CN218938494U - High-power density radar array surface thermal simulation system - Google Patents
High-power density radar array surface thermal simulation system Download PDFInfo
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- CN218938494U CN218938494U CN202223121456.2U CN202223121456U CN218938494U CN 218938494 U CN218938494 U CN 218938494U CN 202223121456 U CN202223121456 U CN 202223121456U CN 218938494 U CN218938494 U CN 218938494U
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Abstract
The utility model discloses a high-power density radar array surface thermal simulation system, and belongs to the technical field of radar thermal simulation. The high-power thick film resistor is adopted as the array surface of the heating element microsystem of the heating main body to realize higher power density, the resistance value precision of the high-power thick film resistor is +/-1%, the output of a system power supply is adjustable, the voltage precision of the high-power thick film resistor is better than 1%, the power precision and the power consistency of the system are ensured, the microsystems of the heating elements are independent and do not influence each other, and the system can flexibly control the power and the heating value of the system by adjusting the output voltage of the power supply; and the high-power thick film resistor surface-mounted technology is adopted, so that the manufacturing process is simple, the cost is low, and the method is suitable for heating scenes when thousands of TR components of the array surface of the active phased array radar antenna are simultaneously operated by a plurality of microsystems in large-area array simulation.
Description
Technical Field
The utility model relates to a high-power density radar array surface thermal simulation system, and belongs to the technical field of radar thermal simulation.
Background
Radar (RAdio Detection And Ranging) is a technology that uses scattering of electromagnetic waves by objects to find and determine the spatial position of the objects, and has the characteristics of no obstruction by fog, cloud and rain, all weather, and all day. Because electromagnetic waves have certain penetrability, radar technology is widely applied to the fields of military, air traffic, weather detection, resource detection, environmental monitoring and the like.
Radar systems generally include a transmitter, an antenna, a receiver, a signal processor, a host, and other devices, where the transmitter is configured to generate a radar signal, amplify the power, and send the amplified radar signal to the antenna, where the antenna is configured to implement conversion between electromagnetic waves and electrical signals; because the frequency of the radar signal is generally higher and can reach tens of GHz, a receiver is arranged to down-convert the signal to be within 2GHz so as to be beneficial to subsequent processing; the signal processor is used as the most core part of the radar system and is used for analyzing the signals and obtaining the information such as the position, the speed and the like of the target; after the signal processor analyzes and obtains the target information, the target information is transmitted to the host computer so as to display the target information, thereby facilitating the subsequent arrangement and use and backup processing of the user.
As the radar working distance gets longer and longer, the power density (the power density refers to the ratio of output power to weight) of the radar system gets higher and higher, so that the requirements of antenna extension and system development are better met, the radar array surface with high power density needs to be subjected to thermal simulation, but the existing radar array surface thermal simulation technology cannot meet the requirements, specifically, the existing main simulation mode includes a heating wire (chip) technology, a ceramic heating chip technology and a single-chip power chip technology, wherein the heating wire (chip) technology is a relatively wide technology used in early days. The resistor wire is mainly adopted, the technology has the advantages of low cost and convenient debugging, but has the defects of obvious planar heating and uneven heating, the device is easy to deform and repair, and the control precision of the resistance value is low. The ceramic heating plate technology is formed by technical upgrading on the resistance wire technology, and the metal alloy with excellent heat conductivity is adopted to heat by adopting electronic infrared radiation, so that the ceramic heating plate has longer service life, better corrosion resistance and higher heat conduction efficiency. But the defects are obvious, the power density of the unit area is insufficient, the manufacturing process is complex and the cost is high. The monolithic power chip technology adopts a power amplification chip to simulate heating. The heating condition of the antenna extension and the internal chip of the system can be accurately simulated, and the control accuracy is high. However, the disadvantage is that the cost is too high, the power uniformity is general, and the reliability of the peripheral auxiliary circuits is more general. The higher the power density is, the more urgent the requirements of the antenna extension and the system for heat dissipation are, and a more reasonable heat dissipation mode needs to be designed when the thermal simulation of the radar array surface with high power density is performed. In addition, the existing thermal simulation modes are all aimed at the traditional radar, and compared with the traditional radar, the traditional radar has only one central transmitter and one receiver, each radiator of the active phased array radar is provided with a transmitting/receiving assembly, and each assembly can generate and receive electromagnetic waves, so that when the thermal simulation is carried out, the different working modes can be simulated in a partitioning mode, but the existing thermal simulation modes cannot meet the requirement.
Therefore, the existing thermal simulation mode can not completely meet the physical thermal simulation requirements of the radar antenna extension and the system under high power density.
Disclosure of Invention
In order to solve the above problems, the present utility model provides a high power density radar array thermal simulation system, comprising: a system power supply, a main control subsystem and a heating element microsystem array surface; the heating element microsystem array surface is formed by assembling a plurality of heating element microsystems and is used for simulating heating states of the active phased array radar array surface in different working modes; each heating element microsystem consists of a plurality of same heating element subunits and a cold plate structure frame, wherein the cold plate structure frame is provided with a liquid cooling input/output port, and a heat dissipation liquid cooling loop is arranged in the cold plate structure frame; the front side of the cold plate structure frame is provided with heating element subunits, the heating element subunits are isolated through cold plate isolating beams, and the back side of the cold plate structure frame is provided with a doubling device for collecting and outputting power wires of the heating element subunits;
the heating element subunit comprises a substrate, a heating resistor and a temperature sensor; the heating resistor adopts a high-power thick film resistor.
In one embodiment, each heating element subunit is connected with the system power supply and the main control subsystem through a power line; the system power supply is used for supplying power to each heating element microsystem, and the main control subsystem is used for receiving the temperature acquired by the temperature sensor in each heating element subunit and correspondingly controlling the system power supply output voltage.
In one embodiment, the substrate is a ceramic substrate having a thermal conductivity of > 170W/m.k.
In one embodiment, the cold plate structure frame is made of aluminum alloy.
In one embodiment, in the heat-generating component subunit, the heat-generating resistor is mounted on the substrate by using a surface-mount technology.
In one embodiment, the high-power-density radar array surface thermal simulation system further comprises an air cooling device, and the air cooling device is electrically connected with the system power supply and the main control subsystem.
In one embodiment, each heat generating component subsystem includes six identical heat generating component subunits.
In one embodiment, several identical heat generating sub-units in each heat generating component microsystem are assembled in a regular pattern. The regular pattern includes squares and rectangles.
In one embodiment, the high-power density radar array thermal simulation system further comprises a temperature alarm device, and the temperature alarm device is electrically connected with the main control subsystem.
The utility model has the advantages that:
the utility model introduces the high-power thick film resistor simulation heating technology, the power control technology, the temperature real-time measurement and control technology and the liquid cooling loop control technology, so that the thermal simulation system overcomes the limitation of the traditional heating simulation and has the advantages of extremely wide application scene, extremely high power precision, extremely high power consistency, extremely high conversion efficiency, extremely high power stability and reliability, easy control of output power, small volume, good economy, strong vibration resistance, light weight and the like.
In particular, the utility model solves the problems of the traditional resistance wire type heating surface line shape heating, easy deformation of the device and difficult repair. The high-power thick film resistor is more in line with the actual heating situation of the power amplifier chip surface, and the resistor is not easy to deform and convenient to maintain and replace.
The utility model solves the problems of insufficient power density of unit area of the ceramic heating plate, complex manufacturing process and higher cost. The power density can reach 20W/cm 2 The highest rated power of a single heating element subunit is 300W, and the highest rated power of each heating element microsystem is 1800W, so that the manufacturing process is simple, the cost is low, and the method is suitable for heating scenes when thousands of TR components of the active phased array radar antenna array face are simultaneously operated in a large-area array simulation mode of a plurality of microsystems due to the adoption of a high-power thick film resistor surface mount technology.
The utility model solves the problems of high cost, general power consistency and more reliability of peripheral auxiliary circuits of the single chip power chip technology. The manufacturing process is simple, the cost is low, the power precision is high, the power consistency is high, and the reliability of peripheral auxiliary circuits is not needed. The high-power thick film resistor adopted by the system has the resistance accuracy of +/-1%, the power output of the system is adjustable, the voltage accuracy of the system is better than 1%, the power accuracy and the power consistency of the system are ensured, and the system can flexibly control the power and the heating value of the system by adjusting the output voltage of the power supply.
The utility model adopts a general modularized design technology, so that the system can be widely applied to various heating use scenes such as radar antennas, radar systems, power amplifier modules, instruments and equipment and the like. The heating element sub-unit, the heating element microsystem or the heating element microsystem array surface can be selected according to an actual heating scene to carry out thermal simulation, and particularly, the thermal simulation of the working state of the transmitting/receiving assembly can be simultaneously realized in a partitioning mode under the condition that each radiator of the active phased array radar is provided with one transmitting/receiving assembly. The heating element sub-units are provided with temperature sensors, and the temperature states of the sub-units can be reported in real time, so that operators can know the heating situation conveniently and adjust the heating situation. Meanwhile, the system is provided with temperature protection, and temperature alarm is carried out when the temperature exceeds the protection temperature, and power-off protection is carried out after the temperature alarm, so that the safety of the system is ensured.
Drawings
Fig. 1 is a schematic diagram of a high power density radar array thermal simulation system provided herein.
Fig. 2 is a diagram of a heat generating component subunit in a high-power-density radar array thermal simulation system according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a heat generating element microsystem forming an array in a high power density radar array surface thermal simulation system according to an embodiment of the present application.
Detailed Description
The present utility model will be described in detail below.
Example 1
The present embodiment provides a high-power-density radar array thermal simulation system, referring to fig. 1, including: a system power supply, a main control subsystem and a heating element microsystem array surface; the heating element microsystem array surface is formed by assembling a plurality of heating element microsystems and is used for simulating heating states of the active phased array radar array surface in different working modes; each heating element microsystem consists of a plurality of same heating element subunits and a cold plate structure frame, wherein the cold plate structure frame is provided with a liquid cooling input/output port, and a heat dissipation liquid cooling loop is arranged in the cold plate structure frame; the front side of the cold plate structure frame is provided with heating element subunits, the heating element subunits are isolated through cold plate isolating beams, and the back side of the cold plate structure frame is provided with a doubling device for collecting and outputting power wires of the heating element subunits;
each heating element subunit comprises a substrate, a heating resistor and a temperature sensor; the heating resistor adopts a high-power thick film resistor. The substrate is a ceramic substrate with ultrahigh thermal conductivity (> 170W/m.k) and is used for simulating actual heat conduction; the cold plate structure frame is an aluminum alloy structural member; the temperature sensor is used for acquiring the temperature of each heating element subunit in real time.
Since the substrate is made of a ceramic material having a thermal conductivity of more than 170W/m.k, the thermal conductivity is close to that of an aluminum alloy used for the cold plate structure frame, and thus heat can be well conducted to the cold plate structure frame.
The frame of the cold plate structure is provided with a liquid cooling input/output port, and a heat dissipation liquid cooling loop is arranged inside the frame.
In fig. 1, the high-power density radar array thermal simulation system can also be connected with a computer end through a cable W01 (an RS232 standard interface protocol can be adopted) so as to meet the requirement of remote control.
The main control subsystem is connected with the heating element microsystem array surface through a cable WO3 to acquire the real-time temperature of each heating element subunit, so that the voltage input to the heating element microsystem array surface is controlled through the cable WO 2. The system power supply is connected with the DC-DC level conversion circuit through a cable WO 4. The system power supply is not shown in fig. 1.
The system power supply supplies power to each heating element microsystem of the system, meanwhile, the input/output voltage and current can be monitored through the voltage/current sensor, and the working condition of the system can be evaluated in an auxiliary mode. The output of the system power supply is adjustable, the voltage precision is better than 1%, the power precision and the power flexibility of the system are ensured, and the system flexibly controls the output power of the system by adjusting the output voltage of the power supply so as to accurately control the heating value. Meanwhile, the power supply can be designed into a plurality of output ports, such as four output ports, and can independently output different voltages so as to simulate the heating state of the array surface in different working modes or the heating state when the power supply of the array surface part works abnormally or fails.
The main control subsystem is mainly used for controlling the output voltage of a power supply, receiving temperature uploading information of the heating element microsystems, and controlling and adjusting the output thermal power of the system according to the temperature information uploaded by each heating element microsystem. The main control subsystem comprises an interface control circuit, a DC-DC level conversion circuit and the like, and the interface control circuit mainly controls serial port input signals and serial port output signals, and temperature sensor inquiry and report signals. The DC-DC level conversion circuit mainly realizes the mutual conversion between the levels required by all devices in the system.
The high-power density radar array surface thermal simulation system provided by the embodiment adopts the high-power thick film resistor as the heating main body, and generates heat by using the current thermal effect, so that the high-power density radar array surface thermal simulation system has the advantages of high heating efficiency, stable power, small power difference, easy control of heating value and power and the like.
The heat of the array surface of the system working in the low power mode is conducted to the heat dissipation plate of the array surface structural member through the frame shell for heat dissipation or air cooling blowing is used for dissipation.
When the system works in a high-power mode, heat is taken away in a form of a cooling liquid backflow channel in the frame shell, so that the heat dissipation of the system is achieved, the array surface high-power thick film resistor is ensured to be at a reasonable working temperature, rated power can be effectively and stably output, and the purpose of accurately and truly simulating the heating of an actual heating device is achieved.
The high-power density radar array surface thermal simulation system can be further provided with a temperature alarm which is connected with the main control subsystem, and when the temperature uploaded by each heating element microsystem exceeds the preset temperature, an alarm is sent out to remind operators to process.
The working principle of the utility model is as follows:
according to the high-power-density radar array surface thermal simulation system, input voltage/current of the heating element microsystem array surface can be preset according to different working modes of the active phased array radar array surface to be simulated, in the simulation process, all heating element subunits forming the heating element microsystem array surface upload temperatures acquired by the temperature sensors in real time, and the main control subsystem can regulate and control the heating element microsystem array surface input voltage/current, flow rate of cold liquid in the frame and the like according to temperature information uploaded by all the heating element subunits in real time, and when the temperature exceeds a preset temperature threshold value, the temperature alarm device is started. The high-power density radar array surface thermal simulation system can also realize simulation of different working modes of the active phased array radar array surface through remote control.
While the utility model has been described with reference to the preferred embodiments, it is not limited thereto, and various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (10)
1. A high power density radar array thermal simulation system, the high power density radar array thermal simulation system comprising:
a system power supply, a main control subsystem and a heating element microsystem array surface; the heating element microsystem array surface is formed by assembling a plurality of heating element microsystems and is used for simulating heating states of the active phased array radar array surface in different working modes; each heating element microsystem consists of a plurality of same heating element subunits and a cold plate structure frame, wherein the cold plate structure frame is provided with a liquid cooling input/output port, and a heat dissipation liquid cooling loop is arranged in the cold plate structure frame; the front side of the cold plate structure frame is provided with heating element subunits, the heating element subunits are isolated through cold plate isolating beams, and the back side of the cold plate structure frame is provided with a doubling device for collecting and outputting power wires of the heating element subunits;
the heating element subunit comprises a substrate, a heating resistor and a temperature sensor; the heating resistor adopts a high-power thick film resistor.
2. The high power density radar array thermal modeling system of claim 1, wherein each heat generating element subunit is connected to the system power supply and the main control subsystem by a power line.
3. The high power density radar array thermal modeling system of claim 1, wherein the substrate is a ceramic substrate with a thermal conductivity of > 170W/m-k.
4. The high power density radar array thermal modeling system of claim 1, wherein the cold plate structure frame is made of aluminum alloy.
5. The high power density radar array surface thermal modeling system of claim 1, wherein in the heat generating element sub-unit, the heat generating resistor is mounted on a substrate using a surface mount process.
6. The high power density radar array thermal simulation system of claim 1, further comprising an air cooling device electrically connected to the system power supply and the main control subsystem.
7. The high power density radar array thermal modeling system of claim 1, wherein each heat generating component subsystem includes six identical heat generating component sub-units.
8. The high power density radar array thermal modeling system of claim 1, wherein the plurality of identical heat generating sub-units in each heat generating sub-system are assembled in a regular pattern.
9. The high power density radar array thermal modeling system of claim 8, wherein the regular pattern includes squares and rectangles.
10. The high power density radar array thermal simulation system of claim 1, further comprising a temperature alarm device electrically connected to the main control subsystem.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202223121456.2U CN218938494U (en) | 2022-11-23 | 2022-11-23 | High-power density radar array surface thermal simulation system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202223121456.2U CN218938494U (en) | 2022-11-23 | 2022-11-23 | High-power density radar array surface thermal simulation system |
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| CN218938494U true CN218938494U (en) | 2023-04-28 |
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| CN202223121456.2U Active CN218938494U (en) | 2022-11-23 | 2022-11-23 | High-power density radar array surface thermal simulation system |
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