CN218898101U

CN218898101U - Cooling mechanism after wafer cake demoulding

Info

Publication number: CN218898101U
Application number: CN202223013939.0U
Authority: CN
Inventors: 蔡腾跃
Original assignee: Haoyunlai Fujian Food Co ltd
Current assignee: Haoyunlai Fujian Food Co ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-04-25
Anticipated expiration: 2032-11-11

Abstract

The utility model discloses a cooling mechanism for a wafer after demolding, which belongs to the field of wafer production, and is characterized by comprising a cooling chamber (3) positioned at one side of an oven (1), and the cooling mechanism is characterized in that: the automatic transfer device is characterized by further comprising an automatic transfer device (4) rotatably connected to one end of the oven (1), wherein the discharge end of the automatic transfer device (4) is connected with a conveying belt (5), and the conveying belt (5) penetrates into the cooling chamber (3) to be connected with the conveying belt in the cooling chamber (3).

Description

Cooling mechanism after wafer cake demoulding

Technical Field

The utility model belongs to the field of wafer production, and particularly relates to a cooling mechanism for a wafer after demolding.

Background

Waffles are a type of waffle derived from belgium, also called waffles, that are made with ovens equipped with special baking trays.

At present, the industrialized wafer making is realized through a circulating oven, the structure of the circulating oven is shown in fig. 1, the circulating oven comprises an oven 1, a plurality of baking trays 2 are arranged inside and outside the oven 1, and the baking trays 2 are connected end to end through a connecting mechanism 7 to form an annular structure. Wherein, the baking tray 2 is formed by hinging a chassis 201 and a top cover 202, and a plurality of die cavities 203 for extruding wafer raw material slurry are arranged on the chassis 201 and the top cover 202.

After the wafer stock slurry is extruded into the mold cavity 203 of the baking tray 2 by the blanking mechanism 8, the baking tray 2 automatically covers and enters the interior of the baking oven 1 along the annular path for baking, then exits the baking oven 1 along the annular path, covers and returns to the initial position (i.e. above the baking oven 1), and at this time, the wafer is taken out of the mold cavity 203 to enter the next circulation operation.

The subsequent baking of wafers in oven 1, similar to the wafer production process described above in the prior art, is the transfer of wafers into cooling chamber 3 for cooling. The temperature in the cooling chamber 3 is low and the wafer will move slowly on the conveyor belt in the cooling chamber 3 until it moves outside the cooling chamber 3 for natural cooling.

However, in the conventional wafer transfer method, wafers are manually taken out of the mold cavity 203 by a tool such as a clip and then manually transferred into the cooling chamber 3 during the transfer of wafers from the oven 1 to the cooling chamber 3, which is troublesome in operation, is easily scalded, and causes unsanitary conditions.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model aims to provide the wafer cake production field, the whole transfer process is not needed to be manual, the automation degree is high, and the problems of scalding and insanitation are avoided.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a cooling mechanism behind wafer drawing of patterns, includes the cooling chamber that is located oven one side, still including rotating the automatic transfer device who connects in oven one end top, automatic transfer device's discharge end is connected with the conveyer belt, the conveyer belt penetrates in the cooling chamber and is connected with the conveyer belt in the cooling chamber.

Through adopting above-mentioned technical scheme, automatic transfer device can be with the waffle automatic transfer to the cooling chamber on the cyclic baking tray, need not the manual transfer waffle, and degree of automation is high, can not appear scalding moreover, unhygienic problem.

The utility model is further provided with: the automatic transfer device comprises a roller which is rotatably connected above the oven and is close to one end of the cooling chamber, and the roller is driven by a driving device; the surface of the rotating roller is provided with a plurality of suction holes corresponding to the die cavities on the chassis, the inside of the rotating roller is provided with a vacuum suction pipe connected with the suction holes, and the vacuum suction pipe is connected with an external vacuum pump through a rotary joint; one end of the conveying belt, which is close to the rotating roller, is fixed with a cutter, one end of the cutter is close to the surface of the rotating roller, and the other end of the cutter is connected with the conveying belt.

Through adopting above-mentioned technical scheme, circulating baking tray can follow annular route slow rotation, and the rotational speed of control commentaries on classics roller corresponds with circulating baking tray's speed, can make the suction opening inhale the waffle that corresponds in the die cavity on changeing the roller, then under the cutting action of cutter, the waffle shifts to on the conveyer belt from changeing the roller, carries to the cooling chamber at last. The whole process does not need to manually transfer the waffle, so that the automation degree is high, and the problems of scalding and insanitation are avoided.

The utility model is further provided with: the surface of the conveying belt connected with the cutter is net-shaped.

By adopting the technical scheme, the net shape can reduce the adhesion of oil, reduce the occurrence of the problem of wafer slip, and avoid wafer slip.

In summary, the utility model has the following advantages:

1. by arranging the automatic transfer device, the automatic transfer device can automatically transfer the waffles on the circulating baking tray into the cooling chamber without manually transferring the waffles, so that the automatic baking tray has high automation degree, and the problems of scalding and insanitation are avoided;

2. through setting up roller and cutter to set up the suction opening, suck the waffle in the die cavity through the suction opening, and cut and shift the waffle of absorption on the roller to the rear conveyer belt through the cutter, and then send into the cooling chamber, whole process need not the manual transfer waffle, and degree of automation is high, can not appear scalding moreover, unhygienic problem.

Drawings

FIG. 1 is a schematic view of a prior art circulating oven;

FIG. 2 is an overall schematic diagram of the present embodiment;

fig. 3 is a schematic structural diagram of the embodiment after hiding the cooling chamber.

Reference numerals: 1. an oven; 2. a baking tray; 201. a chassis; 202. a top cover; 203. a mold cavity; 3. a cooling chamber; 4. an automatic transfer device; 401. a rotating roller; 402. a driving device; 403. a suction hole; 5. a conveyor belt; 6. a cutter; 7. a connecting mechanism; 8. and a blanking mechanism.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings.

The cooling mechanism after the wafer demolding is referred to as fig. 2, and comprises a cooling chamber 3 positioned at one side of an oven 1, wherein the temperature in the cooling chamber 3 is regulated to be lower than normal temperature by an air conditioner, and the wafer can be slowly conveyed outwards and rapidly cooled on a conveying belt in the cooling chamber 3 after entering the cooling chamber.

Referring to fig. 2 and 3, the cooling mechanism further includes an automatic transfer device 4 rotatably connected to an upper portion of one end of the oven 1, a discharge end of the automatic transfer device 4 is connected with a conveyor belt 5, a surface of the conveyor belt 5 is in a net shape (not shown), and the conveyor belt 5 penetrates into the cooling chamber 3 to be connected with other conveyor belts in the cooling chamber 3.

The automatic transfer device 4 comprises a rotary roller 401 which is rotatably connected above the oven 1 and is close to one end of the cooling chamber 3, the rotary roller 401 is driven by a driving device 402 and rotates clockwise, the driving device 402 is a matched structure of a motor, a chain and a gear, the two gears are meshed on the gear, and the motor drives the rotary roller 401 to rotate through the chain and the gear. The peripheral side wall of the roller 401 is close to the chassis 201 of the baking tray 2, and when the baking tray 2 just exits the oven 1 and the top cover 202 is opened, the peripheral side wall of the roller 401 is attached to the wafer.

The surface of the rotary roller 401 is provided with a plurality of suction holes 403 corresponding to the die cavities 203 on the chassis 201, and a vacuum suction pipe (not shown in the figure) connected with the suction holes 403 is arranged inside the rotary roller 401 and is connected with an external vacuum pump (not shown in the figure) through a rotary joint. The rotary joint belongs to the prior art, and the relative rotation of the joint and the vacuum suction pipe can be realized under the condition of ensuring sealing. The wafer can be sucked to the surface of the roller 401 by the negative pressure of the suction holes 403 and move with the roller 401.

One end of the conveyor belt 5, which is close to the roller 401, is fixed with a cutter 6, one end of the cutter 6 is close to the surface of the roller 401, preferably the cutter 6 is tangential to the peripheral side wall of the roller 401, and the arrangement can cut wafers adsorbed on the roller 401. The other end of the cutter 6 is engaged with the conveyor belt 5 and flush with the upper surface of the conveyor belt 5. Wafers adsorbed on the rotary roller 401 are cut off and piled on the cutter 6 when passing through the cutter 6, and along with the continuous piling of the follow-up wafers, the wafers cut off firstly are extruded onto the conveying belt 5, and along with the conveying belt 5 entering the cooling chamber 3 for cooling, the whole process does not need manual touching and transferring of the wafers.

The working process and the beneficial effects of the utility model are as follows: the circulating baking tray 2 can slowly rotate along the annular path, the rotation speed of the rotating roller 401 is controlled to correspond to the speed of the circulating baking tray 2, so that the suction holes 403 can suck the wafer corresponding to the mold cavities 203 on the rotating roller 401, then the wafer is transferred from the rotating roller 401 to the conveying belt 5 under the cutting action of the cutter 6, and finally the wafer is conveyed into the cooling chamber 3. The whole process does not need to manually transfer the waffle, so that the automation degree is high, and the problems of scalding and insanitation are avoided.

The above embodiments are only preferred embodiments of the present utility model, and are not intended to limit the present utility model, and any modifications, equivalent substitutions, improvements, etc. within the design concept of the present utility model should be included in the scope of the present utility model.

Claims

1. The utility model provides a cooling mechanism behind wafer drawing of patterns, includes cooling chamber (3) that are located oven (1) one side, its characterized in that: still including rotating automatic transfer device (4) of being connected in oven (1) one end top, the discharge end of automatic transfer device (4) is connected with conveyer belt (5), conveyer belt (5) penetrate in cooling chamber (3) and are connected with the conveyer belt in cooling chamber (3).

2. A wafer de-molding cooling mechanism according to claim 1, wherein: the automatic transfer device (4) comprises a rotary roller (401) which is rotatably connected above the oven (1) and is close to one end of the cooling chamber (3), and the rotary roller (401) is driven by a driving device (402);

a plurality of suction holes (403) corresponding to the die cavities (203) on the chassis (201) are formed in the surface of the rotary roller (401), a vacuum suction pipe connected with the suction holes (403) is arranged inside the rotary roller (401), and the vacuum suction pipe is connected with an external vacuum pump through a rotary joint;

one end of the conveying belt (5) close to the rotating roller (401) is fixedly provided with a cutter (6), one end of the cutter (6) is close to the surface of the rotating roller (401), and the other end of the cutter is connected with the conveying belt (5).

3. A wafer de-molding cooling mechanism according to claim 2, wherein: the surface of the conveying belt (5) connected with the cutter (6) is net-shaped.