CN218941456U

CN218941456U - Circuit board electronic component welding spot repairing device

Info

Publication number: CN218941456U
Application number: CN202222838188.XU
Authority: CN
Inventors: 林海清; 林珍朱; 李捷凯
Original assignee: Fuzhou Tuowei Electronic Technology Co ltd
Current assignee: Fuzhou Tuowei Electronic Technology Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-04-28
Anticipated expiration: 2032-10-27

Abstract

The utility model discloses a circuit board electronic element welding spot repairing device which comprises a base and a placing plate, wherein a movable frame is movably clamped on the placing plate, a connecting screw is connected in a threaded hole in a threaded manner, the bottom end of the connecting screw is fixedly connected with a pressing plate, the bottom end of the supporting frame is respectively provided with a tin suction belt roller and a linear moving assembly, and the lower end of the linear moving assembly is connected with a clamping sleeve through a universal joint. The welding spot repairing device for the electronic component of the circuit board guides the pulled tin-absorbing belt by utilizing the guide roller, covers the tin-absorbing belt on the welding spot to be repaired, clamps the welding head in the clamping sleeve, can directly drive the welding head to linearly reciprocate on the tin-absorbing belt through the linear driving assembly, ensures the stability of the welding head and the pressure stability between the welding head and the circuit board in the moving process, reduces the damage to the circuit board, and improves the repairing quality.

Description

Circuit board electronic component welding spot repairing device

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a device for repairing welding spots of electronic elements of a circuit board.

Background

In the manufacturing process of the circuit board, the phenomenon that welding spots are unqualified often occurs, so that some defective products or unqualified products occur, in order to save cost, a part of circuit board products are usually required to be repaired by using some repairing means, the repairing process is generally manual repairing, and also there is a repairing means by using automatic machinery, but the cost is high, the manual repairing is usually that an operator holds a soldering bit and a solder absorber or a solder strip firstly to suck soldering tin at the unqualified welding spots, and then performs a spot welding process on the welding spots again, so that the repairing purpose is achieved. Therefore, we propose a circuit board electronic component solder joint repairing device.

Disclosure of Invention

The utility model aims to provide a circuit board electronic element welding spot repairing device which is used for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a circuit board electronic component solder joint prosthetic devices, includes the base and places the board, place the board and be located the base top, be provided with vacuum chuck on placing the board, place board upper end one side and be provided with the guide roll, movable joint has the movable frame on the board, the equidistant screw hole that arranges of movable frame upper end, threaded hole threaded connection has connecting screw, connecting screw bottom fixedly connected with clamp plate, base upper end fixedly connected with support, be connected with the support frame through the cylinder subassembly on the support, the support frame bottom is provided with tin suction belt roller and rectilinear movement subassembly respectively, rectilinear movement subassembly lower extreme is connected with the centre gripping sleeve through the universal joint.

Preferably, the limiting grooves are symmetrically formed in two sides of the placing plate, limiting blocks are fixedly connected to the inner wall of the movable frame, and the limiting blocks are movably clamped in the limiting grooves.

Preferably, a guide groove is formed in the side face of the support, a guide block is fixedly connected to one end of the support frame, and the guide block is movably clamped in the guide groove.

Preferably, the linear movement assembly comprises a screw rod, a handle, a screw rod nut and a limiting rod, wherein the screw rod is movably connected below the supporting frame, one end of the screw rod is fixedly connected with the handle, the screw rod is connected with the screw rod nut in a threaded manner, the limiting rod penetrates through the screw rod nut, and the universal joint is connected to the bottom end of the screw rod nut.

Preferably, the clamping sleeve is provided with an adjusting screw in a penetrating mode, the adjusting screws are arranged in an annular mode, and the end portion of each adjusting screw is fixedly connected with an arc-shaped clamping plate.

Compared with the prior art, the utility model has the beneficial effects that: this kind of circuit board electronic component solder joint prosthetic devices adsorbs and fixes the circuit board on placing the board through vacuum chuck, directly cup joint the solder strip on the solder strip roller, utilize the guide roll to lead to the solder strip that pulls down, and cover it on the solder joint that needs to be repaired, the cooperation through connecting screw rod and clamp plate carries out the crimping to the tip of solder strip and fixes, with soldering iron head centre gripping in the centre gripping sleeve, utilize cylinder assembly to drive soldering iron head height-adjusting, until the soldering iron head can contact the solder strip surface, can directly drive soldering iron head on the solder strip straight reciprocating motion through sharp drive assembly, guarantee the stability of soldering iron head and the pressure stability between soldering iron head and the circuit board in the removal process, reduce the damage that causes the circuit board, improve repair quality.

Drawings

FIG. 1 is a front view of the present utility model;

FIG. 2 is a schematic perspective view of a placement plate according to the present utility model;

fig. 3 is a partial front cross-sectional view of the stent of the present utility model.

In the figure: the device comprises a base 1, a placing plate 2, a vacuum chuck 3, a bracket 4, an air cylinder assembly 5, a supporting frame 6, a guide groove 7, a guide block 8, a tin sucking belt roller 9, a guide roller 10, a moving frame 11, a threaded hole 12, a connecting screw 13, a pressing plate 14, a limiting groove 15, a limiting block 16, a linear moving assembly 17, a screw rod 171, a handle 172, a screw rod nut 173, a limiting rod 174, a universal joint 18, a clamping sleeve 19, an adjusting screw 20 and an arc clamping plate 21.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a circuit board electronic component solder joint prosthetic devices, including base 1 and placing board 2, placing board 2 is located base 1 top, is provided with vacuum chuck 3 on placing board 2, and vacuum chuck 3 is connected with air duct and vacuum pump subassembly, and vacuum chuck 3 evenly distributed is on placing board 2, when repairing the circuit board, can directly place the circuit board in the suitable position of placing on board 2 to utilize vacuum chuck 3 to adsorb fixedly the circuit board, avoid shifting the circuit board in the repair process;

the upper end of the placing plate 2 is provided with a guide roller 10, the guide roller 10 is positioned at one side of the placing plate 2, a tin-absorbing belt is placed at the upper position of the placing plate 2, after the end part of the tin-absorbing belt is pulled down from the upper part, the end part of the tin-absorbing belt is wound around the guide roller 10 and is paved on the placing plate 2, so that the tin-absorbing belt can be paved on a circuit board, in addition, when the circuit board is placed, the circuit board is moved back and forth on the placing plate 2 according to the relative positions of the tin-absorbing belt and a repaired welding spot, and the paved tin-absorbing belt can be covered on the welding spot to be repaired;

the movable clamping connection device comprises a placing plate 2, a movable frame 11, threaded holes 12, connecting screws 13, pressing plates 14, a pressing plate 14, a tin sucking belt, a welding point, a connecting screw 13, a pressing plate 14, a tin sucking belt, a connecting screw, a pressing plate 14 and a tin sucking plate, wherein the movable frame 11 is movably clamped on the placing plate 2, the threaded holes 12 are arranged at the upper end of the movable frame 11 at equal intervals, the connecting screw 13 is connected with the connecting screw through threads, the pressing plate 14 is fixedly connected with the bottom end of the connecting screw, the cross section of the movable frame 11 can be of an inverted U-shaped structure, the two sides of the movable frame are movably clamped on the two sides of the placing plate 2, the movable frame 11 can move left and right on the placing plate 2, after the tin sucking belt is paved on the welding point, the movable frame 11 moves back and forth, the movable frame 11 is positioned at the end position of the tin sucking belt, the connecting screw 13 is connected with the corresponding threaded holes 12 through threads, and rotates, and the pressing plate 14 is adjusted until the pressing plate 14 abuts against the end of the tin sucking belt;

limiting grooves 15 are symmetrically formed in two sides of the placing plate 2, limiting blocks 16 are fixedly connected to the inner wall of the movable frame 11, the limiting blocks 16 are movably clamped in the limiting grooves 15, and when the movable frame 11 moves forwards and backwards, the limiting blocks 16 move forwards and backwards in the limiting grooves 15, so that the guiding limiting effect on the movable frame 11 is realized;

the upper end of the base 1 is fixedly connected with a support 4, the support 4 is connected with a support frame 6 through an air cylinder assembly 5, the bottom end of the support frame 6 is respectively provided with a tin-absorbing belt roller 9 and a linear moving assembly 17, the lower end of the linear moving assembly 17 is connected with a clamping sleeve 19 through a universal joint 18, the support 4 is of an inverted L-shaped cross section structure, the air cylinder assembly 5 is fixedly connected with the upper end of the support frame 4, the stroke end of the air cylinder assembly 5 is fixedly connected with the upper end of the support frame 6, the height of the support frame 6 can be adjusted up and down by utilizing the air cylinder assembly 5, a tin-absorbing belt roller is sleeved on the tin-absorbing belt roller 9, the tin-absorbing belt roller 9 can be detached from the lower part of the support frame 6, the tin-absorbing belt roller is convenient to replace a tin-absorbing belt reel, the handle of a soldering iron head can be clamped in the clamping sleeve 19, the angle of the clamping sleeve 19 is adjusted through the universal joint 18, the transverse position of the clamping sleeve 19 is adjusted by utilizing the air cylinder assembly 5, the soldering iron head can be contacted with a tin-absorbing belt below, the soldering iron head can be contacted with a soldering iron pad at the same time, the transverse position of the clamping sleeve 19 is adjusted by utilizing the linear adjusting assembly 17, the soldering iron head can be contacted with a soldering iron pad, the soldering tin can be directly repaired, the soldering tin can be absorbed on a soldering pad, and can be directly and absorbed by a soldering circuit after the soldering tin can be directly and absorbed by a soldering pad;

the side of the support 4 is provided with a guide groove 7, one end of the support frame 6 is fixedly connected with a guide block 8, the guide block 8 is movably clamped in the guide groove 7, and when the support frame 6 moves up and down, the guide block 8 can move up and down in the guide groove 7 to support and guide the support frame 6;

the linear moving assembly 17 comprises a screw rod 171, a handle 172, a screw rod nut 173 and a limiting rod 174, wherein the screw rod 171 is movably connected below the supporting frame 6, one end of the screw rod 171 is fixedly connected with the handle 172, the screw rod 171 is connected with the screw rod nut 173 in a threaded manner, the limiting rod 174 penetrates through the screw rod nut 173 to be arranged, the universal joint 18 is connected to the bottom end of the screw rod nut 173, the handle 172 can drive the screw rod 171 to rotate, and then the screw rod nut 173 drives the clamping sleeve 19 to slowly reciprocate under the limiting action of the limiting rod 174;

the clamping sleeve 19 is provided with the adjusting screw rods 20 in a penetrating mode, the adjusting screw rods 20 are in annular arrangement, the end portions of the adjusting screw rods 20 are fixedly connected with the arc clamping plates 21, the adjusting screw rods 20 can be rotated to drive the arc clamping plates 21 to adjust positions forwards and backwards until the arc clamping plates 21 are abutted to the side walls of the soldering iron head handles, and stable clamping of the soldering iron head handles is achieved.

When the soldering iron is used, a circuit board is directly placed at a proper position on the placing plate 2, the circuit board is adsorbed and fixed by utilizing the vacuum chuck 3, the tin absorption belt on the tin absorption belt roller 9 is pulled down, the end part of the tin absorption belt is wound and connected with the guide roller 10 and is paved on the placing plate 2, the paved solder absorption belt can be covered on a welding spot needing to be repaired, the moving frame 11 is moved back and forth, the moving frame 11 is positioned at the end part of the tin absorption belt, the connecting screw 13 is connected in the corresponding threaded hole 12 in a threaded manner and rotates, the height of the pressing plate 14 is regulated until the pressing plate 14 abuts against the end part of the tin absorption belt, the tin absorption belt is fixed, the handle part of the soldering iron head is clamped in the clamping sleeve 19, the angle of the clamping sleeve 19 is regulated by the universal joint 18, the height of the supporting frame 6 is regulated by the cylinder component 5, the soldering iron head can contact the lower tin absorption belt, the welding spot is firstly regulated by utilizing the linear regulating component 17, the transverse position of the clamping sleeve 19, the soldering iron head can contact with the repairing welding spot, the soldering iron head can be driven to the end part of the tin absorption belt, the connecting screw 13 is screwed into the corresponding threaded hole 12, the corresponding tin absorption belt can be directly absorbed, the soldering iron can be directly absorbed by the welding spot, and the circuit can be repaired, and the purpose of the soldering iron can be directly absorbed by the soldering iron and the welding point.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board electronic component solder joint prosthetic devices, includes base (1) and places board (2), its characterized in that: place board (2) and be located base (1) top, be provided with vacuum chuck (3) on placing board (2), place board (2) upper end one side and be provided with guide roll (10), movable joint has movable frame (11) on placing board (2), equidistant screw hole (12) of being arranged in movable frame (11) upper end, screw hole (12) female screw connection has connecting screw (13), connecting screw (13) bottom fixedly connected with clamp plate (14), base (1) upper end fixedly connected with support (4), be connected with support frame (6) through cylinder subassembly (5) on support (4), support frame (6) bottom is provided with solder suction belt roller (9) and rectilinear movement subassembly (17) respectively, rectilinear movement subassembly (17) lower extreme is connected with centre gripping sleeve (19) through universal joint (18).

2. The circuit board electronic component solder joint repairing apparatus according to claim 1, wherein: limiting grooves (15) are symmetrically formed in two sides of the placing plate (2), limiting blocks (16) are fixedly connected to the inner wall of the movable frame (11), and the limiting blocks (16) are movably clamped in the limiting grooves (15).

3. The circuit board electronic component solder joint repairing apparatus according to claim 1, wherein: the side of the support (4) is provided with a guide groove (7), one end of the support frame (6) is fixedly connected with a guide block (8), and the guide block (8) is movably clamped in the guide groove (7).

4. The circuit board electronic component solder joint repairing apparatus according to claim 1, wherein: the linear movement assembly (17) comprises a screw rod (171), a handle (172), a screw rod nut (173) and a limiting rod (174), wherein the screw rod (171) is movably connected below the supporting frame (6), one end of the screw rod (171) is fixedly connected with the handle (172), the screw rod (171) is connected with the screw rod nut (173) in a threaded mode, the limiting rod (174) penetrates through the screw rod nut (173) to be arranged, and the universal joint (18) is connected to the bottom end of the screw rod nut (173).

5. The circuit board electronic component solder joint repairing apparatus according to claim 1, wherein: the clamping sleeve (19) is provided with an adjusting screw (20) in a penetrating mode, the adjusting screws (20) are arranged in an annular mode, and the end portion of each adjusting screw (20) is fixedly connected with an arc clamping plate (21).