shaped groove 102 can also accommodate and tightly adhere to side plates with different thickness by virtue of the characteristic of tightly adhering to the side plates 300 due to deformation, unlike the conventional waterproof ring 400, which needs to be manufactured for the side plates 300 with different thickness, the waterproof ring with the grooves 401 suitable for the thickness of the side plates 300 is manufactured, so that the wire waterproof structure 100 of the utility model not only has better waterproof effect than the conventional waterproof ring 400, but also has the advantage of improving the assembly economic benefit of the electronic device. In addition, the L-shaped groove 102 may further include a protrusion 102b at the L-shaped corner inside the L-shaped groove 102 to further increase the adhesion between the end of the side plate 300 and the L-shaped corner of the L-shaped groove 102, so as to enhance the waterproof performance of the wire waterproof structure 100.
Referring to fig. 2A, 2B, 4 and 7, in an embodiment of the utility model, the wire waterproof structure 100 further includes a flange 107, and the flange 107 is disposed at the other end of the wire waterproof structure 100 opposite to the thin structure 101 and located at the inner edge of the second opening 105. The convex design of the flange 107 enables the wire waterproof structure 100 to be tightly attached to the wire 200 at the inner edge of the second opening 105 through the deformation of the flange 107, so as to further enhance the waterproof effect of the wire waterproof structure 100, and the convex design of the flange 107 is not found in the opening 402 of the conventional waterproof ring 400, so that the wire waterproof structure 100 of the present utility model further has a better waterproof effect than the conventional waterproof ring 400.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating a state before the wire waterproof structure 100 and the wire 200 are combined, and further referring to fig. 4, in a cross-sectional view illustrating a combined state of the wire waterproof structure 100 and the wire 200 shown in fig. 4, it can be seen that the wire waterproof structure 100 is tightly adhered to the wire 200 at the positions of the first opening 104 and the second opening 105 by the thin structure 101 and the flange 107, so as to achieve an excellent waterproof effect. Such a waterproof design in the first opening 104 and the second opening 105 is not the case of the conventional waterproof ring 400, so it is obvious that the wire waterproof structure 100 of the present utility model provides better waterproof performance at the place where the wire 200 passes compared to the conventional waterproof ring 400.
Referring to fig. 5, fig. 5 is a schematic diagram showing a combination state of the wire waterproof structure 100 and the wire 200 and a side plate 300 of an electronic device housing of the present utility model, and further referring to fig. 6, in a cross-sectional view showing a combination state of the wire waterproof structure 100 and the wire 200 and the side plate 300 of fig. 6, it can be seen that the wire waterproof structure 100 is designed by the L-shaped concave groove 102, so that the wire waterproof structure 100 and the side plate 300 can form a tight joint after being assembled, so as to prevent the defect that the conventional water vapor can infiltrate into the interior of the electronic device through a gap formed between the groove 401 of the conventional waterproof ring 400 and the wire 200, thereby causing a fault.
As can be seen from the above embodiments, the wire waterproof structure 100 of the present utility model has at least three different waterproof designs (including the thin structure 101, the L-shaped groove 102 and the flange 107), and thus can provide better waterproof performance than the conventional waterproof ring 400, and is therefore very suitable for being applied to electronic devices that need to operate in extreme environments (e.g. humid).
In a further embodiment, the wire waterproof structure 100 of the present utility model can change the deformation amount of the wire waterproof structure 100 by changing the material for manufacturing the wire waterproof structure 100 or changing the elastic coefficient thereof, so as to enhance the waterproof effect, wherein the wire waterproof structure 100 is made of plastic, rubber, resin or silica gel material, and the wire waterproof structure 100 is an integrally formed structure.
In the above embodiment, the wire waterproof structure 100 may be molded and made of a thermosetting polymer (Thermosetting polymer) or the like, such as, but not limited to, butadiene Rubber (BR), isobutylene isoprene rubber (isobutylene isoprene rubber), ethylene-propylene rubber (ethylene-propylene rubber), nitrile rubber (nitrile butadiene rubber), polyacrylate rubber (polyacrylate rubber), silicone rubber (silicone rubber), styrene-butadiene rubber (styrene butadiene rubber), polysulfide rubber (polysulfide rubber), or the like, or a thermoplastic or the like, such as, but not limited to, thermoplastic elastomer (thermoplastic elastomer), thermoplastic polyolefin (thermoplastic polyolefin), thermoplastic polyurethane (TPU, thermoplastic polyurethane), thermoplastic polyamide (thermoplastic polyamide), thermoplastic vulcanized rubber (thermoplastic vulcanizate), or the like.
The foregoing description has fully and clearly described a wire waterproof structure and an electronic device having the same of the present utility model. It should be emphasized that the above-described detailed description is directed to a specific embodiment of the present utility model, which is not intended to limit the scope of the utility model, but is intended to cover all equivalent implementations or modifications that do not depart from the spirit of the utility model.
Claims (10)
1. A wire waterproof structure, characterized in that it comprises:
the thin structure is arranged at one end of the wire waterproof structure;
an L-shaped concave groove which is arranged around the outer periphery of the wire waterproof structure and is connected with the thin structure through a side wall;
the first opening is arranged at one end of the wire waterproof structure, which is provided with the thin structure;
the second opening is arranged at the other end of the wire waterproof structure, which is opposite to the thin structure; and
the accommodating space is arranged in the space between the first opening and the second opening in the wire waterproof structure;
wherein the thickness of the thin structure gradually thins towards the direction of the first opening;
the L-shaped concave groove is an L-shaped groove formed by concave inward towards the side wall of the wire waterproof structure and concave further towards the thin structure of the wire waterproof structure;
the wire rod penetrates through the wire rod waterproof structure through the first opening, the accommodating space and the second opening.
2. The wire waterproof structure of claim 1, further comprising a flange disposed at the other end of the wire waterproof structure opposite to the thin structure and at an inner edge of the second opening.
3. The wire waterproof structure of claim 1, wherein the L-shaped groove is configured to receive and mount a side plate of an electronic device housing and to be in close contact with the side plate.
4. The wire waterproof structure according to claim 1, wherein the caliber of the first opening is smaller than the caliber of the second opening.
5. The wire waterproof structure according to claim 1, wherein the deformation amount of the wire waterproof structure is changed by changing the material of the wire waterproof structure or changing the elastic coefficient thereof, thereby enhancing the waterproof effect.
6. The wire waterproof structure according to claim 1, wherein the wire waterproof structure is an integrally formed structure.
7. The wire waterproof structure according to claim 1, wherein the wire waterproof structure is made of plastic, rubber, resin or silica gel material.
8. The wire waterproof structure of claim 1, wherein the L-shaped groove further comprises an L-shaped corner protruding inside the L-shaped groove.
9. The wire waterproof structure of claim 3, wherein the electronic device is a power supply.
10. An electronic device comprising the wire waterproof structure according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223536673.8U CN218975888U (en) | 2022-12-28 | 2022-12-28 | Wire waterproof structure and electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223536673.8U CN218975888U (en) | 2022-12-28 | 2022-12-28 | Wire waterproof structure and electronic device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218975888U true CN218975888U (en) | 2023-05-05 |
Family
ID=86148950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223536673.8U Active CN218975888U (en) | 2022-12-28 | 2022-12-28 | Wire waterproof structure and electronic device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218975888U (en) |
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2022
- 2022-12-28 CN CN202223536673.8U patent/CN218975888U/en active Active
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