CN218918799U

CN218918799U - Tin-plating device for semiconductor production

Info

Publication number: CN218918799U
Application number: CN202222738405.8U
Authority: CN
Inventors: 梁飞
Original assignee: Suzhou Ga Gang Semiconductor Co ltd
Current assignee: Suzhou Ga Gang Semiconductor Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-04-25
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses a tin-plating device for semiconductor production, which comprises a supporting mechanism, wherein the supporting mechanism comprises a supporting column, the top of the supporting column is fixedly connected with a supporting plate, the top of the supporting plate is fixedly connected with a protective box, one side of the protective box is provided with a feeding and discharging groove, a processing mechanism is arranged in the protective box, the top of the supporting plate is provided with a fixing mechanism, the top of the fixing mechanism is provided with a clamping mechanism, the processing mechanism comprises a first motor, and the first motor is fixedly connected with the inner top wall of the protective box. The beneficial effects are that: the method comprises the steps that a processing mechanism is arranged, the processing mechanism comprises a polishing assembly, and oxides on the surface of a semiconductor to be welded are polished through the polishing assembly; the processing mechanism comprises a cleaning disc, the surface after polishing is cleaned by the cleaning disc, and the tin spot quality is ensured; the processing mechanism comprises a belt, linkage is realized through the belt, the processing mechanism is multipurpose, and the service efficiency of equipment is improved.

Description

Tin-plating device for semiconductor production

Technical Field

The utility model relates to the field of semiconductor production, in particular to a tin spot device for semiconductor production.

Background

Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, and the like, and are required to be soldered in the semiconductor manufacturing process.

The utility model discloses a point tin device for semiconductor production through retrieving chinese patent publication No. CN216487981U, which comprises a workbench, the spout has been seted up at the workstation top, the spout with the inside intercommunication of workstation, workstation top front end is connected with places the board, workstation top rear end is connected with the protection frame, protection frame front side is provided with the observation window, protection frame front side and lie in the observation window below sets up to the opening, be provided with some tin mechanism on the protection frame rear side inner wall, protection frame top is provided with the air extraction mechanism that is used for taking out harmful gas and purifies.

The above patent can draw out and purify the harmful gas that produces with some tin through air extraction mechanism, then discharges in the air, guarantees people's physical and mental health, but when some tin, if there are the oxide on the semiconductor surface, the existence of these oxides can directly influence some tin quality.

Disclosure of Invention

The present utility model aims to solve the above problems and provide a tin plating device for semiconductor production.

The utility model realizes the above purpose through the following technical scheme:

a point tin device for semiconductor production, including supporting mechanism, supporting mechanism includes the support column, the top fixedly connected with backup pad of support column, the top fixedly connected with protective housing of backup pad, business turn over groove has been seted up to one side of protective housing, the inside of protective housing is provided with processing mechanism, the top of backup pad is provided with fixed establishment, fixed establishment's top is provided with clamping mechanism, processing mechanism includes first motor, first motor fixedly connected with is in the interior roof of protective housing, the output fixedly connected with rotation axis of first motor, the bottom fixedly connected with subassembly of polishing of rotation axis, fixedly connected with action wheel on the rotation axis, be connected with the belt on the action wheel, the other end fixedly connected with from the driving wheel of belt, fixedly connected with axis of rotation on the driving wheel, the axis of rotation swivelling joint is in the top of protective housing, the bottom fixedly connected with of axis of rotation cleans the dish.

Preferably, the fixing mechanism comprises a bearing table, a through groove is formed in one side of the bearing table, a fixing block is fixedly connected to the bottom of the bearing table, an electric push rod is fixedly connected to one side of the fixing block, a mounting plate is fixedly connected to the other end of the electric push rod, and the mounting plate is fixedly connected to one side of the bottom of the supporting plate.

Preferably, the clamping mechanism comprises a second motor, the second motor is fixedly connected with the side wall of the through groove formed in one side of the bearing table, the output end of the second motor is connected with a screw rod through a coupling, two sliding blocks are connected to the screw rod in a threaded mode, a sliding rod is fixedly connected to the top of each sliding block, a vertical plate is fixedly connected to the top of each sliding rod, a connecting rod is fixedly connected to one side of each vertical plate, and a clamping plate is fixedly connected to the other side of each connecting rod.

Preferably, a glass window is arranged on the front side of the protective box.

Preferably, a tin component is arranged on one side of the protective box away from the inlet and outlet grooves.

Preferably, the screw rod is provided with two kinds of threads with different rotation directions, the top of the bearing table is provided with a sliding groove, the sliding groove is connected with the sliding rod in a sliding manner, the top of the supporting plate is provided with a sliding groove, and the sliding groove is connected with the fixing block in a sliding manner.

The beneficial effects are that: the processing mechanism is arranged and comprises a polishing assembly, and oxides on the surface of the semiconductor to be welded are polished through the polishing assembly; the processing mechanism comprises a cleaning disc, the surface after polishing is cleaned by the cleaning disc, and the tin spot quality is ensured; the processing mechanism comprises a belt, linkage is realized through the belt, the processing mechanism is multipurpose, and the service efficiency of equipment is improved.

Additional features and advantages of the utility model will be set forth in the description which follows, or may be learned by practice of the utility model.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model, and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the description serve to explain, without limitation, the utility model. In the drawings:

FIG. 1 is a schematic view of a tin plating apparatus for semiconductor manufacturing according to the present utility model;

fig. 2 is a front view showing the internal structure of the spot tin device for semiconductor production according to the present utility model;

fig. 3 is a top view of a tin plating apparatus for semiconductor manufacturing according to the present utility model;

fig. 4 is a right side view of the spot tin device for semiconductor manufacturing according to the present utility model.

The reference numerals are explained as follows: 1. a support mechanism; 101. a support column; 102. a support plate; 2. a protective box; 201. a glazing; 3. a processing mechanism; 301. a first motor; 302. a rotation shaft; 303. a polishing assembly; 304. a driving wheel; 305. a belt; 306. driven wheel; 307. a rotating shaft; 308. a cleaning plate; 4. a fixing mechanism; 401. a carrying platform; 402. a fixed block; 403. an electric push rod; 404. a mounting plate; 5. a clamping mechanism; 501. a second motor; 502. a screw rod; 503. a slide block; 504. a slide bar; 505. a vertical plate; 506. a connecting rod; 507. a clamping plate; 6. and (5) a tin plating assembly.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

The utility model is further described below with reference to the accompanying drawings:

examples

As shown in fig. 1-4, the tin spot device for semiconductor production comprises a supporting mechanism 1, the supporting mechanism 1 comprises a supporting column 101, a supporting plate 102 is welded at the top of the supporting column 101, a protecting box 2 is connected at the top of the supporting plate 102 through bolts, a slot is formed in one side of the protecting box 2, a processing mechanism 3 is arranged in the protecting box 2, a fixing mechanism 4 is arranged at the top of the supporting plate 102, a clamping mechanism 5 is arranged at the top of the fixing mechanism 4, the processing mechanism 3 comprises a first motor 301, the first motor 301 is fixedly connected to the inner top wall of the protecting box 2, the output end of the first motor 301 is fixedly connected with a rotating shaft 302 through a coupler, a polishing component 303 is fixedly connected at the bottom of the rotating shaft 302, a driving wheel 304 is fixedly connected to the rotating shaft 302, the belt 305 is connected to the driving wheel 304, the driven wheel 306 is fixedly connected to the other end of the belt 305, the rotating shaft 307 is fixedly connected to the driven wheel 306, the rotating shaft 307 is rotatably connected to the top of the protective box 2 through a bearing, the cleaning disc 308 is fixedly connected to the bottom of the rotating shaft 307, the polishing component 303 reaches the top of the semiconductor, then the first motor 301 is started, the first motor 301 drives the rotating shaft 302 to rotate, the rotating shaft 302 drives the polishing component 303 to rotate, the oxide on the semiconductor surface is polished, the rotating shaft 302 drives the driving wheel 304 to rotate while the rotating shaft 302 drives the belt 305, the driven wheel 306 and the rotating shaft 307 to rotate, and the rotating shaft 307 drives the cleaning disc 308 to rotate, so that the semiconductor surface is cleaned.

In this embodiment, the fixing mechanism 4 includes a carrying platform 401, a through slot is formed on one side of the carrying platform 401, a fixing block 402 is fixedly connected to the bottom of the carrying platform 401, an electric push rod 403 is fixedly connected to one side of the fixing block 402, a mounting plate 404 is fixedly connected to the other end of the electric push rod 403, the mounting plate 404 is fixedly connected to one side of the bottom of the supporting plate 102, and the fixing block 402 drives the carrying platform 401 to move by controlling the electric push rod 403.

In this embodiment, the clamping mechanism 5 includes a second motor 501, the second motor 501 is connected with a side wall of a through groove formed on one side of the bearing table 401 by a bolt, an output end of the second motor 501 is connected with a screw rod 502 through a coupling, two sliding blocks 503 are connected with threads on the screw rod 502, a sliding rod 504 is fixedly connected with the top of the sliding block 503, a vertical plate 505 is fixedly connected with the top of the sliding rod 504, a connecting rod 506 is fixedly connected with one side of the vertical plate 505, a clamping plate 507 is fixedly connected with the other side of the connecting rod 506, the second motor 501 is started, the screw rod 502 is driven to rotate by the second motor 501, the two sliding blocks 503 are driven to move relatively close to each other by the screw rod 502, the sliding rod 504 is driven to move by the vertical plate 505, and the connecting rod 506 is driven to clamp a semiconductor by the clamping plate 507.

In the present embodiment, the front side of the protection box 2 is provided with a glass window 201, and the situation in the protection box 2 is convenient to observe at any time through the glass window 201.

In this embodiment, the side of the protective housing 2 remote from the access slot is provided with a spot tin assembly 6.

In this embodiment, the screw rod 502 has two kinds of threads with different rotation directions, the top of the bearing table 401 is provided with a sliding groove, the sliding groove is slidably connected with a sliding rod 504, the top of the supporting plate 102 is provided with a sliding groove, and the sliding groove is slidably connected with a fixed block 402.

Working principle: in the utility model, firstly, a semiconductor to be welded is placed on the surface of a bearing table 401, a second motor 501 is started, the second motor 501 drives a screw rod 502 to rotate, the screw rod 502 drives two sliding blocks 503 to move relatively, the sliding blocks 503 drive sliding rods 504 to move, the sliding rods 504 drive a vertical plate 505 to move, the vertical plate 505 drives a connecting rod 506 to move, the connecting rod 506 drives a clamping plate 507 to clamp the semiconductor, a fixed block 402 drives the bearing table 401 to move through controlling an electric push rod 403, a slot formed in one side of a protective box 2 reaches the protective box 2, a polishing assembly 303 reaches the top of the semiconductor, a first motor 301 is started, the first motor 301 drives a rotating shaft 302 to rotate, the rotating shaft 302 drives the polishing assembly 303 to rotate, oxide on the semiconductor surface is polished, the bearing table 401 continues to move in the same direction, the rotating shaft 302 rotates and simultaneously drives a driving wheel 304 to rotate, the driving wheel 304 drives a belt 305 to rotate, the driven wheel 306 drives the driven wheel 306 to rotate, the driven wheel 306 drives a cleaning disc 308 to rotate, the semiconductor surface is cleaned by controlling an electric push rod 403, and tin begins to be cleaned when the bearing table 401 moves to the lower than a tin assembly 6.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A point tin device for semiconductor production, includes supporting mechanism (1), supporting mechanism (1) include support column (101), the top fixedly connected with backup pad (102) of support column (101), its characterized in that: the utility model provides a business turn over groove has been seted up to the top fixedly connected with protective housing (2) of backup pad (102), business turn over groove has been seted up to one side of protective housing (2), the inside of protective housing (2) is provided with processing mechanism (3), the top of backup pad (102) is provided with fixed establishment (4), the top of fixed establishment (4) is provided with clamping mechanism (5), processing mechanism (3) include first motor (301), first motor (301) fixedly connected with is in the interior roof of protective housing (2), the output fixedly connected with rotation axis (302) of first motor (301), the bottom fixedly connected with subassembly (303) of polishing of rotation axis (302), fixedly connected with action wheel (304) on rotation axis (302), be connected with belt (305) on action wheel (304), the other end fixedly connected with from driving wheel (306) of belt (305), fixedly connected with axis of rotation (307) rotate and be in the top of protective housing (2), the bottom fixedly connected with of axis (307) cleans dish (308).

2. The spot-tin device for semiconductor production according to claim 1, wherein: the fixing mechanism (4) comprises a bearing table (401), a through groove is formed in one side of the bearing table (401), a fixing block (402) is fixedly connected to the bottom of the bearing table (401), an electric push rod (403) is fixedly connected to one side of the fixing block (402), a mounting plate (404) is fixedly connected to the other end of the electric push rod (403), and the mounting plate (404) is fixedly connected to one side of the bottom of the supporting plate (102).

3. The spot-tin device for semiconductor production according to claim 2, wherein: clamping mechanism (5) are including second motor (501), second motor (501) fixed connection is in the lateral wall of logical groove is seted up to plummer (401) one side, the output of second motor (501) is connected with lead screw (502) through the coupling joint, threaded connection has two sliders (503) on lead screw (502), the top fixedly connected with slide bar (504) of slider (503), the top fixedly connected with riser (505) of slide bar (504), one side fixedly connected with connecting rod (506) of riser (505), opposite side fixedly connected with clamping plate (507) of connecting rod (506).

4. The spot-tin device for semiconductor production according to claim 1, wherein: the front side of the protective box (2) is provided with a glass window (201).

5. The spot-tin device for semiconductor production according to claim 1, wherein: one side of the protective box (2) far away from the inlet and outlet groove is provided with a tin component (6).

6. A tin spot-plating apparatus for semiconductor manufacturing according to claim 3, wherein: the screw rod (502) is provided with two threads with different rotation directions, the top of the bearing table (401) is provided with a sliding groove, the sliding groove is connected with the sliding rod (504) in a sliding manner, the top of the supporting plate (102) is provided with a sliding groove, and the sliding groove is connected with the fixing block (402) in a sliding manner.