CN218959139U

CN218959139U - Semiconductor pipeline outer wall heater

Info

Publication number: CN218959139U
Application number: CN202223430859.5U
Authority: CN
Inventors: 王娟; 夏伟龙
Original assignee: Shanghai Qihui Technology Engineering Co ltd
Current assignee: Shanghai Qihui Technology Engineering Co ltd
Priority date: 2022-12-21
Filing date: 2022-12-21
Publication date: 2023-05-02
Anticipated expiration: 2032-12-21

Abstract

The utility model discloses a semiconductor pipeline outer wall heater, which has the technical scheme that: the fixing device comprises a first fixing cylinder, wherein a plurality of fixing blocks are fixedly arranged on the outer circular wall surface of the first fixing cylinder, two of the fixing blocks are a group, one side of each fixing block is provided with a bolt, one side of the first fixing cylinder is provided with a second fixing cylinder, and fixing grooves are formed in the sides, close to each other, of the first fixing cylinder and the second fixing cylinder; the heating element, heating element sets up the interior circular wall of second fixed section of thick bamboo for heat the semiconductor tube, through setting up the fixed slot, can install the heat preservation through the fixed slot, reduce thermal loss when making heating element function, thereby improved heating element's heating efficiency, and then ensured the stability of the heating of the inside material of semiconductor tube, can avoid the continuous heating of heating plate to lead to inefficiency problem through infrared heater, can carry out the heat filling to semiconductor tube.

Description

Semiconductor pipeline outer wall heater

Technical Field

The utility model relates to the technical field of heaters, in particular to a semiconductor pipeline outer wall heater.

Background

The electric heater is an electric appliance which achieves a heating effect by utilizing electric energy. The intelligent temperature control device has the advantages of small volume, high heating power, wide application, intelligent control mode and high temperature control precision, and can be networked with a computer. The application range is wide, the service life is long, and the reliability is high. At the heart of the heater principle is energy conversion, most widely electrical energy to thermal energy.

According to the application number: CN201521061181.5, an electromagnetic induction heater, belongs to the technical field of electric heating devices. The heater comprises a conductive core which is electrified, an insulating layer is sleeved outside the conductive core to form a heating core, and after the heating core penetrates from a penetrating end of a magnetic conductive metal pipe, the heating core is turned back when adjacent to the other end of the magnetic conductive metal pipe and then penetrates out from the penetrating end.

Any of the above schemes has the following disadvantages: the heating effect of the heater is poor, the object can not be heated uniformly when being heated, the temperature cannot be controlled due to the fact that the heating device is not provided, the object can be damaged due to continuous heating of the object, the service life is influenced, and the electromagnetic induction heater is provided.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a semiconductor pipeline outer wall heater, which solves the problems that the heating effect of the heater is poor, the heating can not be uniform when an object is heated, a heat supplementing device is not provided, the temperature can not be controlled, and the object can be damaged due to continuous heating of the object, so that the service life is influenced.

The technical aim of the utility model is realized by the following technical scheme:

a semiconductor die outer wall heater comprising: the semiconductor tube fixing device comprises a first fixing barrel, a plurality of fixing blocks are fixedly arranged on the outer circular wall surface of the first fixing barrel, two of the fixing blocks are a group, a bolt is arranged on one side of each fixing block, a second fixing barrel is arranged on one side of the first fixing barrel, fixing grooves are formed in one sides, close to each other, of the first fixing barrel and the second fixing barrel, and a heating assembly is arranged on the inner circular wall surface of the second fixing barrel and used for heating semiconductor tubes.

Through adopting above-mentioned technical scheme, through setting up the fixed slot, can install the heat preservation through the fixed slot, make heating element reduce thermal loss when the operation to heating element's heating efficiency has been improved, and then the stability of the heating of the inside material of semiconductor has been ensured.

Preferably, the heating assembly includes: the fixed ring comprises a plurality of fixed rings, two of the fixed rings are fixedly arranged at two ends of the first fixed cylinder and the second fixed cylinder respectively, a plurality of mounting grooves are formed in the inner circular wall surface of the fixed ring, an infrared heater is fixedly sleeved on the inner circular wall surface of the mounting groove, and a plurality of placing grooves are formed in the inner circular wall surfaces of the first fixed cylinder and the second fixed cylinder respectively.

Through adopting above-mentioned technical scheme, through setting up infrared heater, can avoid the continuous heating of heating plate to lead to inefficiency problem through infrared heater, can carry out the concurrent heating to semiconductor pipeline to make the inside temperature conduction of semiconductor pipeline more even, and then promote heating element's overall heating efficiency, avoid the appearance of local heating phenomenon.

Preferably, the heating assembly further comprises: the heating device comprises a plurality of heating plates, wherein the heating plates are respectively and fixedly arranged on the inner wall surfaces of a plurality of placing grooves, an insulating layer is fixedly arranged on the inner wall surfaces of the fixing grooves, copper pipes are fixedly sleeved on the inner circular wall surfaces of the heating plates, and a temperature sensor is arranged on the outer circular wall surface of a first fixing cylinder.

Through adopting above-mentioned technical scheme, through setting up the copper pipe, can carry out fine transmission to the heat that the heating plate produced through the copper pipe, make the temperature of the excircle wall surface of semiconductor pipeline promote speed to heating element's practicality has been improved.

Preferably, the through hole is formed in the outer circular wall surface of the first fixed cylinder, the inner circular wall surface of the through hole is fixedly sleeved with the outer circular wall surface of the temperature sensor, a temperature display is fixedly installed at one end of the temperature sensor, and the other end of the temperature sensor is fixedly installed at one side of the heating plate at the right side.

Through adopting above-mentioned technical scheme, through setting up temperature sensor, can transmit the temperature of heating plate to temperature display through temperature sensor on, make things convenient for the staff to the audio-visual observation of temperature of heating plate, simultaneously with PLC controller electric connection, can be with signal transmission to the PLC controller when the temperature is too high to close the heating plate through the PLC controller.

Preferably, a positioning hole is formed in one side of the fixed block, and the inner circular wall surface of the positioning hole is movably sleeved with the outer circular wall surface of the bolt.

Through adopting above-mentioned technical scheme, through setting up the locating hole, can fix first fixed cylinder and second fixed cylinder under the effort of bolt through the locating hole to make things convenient for the staff to the dismantlement and the installation of first fixed cylinder and second fixed cylinder, and then improve staff's work efficiency.

Preferably, a plurality of limiting blocks are fixedly arranged on the outer circular wall surface of the second fixed cylinder, the limiting blocks correspond to the fixed blocks, a threaded hole is formed in one side of each limiting block, the threaded hole corresponds to the positioning hole, and the threaded hole is in threaded connection with the bolt.

Through adopting above-mentioned technical scheme, through setting up the stopper, can establish the fixed cover of first fixed section of thick bamboo and second fixed section of thick bamboo at the excircle wall surface of semiconductor pipeline under the effort of bolt through the stopper, make heating element can heat the semiconductor pipeline outer wall surface to the inside material of semiconductor pipeline heats.

In summary, the utility model has the following advantages:

through setting up heating element, can evenly heat through heating element to the outer circular wall of semiconductor tube, the incomplete problem of local heating has been avoided, thereby carry out the heat compensation to the outer circular wall of semiconductor tube under the effort of infrared heater, prevent that the heating plate from lasting heating inefficiency scheduling problem, through setting up infrared heater, can avoid the continuous heating of heating plate to lead to inefficiency problem through infrared heater, can carry out the heat compensation to the semiconductor tube, thereby make the inside temperature conduction of semiconductor tube more even, and then promote heating element's whole heating efficiency, avoid the appearance of local heating phenomenon, through setting up the copper pipe, can carry out fine transmission to the heat that the heating plate produced through the copper pipe, make the temperature of the outer circular wall of semiconductor tube promote the speed acceleration, thereby heating element's practicality has been improved, can be with the temperature transmission of heating plate to the temperature display on, make things convenient for the staff to the intuitive observation of temperature of heating plate, simultaneously with PLC controller electric connection, can be with signal transmission to the PLC controller when the temperature is too high, thereby close the heating plate through the PLC controller.

Through setting up the fixed slot, can install the heat preservation through the fixed slot, make heating element reduce thermal loss when the function, thereby heating element's heating efficiency has been improved, and then the stability of the heating of the inside material of semiconductor tube has been ensured, through setting up the locating hole, can fix first fixed section of thick bamboo and second fixed section of thick bamboo under the effort of bolt through the locating hole, thereby make things convenient for the staff to the dismantlement and the installation of first fixed section of thick bamboo and second fixed section of thick bamboo, and then improve staff's work efficiency, through setting up the stopper, can establish first fixed section of thick bamboo and the fixed cover of second fixed section of thick bamboo at the excircle wall of semiconductor tube way under the effort of bolt through the stopper, make heating element can heat the outer wall surface of semiconductor tube, thereby heat the inside material of semiconductor tube.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic view of a split construction of the present utility model;

FIG. 3 is a schematic view of the structure of the fixing ring of the present utility model;

FIG. 4 is an enlarged schematic view of the partial structure of FIG. 2A;

fig. 5 is a schematic diagram of a system block of the present utility model.

Reference numerals: 1. a first fixed cylinder; 2. a fixed block; 3. a bolt; 4. a second fixed cylinder; 5. a fixing ring; 6. a mounting groove; 7. an infrared heater; 8. a placement groove; 9. a heating sheet; 10. a heat preservation layer; 11. copper pipe; 12. a temperature sensor; 13. a temperature display; 14. a through hole; 15. positioning holes; 16. a limiting block; 17. a threaded hole; 18. a fixing groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, a semiconductor channel outer wall heater includes a first fixed cylinder 1, a plurality of fixed blocks 2 are fixedly installed on an outer circumferential wall surface of the first fixed cylinder 1, two of the plurality of fixed blocks 2 are a group, a PLC controller is fixedly installed on an outer circumferential wall surface of the first fixed cylinder 1, the PLC controller is electrically connected with an infrared heater 7, a heating plate 9 and a temperature sensor 12, the PLC controller is electrically connected with the infrared heater 7, the heating plate 9 and the temperature sensor 12 in an existing structure, which is not repeated herein, a bolt 3 is arranged on one side of the fixed block 2, the bolt 3 is an existing structure, which is not repeated herein, a second fixed cylinder 4 is arranged on one side of the first fixed cylinder 1, a fixed groove 18 is formed on one side of the first fixed cylinder 1, which is close to the second fixed cylinder 4, a heating assembly is arranged on an inner circumferential wall surface of the second fixed cylinder 4, the heat insulation layer 10 is used for heating the semiconductor tube, the heat insulation layer 10 can be installed through the fixing groove 18, the heat loss of the heating component is reduced during operation, the heating efficiency of the heating component is improved, the heating stability of substances in the semiconductor tube is further guaranteed, the heating component comprises a plurality of fixing rings 5, two of the plurality of fixing rings 5 are respectively fixedly installed at two ends of the first fixing cylinder 1 and the second fixing cylinder 4, a plurality of mounting grooves 6 are formed in the inner circular wall surface of the fixing rings 5, an infrared heater 7 is fixedly sleeved on the inner circular wall surface of the mounting grooves 6, a plurality of placing grooves 8 are formed in the inner circular wall surfaces of the first fixing cylinder 1 and the second fixing cylinder 4, the problem of low efficiency caused by continuous heating of the heating plates 9 can be avoided through the infrared heater 7 through the arrangement of the infrared heater 7, the semiconductor pipeline can be subjected to heat supplement, so that the temperature conduction in the semiconductor pipeline is more uniform, the overall heating efficiency of the heating assembly is improved, and the occurrence of a local heating phenomenon is avoided.

Referring to fig. 1, fig. 2, fig. 4 and fig. 5, heating element still includes a plurality of heating plate 9, a plurality of heating plate 9 fixed mounting respectively is at the inner wall of a plurality of standing groove 8, the inner wall fixed mounting of fixed slot 18 has heat preservation 10, the fixed cover of the interior wall of heating plate 9 is equipped with copper pipe 11, heat preservation 10 and copper pipe 11 have the structure and do not repeating here, the outer wall of first fixed section of thick bamboo 1 is provided with temperature sensor 12, through setting up copper pipe 11, can carry out fine transmission to the heat that heating plate 9 produced through copper pipe 11, make the temperature of the outer wall of semiconductor channel promote the speed, thereby the practicality of heating element has been improved, the through-hole 14 has been seted up to the outer wall of first fixed section of thick bamboo 1, the interior wall of through-hole 14 and the fixed cover of temperature sensor 12 are established, temperature sensor 12's one end fixed mounting has temperature display 13, temperature display 13 has the structure and does not do here in detail, temperature sensor 12's the other end and one side fixed mounting of right side heating plate 9, through setting up temperature sensor 12, can be to the temperature sensor 12 through temperature sensor 12, can be controlled to the temperature sensor 9 through temperature sensor, can be connected to temperature sensor 9 through temperature sensor 13 when the temperature sensor, can be with temperature controller 9, the PLC is convenient for carrying out the temperature control signal transmission to the PLC, and PLC is high temperature controller, the PLC is used to carry out, and can be connected to the temperature controller when the temperature controller is convenient to the temperature, and can be passed through to the PLC.

Referring to fig. 1, 2, 3 and 4, a positioning hole 15 is formed in one side of the fixing block 2, an inner circular wall surface of the positioning hole 15 is movably sleeved with an outer circular wall surface of the bolt 3, the first fixing cylinder 1 and the second fixing cylinder 4 can be fixed under the acting force of the bolt 3 through the positioning hole 15, so that a worker can conveniently detach and install the first fixing cylinder 1 and the second fixing cylinder 4, further the working efficiency of the worker is improved, a plurality of limiting blocks 16 are fixedly arranged on the outer circular wall surface of the second fixing cylinder 4, the limiting blocks 16 correspond to the fixing block 2, a threaded hole 17 is formed in one side of the limiting blocks 16, the threaded hole 17 corresponds to the positioning hole 15, the threaded hole 17 is in threaded connection with the bolt 3, the first fixing cylinder 1 and the second fixing cylinder 4 can be fixedly sleeved on the outer circular wall surface of the semiconductor pipeline under the acting force of the bolt 3 through the limiting blocks 16, and the heating assembly can heat the outer circular wall surface of the semiconductor pipeline, so that substances in the semiconductor pipeline can be heated.

Working principle: referring to fig. 1-5, when in use, a worker can take out the bolt 3 from the screw hole 17 in a rotating manner, then separate the first fixed cylinder 1 from the second fixed cylinder 4, and then respectively sleeve the first fixed cylinder 1 and the second fixed cylinder 4 on the outer circular wall surface of the semiconductor channel to be heated, at this time, the bolt 3 passes through the positioning hole 15 to be in threaded connection with the screw hole 17, then the heating plate 9 is started by the PLC controller, the heating plate 9 conducts heat to the outer circular wall surface of the semiconductor channel through the copper pipe 11, so that the temperature lifting speed of the outer circular wall surface of the semiconductor channel is accelerated, thereby improving the practicability of the heating assembly, further the temperature sensor 12 can transmit the temperature of the heating plate 9 to the temperature display 13, facilitating the visual observation of the temperature of the heating plate 9 by the worker, and simultaneously being electrically connected with the PLC controller, and transmitting signals to the PLC controller when the temperature is too high, thereby closing the heating plate 9 by the PLC controller, and then conducting heat to the semiconductor channel through the infrared heater 7 when the temperature is too low, so that the internal temperature of the semiconductor channel is conducted to the semiconductor channel is not uniform, thereby avoiding the problem of heat loss of the first heating assembly, the heating assembly is avoided, and the problem of the internal heat insulation of the first heating assembly is more uniform, and the heating assembly is avoided, and the problem of the heating assembly is not being heated, and the whole, and the problem of the heating assembly is avoided.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor die outer wall heater, comprising:

the fixing device comprises a first fixing barrel (1), wherein a plurality of fixing blocks (2) are fixedly arranged on the outer circular wall surface of the first fixing barrel (1), two of the fixing blocks (2) are in a group, one side of each fixing block (2) is provided with a bolt (3), one side of the first fixing barrel (1) is provided with a second fixing barrel (4), and fixing grooves (18) are formed in one sides, close to each other, of the first fixing barrel (1) and the second fixing barrel (4);

and the heating component is arranged on the inner circular wall surface of the second fixed cylinder (4) and is used for heating the semiconductor tube.

2. The semiconductor die outer wall heater of claim 1, wherein the heating assembly comprises:

the fixing device comprises a plurality of fixing rings (5), wherein two of the fixing rings (5) are fixedly arranged at two ends of a first fixing cylinder (1) and a second fixing cylinder (4), a plurality of mounting grooves (6) are formed in the inner circular wall surface of the fixing rings (5), an infrared heater (7) is fixedly sleeved on the inner circular wall surface of the mounting grooves (6), and a plurality of placing grooves (8) are formed in the inner circular wall surface of the first fixing cylinder (1) and the inner circular wall surface of the second fixing cylinder (4).

3. The semiconductor die outer wall heater of claim 2, wherein the heating assembly further comprises:

the heating device comprises a plurality of heating plates (9), wherein the heating plates (9) are fixedly arranged on the inner wall surfaces of a plurality of placing grooves (8) respectively, an insulating layer (10) is fixedly arranged on the inner wall surface of each fixing groove (18), copper pipes (11) are fixedly sleeved on the inner circular wall surface of each heating plate (9), and a temperature sensor (12) is arranged on the outer circular wall surface of each first fixing cylinder (1).

4. A semiconductor channel outer wall heater according to claim 3, wherein the outer circular wall surface of the first fixed cylinder (1) is provided with a through hole (14), the inner circular wall surface of the through hole (14) is fixedly sleeved with the outer circular wall surface of the temperature sensor (12), one end of the temperature sensor (12) is fixedly provided with a temperature display (13), and the other end of the temperature sensor (12) is fixedly provided with one side of the right heating plate (9).

5. The semiconductor pipeline outer wall heater according to claim 1, wherein a positioning hole (15) is formed in one side of the fixed block (2), and an inner circular wall surface of the positioning hole (15) is movably sleeved with an outer circular wall surface of the bolt (3).

6. The semiconductor pipeline outer wall heater according to claim 5, wherein a plurality of limiting blocks (16) are fixedly arranged on the outer circular wall surface of the second fixed cylinder (4), the limiting blocks (16) correspond to the fixed blocks (2), threaded holes (17) are formed in one side of each limiting block (16), the threaded holes (17) correspond to the positioning holes (15), and the threaded holes (17) are in threaded connection with the bolts (3).