CN218886079U - Automatic chip testing device and automatic testing braider - Google Patents

Automatic chip testing device and automatic testing braider Download PDF

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Publication number
CN218886079U
CN218886079U CN202223528864.XU CN202223528864U CN218886079U CN 218886079 U CN218886079 U CN 218886079U CN 202223528864 U CN202223528864 U CN 202223528864U CN 218886079 U CN218886079 U CN 218886079U
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China
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chip
automatic
test
cavity
tested
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Chinese (zh)
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白建民
朱跃强
姚锡刚
于升辉
高慧欣
白俊
朱海华
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Anhui Xici Technology Co ltd
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Bengbu Ximag Technology Co ltd
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Abstract

The utility model provides a pair of automatic testing arrangement of chip and automatic test braider, automatic testing arrangement of chip is equipped with the chip that awaits measuring including test support plate, rotating member, a plurality of magnet and test piece on the test support plate, is equipped with the cavity that one side is the opening setting in the shown test support plate, and the rotating member part passes in the shown cavity is located to the opening, a plurality of magnets with the rotating member is connected, at least one in the magnet is located in the shown cavity, the test piece with chip electric connection awaits measuring, wherein, the rotating member is configured to be rotated by external drive, is in with the magnet that drives on it the cavity internal motion to provide the change gradient magnetic field, detect the output condition of chip that awaits measuring under the change of gradient magnetic field, and then obtain the relation curve between the output of chip that awaits measuring and the gradient magnetic field, and then acquire the sensitivity of chip itself that awaits measuring, thereby the excellent performance judgement of chip that awaits measuring is judged in the influence judgement.

Description

Automatic chip testing device and automatic testing braider
Technical Field
The utility model relates to an encoder technical field, concretely relates to chip automatic testing arrangement and automatic test braider.
Background
The testing principle of the linear displacement magnetic encoder chip is as follows: when the direction of an external gradient magnetic field (magnetic field to be measured) with strong magnetic field intensity changes, the output of the encoder chip changes correspondingly. The output signal of the encoder chip is acquired, tested and analyzed to obtain a relation curve between the output of the encoder chip and the external gradient magnetic field, the basic characteristics of the encoder chip, such as sensitivity, zero magnetic field output, precision and the like, can be obtained through the relation curve, and the product quality can be judged through the parameters.
In traditional test fixture, often can't provide external change gradient magnetic field for the encoder chip that awaits measuring to unable output condition under the detection encoder chip external gradient magnetic field changes, can't obtain the relation curve between the output of encoder chip and the external gradient magnetic field promptly, and then can't satisfy the test requirement to performances such as encoder chip sensitivity, precision, so that can't acquire the sensitivity of encoder chip itself, thereby influence the excellent performance of judging the encoder chip and judge.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model aims to solve the technical problem that often can't provide the external change gradient magnetic field for the encoder chip that awaits measuring among the prior art, consequently can only test the output of encoder chip under the condition of no external gradient magnetic field, thereby can't detect the output condition of encoder chip under the external gradient magnetic field change, can't obtain the relation curve between the output of encoder chip and the external gradient magnetic field promptly, and then can't satisfy the test requirement to performances such as encoder chip sensitivity, precision, so that can't acquire the sensitivity of encoder chip itself, thereby the excellent performance of encoder chip is judged in the influence.
Therefore, the utility model provides an automatic chip testing device, include:
the test carrier plate is provided with a chip to be tested, and a cavity with one side being opened is arranged in the test carrier plate;
the rotating piece is partially arranged in the cavity through the opening;
the magnets are connected with the rotating piece, and at least one magnet is arranged in the cavity;
the test piece is electrically connected with the chip to be tested;
wherein the rotating member is configured to be driven by an external force to rotate so as to drive the magnet thereon to move in the cavity, so as to provide a variable gradient magnetic field.
Optionally, the surface where the cavity opening is located is adjacent to the surface where the chip to be tested is located.
Optionally, the rotating member comprises:
the magnet is arranged on the surface of the placing part;
and one end of the connecting column is connected with the center of the placing part, the other end of the connecting column is connected with the driving part, and the connecting column is configured to be driven by the driving part to rotate so as to drive the placing part to rotate.
Optionally, the placing part is disc-shaped, and a plurality of magnets are annularly arranged on the surface of the placing part.
Optionally, a number of said magnets are equally spaced.
Optionally, the magnet in the cavity is disposed on one side of the chip to be tested, and is located at a vertical projection overlapping portion of the chip to be tested.
Optionally, the automatic chip testing device further comprises a base, the driving piece is arranged in the base, and the testing piece is connected with the base.
Optionally, the automatic chip testing device further comprises a plurality of probes, one end of each probe is connected with the testing piece, and the other end of each probe penetrates through the testing carrier plate and is electrically connected with the chip to be tested.
Optionally, the voltage input end and/or the current input end of the test piece is connected with the power line set so as to supply voltage and/or current, and the test piece is suitable for being connected with the detection device.
An automatic test braider comprises a vibrating disc hopper, a feeding track, a suction nozzle, a mobile platform and an automatic chip test device, wherein the suction nozzle is arranged on a test support plate to suck a chip to be tested, and the automatic chip test device is the automatic chip test device.
The utility model provides a pair of chip automatic testing arrangement and automatic test braider has following advantage:
1. the utility model provides a pair of automatic testing arrangement of chip, including test support plate, rotating member, a plurality of magnet and test piece, be equipped with the chip that awaits measuring on the test support plate, be equipped with the cavity that one side is the opening setting in the shown test support plate, the rotating member part passes in shown cavity is located to the opening, a plurality of magnets with the rotating member is connected, at least one in shown cavity is located to the magnet, the test piece with chip electric connection awaits measuring, wherein, the rotating member is configured to receive external drive to rotate to the magnet that drives on it is in the motion in the cavity, in order to provide the gradient magnetic field that changes.
This chip automatic testing arrangement of mechanism is the cavity that the opening set up through being equipped with one side in the test support plate, passes the rotating part in the opening is located shown cavity, and the magnet with the rotating part is connected, at least one in the magnet is located shown cavity, when the rotating part receives external drive to rotate, the rotating part drives the magnet on it and moves in the cavity, and then provides the gradient magnetic field that changes in chip department that awaits measuring, detects the output condition of the chip that awaits measuring under the gradient magnetic field change, and then obtains the relation curve between the output of the chip that awaits measuring and the gradient magnetic field, and then obtains the sensitivity of the chip that awaits measuring itself to the influence judges the functional quality judgement of the chip that awaits measuring.
2. The utility model provides a pair of automatic chip testing device, the portion of placing is discoid, and is a plurality of the magnet is cyclic annular and locates the portion surface of placing, and a plurality of the equidistant setting of magnet.
The automatic chip testing device of the mechanism is characterized in that the plurality of magnets are arranged on the surface of the placing part in an annular mode, and the magnets are arranged at equal intervals, so that when the placing part drives the magnets to rotate, the gradient magnetic field provided by the magnets at a chip to be tested is more uniform.
3. The utility model provides a pair of chip automatic testing arrangement, the magnet in the cavity is located chip one side of awaiting measuring, and it is located chip vertical projection that awaits measuring overlaps the position.
The chip automatic testing device of the mechanism improves the effect of the magnetic field intensity applied to the chip to be tested by arranging the magnet to be partially overlapped with the chip to be tested in the vertical projection direction.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of an automatic chip testing device and an automatic chip testing device in an automatic testing braider provided in an embodiment of the present invention;
fig. 2 is an exploded view of an automatic chip testing apparatus provided in an embodiment of the present invention;
FIG. 3 is an enlarged view of the structure of FIG. 2 at circle A;
fig. 4 is a front view of an automatic chip testing apparatus provided in an embodiment of the present invention;
FIG. 5 is an enlarged view of the structure of FIG. 4 at circle B;
fig. 6 is a top view of an automatic chip testing apparatus provided in an embodiment of the present invention;
FIG. 7 is an enlarged view of the structure of FIG. 6 at circle C;
description of reference numerals:
1-testing a carrier plate;
2-a chip to be tested;
3-a rotating member; 31-a placement section; 32-connecting column;
4-a magnet;
5-testing the piece;
6-a base;
7-a probe;
8-suction nozzle.
Detailed Description
The technical solutions of the present invention will be described more clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Example 1
The automatic testing arrangement of chip of this application embodiment is used for the test to the chip, and in this application embodiment, chip 2 that awaits measuring is the encoder chip, and when having the direction change of the stronger outside gradient magnetic field of magnetic field intensity, the output of encoder chip takes place corresponding change. The output signal of the encoder chip is acquired, tested and analyzed to obtain a relation curve between the output of the encoder chip and the external gradient magnetic field, the basic characteristics of the encoder chip, such as sensitivity, zero magnetic field output, precision and the like, can be obtained through the relation curve, and the product quality can be judged through the parameters.
The automatic chip testing device is not limited to testing the encoder chip, and can be applied to other chips which need to provide an external variable gradient magnetic field for testing.
The automatic chip testing device provided by this embodiment, as shown in fig. 1 to 7, includes a test carrier 1, a rotating member 3, eight magnets 4, a test piece 5, and a base 6.
As shown in fig. 1 to 3, the testing part 5 is fixedly connected to the right side of the upper surface of the base 6 through a non-magnetic screw, the testing carrier plate 1 is also fixedly connected to the upper surface of the testing part 5 through a non-magnetic screw, the upper surface of the testing carrier plate 1 is provided with a placing cavity for placing the chip 2 to be tested, and the placing cavity is arranged in the middle of the upper surface of the testing carrier plate 1.
Furthermore, a cavity is arranged in the test carrier plate 1, an opening is arranged on the left side of the cavity, and a placing cavity arranged on the upper surface of the test carrier plate 1 is located on the upper side of the cavity, that is, the depth of the cavity is greater than the distance from the placing cavity to the left side of the test carrier plate 1.
As shown in fig. 2, 4 and 5, the automatic chip testing apparatus further includes a probe 7, one end of the probe 7 is electrically connected to the testing part 5, the other end of the probe 7 penetrates through the cavity in the testing carrier board 1, and a tip of the probe 7 is exposed at the bottom of the placing cavity, so that the probe 7 is electrically connected to the chip 2 to be tested. The test piece 5 supplies power to the chip 2 to be tested through the probe 7 and collects an output signal of the chip 2 to be tested. It will be appreciated that the number of probes 7 may be set according to the test requirements.
The power line group is fixed at a voltage input end or a current input end of the test piece 5 and used for introducing variable voltage or current to the test piece 5, or the power line group is fixed at the voltage input end and the current input end of the test piece 5 and simultaneously introduces variable voltage and current to the test piece 5. And the output port of the test piece 5 is connected with a detection device, the detection device can output the collected data for analysis and detection, and the test piece 5 is a printed circuit board.
Still refer to fig. 1 and fig. 2, rotating member 3 includes interconnect's place portion 31 and spliced pole 32, place portion 31 is discoid, spliced pole 32 one end is connected with place portion 31 center department, the spliced pole 32 other end sets up inside base 6 through the through-hole of seting up on base 6, and the inside driving pieces such as driving motor that are provided with of base 6, and set up spliced pole 32 one end and driving motor output fixed connection inside base 6, and then make driving motor can drive spliced pole 32 rather than being connected and rotate, and then drive place portion 31 round spliced pole 32 axis rotation.
Further, the upper surface part of discoid placing part 31 side department passes the opening and locates in the cavity, and when driving motor drove placing part 31 and rotated around spliced pole 32 axis, discoid placing part 31 passed the opening and locates the part in the cavity and can move in the cavity.
As shown in fig. 2 and fig. 6, eight magnets 4 are fixedly connected to the upper surface of the disc-shaped placing part 31, and the magnets 4 are arranged at the edge of the disc-shaped placing part 31, so that when the driving motor drives the placing part 31 to rotate around the axis of the connecting column 32, the magnets 4 moving along with the placing part 31 move in the cavity.
Wherein, eight magnets 4 are cyclic annular and locate placing portion 31 surface, and eight magnets 4 equidistant setting for when placing portion 31 drove magnet 4 and rotates, can make magnet 4 more even at the gradient magnetic field that awaits measuring chip 2 provided.
It will be appreciated that in other embodiments, the magnets 4 may be provided in other numbers, and the placement portion 31 may have other shapes, such as other shapes capable of carrying the magnets 4 for movement within the cavity.
As shown in fig. 4 and 5, the magnet 4 and the placing portion 31 disposed in the cavity of the test carrier board 1 are disposed on one side of the probe 7, and a space is provided between the placing portion 31 and the probe 7, so that the placing portion 31 can be prevented from colliding with the probe 7 when the driving motor drives the placing portion 31 to move in the cavity.
Further, as shown in fig. 6 and 7, the magnet 4 in the cavity is disposed at one side of the chip 2 to be tested, and is located at a vertical projection overlapping portion of the chip 2 to be tested, that is, a top view range of the chip 2 to be tested overlaps a top view range of the magnet 4 in the cavity, so as to improve an effect of a magnetic field intensity applied to the chip to be tested.
The chip automatic testing device provided by the embodiment has the following working principle:
firstly, a chip 2 to be tested is placed in a placing cavity on the upper surface of a test carrier plate 1, the chip 2 to be tested is electrically connected with a probe 7 at the bottom of the placing cavity, then the chip 2 to be tested and a test piece 5 can transmit signals mutually, then variable voltage or current is introduced into the test piece 5, a drive motor arranged in a base 6 drives a connecting column 32 to rotate, further a placing part 31 is driven to rotate around the axis of the connecting column 32, a magnet 4 connected with the placing part 31 is driven to move in a cavity in the test carrier plate 1, an external variable gradient magnetic field is provided for the chip 2 to be tested, an output signal of the chip 2 to be tested is collected, tested and analyzed through a detection device, a relation curve between the output of the chip 2 to be tested and the external gradient magnetic field is obtained, basic characteristics of the chip 2 to be tested can be obtained through the relation curve, such as sensitivity, zero magnetic field output, precision and the like, and the product quality is judged through the parameters.
Example 2
The embodiment provides an automatic testing braider, which comprises a vibration disc hopper, a feeding track, a suction nozzle 8, a mobile platform and an automatic chip testing device, wherein the automatic chip testing device is the automatic chip testing device in the embodiment 1. As shown in fig. 1, the suction nozzle 8 is disposed above the chip 2 to be tested.
When the automatic chip testing device works, a chip 2 to be tested is placed in a vibrating disc hopper, the direction is aligned by adopting a circular vibration mode, the bottom of the vibrating disc hopper is provided with an electromagnet, the hopper can vibrate in the vertical direction, the hopper is driven by an inclined spring piece to do torsional vibration around the vertical axis of the hopper, the chip 2 to be tested in the hopper rises along a spiral track due to the vibration, the chip 2 to be tested can automatically enter a feeding track in a uniform state according to the assembly or processing requirements through the screening or posture change of a series of tracks in the rising process, the chip 2 to be tested can automatically enter the feeding track, a suction nozzle 8 is moved to the outlet of the feeding track through a moving platform to suck the chip 2 to be tested and then moves to an automatic chip testing device, the suction nozzle 8 is pressed down, the chip 2 to be tested is placed in a placing cavity on a testing support plate 1, and a driving motor arranged in a base 6 drives a connecting column 32 to rotate, then the placing part 31 is driven to rotate around the axis of the connecting column 32, and further the magnet 4 connected with the placing part 31 is driven to move in the cavity inside the test carrier plate 1, so as to provide an external variable gradient magnetic field for the chip 2 to be tested, then the variable voltage or current is introduced to the test piece 5, the output signal of the chip 2 to be tested is collected, tested and analyzed by the detection device, so as to obtain the relation curve between the output of the chip 2 to be tested and the external gradient magnetic field, the basic characteristics of the chip 2 to be tested, such as sensitivity, zero magnetic field output, precision and the like, can be obtained through the relation curve, the product quality is judged according to the parameters, after the test is finished, the suction nozzle 8 sucks the chip 2 to be tested to leave the chip automatic test device, the chip 2 to be tested which is detected to be a good product is placed in a braiding component on an automatic test braiding machine for packaging, the chip 2 to be tested to be a bad product is detected, and placing into an NG box at one side of the automatic testing braider.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims (10)

1. An automatic chip testing device, comprising:
the device comprises a test carrier plate (1), a chip (2) to be tested is arranged on the test carrier plate, and a cavity with one side being opened is arranged in the test carrier plate (1);
a rotating member (3) partially arranged in the cavity through the opening;
the magnets (4) are connected with the rotating piece (3), and at least one magnet (4) is arranged in the cavity;
the test piece (5) is electrically connected with the chip (2) to be tested;
wherein the rotating piece (3) is configured to be driven by external force to rotate so as to drive the magnet (4) thereon to move in the cavity, so as to provide a variable gradient magnetic field.
2. The automatic chip testing device according to claim 1, wherein the surface of the cavity opening is adjacent to the surface of the chip (2) to be tested.
3. The automatic chip testing device according to claim 1 or 2, wherein the rotary member (3) comprises:
a placing part (31), wherein the magnet (4) is arranged on the surface of the placing part (31);
a connecting column (32), one end with the center of the placing part (31) is connected, the other end of the connecting column (32) is connected with the driving part, and the connecting column (32) is configured to be driven by the driving part to rotate so as to drive the placing part (31) to rotate.
4. The automatic chip testing device according to claim 3, wherein the placing portion (31) has a disk shape, and a plurality of the magnets (4) are annularly provided on a surface of the placing portion (31).
5. The automatic chip testing device according to claim 4, wherein a plurality of said magnets (4) are arranged at equal intervals.
6. The device for automatically testing chips as claimed in claim 5, wherein the magnet (4) in the cavity is disposed at one side of the chip (2) to be tested and is located at the vertical projection overlapping portion of the chip (2) to be tested.
7. The automatic chip testing device according to any one of claims 4-6, further comprising a base (6), wherein the driving member is disposed in the base (6), and the testing member (5) is connected to the base (6).
8. The apparatus of claim 7, further comprising a plurality of probes (7), one end of each of which is connected to the test piece (5), and the other end of each of which penetrates through the test carrier (1) and is electrically connected to the chip (2) to be tested.
9. The device for the automatic testing of chips according to claim 7, characterized in that the test piece (5) is connected to a set of power lines at its voltage input and/or current input for passing a voltage and/or a current, and the test piece (5) is adapted to be connected to a detection device.
10. An automatic test braider is characterized by comprising a vibration disc hopper, a feeding track, a suction nozzle (8), a moving platform and an automatic chip test device, wherein the suction nozzle (8) is arranged on a test support plate (1) to suck a chip (2) to be tested, and the automatic chip test device is the automatic chip test device as claimed in any one of claims 1 to 9.
CN202223528864.XU 2022-12-20 2022-12-20 Automatic chip testing device and automatic testing braider Active CN218886079U (en)

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Application Number Priority Date Filing Date Title
CN202223528864.XU CN218886079U (en) 2022-12-20 2022-12-20 Automatic chip testing device and automatic testing braider

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Application Number Priority Date Filing Date Title
CN202223528864.XU CN218886079U (en) 2022-12-20 2022-12-20 Automatic chip testing device and automatic testing braider

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CN218886079U true CN218886079U (en) 2023-04-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116699373A (en) * 2023-08-08 2023-09-05 北京智芯微电子科技有限公司 Chip external constant magnetic field immunity detection device and chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116699373A (en) * 2023-08-08 2023-09-05 北京智芯微电子科技有限公司 Chip external constant magnetic field immunity detection device and chip

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Address after: Xici Technology Industrial Park, No. 321 Taibo Road, Sensing Valley C District, Bengbu Economic Development Zone, Anhui Province, 233060

Patentee after: Anhui Xici Technology Co.,Ltd.

Address before: 102 #, China (Bengbu) Microelectronics Technology Park, Intersection of Caiyuan Road and Huanhu West Road, Economic Development Zone, Bengbu City, Anhui Province, 233000

Patentee before: Bengbu Ximag Technology Co.,Ltd.

CP03 Change of name, title or address