CN218966069U

CN218966069U - Cooling forming device for manufacturing plastic products

Info

Publication number: CN218966069U
Application number: CN202222754754.9U
Authority: CN
Inventors: 王涛; 石振; 王诗蕊
Original assignee: Tianhou Huanneng Liaoning Environmental Protection Technology Co ltd
Current assignee: Tianhou Huanneng Liaoning Environmental Protection Technology Co ltd
Priority date: 2022-10-19
Filing date: 2022-10-19
Publication date: 2023-05-05
Anticipated expiration: 2032-10-19

Abstract

The utility model discloses a cooling forming device for manufacturing plastic products, which belongs to the technical field of plastic product manufacturing and comprises a lower die and an upper die sleeved above the lower die in a sliding manner, wherein both ends of the upper die and the lower die are provided with cooling grooves, mounting frames are detachably embedded and fixed through the cooling grooves, a heat insulation frame with a frame structure is embedded and fixed on one side surface of the upper die, which is opposite to the lower die, both ends of the upper die and the lower die are symmetrically provided with positioning holes, a semiconductor refrigerating plate attached to the inner wall of the cooling grooves is embedded and fixed in the center position of the mounting frames, and both ends of the mounting frames are detachably spliced with storage batteries, and positioning rods clamped with the positioning holes are elastically spliced on the side walls of the mounting frames.

Description

Cooling forming device for manufacturing plastic products

Technical Field

The utility model belongs to the technical field of plastic product manufacturing, and particularly relates to a cooling forming device for plastic product manufacturing.

Background

The plastic mould is a tool matched with a plastic forming machine in the plastic processing industry and endows a plastic product with complete configuration and accurate size; because of the variety of plastics and the variety of processing methods, the structures of the plastic molding machine and the plastic products are various, so the variety and the structure of the plastic mold are also various.

At present, after the plastic product is processed by an injection mold in the manufacturing process, the plastic product needs to be naturally cooled in the injection mold to be demolded, however, as the temperature of the plastic product after the mold is contacted and heated is increased, the cooling time of the plastic product is very long, so that the demolding waiting time of the plastic product is too long, and the processing efficiency of the plastic product is affected.

For this reason, we propose a cooling molding apparatus for plastic product manufacturing to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to solve the problems that in the prior art, after a plastic product is processed by an injection mold in the manufacturing process, the plastic product needs to be naturally cooled in the injection mold to be demolded, however, the cooling time of the plastic product is very long due to the fact that the temperature of the plastic product after the mold is heated by contact is increased, so that the demolding waiting time of the plastic product is too long, and the processing efficiency of the plastic product is affected.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a plastic products makes and uses cooling forming device, includes the bed die and cup joints the last mould in the bed die top with the slip, go up the cooling tank has all been seted up at the both ends of mould and bed die to through the detachable embedded mounting bracket that is fixed with of cooling tank, and go up the mould and all built-in the side that faces in opposite directions of bed die is fixed with the insulating frame that is the framework structure, wherein go up the equal symmetry in both ends of mould and bed die and seted up the locating hole, the central point department of mounting bracket is built-in and is fixed with the semiconductor refrigeration board that laminates with the cooling tank inner wall, and the both ends of mounting bracket all detachable peg graft has the battery, wherein the lateral wall elasticity grafting of mounting bracket has the locating lever with the locating hole joint.

Through above-mentioned technical scheme, accessible has the mounting bracket in last mould and the bed die lateral wall cooling tank, the battery in the mounting bracket supplies power to the semiconductor refrigeration board, make the semiconductor refrigeration board be close to the side refrigeration of injection molding groove, thereby make last mould and bed die to contact with the semiconductor refrigeration board cool off, thereby the efficiency of plastic products cooling shaping in the acceleration injection molding groove, the another side of conductor refrigeration board heats simultaneously, two conductor refrigeration boards heat last mould and bed die respectively, thereby avoided the mould temperature to be too low to lead to liquid plastics not to flow into the injection molding groove and take place the phenomenon of cooling shaping, simultaneously the insulation frame can separate the cold and hot both ends of last mould and bed die, avoided the heat conduction to lead to mould cold and hot offset, be convenient for carry out cooling shaping to plastic products, the machining efficiency of plastic products has been promoted.

As a further preferable scheme, the two ends of the upper die are symmetrically fixed with first positioning parts, and an injection molding pipe is arranged at the center of the top end surface of the upper die.

Through the technical scheme, liquid plastic can flow into the injection groove between the upper die and the lower die through the injection pipe.

As a further preferable scheme, the two ends of the lower die are symmetrically fixed with second positioning parts, and the top ends of the second positioning parts are fixed with positioning rods.

Through the technical scheme, the positioning rod can slide in the second positioning part, so that the upper die and the lower die are mutually positioned and attached.

As a further preferable scheme, an injection groove communicated with the injection pipe is formed in the center of the top end face of the lower die, and the positioning rod is connected in an anastomotic manner in the first positioning part.

As a further preferable scheme, the mounting frame is connected in the cooling groove in an anastomotic manner, and a handle is fixed at the center of the side wall of the mounting frame.

Through the technical scheme, the mounting frame can be conveniently inserted into/pulled out of the cooling groove through the handle.

As a further preferable scheme, mounting holes are formed in the center positions of the two ends of the mounting frame, and springs are fixed to the inner walls of the mounting holes.

As a further preferable scheme, the positioning rod is anastomotic and spliced in the mounting hole and fixedly connected with the spring, and one end of the positioning rod extending out of the mounting hole is anastomotic and spliced in the positioning hole.

Through the technical scheme, the positioning rod can be pushed by the spring to be anastomosed and inserted into the positioning hole, so that the mounting frame and the semiconductor refrigeration plate are kept fixed in the cooling groove, the positioning rod is extruded from the side walls of the first die and the second die to be moved out of the positioning hole, and the mounting frame can be pulled out of the cooling groove.

In summary, the technical effects and advantages of the present utility model are: this cooling forming device for plastic products manufacturing has the mounting bracket through the embedded mounting bracket that has in last mould and lower mould lateral wall cooling tank, the battery in the mounting bracket supplies power to the semiconductor refrigeration board, make the semiconductor refrigeration board be close to the side refrigeration of injection molding tank, thereby make the last mould and the lower mould that contact with the semiconductor refrigeration board cool off, thereby the efficiency of plastic products cooling forming in the acceleration injection molding tank, the another side of conductor refrigeration board heats simultaneously, two conductor refrigeration boards heat last mould and lower mould respectively, thereby avoided the mould temperature to be too low to lead to liquid plastics not to flow into the injection molding tank and take place the phenomenon of cooling forming, simultaneously the thermal-insulated frame can separate the cold and hot both ends of last mould and lower mould, avoided the heat conduction to lead to mould cold and hot counterbalance, be convenient for carry out cooling forming to plastic products, the machining efficiency of plastic products has been promoted.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the lower die structure of the present utility model;

FIG. 3 is a schematic view of the internal structure of the lower die of the utility model;

fig. 4 is a schematic view of the structure of the mounting frame of the present utility model.

In the figure: 1. a lower die; 2. a first positioning portion; 3. an upper die; 4. injection molding a tube; 5. a cooling tank; 6. a mounting frame; 7. a positioning rod; 8. an injection molding groove; 9. a second positioning portion; 10. a heat insulation frame; 11. positioning holes; 12. a storage battery; 13. a semiconductor refrigeration plate; 14. a mounting hole; 15. a spring; 16. a positioning rod; 17. a handle.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1 and 2, the cooling molding device for manufacturing plastic products comprises a lower die 1 and an upper die 3 which is sleeved on the lower die 1 in a sliding manner, wherein both ends of the upper die 3 and the lower die 1 are respectively provided with a cooling groove 5, a mounting frame 6 is detachably embedded and fixed in the cooling grooves 5, and a heat insulation frame 10 with a frame structure is embedded and fixed in one side surface of the upper die 3 opposite to the lower die 1, wherein both ends of the upper die 3 and the lower die 1 are respectively symmetrically provided with a positioning hole 11;

the semiconductor refrigeration plate 13 attached to the inner wall of the cooling tank 5 is fixedly embedded in the center position of the mounting frame 6, the storage battery 12 is detachably inserted at two ends of the mounting frame 6, and the positioning rod 16 clamped with the positioning hole 11 is elastically inserted at the side wall of the mounting frame 6.

The mounting frames 6 are embedded in the side wall cooling grooves 5 of the upper die 3 and the lower die 1, the storage batteries 12 in the mounting frames 6 supply power to the semiconductor refrigeration plates 13, so that one side surface of the semiconductor refrigeration plates 13 close to the injection molding groove 8 is refrigerated, the upper die 3 and the lower die 1 which are in contact with the semiconductor refrigeration plates 13 are cooled, the cooling molding efficiency of plastic products in the injection molding groove 8 is accelerated, and the other side surface of the semiconductor refrigeration plates is heated;

the two conductor refrigerating plates respectively heat the upper die 3 and the lower die 1, so that the phenomenon that liquid plastic is cooled and formed when the liquid plastic does not flow into the injection groove 8 due to the fact that the temperature of the die is too low is avoided, meanwhile, the heat insulation frame 10 can separate cold and hot two ends of the upper die 3 and the lower die 1, and the phenomenon that the dies are balanced against each other due to heat conduction is avoided.

The two ends of the upper die 3 are symmetrically fixed with the first positioning parts 2, and an injection molding pipe 4 is arranged at the center of the top end surface of the upper die 3, and the injection molding pipe 4 enables liquid plastic to flow into an injection molding groove 8 between the upper die 3 and the lower die 1.

The two ends of the lower die 1 are symmetrically fixed with second positioning parts 9, the top ends of the second positioning parts 9 are fixed with positioning rods 16, and the positioning rods 16 slide in the second positioning parts 9, so that the upper die 3 and the lower die 1 are positioned and attached to each other.

Referring to fig. 3 and 4, an injection molding groove 8 communicated with the injection molding pipe 4 is formed in the center of the top end surface of the lower mold 1, a positioning rod 16 is in fit connection with the first positioning part 2, a mounting frame 6 is in fit connection with the cooling groove 5, and a handle 17 is fixed in the center of the side wall of the mounting frame 6.

The handle 17 is convenient for inserting/extracting the mounting frame 6 from the cooling groove 5, the center positions of the two ends of the mounting frame 6 are provided with mounting holes 14, and the inner wall of the mounting holes 14 is fixed with springs 15.

The positioning rod 16 is in fit connection with the mounting hole 14 and is fixedly connected with the spring 15, one end of the positioning rod 16 extending out of the mounting hole 14 is in fit connection with the positioning hole 11, the spring 15 pushes the positioning rod 16 to be in fit connection with the positioning hole 11, the mounting frame 6 and the semiconductor refrigeration plate 13 are kept fixed in the cooling groove 5, the positioning rod 16 is extruded from the side walls of the first die and the second die to be removed from the positioning hole 11, and the mounting frame 6 can be pulled out of the cooling groove 5.

Working principle: the storage battery 12 supplies power to the semiconductor refrigeration plate 13, so that the upper die 3 and the lower die 1 which are in contact with the semiconductor refrigeration plate 13 are cooled, the cooling and forming efficiency of plastic products in the injection molding groove 8 is accelerated, meanwhile, the other surfaces of the conductor refrigeration plates are heated, the upper die 3 and the lower die 1 are respectively heated by the two conductor refrigeration plates, the phenomenon that liquid plastic does not flow into the injection molding groove 8 and is cooled and formed due to the fact that the temperature of the die is too low is avoided, and meanwhile, the heat insulation frame 10 can separate the cold and hot two ends of the upper die 3 and the lower die 1.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a plastic products makes and uses cooling forming device, includes bed die (1) and slip cup joints last mould (3) in bed die (1) top, its characterized in that, cooling tank (5) have all been seted up at the both ends of going up mould (3) and bed die (1) to be fixed with mounting bracket (6) through cooling tank (5) detachable embedded, and go up mould (3) and bed die (1) opposite side all embedded be fixed with be frame body structure's thermal-insulated frame (10), wherein go up mould (3) and bed die (1) both ends all symmetry set up locating hole (11), the central point department of mounting bracket (6) is embedded to be fixed with semiconductor refrigeration board (13) laminating with cooling tank (5) inner wall, and the grafting of both ends of mounting bracket (6) all detachable has battery (12), wherein the lateral wall elasticity grafting of mounting bracket (6) has locating lever (16) with locating hole (11) joint.

2. The cooling molding apparatus for plastic product manufacturing according to claim 1, wherein the first positioning portions (2) are symmetrically fixed at both ends of the upper mold (3), and an injection pipe (4) is installed at a center position of a top end surface of the upper mold (3).

3. The cooling molding apparatus for plastic product manufacturing according to claim 2, wherein the two ends of the lower mold (1) are symmetrically fixed with a second positioning portion (9), and a positioning rod (16) is fixed at the top end of the second positioning portion (9).

4. A cooling molding apparatus for plastic product manufacturing according to claim 3, wherein an injection molding groove (8) communicating with the injection molding pipe (4) is provided at a center position of a top end surface of the lower mold (1), and the positioning rod (16) is fitted and inserted into the first positioning portion (2).

5. The cooling molding device for manufacturing plastic products according to claim 1, wherein the mounting frame (6) is in fit connection with the cooling groove (5), and a handle (17) is fixed at the center of the side wall of the mounting frame (6).

6. The cooling molding device for manufacturing plastic products according to claim 1, wherein the mounting frame (6) is provided with mounting holes (14) at the central positions of both ends, and springs (15) are fixed on the inner walls of the mounting holes (14).

7. The cooling molding device for manufacturing plastic products according to claim 6, wherein the positioning rod (16) is in fit connection with the mounting hole (14) and fixedly connected with the spring (15), and one end of the positioning rod (16) extending out of the mounting hole (14) is in fit connection with the positioning hole (11).