CN218885182U

CN218885182U - Sensor, battery package and car

Info

Publication number: CN218885182U
Application number: CN202222908199.0U
Authority: CN
Inventors: 曾招停; 林彦强
Original assignee: Wuhan Topson Sensor Technology Co ltd
Current assignee: Wuhan Topson Sensor Technology Co ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2023-04-18
Anticipated expiration: 2032-11-02

Abstract

The utility model relates to a sensor, battery package and car, the sensor includes: an isolatable layer capable of insulation having a first surface and a second surface; the sensor body is arranged on the isolation layer and is provided with two pins, one ends of the two pins are connected with the sensor body, and the other ends of the two pins extend along the first surface and the second surface respectively; one ends of the two flexible circuits are respectively connected with one ends of the two pins far away from the sensor body; and the cover film wraps and covers the isolation layer, the sensor body and the flexible circuit. The sensor pins provide enough size to be connected with the flexible circuit, so that the connection stability is improved; the isolation layer provides a mounting position for the sensor body, and the two pins can be isolated by the isolation layer so as to avoid short circuit caused by contact of the two pins and improve the working stability of the sensor; the cover film provides stable waterproofing performance to the whole structure.

Description

Sensor, battery package and car

Technical Field

The utility model relates to a sensor field especially relates to a sensor, battery package and car.

Background

With the development of intelligence, more and more carriers need to obtain information of surrounding environment by means of sensors so as to provide data acquisition and collection for realizing intelligence.

For some sensors, such as temperature sensors, the temperature sensors are usually welded on a flexible circuit board, the stability of the product is insufficient, the sensors only have two poles without lead welding, the problem of insufficient solder joint may also occur in the welding process, the service requirement cannot be met even if the whole service life of the insufficient solder joint product does not occur, the sensors (especially patch type sensors) are usually sealed by waterproof glue after being welded, the sealing effect cannot meet the waterproof requirement, even if the sensors are just waterproof, the sensors are slowly carbonized to finally lose efficacy in the use process, and the performance of the whole product is also influenced.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a can be waterproof and connect stable sensor to solve above-mentioned technical problem.

A sensor, comprising: an isolatable layer capable of insulation having a first surface and a second surface; the sensor body is arranged on the isolation layer and is provided with two pins, one ends of the two pins are connected with the sensor body, and the other ends of the two pins extend along the first surface and the second surface respectively; one ends of the two flexible circuits are respectively connected with one ends of the two pins far away from the sensor body; and the cover film wraps and covers the isolation layer, the sensor body and the flexible circuit.

According to the sensor, the sensor body is provided with the two pins, and the pins provide enough size to be connected with the flexible circuit, so that the connection stability is improved; the isolation layer provides a mounting position for the sensor body, the first surface and the second surface provide a joint surface for extending paths of the two pins, and the two pins can be separated by the isolation layer so as to avoid short circuit caused by contact of the two pins and improve the working stability of the sensor; the cover film provides stable waterproofing performance to the entire structure.

In one embodiment, the first surface and the second surface are provided on opposite sides of the sensor body.

In one embodiment, one end of the flexible circuit is soldered to the corresponding pin.

In one embodiment, the other end of the flexible circuit is provided with a copper-clad welding point.

In one embodiment, the isolation layer is provided with an embedding hole penetrating from the first surface to the second surface, the sensor body is embedded in the embedding hole, and the two pins are respectively arranged at two ends of the sensor body corresponding to the first surface and the second surface.

In one embodiment, the sensor body is any one of a NT C temperature sensor, a PT temperature sensor, a thermocouple, a diode thermistor _。

In one embodiment, the sensor body is externally encapsulated with a glass layer, and the lead portion extends out of the glass layer.

In one embodiment, the cover film is a PI film or a PE film.

The utility model also provides a battery package, including foretell sensor.

The utility model also provides an automobile, including foretell sensor.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the internal structure of the present invention;

fig. 2 isbase:Sub>A sectional view taken atbase:Sub>A-base:Sub>A of fig. 1.

Reference numerals:

the insulation layer 100, the first surface 101, the second surface 102 and the embedding hole 110;

sensor body 200, pins 210;

flexible circuit 300, copper-clad solder joint 310;

the cover film 400.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for purposes of illustration only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, the present invention provides a sensor including an isolation layer 100, a sensor body 200, a flexible circuit 300, and a cover film 400.

The isolation layer 100 can be insulating, such as plastic. The isolation layer 100 has a first surface 101 and a second surface 102; the sensor body 200 is mounted on the isolation layer 100, the sensor body 200 is provided with two pins 210, one end of each of the two pins 210 is connected with the sensor body 200, and the other end of each of the two pins 210 extends along the first surface 101 and the second surface 102 respectively, that is, the two pins 210 are respectively attached to the first surface 101 and the second surface 102; wherein a portion of one lead 210 extends along the first surface 101 and a portion of the other lead 210 extends along the second surface 102; one end of each of the two flexible circuits 300 is connected to one end of each of the two pins 210 away from the sensor body 200, so that the sensor is electrically connected to an external control system; the cover film 400 covers the isolation layer 100, the sensor body 200, and the flexible wiring 300.

In one embodiment, the Flexible Circuit 300 is part of a Flexible wiring board, which is not limited to FPC (Flexible Printed Circuit) and FFC (Flexible Flat Cable). The isolation layer 100 is also part of the flex circuit board. Specifically, a part of the adhesive of the flexible printed circuit board may penetrate between the two pins 210 of the sensor body 200 as the isolation layer 100, so as to ensure the insulation of the two pins 210. That is, the flexible printed circuit board has a first surface 101 and a second surface 102, the first surface 101 and the second surface 102 are respectively exposed with a flexible circuit 300, the flexible circuit 300 of the first surface 101 is connected with one pin 210 of the sensor body 200, and the flexible circuit 300 of the second surface 102 is connected with the other pin 210 of the sensor body 200. It can be understood that the flexible circuit 300 may be integrally formed with the isolation layer 100, that is, the flexible circuit 300 and the isolation layer 100 are an integral body, or may be formed by a patch type assembly, that is, the flexible circuit 300 and the isolation layer are separate bodies.

The utility model provides a sensor, sensor body 200 are equipped with two pins 210, and pin 210 provides sufficient size and is connected with flexible line 300, improves connection stability, compares SMD thermistor only the two poles of the earth and does not have the lead wire welding, and pin 210 is more convenient and external connection, and connection stability is stronger.

In the related art, the chip thermistor is generally directly welded on the flexible circuit board, and due to the fact that soldering is needed and welding points are on the same surface of the chip thermistor, the defects of insufficient welding, weak welding and the like are prone to occurring. On the other hand, in the detection process, the welding spot is positioned at the heat source, and the heat source also influences the reliability of the welding spot, so that the temperature resistance is difficult to ensure. Moreover, the chip thermistor is welded on the flexible circuit board and then covered by waterproof glue. The sealing effect of the waterproof glue is difficult to reach high waterproof requirements, and even if the waterproof glue can be used for preventing water at the beginning, the waterproof glue is easy to separate from the glue of the flexible circuit board in the subsequent use process, and the waterproof glue fails due to the problems of water seepage and the like.

In the sensor adopting the scheme, the isolation layer 100 provides a mounting position for the sensor body 200, the first surface 101 and the second surface 102 provide a joint surface for the extension paths of the two pins 210, and the two pins 210 can be separated by the isolation layer 100, so that the two pins 210 are prevented from being in contact with each other to cause short circuit, and the working stability of the sensor is improved; the cover film 400 provides stable waterproof performance for the entire structure, and the cover film 400 is more stable in sealing than waterproof glue.

Moreover, according to the sensor of the scheme, the connection point of the pin 210 and the flexible circuit 300 can be far away from the sensor body 200, namely, in the detection process, the connection point of the pin 210 and the flexible circuit 300 can be far away from a heat source, the influence of the heat source on the connection point in the detection process is reduced, the service life and the working reliability can be guaranteed, and the temperature resistance is higher. In addition, the pin 210 and the flexible circuit 300 can be connected without soldering tin, so that the flexible circuit has higher temperature resistance. Moreover, in this scheme, two solder joints can be staggered, that is, the connection point of the flexible circuit 300 on the first surface 101 and one pin 210 of the sensor body 200 and the connection point of the flexible circuit 300 on the second surface 102 and the other pin 210 of the sensor body 200 are staggered in the thickness direction of the isolation layer 100 to avoid overlapping, and the glue of the flexible circuit board can separate the connection points of the first surface 101 and the second surface 102 well on both sides of the flexible circuit board, and the moist environment on the first surface 101 side is difficult to affect the second surface 102 side, so the moisture resistance is better.

In one embodiment, the first surface 101 and the second surface 102 are disposed on opposite sides of the sensor body 200 such that the isolation layer 100 is sandwiched between the two leads 210 to stably space the two leads 210 apart. As shown in fig. 1, two leads 210 are respectively represented by a solid line and a dotted line, the leads 210 represented by the solid line are attached to the first surface 101, and the leads 210 represented by the dotted line are attached to the second surface 102.

In one embodiment, one end of the flexible circuit 300 is soldered to the corresponding pin 210 to achieve electrical connection, and the pin 210 has sufficient size to be soldered to the flexible circuit 300, so that the connection is more stable.

In a more specific embodiment, the other end of the flexible circuit 300 is provided with a copper-clad solder joint 310 to facilitate a solder connection with an external circuit. It is understood that the coverlay 400 covers the flexible circuit 300 but does not cover the copper-clad solder 310, so that the copper-clad solder 310 is exposed for soldering with an external circuit.

In one embodiment, the isolation layer 100 is provided with an insertion hole 110 penetrating from the first surface 101 to the second surface 102, and the sensor body 200 is inserted into the insertion hole 110. Sensor body 200 wholly is the columnar structure, with inlay dress hole 110 adaptation, in order to realize that sensor body 200 stabilizes accurate installation, and sensor body 200 imbeds and inlays dress hole 110, can play the guard action to sensor body 200, when avoiding pressfitting in the production process to cover membrane 400, sensor body 200 does not receive direct pressfitting pressure, avoid damaging, and if when SMD sensor, receive the pressfitting pressure in the production process of covering membrane 400 easily and damage. The sensor body 200 is embedded into the embedding hole 110, so that the thickness of the whole structure is not increased, the surface of the isolation layer 100 is smoother, the space is more optimized, and the film covering is more convenient. The two pins 210 are respectively arranged at two ends of the sensor body 200 corresponding to the first surface 101 and the second surface 102, namely the two pins 210 are arranged at two ends of the sensor body 200 leaking from the embedded hole 110, so that before the sensor body 200 is inserted, the two pins 210 are in a standing state, after the sensor body 200 is inserted into the embedded hole 110, the two pins 210 are broken off to be attached to the first surface 101 and the second surface 102, and when the sensor body is installed, the pins 210 cannot interfere with the sensor body 200 to be inserted into the embedded hole 110, so that the installation is convenient, and meanwhile, the damage is avoided.

In one specific embodiment, the sensor body 200 is an NTC temperature sensor, which has a long service life and can withstand various high-precision, high-sensitivity, high-reliability, ultra-high temperature, and high pressure tests and still stably work for a long time.

In one specific embodiment, the sensor body 200 is packaged with a glass layer, the pins 210 extend out of the glass layer, and the NTC temperature sensor is packaged with glass, so that the NTC temperature sensor has higher temperature resistance and better waterproof performance. Of course, the sensor body 200 could also be any of a PT temperature sensor, a thermocouple, a diode thermistor.

In one specific embodiment, the cover film 400 is a PI film, and a PI cover film with better temperature resistance and waterproof performance is selected to be made into a double-sided board, so that the temperature resistance and waterproof grade of the whole product is higher than that of the first floor under the condition of ensuring insulation and pressure resistance. The sensor body 200 is of a non-patch structure, and is more suitable for covering a PI film to ensure waterproofness. During processing, the product with the double-sided covering film attached can be subjected to vacuum film pressing to ensure the attaching property and the waterproof property of the covering film 400. In other embodiments, PE films may also be used, which may also achieve better fit and water resistance. Of course, the cover film 400 of this embodiment is not limited to a single-layer structure, and may be a multilayer film structure.

In one embodiment, a plurality of sensors may be tiled or stacked, for example, to form a relatively large area panel.

The utility model also provides a battery package, including above-mentioned sensor, the connection of sensor is stable, waterproof performance is good, and the sensor is used for detecting the parameter of battery package, is NTC temperature sensor if the sensor, then can be used to monitor the temperature of battery package.

The utility model also provides an automobile, including above-mentioned battery package and sensor, the connection of sensor is stable, waterproof performance is good, can play stable monitoring to the battery package for automobile control system can stably obtain the parameter of battery package.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A sensor, comprising:

an isolatable layer (100) capable of insulation, having a first surface (101) and a second surface (102);

the sensor body (200) is arranged on the isolation layer (100) and provided with two pins (210), one ends of the two pins (210) are connected with the sensor body (200), and the other ends of the two pins extend along the first surface (101) and the second surface (102) respectively;

one ends of the two flexible circuits (300) are respectively connected with one ends, far away from the sensor body (200), of the two pins (210);

a cover film (400) that covers the isolation layer (100), the sensor body (200), and the flexible circuit (300).

2. A sensor according to claim 1, wherein the first surface (101) and the second surface (102) are provided on opposite sides of the sensor body (200).

3. A sensor according to claim 1 or 2, characterized in that one end of the flexible circuit (300) is soldered to the corresponding pin (210).

4. A sensor according to claim 3, characterized in that the other end of the flexible circuit (300) is provided with a copper-clad solder joint (310).

5. The sensor according to claim 2, wherein the spacer (100) is provided with an insertion hole (110) penetrating from the first surface (101) to the second surface (102), the sensor body (200) is inserted into the insertion hole (110), and the two pins (210) are respectively provided at two ends of the sensor body (200) corresponding to the first surface (101) and the second surface (102).

6. The sensor of claim 1, wherein the sensor body (200) is any one of an NTC temperature sensor, a PT temperature sensor, a thermocouple, a diode thermistor _。

7. The sensor according to claim 1, characterized in that the sensor body (200) is externally encapsulated with a glass layer, the pins (210) partially extending out of the glass layer.

8. The sensor according to claim 1, wherein the cover film (400) is a PI film or a PE film.

9. A battery pack comprising a sensor according to any one of claims 1 to 8.

10. An automobile, characterized in that it comprises a sensor according to any one of claims 1 to 8.