CN218884344U

CN218884344U - Ice maker comprehensively using compressor and semiconductor refrigeration assembly

Info

Publication number: CN218884344U
Application number: CN202223148647.8U
Authority: CN
Inventors: 陈创滨; 程辉; 冯勤生
Original assignee: Zhongshan Sanchuang Electronics Co ltd
Current assignee: Zhongshan Sanchuang Electronics Co ltd
Priority date: 2022-11-24
Filing date: 2022-11-24
Publication date: 2023-04-18
Anticipated expiration: 2032-11-24

Abstract

The utility model discloses an ice maker for comprehensively using a compressor and a semiconductor refrigeration assembly, the arrangement of the connection of the semiconductor refrigeration assembly and a compressor heat dissipation device is convenient for integrating the functions and the energy efficiency of the semiconductor refrigeration assembly and the compressor heat dissipation device, so that the volume of the compressor heat dissipation device can be reduced while the same ice making effect is realized, and the space occupation is favorably reduced; the overall noise of the ice maker is reduced compared with a mode of singly using the compressor heat dissipation device, and the comfort of a user can be improved; in addition, compared with an ice maker which independently uses the semiconductor refrigeration assembly, the ice maker has higher ice making speed and is beneficial to improving the ice making efficiency. The ice making device is arranged so as to realize the ice making function.

Description

Ice maker comprehensively using compressor and semiconductor refrigeration assembly

Technical Field

The utility model relates to an ice maker, concretely relates to use multipurposely compressor and semiconductor refrigeration subassembly's ice maker.

Background

With the improvement of living standard of people, the cold drink industry is developed vigorously, the demand of the ice machine is larger and larger, and especially the requirements on the household property, the portability and the low noise of the ice machine are higher and higher.

Patent publication number WO2018121429A1 discloses a refrigerator with dual refrigeration systems, which comprises a semiconductor refrigeration system and a compressor heat dissipation device, and a microchannel condenser is shared between the two systems, so that the arrangement is compact, and the problems of small heat dissipation area of a hot end and low heat exchange efficiency in the semiconductor refrigeration system are solved; however, the semiconductor refrigeration system and the compressor heat dissipation device work independently, the semiconductor refrigeration system is usually used for refrigeration, when the semiconductor refrigeration system is used alone for ice making, a large heat dissipation structure needs to be installed to have enough refrigeration capacity, and the ice making speed is slow; when the compressor heat dissipation device is used independently, a plurality of operation structures such as a rotating mechanism are needed, a refrigeration pipeline is complex, the flow direction of a refrigerant needs to be switched in the ice removal process after ice making is completed, the complexity of control and the pipeline is increased, noise and vibration are large, and ice making efficiency is influenced.

Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model overcomes above-mentioned not enough of technique provides an use multipurposely ice machine of compressor and semiconductor refrigeration subassembly.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the ice maker comprehensively uses the compressor and the semiconductor refrigeration assembly comprises an ice maker body 1, wherein the ice maker body 1 is provided with the semiconductor refrigeration assembly 2 capable of refrigerating/heating and a compressor heat dissipation device connected with the semiconductor refrigeration assembly 2, the semiconductor refrigeration assembly 2 comprises a hot end 21 and a cold end 22, the cold end 22 is connected with an ice making device 4, the hot end 21 is connected with an evaporator 5, and the compressor heat dissipation device is connected with the evaporator 5 and accelerates heat transmission of the evaporator 5.

Preferably, the compressor heat sink includes a compressor 31, and the compressor 31 is connected with a condenser 32, a dry filter 33, a capillary tube 34, and the evaporator 5 in sequence to form a loop.

Preferably, a heat dissipation fan 6 located at one side of the condenser 32 is connected to a frame of the ice maker body 1, and a heat dissipation window 7 facilitating heat dissipation outwards is connected between the hot end 21 of the semiconductor refrigeration assembly 2 and the heat dissipation fan 6 through the frame.

Preferably, the ice making device 4 includes an ice making box 41 connected to the cold end 22 of the semiconductor refrigeration assembly 2, an ice storage box 42 for storing ice cubes made by the ice making box 41, and a water supply structure for supplying water to the ice making box 41.

Preferably, the water supply structure includes a water storage tank 431, a water pump 432 and a water tank 433 which are sequentially connected through a pipeline, the water tank 433 is disposed above the ice making tank 41 and is vertically communicated with the ice making tank, the water storage tank 431 is disposed below the ice storage tank 42 and is vertically communicated with the ice storage tank, and the water pump 432 pumps water in the water storage tank 431 to the water tank 433.

Preferably, the ice bank 42 is provided with an insulating layer.

Preferably, the ice maker body 1 is further provided with a power supply and control device 8 for supplying power to the ice maker and controlling the ice maker to work, and the power supply and control device 8 is connected with the semiconductor refrigeration assembly 2 through a circuit line.

Preferably, the semiconductor refrigeration component 2 is a semiconductor refrigeration piece.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the structure of the scheme is simple and easy to realize, and the semiconductor refrigeration assembly and the compressor heat dissipation device are connected, so that the functions and the energy efficiency of the semiconductor refrigeration assembly and the compressor heat dissipation device are integrated, the volume of the compressor heat dissipation device can be reduced while the same ice making effect is realized, and the space occupation is reduced; the overall noise of the ice maker is reduced compared with a mode of singly using the compressor heat dissipation device, and the comfort of a user can be improved; in addition, compared with an ice maker which independently uses the semiconductor refrigeration assembly, the ice maker has higher ice making speed and is beneficial to improving the ice making efficiency. The ice making device is arranged so as to realize the ice making function.

2. The water tank is arranged above the ice making box body, so that water flows into the ice making box body through the action of gravity to make ice. The water storage tank is arranged below the ice storage tank body, so that unfrozen water flow flowing through the ice storage tank body can flow back to the water storage tank again, and water resources can be recycled.

3. The power supply and control device is convenient to deice by changing the power supply direction of the semiconductor refrigeration assembly, so that the deice efficiency is improved, and the control is simple.

Drawings

Fig. 1 is a schematic structural diagram of the present disclosure.

Fig. 2 is a partial structural schematic diagram of the scheme.

Detailed Description

The features of the present invention and other related features are described in further detail below by way of examples to facilitate understanding by those skilled in the art:

as shown in fig. 1 and 2, a semiconductor refrigeration assembly 2 capable of refrigerating/heating and a compressor heat dissipation device connected with the semiconductor refrigeration assembly 2 are arranged on an ice maker body 1, the semiconductor refrigeration assembly 2 comprises a hot end 21 and a cold end 22, the cold end 22 is connected with an ice making device 4, the hot end 21 is connected with an evaporator 5, and the compressor heat dissipation device is connected with the evaporator 5 and accelerates heat transfer of the evaporator 5.

The structure of the scheme is simple and easy to realize, and the semiconductor refrigeration assembly 2 and the compressor heat dissipation device are connected, so that the functions and the energy efficiency of the semiconductor refrigeration assembly 2 and the compressor heat dissipation device are integrated, the size of the compressor heat dissipation device can be reduced while the same ice making effect is realized, and the space occupation is reduced; the overall noise of the ice maker is reduced compared with a mode of singly using the compressor heat dissipation device, and the comfort of a user can be improved; in addition, compared with an ice maker which independently uses the semiconductor refrigeration assembly 2, the ice maker has higher ice making speed and is beneficial to improving the ice making efficiency. The ice making device 4 is provided so as to realize an ice making function.

As shown in fig. 1, the heat sink of the compressor includes a compressor 31, and the compressor 31 is connected with a condenser 32, a dry filter 33, a capillary tube 34, and an evaporator 5 in sequence to form a loop. In this way, on the one hand, it is convenient to be able to accelerate the heat transfer of evaporator 5, so as to facilitate the heat dissipation of hot end 21 of semiconductor refrigeration assembly 2; on the other hand, the circulation heat dissipation is realized through a loop.

As shown in fig. 1, in a specific implementation, a frame of the ice maker body 1 is connected with a heat dissipation fan 6 located at one side of the condenser 32, and a heat dissipation window 7 facilitating heat to be dissipated outwards is connected between the hot end 21 of the semiconductor refrigeration assembly 2 and the heat dissipation fan 6 through the frame. Therefore, the heat dissipation effect is better by the combined action of the condenser 32 and the heat dissipation effect.

As shown in fig. 1, in a specific implementation, the ice making device 4 includes an ice making box 41 connected to the cold end 22 of the semiconductor refrigeration assembly 2, an ice storage box 42 for storing ice pieces made by the ice making box 41, and a water supply structure for supplying water to the ice making box 41. Thus, the ice making function and the ice storage function are conveniently realized.

As shown in fig. 1 or fig. 2, in a specific implementation, the water supply structure includes a water storage tank 431, a water pump 432, and a water tank 433 sequentially connected through a pipe, the water tank 433 is disposed above the ice making tank 41 and is vertically communicated with the ice making tank, the water storage tank 431 is disposed below the ice storage tank 42 and is vertically communicated with the ice storage tank, and the water pump 432 pumps water in the water storage tank 431 to the water tank 433.

As described above, the water tank 433 is disposed above the ice making case body 41 so that water flows into the ice making case body 41 by gravity to make ice. The water storage tank 431 is arranged below the ice storage box 42, so that the water flow which is not frozen after passing through the ice storage box 42 can flow back to the water storage tank 431 again, and the water resource can be recycled.

In the specific implementation, the ice storage box 62 is provided with a heat preservation layer. Therefore, the loss of cold energy is reduced, energy is saved, and waste is reduced.

As shown in fig. 1, the ice maker body 1 is further provided with a power supply and control device 8 for supplying power to the ice maker and controlling the operation of the ice maker, and the power supply and control device 8 is connected with the semiconductor refrigeration assembly 2 through a circuit line. Therefore, the power supply direction of the semiconductor refrigeration assembly 2 can be changed by the power supply and control device 8 to realize ice removal, so that the ice removal efficiency is improved, and the control is simple. In specific implementation, the semiconductor refrigeration component 2, the compressor 31, the cooling fan 6 and the water pump 432 are all communicated with the power supply and control device 8 through circuit lines, and the power supply and control device 8 is further provided with a display device.

In the specific implementation, the semiconductor refrigeration component 2 is a semiconductor refrigeration piece. Thus, noise and pollution can be reduced, and the functions of refrigeration and heating can be realized.

As described above, during ice making, heat generated at the hot end 21 of the semiconductor refrigeration assembly 2 is absorbed by the evaporator 5 and then compressed by the compressor 31 to do work, and then the heat is discharged from the heat dissipation window 52 by the combined action of the condenser 32 and the heat dissipation fan 51, and the cold end 22 of the semiconductor refrigeration assembly 2 is connected to the ice making device 4 to realize ice making; after ice making is finished, the power supply and control device 6 switches the power supply direction of the semiconductor refrigeration assembly 2, so that the original cold end 22 heats and dehydrates, and the original hot end 21 refrigerates and cools, thereby realizing ice removal and cooling and saving energy waste.

As described above, the present invention provides an ice maker that uses a compressor and a semiconductor refrigeration module in combination, and all technical solutions that are the same as or similar to the present invention should be considered to fall within the scope of the present invention.

Claims

1. The ice maker comprehensively using the compressor and the semiconductor refrigeration assembly comprises an ice maker body (1) and is characterized in that the ice maker body (1) is provided with the semiconductor refrigeration assembly (2) capable of refrigerating/heating and a compressor heat dissipation device connected with the semiconductor refrigeration assembly (2), the semiconductor refrigeration assembly (2) comprises a hot end (21) and a cold end (22), the cold end (22) is connected with an ice making device (4), the hot end (21) is connected with an evaporator (5), and the compressor heat dissipation device is connected with the evaporator (5) and accelerates heat transmission of the evaporator (5).

2. Ice maker using a combination of compressor and semiconductor refrigeration unit according to claim 1, in which the compressor heat sink comprises a compressor (31), and the compressor (31) is connected to a condenser (32), a dry filter (33), a capillary tube (34), and an evaporator (5) in sequence to form a loop.

3. The ice maker comprehensively using the compressor and the semiconductor refrigeration assembly as claimed in claim 2, characterized in that a frame of the ice maker body (1) is connected with a heat radiation fan (6) positioned at one side of the condenser (32), and a heat radiation window (7) convenient for heat to be radiated outwards is connected between the hot end (21) of the semiconductor refrigeration assembly (2) and the heat radiation fan (6) through the frame.

4. The ice maker using a combination of a compressor and a semiconductor refrigeration unit as claimed in claim 1, wherein the ice making device (4) comprises an ice making housing (41) connected to the cold end (22) of the semiconductor refrigeration unit (2), an ice storage housing (42) for storing ice cubes made in the ice making housing (41), and a water supply structure for supplying water to the ice making housing (41).

5. The ice maker as claimed in claim 4, wherein the water supply structure comprises a water storage tank (431), a water pump (432), and a water tank (433) connected in sequence by pipes, the water tank (433) is disposed above and in up-and-down communication with the ice making tank (41), the water storage tank (431) is disposed below and in up-and-down communication with the ice storage tank (42), and the water pump (432) pumps water in the water storage tank (431) to the water tank (433).

6. The ice maker as claimed in claim 4, wherein the ice storage box (42) is provided with an insulating layer.

7. The ice maker comprehensively using the compressor and the semiconductor refrigeration assembly as claimed in claim 1, characterized in that the ice maker body (1) is further provided with a power supply and control device (8) for supplying power to the ice maker and controlling the operation of the ice maker, and the power supply and control device (8) is connected with the semiconductor refrigeration assembly (2) through a circuit line.

8. Ice maker using a combination of a compressor and a semiconductor refrigeration unit according to claim 1, characterised in that the semiconductor refrigeration unit (2) is a semiconductor refrigeration plate.