CN218867042U

CN218867042U - Wafer laminating machine

Info

Publication number: CN218867042U
Application number: CN202221997386.4U
Authority: CN
Inventors: 马运刚; 刘双红; 史彦青
Original assignee: Zhengzhou Qisheng Precision Manufacturing Co ltd
Current assignee: Zhengzhou Qisheng Precision Manufacturing Co ltd
Priority date: 2022-11-19
Filing date: 2022-11-19
Publication date: 2023-04-14
Anticipated expiration: 2032-11-19

Abstract

The utility model relates to a wafer laminating machine, the utility model discloses effectively solved not good to the chucking effect of wafer, chucking wafer both ends that can not be accurate make the film paste partially easily, and need operating personnel frequent operation at the in-process of tectorial membrane, and the tectorial membrane process is comparatively loaded down with trivial details, is not convenient for the problem of using when the tectorial membrane to the wafer. This wafer laminating machine passes through the wafer rack, drive assembly, the rubber pad, the film winding shaft, and cut out the setting of membrane subassembly, the wafer rack is convenient for carry on spacingly with not unidimensional wafer, can align wafer and film, drive assembly can be with the whereabouts of wafer jack-up film simultaneously through the rubber pad, thereby make the tight film in wafer top just can cover on the wafer surface, then rotate through the rotating turret and cut out the membrane subassembly and can cut out the film, the radius of rotation of cutting out the membrane subassembly can be adjusted according to the radius of wafer, cover the film of corresponding size to the wafer, and the device easy operation, better just the effectual efficiency that improves the wafer tectorial membrane to the tectorial membrane effect of wafer.

Description

Wafer laminating machine

Technical Field

The utility model belongs to the technical field of the wafer processingequipment, concretely relates to wafer laminating machine.

Background

The wafer is an important raw material in semiconductor production, a domestic wafer production line mainly takes 8 inches and 12 inches, before the wafer is produced into a semiconductor, one surface without a circuit structure is generally required to be polished and cut to be thinned, so that the surface of the wafer with the circuit structure is required to be covered with a protective film to prevent the circuit structure of the wafer from being scratched and damaged, and the existing cutting mode is to cut the wafer covering film around the radius of the wafer by a handheld cutter.

The device can realize automatic film cutting in the use process through the arrangement of a rotating shaft, a U-shaped frame, a connecting rod, an extension spring, a sliding block and a servo motor, thereby playing the role of ensuring the same shape of each cutting, reducing the deviation in the film cutting process and achieving the purposes of improving the working efficiency and the film coating quality; through the fixed column, the cooperation setting of compression spring and clamp plate, the in-process of using can compress tightly fixedly to the film, thereby avoid the film to be dragged and take place deformation and fold, influence the quality of wafer tectorial membrane, through the L push rod, the cooperation setting of connecting spring and joint rod, the in-process of using can dismantle the sliding block, put into corresponding spout with the sliding block according to wafer size, thereby played the effect that can cut the wafer tectorial membrane of multiple size, but the device is not good to the chucking effect of wafer, chucking wafer both ends that can not be accurate, make the film paste partially easily, and need operating personnel frequent operation at the in-process of tectorial membrane, the tectorial membrane process is comparatively loaded down with trivial details, be not convenient for use when the wafer tectorial membrane, therefore we have proposed a wafer laminating machine in order to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides a wafer laminating machine, the wafer rack that this wafer laminating machine set up is convenient for carry on not unidimensional wafer spacing, makes it place the rigidity, can align wafer and film, and drive assembly passes through the rubber pad and can fall wafer jack-up film whereabouts simultaneously, and the radius of rotation of cutting out the membrane subassembly can be adjusted according to the radius of wafer, covers the film of corresponding size to the wafer.

The utility model provides a wafer laminating machine, includes the base, the last fixed surface of base is connected with the wafer rack, the below of wafer rack is provided with drive assembly and drive assembly's top is provided with the rubber pad, the inside at the wafer rack is worn to establish by the rubber pad, one side transmission of drive assembly is connected with driven subassembly, the top fixedly connected with roof of driven subassembly, the one end joint of roof lower surface has roll up membrane axle and other end joint and has the receipts winding rod, the outside winding of roll up membrane axle and receipts winding rod has the film, the receipts winding rod is motor drive axle, the both sides of roof lower surface all are provided with locating component, the bottom that the middle part joint on roof surface has rotating turret and rotating turret is provided with cuts out the membrane subassembly.

The beneficial effects of the technical scheme are as follows:

this wafer laminating machine passes through the wafer rack, drive assembly, the rubber pad, the film winding shaft, and the setting of cutting out the membrane subassembly, the wafer rack is convenient for carry on spacingly with not unidimensional wafer, it is fixed to make it place, can align wafer and film, drive assembly can be with the whereabouts of wafer jack-up simultaneous film through the rubber pad, thereby make the tight film in wafer top just can cover on the wafer surface, then cut out the membrane subassembly through the rotating turret rotation and can cut out the film, the radius of rotation of cutting out the membrane subassembly can be adjusted according to the radius of wafer, cover the corresponding big or small film of wafer, and the device easy operation, better just the effectual efficiency that improves the wafer tectorial membrane to the tectorial membrane effect of wafer.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the base of the present invention;

fig. 3 is a schematic view of a top plate of the present invention;

fig. 4 is a schematic view of the driven assembly of the present invention;

FIG. 5 is a schematic view of a spur gear rod of the present invention;

fig. 6 is a schematic view of a first rack of the present invention;

FIG. 7 is a schematic view of the film cutting assembly of the present invention;

fig. 8 is a schematic view of the split structure of fig. 7 according to the present invention.

In the figure: 1. a base; 2. placing a wafer rack; 3. a rubber pad; 4. a top plate; 5. a film winding shaft; 6. winding the rod; 7. a rotating frame; 8. a first placing groove; 9. a second placing groove; 10. a drive motor; 11. a right angle drive gear rod; 12. a straight gear rod; 13. a first rack; 14. a first clip frame; 15. a second clamping frame; 16. a second rack; 17. clamping a plate; 18. a rubber roller; 19. a fixed mount; 20. a first film cutting cutter bar; 21. a second film cutting cutter bar; 22. a sleeve; 23. and (4) inserting the rod.

Detailed Description

The foregoing and other technical matters, features and effects of the present invention will be described in detail with reference to the accompanying drawings 1 to 8.

The embodiment provides a wafer laminating machine, as shown in the attached drawing, which comprises a base 1, a wafer placing rack 2 is fixedly connected to the upper surface of the base 1, a driving assembly is arranged below the wafer placing rack 2, a rubber pad 3 is arranged at the top end of the driving assembly, the rubber pad 3 is arranged inside the wafer placing rack 2 in a penetrating manner, a first placing groove 8 and a second placing groove 9 are arranged on the upper surface of the wafer placing rack 2, the diameters of the first placing groove 8 and the second placing groove 9 can be set to be 12 inches and 8 inches, so that 12 inches and 8 inches of wafers can be respectively placed inside the wafer placing rack, a limiting effect is achieved on the positions of the wafers, the wafers can be aligned with a film, the rubber pad 3 is arranged inside the second placing groove 9, the driving assembly comprises a driving motor 10, a right-angle driving gear rod 11, a straight gear rod 12, a first rack 13 and a first rack 14, the driving motor 10, supporting plates are fixedly connected to the upper surface of the base 1 in a clamping manner and fixedly connected to the upper surface of the base 1 in a penetrating manner through a driving bolt 15, the driving rack 13, and a second rack 14, the driving assembly is connected to one side of the straight gear rod 12, the driving motor 10, the straight gear rod 12, the driving rack 14, the driving assembly comprises two rack assemblies, the driving rack 12, the driving rack 14, the driving motor 10, the driving rack 12 and the rack assembly is connected to one side of the second rack assembly, the rack assembly and the rack assembly, the rack assembly is connected to one side of the second rack assembly, the driving motor 10, the number of the second racks 16 is two, the two second racks 16 are respectively meshed with the two straight gear rods 12 and fixedly connected to one side of the lower surface of the top plate 4, the driving motor 10 can drive the right-angle transmission gear rod 11 to rotate so as to drive the straight gear rods 12 to rotate, the straight gear rods 12 can drive the first rack 13 and the second rack 16 to relatively move, the second rack 16 can synchronously move downwards when the first rack 13 moves upwards, the top end of the driven component is fixedly connected with the top plate 4, one side, close to the second clamping frame 15, of the upper surface of the base 1 is fixedly connected with a sleeve 22, one side, close to the second rack 16, of the lower surface of the top plate 4 is fixedly connected with an inserted rod 23, the inserted rod 23 is inserted into the sleeve 22 and plays a supporting role for the top plate 4, one end of the lower surface of the top plate 4 is clamped with the film rolling shaft 5, the other end of the top plate is clamped with the rolling rod 6, and films are wound outside the film rolling shaft 5 and the rolling rod 6, the winding rod 6 is a motor driving shaft, the driving motor 10 and the motor driving the winding rod 6 are both servo motors and are electrically connected with an external control unit through a motor controller, the two sides of the lower surface of the top plate 4 are both provided with positioning components, the positioning components comprise clamping plates 17 and rubber rollers 18, the two sides of the lower surface of the top plate 4 are both fixedly connected with the clamping plates 17, the rubber rollers 18 are clamped between the two clamping plates 17, the side surfaces of the clamping plates 17 are clamped with the two rubber rollers 18, the two rubber rollers 18 are mutually abutted, a film wound on the film winding shaft 5 passes through the middle of the two rubber rollers 18 on one side and passes out of the two rubber rollers 18 on the other side and is wound outside the winding rod 6, the rubber rollers 18 play a role in compressing the film, the film winding shaft 5 needs to be driven by the driving force of the motor when rotating, and needs large pulling force when the film is rotated, so that the film is tightened when the wafer pushes the film and the film winding shaft 5 cannot rotate, the film pulling can be realized by the rotation of the external motor-driven winding rod 6, the film is convenient to continuously move, the middle joint on the surface of the top plate 4 is provided with the film cutting assembly at the bottom end of the rotating frame 7 and the rotating frame 7, the film cutting assembly comprises a fixing frame 19, a first film cutting cutter rod 20 and a second film cutting cutter rod 21, the fixing frame 19 is fixedly connected to the bottom end of the rotating frame 7, the lower surface of the first film cutting cutter rod 20 and the upper surface of the second film cutting cutter rod 21 are both provided with toothed patterns, the middle joint of the fixing frame 19 is provided with a straight gear, the first film cutting cutter rod 20 and the second film cutting cutter rod 21 are both arranged in the fixing frame 19 in a penetrating mode and meshed with the straight gear, the straight gear has larger resistance relative to the first film cutting cutter rod 20 and the second film cutting cutter rod 21, the relative positions of the first film cutting cutter rod 20 and the second film cutting cutter rod 21 cannot be changed reversely under the action of external force, the extending lengths of the first film cutting cutter rod 20 and the second film cutting cutter rod 21 can be adjusted independently to enable the other end to be adjusted synchronously, the diameter of the first film cutting cutter rod 20 and the radius of the second film cutting cutter rod 21 are respectively arranged above the fixing frame 20 and the fixing frame 19.

In summary, the wafer laminating machine comprises the following steps:

1. when the film needs to be coated on the wafer, a user places the wafer in the corresponding first placing groove 8 or second placing groove 9 on the wafer placing frame 2, then operates the driving motor 10 to drive the right-angle transmission gear rod 11 to rotate anticlockwise, and accordingly drives the first rack 13 and the second rack 16 to move upwards or downwards respectively through the straight gear rod 12;

2. the first rack 13 moves upwards to jack the wafer up through the rubber pad 3, meanwhile, the second rack 16 can drive the top plate 4 to move downwards, when the wafer rises to tightly jack the thin film, and the height of the jacked thin film is higher than the lowest ends of the first film cutting cutter bar 20 and the second film cutting cutter bar 21, the driving motor 10 stops running, the thin film covers the wafer, and the first film cutting cutter bar 20 and the second film cutting cutter bar 21 are inserted into the thin films on the two sides of the wafer;

3. then, the rotating frame 7 is rotated for half a circle, so that the film covered on the wafer can be cut off, and the rotating radius of the first film cutting cutter bar 20 or the second film cutting cutter bar 21 can be adjusted by pulling, so that the diameter of the cut film can be adjusted according to the diameter of the wafer;

4. after cutting, the driving motor 10 drives the right-angle transmission gear rod 11 to rotate clockwise, so that the rubber pad 3 and the top plate 4 can be reset, the external motor drives the winding rod 6 to rotate after reset, a part of the film is wound, the next unused film is moved to the position above the wafer placing frame 2, and subsequent wafer film coating work is facilitated.

The above description is only for the purpose of illustration, and it should be understood that the present invention is not limited to the above embodiments, and various modifications conforming to the spirit of the present invention are within the scope of the present invention.

Claims

1. The utility model provides a wafer laminating machine, includes base (1), its characterized in that: the upper surface fixedly connected with wafer rack (2) of base (1), the top that the below of wafer rack (2) was provided with drive assembly and drive assembly is provided with rubber pad (3), rubber pad (3) are worn to establish in the inside of wafer rack (2), one side transmission of drive assembly is connected with driven subassembly, the top fixedly connected with roof (4) of driven subassembly, the one end joint of roof (4) lower surface has roll up membrane axle (5) and other end joint and has rolling rod (6), the outside winding of roll up membrane axle (5) and rolling rod (6) has the film, rolling rod (6) are motor drive axle, the both sides of roof (4) lower surface all are provided with locating component, the bottom that the middle part joint on roof (4) surface has rotating turret (7) and rotating turret (7) is provided with cuts out the membrane subassembly.

2. A wafer laminator according to claim 1, wherein: the wafer placing frame is characterized in that a first placing groove (8) and a second placing groove (9) are formed in the upper surface of the wafer placing frame (2), and the rubber pad (3) is arranged inside the second placing groove (9).

3. A wafer laminator according to claim 1, wherein: drive assembly includes driving motor (10), right angle transmission gear pole (11), straight-teeth gear pole (12), first rack (13) and first card frame (14), the equal joint in outside of driving motor (10), right angle transmission gear pole (11) and straight-teeth gear pole (12) has backup pad and backup pad fixed connection at the upper surface of base (1), right angle transmission gear pole (11) are the drive shaft of driving motor (10) and are connected with straight-teeth gear pole (12) transmission through right angle drive gear, the side meshing of straight-teeth gear pole (12) has first rack (13) and first rack (13) fixed connection at the lower surface of rubber pad (3), first card frame (14) are worn to establish inside first card frame (14) through bolted connection at the upper surface of base (1) and first rack (13), the quantity of first rack (13) and straight-teeth gear pole (12) is two.

4. A wafer laminator according to claim 3, wherein: the driven assembly comprises a second clamping frame (15) and second racks (16), the second clamping frame (15) is connected to one side of the upper surface of the base (1) through bolts, the second racks (16) penetrate through the inside of the second clamping frame (15), and the number of the second racks (16) is two, and the two second racks (16) are respectively meshed with the two straight gear rods (12) and fixedly connected to one side of the lower surface of the top plate (4).

5. A wafer laminator according to claim 1, wherein: the positioning assembly comprises clamping plates (17) and rubber rollers (18), wherein the clamping plates (17) and the rubber rollers (18) are fixedly connected to the two sides of the lower surface of the top plate (4) and clamped between the two clamping plates (17), and the two rubber rollers (18) are clamped to the side faces of the clamping plates (17) and are abutted to each other.

6. A wafer laminator according to claim 1, wherein: cut out the membrane subassembly and include mount (19), first cut out membrane cutter arbor (20) and second cut out membrane cutter arbor (21), mount (19) fixed connection is in the bottom of rotating turret (7), the lower surface of first cut out membrane cutter arbor (20) and the upper surface of second cut out membrane cutter arbor (21) all are provided with the insection, the middle part joint of mount (19) has spur gear and first cut out membrane cutter arbor (20) and second to cut out membrane cutter arbor (21) and all wear to establish in the inside of mount (19) and with the spur gear meshing.