CN218916043U - Heat sink with improved condensing zone structure - Google Patents
Heat sink with improved condensing zone structure Download PDFInfo
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- CN218916043U CN218916043U CN202222447596.2U CN202222447596U CN218916043U CN 218916043 U CN218916043 U CN 218916043U CN 202222447596 U CN202222447596 U CN 202222447596U CN 218916043 U CN218916043 U CN 218916043U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The utility model discloses a heat dissipating device with an improved condensation area structure, which comprises a body, a heat dissipating medium, a first capillary structure, a second capillary structure and a hydrophobic carbon material layer, wherein the heat dissipating medium is arranged on the body; the body is provided with a sealing cavity, the first capillary structure and the second capillary structure are respectively arranged in a first area and a second area of the sealing cavity and are fixedly combined with the inner wall of the body, and the first area and the second area are respectively arranged corresponding to an evaporation area and a condensation area of the heat dissipation device; the heat dissipation medium is also distributed in the sealed cavity, and comprises water; the hydrophobic carbon material layer is covered on the surface of the second capillary structure. Compared with the prior art, the hydrophobic carbon material layer is arranged on the surface of the capillary structure of the condensing area of the heat dissipating device, so that the advantages of strong hydrophobicity, high heat conductivity and the like can be utilized, water is prevented from forming a water film on the surface of the capillary structure of the condensing area, the thermal resistance of the condensing area is effectively reduced, and the temperature uniformity performance and the power of the heat dissipating device are greatly improved.
Description
Technical Field
The present utility model relates to heat dissipation devices, and particularly to a heat dissipation device with an improved condensation area.
Background
When the heat dissipation devices such as the heat pipe, the temperature equalizing plate and the like work, the heated water in the evaporation area can generate water vapor, the water vapor is condensed into liquid water in the condensation area, and the liquid water flows back to the evaporation area through the capillary layer. Taking a heat pipe with a copper pipe as a body as an example, the temperature of the outer wall of the copper pipe at the condensation area is the lowest, and the copper capillary layer is connected to the inner wall of the copper pipe at the condensation area. There is a constant desire in the industry to address this problem, but no effective solution has heretofore been available.
Disclosure of Invention
The main objective of the present utility model is to provide a heat dissipating device with an improved condensation area structure, so as to overcome the shortcomings of the prior art.
In order to achieve the purpose of the utility model, the technical scheme adopted by the utility model comprises the following steps:
some embodiments of the present utility model provide a heat sink with an improved condensing zone structure, comprising:
the body is provided with a sealing cavity, the sealing cavity is provided with a first area and a second area, and the first area and the second area are respectively arranged corresponding to an evaporation area and a condensation area of the heat dissipation device;
the heat dissipation medium is distributed in the sealed cavity and comprises water;
the first capillary structure is arranged in a first area of the sealing cavity and is fixedly combined with the inner wall of the body;
the second capillary structure is arranged in a second area of the sealing cavity and is fixedly combined with the inner wall of the body;
and the hydrophobic carbon material layer is covered on the surface of the second capillary structure.
In one embodiment, the hydrophobic carbon material layer comprises a graphene layer and/or a carbon nanotube layer.
In one embodiment, the hydrophobic carbon material layer has a capillary structure.
In one embodiment, the first capillary structure has a hydrophilic surface.
In one embodiment, the sealed chamber further has a third region disposed in correspondence with the heat-insulating section of the heat-dissipating device and distributed between the first region and the second region; the heat dissipation device further comprises a third capillary structure, wherein the third capillary structure is arranged in the third area and fixedly combined with the inner wall of the body; the first capillary structure is connected with the second capillary structure through the third capillary structure.
In one embodiment, the third capillary structure has a hydrophilic surface.
In one embodiment, at least one of the first and second capillary structures is integrally provided with the third capillary structure.
In one embodiment, the first capillary structure, the second capillary structure, and the third capillary structure are integrally provided.
In one embodiment, the body is a housing having a hollow cavity, the sealed cavity is formed by sealing the hollow cavity, and the first capillary structure and the second capillary structure are fixedly combined on the inner wall of the housing.
In one embodiment, the body, the first capillary structure, and the second capillary structure are all metal members.
Illustratively, the body may be a copper tube or an aluminum tube, or the like. Alternatively, the body may be a shell-like member made of copper plate, aluminum plate or other metal plate by welding or the like.
The first capillary structure, the second capillary structure, and the third capillary structure may be capillary structures formed by sintering copper powder, copper alloy powder, or other metal powder, or capillary structures formed by using copper mesh, copper alloy mesh, or other metal mesh, etc.
In one embodiment, the heat sink comprises a heat pipe or a temperature equalizing plate.
Compared with the prior art, the hydrophobic carbon material layer is arranged on the surface of the capillary structure of the condensing area of the heat dissipating device, so that the advantages of strong hydrophobicity, high heat conductivity and the like can be utilized, water is prevented from forming a water film on the surface of the capillary structure of the condensing area, the thermal resistance of the condensing area is effectively reduced, and the temperature uniformity performance and the power of the heat dissipating device are greatly improved; and by setting the capillary structure surface at the evaporation area, the heat insulation section and the like as a hydrophilic surface, the heat conduction efficiency of the heat dissipation device can be further improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic view showing the structure of a heat pipe according to comparative example 1 of the present utility model;
FIG. 2 is a schematic view of a heat pipe according to embodiment 1 of the present utility model;
FIG. 3 is a schematic view of a heat pipe according to embodiment 2 of the present utility model;
fig. 4 is a schematic structural view of a temperature equalization plate in embodiment 3 of the present utility model.
Detailed Description
The technical solution of the present utility model will be described in more detail with reference to the accompanying drawings and examples, but it should be understood that the following examples are only for the purpose of explaining and illustrating the technical solution of the present utility model and do not limit the scope of the present utility model.
Comparative example 1 referring to fig. 1, a heat pipe provided in this comparative example includes a copper pipe 10 having both ends closed to form a sealed chamber therein, the sealed chamber having a first region 11, a second region 12, and a third region 13 sequentially distributed in a horizontal direction, the first region 11, the second region 12, and the third region 13 being disposed corresponding to an evaporation region, a condensation region, and an insulation section of the heat pipe, respectively. And the first, second and third regions 11, 12, 13 are respectively provided with a first capillary structure 14, a second capillary structure 15 and a third capillary structure 16, and the first capillary structure 14 and the second capillary structure 15 are connected by the third capillary structure 16. The first capillary structure 14, the second capillary structure 15 and the third capillary structure 16 are all capillary layers formed by sintering copper powder, and are fixedly combined on the inner wall of the copper pipe. In some cases, the first capillary structure 14, the second capillary structure 15, and the third capillary structure 16 may be integrally sintered. At the same time, water (not shown) is also distributed in the sealed chamber as working medium.
When the heat pipe works, the evaporation area is heated, so that water is evaporated to form water vapor, and the water vapor is condensed into liquid water in the condensation area and flows back to the evaporation area through the third capillary structure 16. In the condensation area, the second capillary structure 15 is a copper capillary structure because of lower temperature, the surface of the second capillary structure is hydrophilic, a water film formed by condensing water vapor can be attached to the surface of the second capillary structure 15, and when the water vapor transfers heat to the wall of the copper pipe through the second capillary structure 15, the thermal resistance r1=the thermal resistance of the water film+the thermal resistance of the copper capillary layer, because the thermal conductivity of water is far lower than that of copper, the corresponding thermal resistance of the water film is far greater than that of the copper capillary layer, so that the actual power of the heat pipe is lower.
Embodiment 1 referring to fig. 2, the heat pipe according to this embodiment has substantially the same structure as that of comparative example 1, except that: the surface of the second capillary structure 15 is covered with a carbon nanotube layer 17. The thickness of the carbon nanotube layer may be 0.05-5 μm. The carbon nanotube layer 17 may be a carbon nanotube film formed in situ on the surface of the second capillary structure 15 by chemical vapor deposition (refer to journal of physics, 2013, vol.62, no.15, page 158801), or may be formed by transferring a carbon nanotube film prepared by a floating catalytic cracking method or a filtration method to the surface of the second capillary structure 15 (refer to Advanced Functional Materials,2012, volume 22, page 5209).
By attaching the carbon nanotube layer 17 to the surface of the second capillary structure 15, the thermal resistance r2=carbon material thermal resistance+capillary layer thermal resistance when the water vapor transfers heat to the copper pipe wall through the second capillary structure 15 because the carbon nanotube has very high thermal conductivity and high hydrophobicity and the water vapor is not condensed and adsorbed on the surface of the second capillary structure 15 to form a water film. Compared with comparative example 1, because R2 is far smaller than R1, the actual power of the heat pipe is higher than that of the heat pipe of comparative example 1 by more than 50%, and the temperature uniformity and the power of the heat pipe are greatly improved.
Embodiment 2 referring to fig. 3, the heat pipe provided in this embodiment includes a copper pipe 20, two ends of the copper pipe are sealed, so that a sealed chamber is formed inside the copper pipe, the sealed chamber has a first area 21 and a second area 22 that are distributed from top to bottom in sequence, and the first area 21 and the second area 22 are respectively disposed corresponding to an evaporation area and a condensation area of the heat pipe. And the first region 21 and the second region 22 are respectively provided with a first capillary structure 23 and a second capillary structure 24. The first capillary structure 23 and the second capillary structure 24 are copper wool fine layers made of copper mesh or copper alloy mesh, and are fixedly combined on the inner wall of the copper pipe. The surface of the second capillary structure 24 is covered with a graphene layer 25. The graphene layer 25 is formed by transferring a graphene film prepared by a suction filtration method to the surface of the second capillary structure 24, and has a thickness of 0.05-5 μm. At the same time, water (not shown) is also distributed in the sealed chamber as working medium.
When the heat pipe works, the evaporation area is heated, so that water is evaporated to form water vapor, the water vapor rises to the condensation area to be condensed into liquid water, and the liquid water flows back to the evaporation area under the action of gravity. The graphene layer 25 can prevent water from condensing and adhering on the surface of the second capillary structure 24 to form a water film, so that the temperature uniformity and the power of the heat pipe are effectively improved. Compared with a heat pipe without the graphene layer 25, the improvement of the actual power is more than 50%.
Embodiment 3 referring to fig. 4, the present embodiment provides a temperature equalizing plate, which includes a hollow housing 30 formed by welding upper and lower aluminum plates, wherein a sealed chamber is formed inside the housing 30, the sealed chamber has a first area 31 and a second area 32 sequentially distributed from top to bottom, and the first area 31 and the second area 32 are respectively disposed corresponding to an evaporation area and a condensation area of the heat pipe. And the first region 31 and the second region 32 are respectively provided with a first capillary structure 33 and a second capillary structure 34. The first capillary structure 33 and the second capillary structure 34 are copper wool fine layers formed by co-sintering copper powder and a copper mesh, and are respectively combined on the bottom inner wall and the top inner wall of the shell. A plurality of capillary structure supporting columns (not shown in the figure) can be further arranged in the shell, and two ends of each supporting column respectively contact with the inner wall of the top and the inner wall of the bottom of the shell. The surface of the second capillary structure 34 is covered with a carbon nanotube layer 35. The carbon nanotube layer 35 is formed by transferring a self-supporting carbon nanotube film prepared by a suction filtration method to the surface of the second capillary structure 34, and has a thickness of 2-5 μm. At the same time, water (not shown) is also distributed in the sealed chamber as working medium.
When the temperature equalizing plate works, the evaporation area is heated, so that water is evaporated to form water vapor, the water vapor rises to the condensation area to be condensed into liquid water, and the liquid water flows back to the evaporation area under the action of gravity. The existence of the carbon nanotube layer 35 can prevent water from condensing and adhering on the surface of the second capillary structure 35 to form a water film, thereby remarkably improving the temperature uniformity and the power of the heat pipe. Compared with the temperature equalizing plate without the carbon nanotube layer 35, the actual power is improved by more than 30%.
Embodiment 4 the structure of a temperature equalizing plate provided in this embodiment is substantially the same as that of embodiment 3, except that: the first capillary structure 33 has a hydrophilic surface. The hydrophilic surface may be formed by chemically modifying the surface of the first capillary structure 33, or may be formed by providing a hydrophilic material layer on the surface of the first capillary structure 33. For example, polyvinyl alcohol may be coated on the surface of the first capillary structure 3 to make the surface hydrophilic, thereby increasing the surface tension coefficient thereof, and thus improving the capillary performance thereof. Compared with the temperature equalizing plate in the embodiment 3, the actual power of the temperature equalizing plate in the embodiment is further improved, and the improvement range is more than 20%.
It should be understood that the technical solution of the present utility model is not limited to the above specific embodiments, and all technical modifications made according to the technical solution of the present utility model without departing from the spirit of the present utility model and the scope of the claims are within the scope of the present utility model.
Claims (10)
1. A heat sink having an improved condensing zone structure, comprising:
the body is provided with a sealing cavity, the sealing cavity is provided with a first area and a second area, and the first area and the second area are respectively arranged corresponding to an evaporation area and a condensation area of the heat dissipation device;
the heat dissipation medium is distributed in the sealed cavity and comprises water;
the first capillary structure is arranged in a first area of the sealing cavity and is fixedly combined with the inner wall of the body;
the second capillary structure is arranged in a second area of the sealing cavity and is fixedly combined with the inner wall of the body;
and the hydrophobic carbon material layer is covered on the surface of the second capillary structure.
2. The heat sink with improved condensing zone structure of claim 1, wherein: the hydrophobic carbon material layer comprises a graphene layer and/or a carbon nanotube layer.
3. The heat sink with improved condensing zone structure of claim 1 or 2, characterized in that: the thickness of the hydrophobic carbon material layer is 0.05-0.5 mu m.
4. The heat sink with improved condensing zone structure of claim 1, wherein: the first capillary structure has a hydrophilic surface.
5. The heat sink with improved condensing zone structure of claim 1, wherein: the sealed cavity is also provided with a third area, and the third area is arranged corresponding to the heat insulation section of the heat dissipation device and is distributed between the first area and the second area; the heat dissipation device further comprises a third capillary structure, wherein the third capillary structure is arranged in the third area and fixedly combined with the inner wall of the body; the first capillary structure is connected with the second capillary structure through the third capillary structure.
6. The heat sink with improved condensing zone structure of claim 5, wherein: at least one of the first capillary structure and the second capillary structure is integrally arranged with the third capillary structure; and/or, the third capillary structure has a hydrophilic surface.
7. The heat sink with improved condensing zone structure of claim 6, wherein: the first capillary structure, the second capillary structure and the third capillary structure are integrally arranged.
8. The heat sink with improved condensing zone structure of claim 1, wherein: the body is a shell with a hollow inner cavity, the sealing cavity is formed by sealing the hollow inner cavity, and the first capillary structure and the second capillary structure are fixedly combined on the inner wall of the shell.
9. The heat sink with improved condensing zone structure of claim 1, wherein: the body, the first capillary structure and the second capillary structure are all metal components.
10. The heat sink with improved condensing zone structure of claim 1, wherein: the heat dissipation device comprises a heat pipe or a temperature equalizing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222447596.2U CN218916043U (en) | 2022-09-15 | 2022-09-15 | Heat sink with improved condensing zone structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222447596.2U CN218916043U (en) | 2022-09-15 | 2022-09-15 | Heat sink with improved condensing zone structure |
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| Publication Number | Publication Date |
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| CN218916043U true CN218916043U (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222447596.2U Active CN218916043U (en) | 2022-09-15 | 2022-09-15 | Heat sink with improved condensing zone structure |
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- 2022-09-15 CN CN202222447596.2U patent/CN218916043U/en active Active
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