CN218885187U

CN218885187U - Temperature measuring device for wafer

Info

Publication number: CN218885187U
Application number: CN202223550727.6U
Authority: CN
Inventors: 罗正勇; 金補哲; 黄中山
Original assignee: Shengjisheng Semiconductor Technology Shanghai Co ltd
Current assignee: Shengjisheng Semiconductor Technology Shanghai Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-04-18
Anticipated expiration: 2032-12-29

Abstract

The utility model relates to a temperature measuring device for wafer, including thermoscope, pipeline and signal line, set up and be provided with temperature sensor in each position department of the inside wafer of cavity, temperature sensor passing signal line is connected with the thermoscope that sets up in the cavity outside, and the periphery at the signal line is put to the pipeline cover, and the first end of pipeline sets up in the inside of cavity. The utility model discloses can effectively protect the temperature measurement signal line, improve temperature measuring device's life.

Description

Temperature measuring device for wafer

Technical Field

The utility model relates to a semiconductor technology field especially relates to a temperature measuring device for wafer.

Background

In various semiconductor production processes, chemical vapor deposition is taken as an example: the wafer is heated, so that the process gas in the reaction chamber reacts with the wafer, and a film layer is deposited on the surface of the wafer. In order to obtain a good epitaxial growth effect, the temperature of the wafer is critical, and the temperature directly affects the process indexes such as the film thickness, uniformity and stress of the surface of the wafer, so the temperature of the wafer needs to be accurately measured and controlled. The prior art generally measures the temperature of the wafer in the following manner: the temperature measuring signal line is led out from the space between the upper cavity body and the lower cavity body, the upper cavity body is pressed on the signal line, the signal line is easily abraded or broken, and the service life of the temperature measuring device is shortened.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a temperature measuring device for wafer to effectively protect the temperature measurement signal line, improve temperature measuring device's life.

The purpose of the utility model is realized by adopting the following technical scheme. The basis the utility model provides a temperature measuring device for wafer, including thermoscope, pipeline and signal line, set up and be provided with temperature sensor in each position department of the inside wafer of cavity, temperature sensor passes through the signal line with set up in the cavity outside the thermoscope is connected, the pipeline cover is put the periphery of signal line, the first end of pipeline set up in the inside of cavity.

In some embodiments, the temperature measurement device further comprises a case, and the temperature detector is disposed inside the case.

In some embodiments, the second end of the conduit is disposed inside the tank.

In some embodiments, the conduit is sealed from the cavity at the point of contact by a sealing ring.

In some embodiments, the conduit is sealed from contact with the tank by a gasket.

In some embodiments, the duct is configured as a containment duct and the enclosure is a containment enclosure.

In some embodiments, the duct includes a first duct portion and a second duct portion, a first end of the first duct portion enters the cavity, a first end of the second duct portion enters the box, and a second end of the first duct portion and a second end of the second duct portion are hermetically connected by a sealing ring.

The beneficial effects of the utility model include at least:

1. the utility model discloses a set up in each position department of the inside wafer of cavity and be provided with temperature sensor, temperature sensor passing signal line and set up to be connected in the outside thermoscope of cavity, the first end of pipeline is put in the periphery of signal line and pipeline to the pipeline cover sets up in the inside of cavity, can effectively protect the signal line through the pipeline, improves temperature measuring device's life.

2. The utility model discloses a thermoscope sets up in the inside of box, the second end of pipeline sets up in the inside of box, and the contact department of pipeline and cavity keeps sealed, pipeline and box through the sealing washer keeps sealed, can make temperature measuring device's whole temperature measurement process go on in vacuum environment, improves the accuracy of temperature measurement.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention can be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are specifically illustrated below, and the detailed description is given in conjunction with the accompanying drawings.

Drawings

Fig. 1 shows a schematic structural diagram of a temperature measuring device for a wafer according to an embodiment of the present invention.

Detailed Description

To further illustrate the technical means of the present invention, the following detailed description of an embodiment of a temperature measuring device for a wafer according to the present invention is provided with reference to the accompanying drawings and preferred embodiments. The following examples are merely for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the scope of protection of the present invention is not limited thereby.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the term "comprising" as well as any variants thereof in the description and claims of the present application and in the description of the above figures.

In the description of the present invention, it is also to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, e.g., as a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The terms described above have 5-body meanings in the present invention, which can be understood by those skilled in the art according to specific situations. Furthermore, the terms "first", "second", etc. are used only for distinguishing descriptions and are not to be construed as referring to

Showing or implying relative importance. "plurality" means two or more.

As shown in fig. 1, a second chamber 2 is disposed above a first chamber 1, an upper surface of the first chamber 1 contacts a lower surface of the second chamber 2, a wafer stage 3 is disposed inside the first chamber 1, and a wafer is disposed on the wafer stage

The upper surface of the stage 3 is provided with a wafer 4. A temperature measuring device 0 for wafer include thermoscope 5, pipeline 6, signal line 7 and box 8, the different positions department of wafer 4 is provided with

A plurality of temperature sensors (e.g. thermocouples) for detecting the temperatures of the corresponding parts, a first end of the signal wire 7 is disposed inside the first chamber 1, a second end of the signal wire 7 is connected with the temperature measuring instrument 5 disposed outside the first chamber 1, the plurality of temperature sensors are all connected with the temperature measuring instrument 5 through the signal wire 7,

the temperature measuring instrument 5 is used for reading the temperature of each position point on the temperature measuring wafer 4, and the pipeline 6 is sleeved on the periphery of the signal line 75 and used for protecting the signal line 7 and keeping a sealed environment. A first end of the duct 6 penetrates and enters the interior of the first chamber 1 and a second end of the duct 6 penetrates and enters the interior of the tank 8.

In one or more embodiments, the contact point of the pipe 6 and the first cavity 1 is kept sealed by a sealing ring, and the contact point of the pipe 6 and the box 8 is kept sealed by a sealing ring. The pipe 6 is configured as a sealed pipe and the box 8 is a closed box for housing the temperature detector 5.

0 in one or more embodiments, the duct 6 may include a first duct portion and a second duct portion,

the first end of the first pipeline part penetrates through and enters the first cavity 1, the first end of the second pipeline part penetrates through and enters the box body 8, and the second end of the first pipeline part is connected with the second end of the second pipeline part in a sealing mode through a sealing ring.

The utility model discloses a set up and be provided with 5 temperature sensor, temperature sensor passing signal line 7 and set up in 1 outside thermoscope 5 of first cavity and be connected, 6 covers of pipeline are put in the periphery of signal line 7 and the first end of pipeline 6 and are set up in 1 inside of first cavity in 1 inside position department of the inside wafer 4 of first cavity, can effectively protect signal line 7 through pipeline 6, improve temperature measuring device's life.

The utility model discloses a thermoscope 5 sets up in the inside of box 8, the second tip of pipeline 6 is established

Is arranged in the box body 8, the contact part of the pipeline 6 and the first cavity 1 is kept sealed by a sealing ring, and the contact part of the pipeline 6 and the box body 8 is kept sealed by a sealing ring, so that the whole temperature measuring device can be arranged

The temperature measurement process is carried out in a vacuum environment, and the accuracy of temperature measurement is improved.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to practice the present invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the invention. Thus, the present invention is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The temperature measuring device for the wafer is characterized by comprising a temperature measuring instrument, a pipeline and a signal line, wherein a temperature sensor is arranged at each part of the wafer in a cavity, the temperature sensor is connected with the temperature measuring instrument arranged outside the cavity through the signal line, the pipeline is sleeved on the periphery of the signal line, and a first end part of the pipeline is arranged in the cavity.

2. The temperature measuring device for the wafer according to claim 1, further comprising a box, wherein the temperature measuring instrument is disposed inside the box.

3. The temperature measurement device for a wafer according to claim 2, wherein the second end of the pipe is disposed inside the case.

4. The temperature measuring device for the wafer as claimed in claim 1, wherein the contact position of the pipeline and the cavity is kept sealed by a sealing ring.

5. The temperature measuring device for the wafer as claimed in claim 2, wherein the contact position of the pipeline and the box body is kept sealed by a sealing ring.

6. The temperature measurement device for a wafer according to claim 2, wherein the pipe is configured as a hermetic pipe, and the case is a hermetic case.

7. The temperature measuring device for the wafer as claimed in claim 2, wherein the pipe comprises a first pipe portion and a second pipe portion, a first end of the first pipe portion enters the cavity, a first end of the second pipe portion enters the box body, and a second end of the first pipe portion and a second end of the second pipe portion are hermetically connected through a sealing ring.