CN218947352U

CN218947352U - Automatic feeding mechanism for small tower base silicon wafer alkali polishing auxiliary agent

Info

Publication number: CN218947352U
Application number: CN202223030263.6U
Authority: CN
Inventors: 许亚文; 尹超; 石宁
Original assignee: Jiangsu Longheng New Energy Co ltd
Current assignee: Jiangsu Longheng New Energy Co ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-05-02
Anticipated expiration: 2032-11-14

Abstract

The utility model belongs to the technical field of silicon wafer alkali polishing, and particularly relates to an automatic feeding mechanism for a small tower-based silicon wafer alkali polishing auxiliary agent, which comprises a main box body, wherein a bearing is embedded in the center of the top of the main box body, a main rod body is inserted and connected in the bearing, a stirring rod in an inclined state is fixedly sleeved on the surface of the main rod body positioned in the main box body, a feeding pipe is fixedly inserted and connected at the top of the main box body, a driving mechanism capable of enabling the main rod body to rotate is arranged at the top of the main box body, mounting frames are fixedly arranged on two sides of the inner wall of the main box body, a filter plate is movably arranged between inner cavities of the two mounting frames, a vibration stirring sheet is fixedly arranged at the bottom of the filter plate and in an inclined state, a discharging pipe which is inclined downwards is fixedly inserted and connected at one side of the main box body, and a control valve is arranged in the discharging pipe.

Description

Automatic feeding mechanism for small tower base silicon wafer alkali polishing auxiliary agent

Technical Field

The utility model belongs to the technical field of silicon wafer alkali polishing, and particularly relates to an automatic feeding mechanism of a small tower base silicon wafer alkali polishing auxiliary agent.

Background

Silicon wafer alkali is required to be polished during processing.

When silicon wafer alkali is polished, a certain amount of auxiliary agent is needed to enhance the polishing efficiency, while in the use process of the existing auxiliary agent, the auxiliary agent is often impure, and some tiny impurities contained in the auxiliary agent can influence the whole polishing process, so that a more perfect automatic feeding device of the silicon wafer alkali polishing auxiliary agent is needed.

Disclosure of Invention

Aiming at the situation, in order to overcome the defects in the prior art, the utility model provides an automatic feeding mechanism of the small tower-based silicon wafer alkali polishing auxiliary agent, which effectively solves the problems in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a little tower base silicon chip alkali polishing auxiliary agent automatic material conveying mechanism, includes the main tank body, the top center of main tank body is embedded to have a bearing, the inside of bearing runs through the grafting has the main pole body, the main pole body is located the inside stirring rod of inclined state of fixed sleeve on the surface of main tank body, the fixed grafting in top of main tank body has the inlet pipe, the top of main tank body is provided with the actuating mechanism that can let main pole body pivoted, the equal fixed mounting in inner wall both sides of main tank body has the installing frame, two movable mounting has the filter between the inner chamber of installing frame, the bottom fixed mounting of filter has vibrations plectrum and the filter is inclined state, the fixed grafting of one side of main tank body has the discharging pipe of downward sloping, be provided with the control valve in the discharging pipe.

Further, the driving mechanism comprises a driving motor, a driving bevel gear and a driven bevel gear, wherein the driven bevel gear is fixedly arranged at the top end of the main rod body, the driving motor is fixedly arranged at the top of the main box body, the driving bevel gear is fixedly arranged at the output end of the driving motor, and the driving bevel gear and the driven bevel gear are meshed with each other.

Further, a protective housing is provided on the outer peripheral side of the driving mechanism.

Furthermore, a transparent glass plate is embedded in the front surface of the main box body, and a control panel is fixedly arranged on the front surface of the main box body.

Furthermore, universal wheels with locks are fixedly arranged at four corners of the bottom of the main box body.

Further, a notch is formed in the front face of the main box body, located below the filter plate, and a cover plate for sealing the notch is hinged to one side of the notch.

Further, the folding hose is fixedly sleeved on one end of the discharging pipe, which is positioned outside the main box body.

Compared with the prior art, the utility model has the beneficial effects that:

the auxiliary agent required in the process of polishing silicon wafer alkali can be deleted, so that fine impurities are prevented from entering the silicon wafer alkali, and the silicon wafer alkali polishing device can automatically feed materials after screening is completed.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic cross-sectional view of the present utility model;

FIG. 2 is a schematic diagram of the front view of the present utility model;

FIG. 3 is a schematic view of a partial structure of a conveyor belt of the present utility model in a top view;

in the figure: 1. a main case; 2. a main rod body; 3. a bearing; 4. a feed pipe; 5. a stirring rod; 6. a driving motor; 7. a drive bevel gear; 8. a driven bevel gear; 9. a protective shell; 10. a mounting frame; 11. a filter plate; 12. vibrating the poking piece; 13. a cover plate; 14. a discharge pipe; 15. a control valve; 16. folding the hose; 17. universal wheels with locks; 18. a transparent glass plate; 19. and a control panel.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model discloses an automatic feeding mechanism for a small tower base silicon wafer alkali polishing auxiliary agent, which is provided by an embodiment I, and is shown in figures 1-3, and comprises a main box body 1, wherein a bearing 3 is embedded in the center of the top of the main box body 1, a main rod body 2 is inserted and connected in a penetrating manner in the bearing 3, a stirring rod 5 in an inclined state is fixedly sleeved on the surface of the main box body 1, a feeding pipe 4 is fixedly inserted and connected at the top of the main box body 1, a driving mechanism capable of enabling the main rod body 2 to rotate is arranged at the top of the main box body 1, mounting frames 10 are fixedly arranged on two sides of the inner wall of the main box body 1, a filter plate 11 is movably arranged between inner cavities of the two mounting frames 10, a vibration stirring sheet 12 is fixedly arranged at the bottom of the filter plate 11 and is in an inclined state, a downward inclined discharging pipe 14 is fixedly inserted and connected at one side of the main box body 1, and a control valve 15 is arranged in the discharging pipe 14.

In the second embodiment, on the basis of the first embodiment, the driving mechanism includes a driving motor 6, a driving bevel gear 7 and a driven bevel gear 8, the driven bevel gear 8 is fixedly mounted at the top end of the main rod body 2, the driving motor 6 is fixedly mounted at the top of the main box body 1, the driving bevel gear 7 is fixedly mounted at the output end of the driving motor 6, the driving bevel gear 7 and the driven bevel gear 8 are meshed with each other, the driving motor 6 is started, the driving bevel gear 7 is driven to rotate by the driving motor 6, the driven bevel gear 8 is driven to rotate, and the main rod body 2 can be driven to rotate.

In the third embodiment, a protective case 9 is provided on the outer peripheral side of the driving mechanism to protect the driving mechanism.

In the fourth embodiment, on the basis of the first embodiment, the front surface of the main box 1 is embedded with the transparent glass plate 18, and the front surface of the main box 1 is fixedly provided with the control panel 19, the transparent glass plate 18 can conveniently observe the internal condition of the main box 1, and the control panel 19 can facilitate the operator to conveniently operate the device.

In the fifth embodiment, on the basis of the first embodiment, the locked universal wheels 17 are fixedly installed at four corners of the bottom of the main box body 1, so that the main box body 1 can be moved conveniently.

In the sixth embodiment, on the basis of the first embodiment, a notch is formed in the front surface of the main case 1 below the filter plate 11, a cover plate 13 for sealing the notch is hinged to one side of the notch, and impurities at the bottom of the main case 1 can be taken out by opening the cover plate 13.

In the seventh embodiment, on the basis of the first embodiment, a folding hose 16 is fixedly sleeved on one end of the discharging pipe 14, which is positioned outside the main box body 1.

Working principle: when the auxiliary agent is added, firstly, the folding hose 16 is inserted into the feed inlet of the silicon wafer alkali polishing device, then the auxiliary agent is poured into the main box body 1 from the feed pipe 4, the driving motor 6 is started, the driving motor 6 can drive the driving bevel gear 7 to rotate, then the driven bevel gear 8 is driven to rotate, then the main rod body 2 can be driven to rotate, the stirring rod 5 can stir the auxiliary agent above the filter plate 11 through the rotation of the main rod body 2, the vibration stirring plate 12 is opened, the filter plate 11 can shake up and down in the mounting frame 10, the filtering rate of the filter plate 11 is enhanced, the control valve 15 is opened after the filtering is completed, the auxiliary agent above the filter plate 11 can flow into the folding hose 16 along the discharge pipe 14, and finally falls into the silicon wafer alkali polishing device.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a little tower base silicon chip alkali polishing auxiliary agent automatic material conveying mechanism, includes main box (1), its characterized in that: the utility model discloses a novel vibrating screen is characterized in that a bearing (3) is embedded in the top center of a main box body (1), a main rod body (2) is inserted through the inside of the bearing (3), a stirring rod (5) in an inclined state is fixedly sleeved on the surface of the main rod body (2) inside the main box body (1), a feeding pipe (4) is fixedly inserted at the top of the main box body (1), a driving mechanism capable of enabling the main rod body (2) to rotate is arranged at the top of the main box body (1), a mounting frame (10) is fixedly arranged on two sides of the inner wall of the main box body (1), a filter plate (11) is movably mounted between inner cavities of the mounting frame (10), a vibrating pulling plate (12) and the filter plate (11) are fixedly mounted at the bottom of the filter plate (11) in an inclined state, a discharging pipe (14) inclined downwards is fixedly inserted at one side of the main box body (1), and a control valve (15) is arranged in the discharging pipe (14).

2. The automatic feeding mechanism for the small tower base silicon wafer alkali polishing auxiliary agent according to claim 1, wherein the automatic feeding mechanism is characterized in that: the driving mechanism comprises a driving motor (6), a driving bevel gear (7) and a driven bevel gear (8), wherein the driven bevel gear (8) is fixedly arranged at the top end of the main rod body (2), the driving motor (6) is fixedly arranged at the top of the main box body (1), the driving bevel gear (7) is fixedly arranged at the output end of the driving motor (6), and the driving bevel gear (7) and the driven bevel gear (8) are meshed with each other.

3. The automatic feeding mechanism for the small tower base silicon wafer alkali polishing auxiliary agent according to claim 2, wherein the automatic feeding mechanism is characterized in that: a protective shell (9) is arranged on the outer periphery side of the driving mechanism.

4. The automatic feeding mechanism for the small tower base silicon wafer alkali polishing auxiliary agent according to claim 1, wherein the automatic feeding mechanism is characterized in that: the front of the main box body (1) is embedded with a transparent glass plate (18), and the front of the main box body (1) is fixedly provided with a control panel (19).

5. The automatic feeding mechanism for the small tower base silicon wafer alkali polishing auxiliary agent according to claim 1, wherein the automatic feeding mechanism is characterized in that: the four corners of the bottom of the main box body (1) are fixedly provided with universal wheels (17) with locks.

6. The automatic feeding mechanism for the small tower base silicon wafer alkali polishing auxiliary agent according to claim 1, wherein the automatic feeding mechanism is characterized in that: the front face of the main box body (1) below the filter plate (11) is provided with a notch, and one side of the notch is hinged with a cover plate (13) for sealing the notch.

7. The automatic feeding mechanism for the small tower base silicon wafer alkali polishing auxiliary agent according to claim 1, wherein the automatic feeding mechanism is characterized in that: the folding hose (16) is fixedly sleeved on one end of the discharging pipe (14) positioned outside the main box body (1).