CN218939632U

CN218939632U - Wafer negative pressure suction type control device

Info

Publication number: CN218939632U
Application number: CN202223230316.9U
Authority: CN
Inventors: 曾麒文; 洪成都
Original assignee: Suzhou Juyun Technology Co ltd
Current assignee: Suzhou Juyun Technology Co ltd
Priority date: 2022-12-03
Filing date: 2022-12-03
Publication date: 2023-04-28
Anticipated expiration: 2032-12-03

Abstract

The utility model provides a wafer negative pressure suction type control device, which comprises a negative pressure pipe, wherein a vertical negative pressure cavity is arranged between two single pipes of the negative pressure pipe, a horizontal negative pressure plate capable of moving up and down is arranged in the negative pressure cavity, a control cylinder is arranged at the upper part of the negative pressure cavity, the telescopic end of the control cylinder is fixedly connected with the negative pressure plate, the control cylinder can pull the negative pressure plate upwards, and the negative pressure pipe is communicated with the lower part of the negative pressure cavity; the lower part of each negative pressure pipe single pipe is provided with more than two adsorption pads in a arraying way, the lower parts of the adsorption pads are elastically attached to the surface of a wafer, and through holes which are vertically communicated are processed in the middle of the adsorption pads. When the device is used, the adsorption force between the adsorption pad and the wafer is larger, so that the wafer cannot fall off even if the wafer is subjected to larger external force in the processing or transferring process; meanwhile, the adsorption pad can keep adsorbing the wafer, so that energy is not required to be continuously consumed, and the energy is saved.

Description

Wafer negative pressure suction type control device

Technical Field

The utility model relates to the technical field of wafer production line equipment, in particular to a wafer negative pressure suction type control device.

Background

The wafer needs to be subjected to subsequent processing flows such as grinding, polishing and layering after the slicing process, the wafer needs to be fixed in the processing process of each wafer slice, and when the wafer is transferred in equipment of different processing flows, the wafer slice needs to be grasped generally, the wafer slice is adsorbed by a traditional adsorption disc with negative pressure for fixing and grasping the wafer, and the wafer slice is moved to equipment of the next processing flow by a manipulator controlled by the negative pressure adsorption disc in the grasping process. However, the traditional wafer adsorption disc adopts a negative pressure pump to provide negative pressure, the negative pressure is smaller, the adsorption force on the wafer is smaller, and once the wafer is subjected to larger external force in the adsorption process, the wafer is easy to fall off; and when the wafer is fixed or grabbed, the negative pressure pump is required to continuously work to provide negative pressure, so that energy consumption is relatively high.

Disclosure of Invention

The utility model provides the wafer negative pressure suction type control device with stronger wafer adsorption and adsorption holding functions.

The technical scheme adopted for solving the technical problems is as follows: the wafer negative pressure suction type control device comprises more than 1 group of negative pressure pipes, wherein each negative pressure pipe comprises two single pipes which are bilaterally symmetrical, a vertical negative pressure cavity is arranged between the two single pipes of each negative pressure pipe, a horizontal negative pressure plate which can move up and down is arranged in each negative pressure cavity, the negative pressure plates are sealed with the inner walls of the negative pressure cavities in a sliding manner, a control cylinder is arranged at the upper part of each negative pressure cavity, the telescopic end of each control cylinder is fixedly connected with each negative pressure plate, the control cylinder can pull the corresponding negative pressure plate upwards, and the negative pressure pipe is communicated with the lower part of each negative pressure cavity; the lower part of each negative pressure pipe single pipe is arranged and assembled with more than two adsorption pads, the adsorption pads are umbrella-shaped, the adsorption pads are made of elastic materials, the lower parts of the adsorption pads are elastically attached to the surface of a wafer, and through holes which are vertically communicated are processed in the middle of the adsorption pads.

Preferably, the cross-sectional area of the negative pressure cavity is five times or more than the single-tube cross-sectional area of the negative pressure tube.

Preferably, the device comprises an inner group of negative pressure pipes and an outer group of negative pressure pipes, wherein the inner group of negative pressure pipes are bilaterally symmetrical, the outer group of negative pressure pipes are formed by two single pipes which are bilaterally symmetrical, and the two sides of the inner group of negative pressure pipes are respectively connected with an independent negative pressure cavity.

Preferably, the negative pressure pipe is made of stainless steel materials, and the upper part of the negative pressure pipe is connected through a cross rod.

Preferably, the upper part of the cross bar is connected with a flange through a bar.

Preferably, the lower part of each single tube on the negative pressure tube is provided with 3-6 adsorption pads.

Preferably, the lower part of the negative pressure cavity is communicated with the outside through a control valve.

The utility model has the beneficial effects that: the negative pressure suction type control device for the wafer can be used in wafer processing equipment as equipment for fixing the wafer, and can be used in a grabbing module of the wafer. When the device is used, the adsorption pad is attached to the surface of a wafer, then the negative pressure plate is driven to move upwards through the control cylinder, the lower part of the negative pressure cavity is pumped, the air pressure in the negative pressure cavity and the negative pressure pipe is reduced, and the lower part of the adsorption pad is umbrella-shaped and is communicated with the negative pressure pipe in the middle because the lower part of the adsorption pad is attached to the surface of the wafer, so that the negative pressure of the lower part of the adsorption pad can adsorb the wafer. In the device, the negative pressure generated by the suction of the negative pressure cavity through the negative pressure plate is lower than the negative pressure generated by the air pump, so that the adsorption force between the adsorption pad and the wafer is larger, and the wafer cannot fall off even if the wafer is subjected to larger external force in the processing or transferring process; meanwhile, the adsorption pad is made of elastic materials, so that a closed cavity is formed between the lower part of the adsorption pad and the negative pressure cavity, the adsorption pad can adsorb wafers, and compared with a negative pressure pump adsorption structure, the adsorption pad does not need to continuously consume energy, and is more energy-saving.

Drawings

Fig. 1 is a schematic diagram of a structure of a wafer negative pressure suction type control device in a front direction.

Fig. 2 is a schematic structural diagram of a wafer negative pressure suction control device in a top view direction.

Fig. 3 is an enlarged schematic view of the cross-section taken along the direction A-A in fig. 2.

Detailed Description

The utility model is further illustrated by the following examples:

in this patent, directional terms are used in relation to each other based on the orientation or positional relation of the figures shown in fig. 1 and 3, only for simplifying the description of the present application, not indicating the specific orientation that the device or element must have, and thus should not be construed as limiting the present application.

In this embodiment, as shown in fig. 1, 2 and 3, the wafer negative pressure suction control device includes more than 1 group of negative pressure pipes 1, the negative pressure pipes 1 include two single pipes which are symmetrical left and right, and a vertical negative pressure cavity 2 is assembled between the two single pipes of the negative pressure pipes 1. The inside of the negative pressure cavity 2 is a cylindrical cavity, a horizontal negative pressure plate 21 capable of moving up and down is assembled in the negative pressure cavity 2, and sliding seal is arranged between the negative pressure plate 21 and the inner wall of the negative pressure cavity 2. The upper part of the negative pressure cavity is provided with a control cylinder 3, the telescopic end of the control cylinder 3 is fixedly connected with a negative pressure plate 21, and the control cylinder 3 can pull the negative pressure plate 21 up and down. The negative pressure pipe 1 is communicated with the lower part of the negative pressure cavity 2, the lower part of the negative pressure cavity 2 is closed, and a connecting port is designed on the side edge of the lower part of the negative pressure cavity 2. The lower part of each negative pressure pipe 2 single tube is arranged and equipped with more than two adsorption pads 11, the adsorption pads 11 are umbrella-shaped, and the umbrella mouth direction is downward. The adsorption pad 11 is made of elastic materials, the lower part of the adsorption pad 11 is elastically attached to the surface of the wafer 4, and a through hole which penetrates up and down is processed in the middle of the adsorption pad 11.

The wafer negative pressure suction type control device can be used in wafer processing equipment as equipment for fixing wafers, and can also be assembled on a mechanical arm for grabbing wafer sheets. When the device is used, the adsorption pad 11 is attached to the surface of the wafer 4, then the negative pressure plate 21 is driven to move upwards through the control cylinder 3, the lower part of the negative pressure cavity 2 is pumped, the air pressure in the negative pressure cavity 2 and the negative pressure pipe 1 is reduced, in the embodiment, the lower parts of the adsorption pads 11 are attached to the surface of the wafer 4 in an array mode, and as the lower parts of the adsorption pads 11 are umbrella-shaped and are communicated with the negative pressure pipe 11 in the middle, the negative pressure at the lower parts of the adsorption pads 11 can adsorb the wafer 4. In the device, the negative pressure generated by the suction of the negative pressure cavity 2 through the negative pressure plate 21 is lower than the negative pressure generated by the air pump, so that the adsorption force between the adsorption pad 11 and the surface of the wafer 4 is larger, and the wafer 4 cannot fall off even if a larger external force is applied in the processing or transferring process; meanwhile, as the adsorption pad 11 is made of elastic materials (such as silica gel rubber, etc.), a closed cavity is formed between the lower part of the adsorption pad 11 and the negative pressure cavity 2, so that the adsorption pad 11 can adsorb wafers, and compared with a negative pressure pump adsorption structure, the adsorption pad has the advantages of no continuous energy consumption and more energy conservation. When the suction pad 11 is required to be separated from the wafer 4, the telescopic end of the control cylinder 3 controls the negative pressure plate 21 to move downwards, so that the suction pad 11 can be separated from the wafer 4 when the inner side of the suction pad is positive pressure.

In a specific design, the cross-sectional area of the negative pressure cavity 2 is more than five times of the single-tube cross-sectional area of the negative pressure tube 1. The larger the sectional area of the negative pressure chamber 2 is, the smaller the distance of movement of the telescopic end of the control cylinder 3 is, so that the device is miniaturized.

In a specific design, as shown in fig. 1 and 2, the device comprises an inner negative pressure pipe 1 and an outer negative pressure pipe 1, wherein the inner negative pressure pipe 1 is bilaterally symmetrical, the outer negative pressure pipe 1 is formed by bilaterally symmetrical two single pipes, and each negative pressure pipe 1 is connected with an independent negative pressure cavity 2. The design of two sets of negative pressure pipes 1 for the device is more to the adsorption point of wafer 4, adsorbs more evenly, in addition because two sets of negative pressure pipes 1 are independent connect negative pressure chamber 2, makes every negative pressure pipe 1 of group all can independent work, even the device still can use that a set of negative pressure pipe 1 goes wrong like this.

In a specific design, as shown in fig. 1 and 2, this embodiment is mainly used for the wafer grabbing operation assembled on a robot arm. The negative pressure pipe 1 is made of stainless steel materials, so that the negative pressure pipe has good corrosion resistance. The upper part of the negative pressure pipe 1 is connected through a cross bar 12. The cross bar 12 may also be made of stainless steel material. The upper part of the cross bar 12 is connected with a flange 14 through a bar 13. The flange can be directly fixedly connected with the flange of the mechanical arm, and the cross rod 12 is used for connecting the negative pressure pipe 1 into a whole, so that the adsorption pads 11 at the lower part of the negative pressure pipe 1 are on the same plane. The rib rod 13 is not only used for connecting the flange 14, but also wraps the control cylinder 3 and the negative pressure cavity 2 together with the lower cross rod 12, so that the whole structure is more compact, and the assembly on the mechanical arm is facilitated. In a specific design, the lower part of each single tube on the negative pressure tube 1 is provided with 3-6 adsorption pads 11.

As shown in fig. 2 and 3, the lower portion of the negative pressure chamber 2 communicates with the outside through a control valve 5. When the wafer 4 is adsorbed by the device, the control valve 5 is closed, the control cylinder 3 drives the negative pressure plate 21 to move upwards, so that negative pressure is generated by the lower part of the negative pressure cavity 2 and the adsorption pad 11, the wafer is adsorbed, and the control valve 5 is kept closed in the wafer adsorption process. When the adsorption pad 11 is required to be separated from the wafer, the control valve 5 is used for controlling the air pressure of the negative pressure cavity 2 to be level with the outside, and at this time, the control cylinder 3 drives the negative pressure plate 21 to move downwards, so that the lower part of the negative pressure cavity 2 becomes positive pressure, and the adsorption pad 11 blows downwards, thereby being more convenient for separating the wafer 4.

The foregoing description is only of the preferred embodiments of the utility model and is not intended to limit the utility model to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims

1. The wafer negative pressure suction type control device comprises more than 1 group of negative pressure pipes (1), and is characterized in that: the negative pressure pipe (1) comprises two single pipes which are bilaterally symmetrical, a vertical negative pressure cavity (2) is arranged between the two single pipes of the negative pressure pipe (1), a horizontal negative pressure plate (21) which can move up and down is arranged in the negative pressure cavity (2), sliding seal is arranged between the negative pressure plate (21) and the inner wall of the negative pressure cavity (2), a control cylinder (3) is arranged on the upper part of the negative pressure cavity, the telescopic end of the control cylinder (3) is fixedly connected with the negative pressure plate (21), the control cylinder (3) can pull the negative pressure plate (21) upwards, and the negative pressure pipe (1) is communicated with the lower part of the negative pressure cavity (2); each negative pressure pipe (1) single tube's lower part range is equipped with more than two absorption pad (11), absorption pad (11) are umbrella form, and absorption pad (11) adopt elastic material to make, absorption pad (11) lower part elasticity is attached on wafer (4) surface, processing has the through-hole that link up from top to bottom in the middle of absorption pad (11).

2. The wafer negative pressure suction control device according to claim 1, wherein: the cross-sectional area of the negative pressure cavity (2) is more than five times of the single-tube cross-sectional area of the negative pressure tube (1).

3. The wafer negative pressure suction control device according to claim 1, wherein: the device comprises an inner negative pressure pipe (1) and an outer negative pressure pipe (1), wherein the inner negative pressure pipe (1) is bilaterally symmetrical, the outer negative pressure pipe (1) is formed by designing two single pipes of the outer negative pressure pipe (1) bilaterally symmetrically on two sides of the inner negative pressure pipe (1), and each negative pressure pipe (1) is connected with an independent negative pressure cavity (2).

4. The wafer negative pressure suction control device according to claim 1, wherein: the negative pressure pipe (1) is made of stainless steel materials, and the upper part of the negative pressure pipe (1) is connected through a cross rod (12).

5. The wafer negative pressure suction control device according to claim 4, wherein: the upper part of the cross rod (12) is connected with a flange (14) through a rib rod (13).

6. The wafer negative pressure suction control device according to claim 1, wherein: the lower part of each single tube on the negative pressure tube (1) is provided with 3-6 adsorption pads (11).

7. The wafer negative pressure suction control device according to claim 1, wherein: the lower part of the negative pressure cavity (2) is communicated with the outside through a control valve (5).