CN218927561U

CN218927561U - Fixing device for semiconductor wafer processing

Info

Publication number: CN218927561U
Application number: CN202223400214.7U
Authority: CN
Inventors: 周君; 周小鎏
Original assignee: Jiangsu Techwell Automation Equipment Co ltd
Current assignee: Jiangsu Techwell Automation Equipment Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-04-28
Anticipated expiration: 2032-12-19

Abstract

The utility model discloses a fixing device for processing a semiconductor wafer, and relates to the technical field of wafer fixing. The utility model comprises a base, a fixed disc and a fixed assembly, wherein a moving strip is arranged on the base, and a movable block is arranged on the moving strip in a sliding manner. According to the utility model, the driving sources of the fixing assemblies are operated to drive the fixing plates to approach each other until the fixing plates are about to contact the wafer, then the power sources of the fixing plates are started to operate to drive the adjusting plates to press down, the adjusting plates press down to drive the springs and the pressing plates to press down, and the pressing plates press down to apply pressure to the wafer, so that the wafer is fixed on the fixing plate.

Description

Fixing device for semiconductor wafer processing

Technical Field

The utility model belongs to the technical field of wafer fixing, and particularly relates to a fixing device for semiconductor wafer processing.

Background

The semiconductor wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, the main processing mode of the wafer is wafer processing and batch processing, namely 1 wafer or a plurality of wafers are processed simultaneously, and the semiconductor wafer needs to be fixed in the processing process to prevent the deviation;

at present, most of the fixing devices for processing the semiconductor wafer are rigidly fixed, which can cause damage to the semiconductor wafer due to larger fixing force in the process of fixing the semiconductor wafer, so that the processing quality of the semiconductor wafer is reduced.

For the problems in the related art, no effective solution has been proposed at present.

Disclosure of Invention

The present utility model provides a fixing device for processing semiconductor wafers, which solves the above-mentioned problems of the prior art.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to a fixing device for processing a semiconductor wafer, which comprises a base, a fixed disc and a fixing component, wherein a movable strip is arranged on the base, a movable block is slidably arranged on the movable strip, a rotating disc is arranged at the upper end of the movable block through a rotating motor, telescopic air pumps are respectively arranged at two sides of the upper end of the rotating disc, the other side of the telescopic air pump is provided with the fixed disc, the fixing component is arranged on the fixed disc, the fixing component comprises a fixing plate, the fixing plates are respectively arranged at two ends of the fixed disc, an adjusting plate is slidably arranged at one end of the fixing plate, and a pressing plate is connected to the lower end of the adjusting plate through a spring.

Further, the baffle is installed to the upper end of base, baffle fixed mounting is in the one end of removal strip, flexible motor is installed to one side of baffle, flexible motor's output fixed mounting has the movable block.

Further, a rotating motor is fixedly arranged at the upper end of the movable block, and a rotating disc is fixedly arranged at the output end of the rotating motor.

Further, the upper surface both ends of rolling disc are provided with the rolling block respectively, the rolling block rotates and installs flexible air pump, the other end of flexible air pump rotates and installs the fixed block, the fixed block sets up respectively the lower surface both ends of fixed disc, the spacing groove has been seted up respectively at the both ends of fixed disc, slidable mounting has fixed subassembly in the spacing groove.

Further, the fixed subassembly is including two-way flexible air pump, two-way flexible air pump fixed mounting is in the lower extreme of fixed disk, the fixed plate is installed respectively to the output of two-way flexible air pump, the fixed plate pass the spacing groove and with spacing groove sliding connection, the inside nested regulation air pump that installs of fixed plate, the output fixed mounting of regulation air pump has the regulating plate, regulating plate lower extreme fixed mounting has the spring, one side fixed mounting of spring has the clamp plate.

The utility model has the following beneficial effects:

1. according to the utility model, the two-way telescopic air pump moves to drive the fixing plates to mutually approach along the limit groove until the fixing plates are about to contact the wafer, then the adjusting air pump is started to operate to drive the adjusting plates to press down, the adjusting plates press down to drive the springs to press down, the springs press down to drive the pressing plates to press down so as to apply pressure to the wafer, and therefore, the wafer is fixed on the fixing disc, meanwhile, as the springs are flexible devices, when the fixing force of the fixing assembly to the wafer is larger, the excessive force is absorbed and converted into the elastic force of the springs through the springs, and the problem that the semiconductor wafer is easily damaged due to larger fixing force in the fixing process of the semiconductor wafer, so that the processing quality of the semiconductor wafer is reduced is solved;

2. according to the utility model, the angle between the rotating disc and the fixed disc is changed by matching the telescopic motor with the movable block, the rotating motor with the rotating disc and operating the telescopic air pump, so that the processing position of the wafer is changed, and the problems that the wafer needs to be fixed again when the processing position of the wafer needs to be changed by the traditional device, the processing time of the wafer is increased and the processing efficiency of the wafer is reduced are solved.

Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings that are needed for the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of one embodiment of the present utility model;

FIG. 2 is a second perspective view of the overall appearance of an embodiment of the present utility model;

FIG. 3 is a third perspective view of the overall appearance of an embodiment of the present utility model;

fig. 4 is a schematic view of a partial enlarged structure at a of fig. 3 according to the present utility model.

In the drawings, the list of components represented by the various numbers is as follows:

1. a base; 11. moving the bar; 12. a baffle; 2. a telescopic motor; 3. a movable block; 4. a rotating motor; 5. a rotating disc; 51. a rotating block; 6. a telescopic air pump; 7. a fixed plate; 71. a fixed block; 72. a limit groove; 8. a fixing assembly; 81. a bidirectional telescopic air pump; 82. a fixing plate; 83. adjusting an air pump; 84. an adjusting plate; 85. a spring; 86. and (5) pressing plates.

Detailed Description

The following description of the technical solutions in the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, based on the embodiments in the utility model, which a person of ordinary skill in the art would obtain without inventive faculty, are within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "open," "upper," "lower," "top," "middle," "inner," and the like indicate an orientation or positional relationship, merely for convenience of description and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.

Referring to fig. 1-4, the utility model discloses a fixing device for processing a semiconductor wafer, which comprises a base 1, a fixed disc 7 and a fixing assembly 8, wherein a moving bar 11 is installed on the base 1, a movable block 3 is slidably installed on the moving bar 11, a rotating disc 5 is installed at the upper end of the movable block 3 through a rotating motor 4, telescopic air pumps 6 are respectively arranged at two sides of the upper end of the rotating disc 5, a fixed disc 7 is installed at the other side of the telescopic air pump 6, the fixing assembly 8 is installed on the fixed disc 7, the fixing assembly 8 comprises a fixed plate 82, the fixed plate 82 is respectively arranged at two ends of the fixed disc 7, an adjusting plate 84 is slidably installed at one end of the fixed plate 82, and a pressing plate 86 is connected at the lower end of the adjusting plate 84 through a spring 85;

when the device is used, the fixing plates 82 are driven to approach each other by the driving source of the fixing assembly 8 until the fixing plates 82 are about to contact a wafer, then the power source of the fixing plates 82 is started to operate to drive the adjusting plates 84 to press down, the adjusting plates 84 press down to drive the springs 85 and the pressing plates 86 to press down, the pressing plates 86 press down to apply pressure to the wafer, so that the wafer is fixed on the fixing plate 7, and as the springs 85 are flexible pieces, after the pressure value of the pressing plates 86 to the wafer reaches a certain degree, the redundant pressure is converted into self elastic force by the springs 85, so that the problem that the semiconductor wafer is easily damaged due to large fixing force in the fixing process of the semiconductor wafer, and the processing quality of the semiconductor wafer is reduced is solved;

when the processing position of the wafer needs to be changed, the telescopic motor 2 is started to operate so as to drive the movable block 3 to move along the moving bar 11, the movable block 3 moves so as to drive the fixed disk 7 to change the position of the fixed disk 7 relative to the base 1, the position of the fixed disk 7 changes so as to change the processing position of the wafer, and the rotary motor 4 is started to operate so as to drive the rotary disk 5 to operate, because the rotary disk 5 is connected with the fixed disk 7 through the telescopic air pump 6, the rotary disk 5 rotates so as to drive the fixed disk 7 to rotate, the fixed disk 7 rotates so as to further change the processing position of the wafer, and meanwhile, the angle between the rotary disk 5 and the fixed disk 7 is changed through the telescopic air pump 6, so that the processing position of the wafer needs to be changed again in the traditional device, the time for processing the wafer is increased, and the problem of the processing efficiency of the wafer is reduced is solved.

In one embodiment, for the base 1, a baffle 12 is installed at the upper end of the base 1, the baffle 12 is fixedly installed at one end of the moving bar 11, a telescopic motor 2 is installed at one side of the baffle 12, and a movable block 3 is fixedly installed at the output end of the telescopic motor 2;

the movable block 3 is moved along the moving bar 11 by the operation of the telescopic motor 2, thereby changing the fixed position of the wafer and thus primarily changing the processing position of the wafer. .

In one embodiment, for the movable block 3, a rotating motor 4 is fixedly mounted at the upper end of the movable block 3, and a rotating disc 5 is fixedly mounted at the output end of the rotating motor 4;

the rotating motor 4 is used for driving the rotating disc 5 to rotate.

In one embodiment, for the above-mentioned rotating disc 5, two ends of the upper surface of the rotating disc 5 are respectively provided with a rotating block 51, the rotating block 51 is rotatably provided with a telescopic air pump 6, the other end of the telescopic air pump 6 is rotatably provided with a fixed block 71, the fixed blocks 71 are respectively arranged at two ends of the lower surface of the fixed disc 7, two ends of the fixed disc 7 are respectively provided with a limiting groove 72, and a fixed component 8 is slidably mounted in the limiting groove 72;

the limiting groove 72 is used for limiting the motion track of the fixing component 8, preventing deviation from affecting the fixing effect of the wafer, and the telescopic air pump 6 is used for adjusting the angle between the rotating disc 5 and the fixed disc 7, so as to change the processing angle of the wafer, and further achieve the effect of adjusting the processing position without re-fixing the wafer.

In one embodiment, for the above-mentioned fixing assembly 8, the fixing assembly 8 includes a bidirectional telescopic air pump 81, the bidirectional telescopic air pump 81 is fixedly mounted at the lower end of the fixed disk 7, the output ends of the bidirectional telescopic air pump 81 are respectively mounted with a fixing plate 82, the fixing plates 82 pass through the limit grooves 72 and are slidably connected with the limit grooves 72, an adjusting air pump 83 is nested inside the fixing plates 82, an adjusting plate 84 is fixedly mounted at the output end of the adjusting air pump 83, a spring 85 is fixedly mounted at the lower end of the adjusting plate 84, and a pressing plate 86 is fixedly mounted at one side of the spring 85;

the bidirectional telescopic air pump 81 is formed by interconnecting two telescopic air pump tails, so as to achieve the effect of driving the fixed plates 82 to approach and separate from each other;

the two-way telescopic air pump 81 moves to drive the fixing plates 82 to be close to each other along the limiting groove 72 until the wafers are to be contacted, then the adjusting air pump 83 is started to operate to drive the adjusting plate 84 to press down, the adjusting plate 84 presses down to drive the spring 85 to press down, the spring 85 presses down to drive the pressing plate 86 to press down, and the pressing plate 86 presses down to apply pressure to the wafers, so that the wafers are fixed on the fixing plate 7, and meanwhile, as the spring 85 is a flexible device, when the fixing force of the fixing assembly 8 to the wafers is large, excessive force is absorbed and converted into the elastic force of the spring 85 through the spring 85, and further the problem that the semiconductor wafers are easily damaged due to large fixing force in the fixing process of the processing of the semiconductor wafers, and the processing quality of the semiconductor wafers is reduced is solved.

In summary, by the above technical solution of the present utility model, the fixing plates 82 are driven to approach each other by the operation of the bi-directional telescopic air pump 81 until the fixing plates 82 are about to contact the wafer, then the adjusting air pump 83 is started to operate to drive the adjusting plate 84 to press down, the adjusting plate 84 presses down to drive the spring 85 and the pressing plate 86 to press down, and the pressing plate 86 presses down to apply pressure to the wafer, so that the wafer is fixed on the fixing plate 7, and since the spring 85 is a flexible member, after the pressure value of the pressing plate 86 to the wafer reaches a certain degree, the redundant pressure is converted into the self elastic force by the spring 85, so that the problem that the semiconductor wafer is easily damaged due to the large fixing force in the fixing process of the processing, and the processing quality of the semiconductor wafer is reduced is solved;

In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above disclosed preferred embodiments of the utility model are merely intended to help illustrate the utility model. The preferred embodiments are not exhaustive or to limit the utility model to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and the full scope and equivalents thereof.

Claims

1. The utility model provides a fixing device is used in semiconductor wafer processing, includes base (1), fixed disk (7) and fixed subassembly (8), its characterized in that: install on base (1) and remove strip (11), remove strip (11) slidable mounting and have movable block (3), movable block (3) upper end is installed through rotating motor (4) and is rotated dish (5), the upper end both sides of rotating dish (5) are provided with flexible air pump (6) respectively, fixed disk (7) are installed to the opposite side of flexible air pump (6), fixed subassembly (8) are installed on fixed disk (7), fixed subassembly (8) are including fixed plate (82), fixed plate (82) set up respectively the both ends of fixed disk (7), the one end slidable mounting of fixed plate (82) has regulating plate (84), the lower extreme of regulating plate (84) is connected with clamp plate (86) through spring (85).

2. The fixing device for semiconductor wafer processing according to claim 1, wherein a baffle plate (12) is installed at the upper end of the base (1), the baffle plate (12) is fixedly installed at one end of the moving bar (11), a telescopic motor (2) is installed at one side of the baffle plate (12), and a movable block (3) is fixedly installed at the output end of the telescopic motor (2).

3. The fixing device for semiconductor wafer processing according to claim 2, wherein a rotating motor (4) is fixedly arranged at the upper end of the movable block (3), and a rotating disc (5) is fixedly arranged at the output end of the rotating motor (4).

4. The fixing device for semiconductor wafer processing according to claim 3, wherein two ends of the upper surface of the rotating disc (5) are respectively provided with a rotating block (51), the rotating block (51) is rotatably provided with a telescopic air pump (6), the other end of the telescopic air pump (6) is rotatably provided with a fixing block (71), the fixing blocks (71) are respectively arranged at two ends of the lower surface of the fixing disc (7), two ends of the fixing disc (7) are respectively provided with a limiting groove (72), and a fixing assembly (8) is slidably installed in the limiting grooves (72).

5. The fixing device for semiconductor wafer processing according to claim 4, wherein the fixing component (8) comprises a bidirectional telescopic air pump (81), the bidirectional telescopic air pump (81) is fixedly installed at the lower end of the fixing disc (7), fixing plates (82) are respectively installed at the output ends of the bidirectional telescopic air pump (81), the fixing plates (82) penetrate through the limit grooves (72) and are in sliding connection with the limit grooves (72), an adjusting air pump (83) is installed inside the fixing plates (82) in a nested mode, an adjusting plate (84) is fixedly installed at the output end of the adjusting air pump (83), springs (85) are fixedly installed at the lower end of the adjusting plate (84), and a pressing plate (86) is fixedly installed at one side of each spring (85).