CN218856812U - Heat radiation module assembling device and heat radiation module - Google Patents
Heat radiation module assembling device and heat radiation module Download PDFInfo
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- CN218856812U CN218856812U CN202223151655.8U CN202223151655U CN218856812U CN 218856812 U CN218856812 U CN 218856812U CN 202223151655 U CN202223151655 U CN 202223151655U CN 218856812 U CN218856812 U CN 218856812U
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Abstract
The embodiment of the utility model provides a heat dissipation module assembly device for connect first part and second part, including the main part, be equipped with first location portion and second location portion in the main part, first location portion sets up with second location portion relatively, and first location portion is used for fixing a position first part, and second location portion is used for fixing a position the second part and is used for making second part and first part overlap. The embodiment of the utility model discloses a through interval setting first location portion and second location portion in the main part, fix a position the operation to first part and second part respectively to second location portion enables first part and second part overlap after fixing a position the second part, utilizes the part of the above-mentioned overlap on first part and the second part, can adopt different connected mode to connect first part and second part, easy operation, and the product packaging efficiency is high.
Description
Technical Field
The embodiment of the utility model provides a relate to dc-to-ac converter technical field, especially relate to a thermal module assembly device and thermal module.
Background
The inverter is a converter which converts direct current electric energy into constant frequency, constant voltage or frequency and voltage regulation alternating current. The inverter bridge consists of an inverter bridge, control logic and a filter circuit, and is widely applied to the photovoltaic field.
When the inverter works, a large amount of heat can be generated, and the inverter is cooled by the heat dissipation module, so that the heat dissipation module plays a key role in normal work of the inverter. The heat dissipation module comprises a bracket and a fan, and is required to be assembled before the heat dissipation module is installed on the inverter.
The method for assembling the heat dissipation module at present comprises the following steps: place support and fan on the positioning seat in proper order earlier, then pass through the manpower and fix the fan to the support on through the screw.
In practicing the prior art, applicants have found that: since the screw holes of the fan and the bracket are aligned with each other when the fan and the bracket are assembled, the difficulty of assembling the fan is increased, and the efficiency of product assembly is affected.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a thermal module assembly device and thermal module can promote the efficiency of product equipment.
In order to solve the technical problem, the utility model discloses a technical scheme be:
the heat dissipation module assembling device comprises a main body, wherein a first positioning part and a second positioning part are arranged on the main body, the first positioning part and the second positioning part are oppositely arranged, the first positioning part is used for positioning the first component, and the second positioning part is used for positioning the second component and enabling the second component to be partially overlapped with the first component.
In one embodiment, the main body includes a first substrate and a second substrate, the first substrate is provided with a mounting surface, the second substrate is disposed on the mounting surface, the first positioning portion is disposed on a portion of the mounting surface where the second substrate is not connected, and the second positioning portion is disposed on the second substrate.
In one embodiment, the first positioning portion includes a positioning groove disposed on the mounting surface, and the second positioning portion includes a positioning notch disposed on a side of the second substrate facing the positioning groove.
In an embodiment, when the first component is disposed in the positioning slot, two opposite side slot walls of the positioning slot are just abutted against two opposite side walls of the first component, respectively.
In one embodiment, when the first component is disposed in the positioning slot, a gap is formed between each of two opposite side slot walls of the positioning slot and two opposite side walls of the first component.
In one embodiment, the gap is in the range of 0.20-0.30mm.
In one embodiment, the bottom wall of the positioning groove is provided with an avoiding hole.
In an embodiment, the mounting surface is further provided with a pick-and-place groove, and the pick-and-place groove is communicated with the positioning groove.
In an embodiment, a transition between the positioning notch and the second substrate is provided with a chamfer.
The utility model also provides a heat dissipation module adopts foretell heat dissipation module assembly device to assemble and form.
The embodiment of the utility model provides a beneficial effect is: be different from prior art's condition, the embodiment of the utility model discloses a through interval setting up first location portion and second location portion in the main part, fix a position the operation to first part and second part respectively to second location portion enables first part and second part overlap after fixing a position the second part, utilizes the part of above-mentioned overlapping on first part and the second part, can adopt different connected mode to connect first part and second part, easy operation, and product packaging efficiency is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any creative effort.
Fig. 1 is a reference view of a heat dissipation module assembly device according to an embodiment of the present invention;
description of reference numerals:
100. a main body;
200. a first substrate; 210. a mounting surface; 220. a first positioning portion; 221. positioning a groove; 2211. side groove walls; 2212. a bottom slot wall; 222. a taking and placing groove; 223. avoiding holes;
300. a second substrate; 310. a second positioning portion; 320. positioning the notch; 330. chamfering;
400. a first member;
500. a second component.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a heat dissipation module assembly apparatus is used for connecting a first component 400 and a second component 500. Wherein the first member 400 may be a bracket and the second member 500 may be a fan. It should be understood that the first member 400 and the second member 500 may be other types of members, and the embodiment is not limited thereto.
The heat dissipation module assembly device includes a main body 100.
The body 100 is used to place the first member 400 and the second member 500.
For example, the body 100 may be stepped, and when the first member 400 and the second member 500 are placed on the body 100, the body 100 may allow the first member 400 and the second member 500 to be at different heights, thereby reducing collision wear generated when the first member 400 and the second member 500 are adjusted in position.
The main body 100 is provided with a first positioning portion 220 and a second positioning portion 310.
Specifically, the first positioning portion 220 and the second positioning portion 310 are used to position the first member 400 and the second member 500, respectively. The first positioning portion 220 and the second positioning portion 310 may be positioned in the same manner or in different manners.
For example, the first positioning portion 220 and the second positioning portion 310 may respectively position the first member 400 and the second member 500 through positioning columns. The first positioning portion 220 may be a positioning column through which the first component 400 is positioned, and the second positioning portion 310 may be provided with a positioning groove 221 through which the second component 500 is positioned.
The first positioning portion 220 and the second positioning portion 310 are oppositely disposed on the main body 100, so as to facilitate the placement of the first member 400 and the second member 500, respectively, and the second positioning portion 310 enables the second member 500 to partially overlap with the first member 400 after positioning the second member 500.
Illustratively, the first positioning portion 220 includes a plurality of positioning pillars, and the plurality of positioning pillars may completely define the first member 400, while the second positioning portion 310 is a slot (provided on the main body 100 at a distance from the positioning pillars), and the second positioning portion 310 positions only one end of the second member 500, and the other end of the second member 500 is placed above the first member 400, so that the second member 500 partially overlaps the first member 400.
In a usage scenario of the above example, when the first component 400 and the second component 500 are both provided with threaded holes and connected through the threaded holes, it is only necessary to control the positions of the positioning posts, so that the second component 500 and the first component 400 are partially overlapped, and the threaded holes are both located at the overlapped portions, so that the two threaded holes can be communicated with each other, and finally, the first component 400 and the second component 500 can be connected by placing bolts in the threaded holes and performing a tightening operation.
In another usage scenario of the above example, when the first member 400 and the second member 500 are connected by welding, the first member 400 and the second member 500 are partially overlapped by the above method, and the circumferential edge of the overlapped portion is used as a welding seam, so that welding can be performed, thereby connecting the first member 400 and the second member 500.
Therefore, the embodiment of the present invention, by disposing the first positioning portion 220 and the second positioning portion 310 on the main body 100 at an interval, the first component 400 and the second component 500 are positioned respectively, and the second positioning portion 310 can partially overlap the first component 400 and the second component 500 after positioning the second component 500, and the first component 400 and the second component 500 can be connected by different connecting methods by using the overlapping portions of the first component 400 and the second component 500, which is simple in operation and high in product assembly efficiency.
Referring to fig. 1, in an embodiment, a main body 100 includes a first substrate 200 and a second substrate 300.
The first substrate 200 and the second substrate 300 may be pillar structures, such as prisms. The first substrate 200 and the second substrate 300 may be made of bakelite, stainless steel, aluminum alloy, or the like.
The first substrate 200 is provided with a mounting surface 210, the second substrate 300 is detachably and adjustably disposed on the mounting surface 210, and the second positioning portion 310 is disposed on the second substrate 300.
Illustratively, the first substrate 200 and the second substrate 300 have the same shape, and are each a rectangular parallelepiped, wherein the width dimension of the first substrate 200 is twice the width dimension of the second substrate 300, the other dimensions of the first substrate 200 are the same as the other dimensions of the second substrate 300, the surface with the largest area on the first substrate 200 is taken as the mounting surface 210, and the second substrate 300 is detachably mounted on the mounting surface 210, so that the stepped body 100 can be assembled.
It is understood that the first substrate 200 and the second substrate 300 have a height difference therebetween. Since the second substrate 300 partially occupies the mounting surface 210, in order to dispose the first positioning portion 220 and the second positioning portion 310 opposite to each other, the first positioning portion 220 is disposed on a portion of the mounting surface 210 to which the second substrate 300 is not connected.
In the present embodiment, by disposing the second substrate 300 on the mounting surface 210 of the first substrate 200, the stepped body 100 may be defined. The second positioning portion 310 is disposed on the second substrate 300, and the first positioning portion 220 is disposed on the mounting surface 210 corresponding to a portion of the second substrate 300 not connected to the second positioning portion, so that the first positioning portion 220 and the second positioning portion 310 may be disposed opposite to each other. By changing the position of the second substrate 300 on the mounting surface 210, the relative positions of the first positioning portion 220 and the second positioning portion 310 can be adjusted, thereby controlling the area of the overlapping portion of the first member 400 and the second member 500.
In one usage scenario of the present embodiment, when the second member 500 needs to have a large overlap with the first member 400, the second substrate 300 is moved toward the first positioning portion 220. When the second member 500 needs to have a small overlapping portion with the first member 400, the second substrate 300 is moved in a direction away from the first positioning portion 220.
The heat dissipation module assembly device of the present embodiment has good adjustment capability, is suitable for assembly requirements of different connection strengths, and is simple to operate, and the first substrate 200 and the second substrate 300 can be detachably connected, so that the first substrate 200 or the second substrate 300 can be conveniently replaced, and the heat dissipation module assembly device is suitable for different first components 400 or second components 500.
Referring to fig. 1, in an embodiment, the first positioning portion 220 includes a positioning groove 221, the positioning groove 221 is disposed on the mounting surface 210, the positioning groove 221 is used for positioning and mounting the first component 400, and the positioning groove 221 has a depth, which may be greater than or equal to a thickness of the first component 400, so as to completely accommodate the first component 400.
The second positioning portion 310 includes a positioning notch 320, the positioning notch 320 may be formed by mold casting or cutting, the positioning notch 320 is disposed on a side of the second substrate 300 facing the positioning groove 221, and when the second component 500 is placed, the second component 500 may be partially accommodated, and a portion of the second component 500 extends out of the positioning notch 320 and partially overlaps with the first component 400 disposed in the positioning groove 221.
In this embodiment, the positioning groove 221 is used for limiting the first component 400, and the positioning notch 320 is used for limiting the second component 500, so that the assembly and disassembly are convenient, and the positioning effect is good.
Referring to fig. 1, in an embodiment, when the first member 400 is disposed in the positioning groove 221, two opposite side groove walls 2211 of the positioning groove 221 are just abutted to two opposite side walls of the first member 400, respectively. It can be understood that the embodiment can achieve a better positioning effect on the first component 400, prevent the first component 400 from rotating in the positioning groove 221, and improve the positioning accuracy of the first component 400.
Referring to fig. 1, in an embodiment, when the first member 400 is disposed in the positioning groove 221, two opposite side groove walls 2211 of the positioning groove 221 respectively have a gap with two opposite side walls of the first member 400. It can be appreciated that in the present embodiment, the first member 400 is easily placed in the positioning groove 221, so that the coupling efficiency can be improved.
Referring to fig. 1, in one embodiment, the gap is in the range of 0.20-0.30mm. As an example, the gap may range from 0.20mm, 0.25mm, and 0.30mm. The size of the gap can be flexibly adjusted according to the requirement.
Referring to fig. 1, in one embodiment, the bottom wall 2212 of the positioning slot 221 is provided with an avoiding hole 223. Because the first member 400 may have some protruding features, and the protruding features may prevent the first member 400 from being stably placed in the positioning groove 221, the protruding features of the avoiding hole 223 correspond to each other, when the first member 400 is placed in the positioning groove 221, the protruding features are received in the avoiding hole 223, so as to achieve an avoiding effect, and the protruding features are matched with the avoiding hole 223, so as to achieve a positioning effect.
Referring to fig. 1, in an embodiment, the mounting surface 210 further has a pick-and-place slot 222, and the pick-and-place slot 222 is communicated with the positioning slot 221.
Illustratively, the first member 400 may be a regular shape, such as a rectangular plate. The positioning groove 221 is similar to the first component 400 in shape, for example, a rectangular groove, when the first component 400 is placed inside the positioning groove 221, the rectangular plate abuts against the corner of the rectangular groove, and under the condition that the positioning groove 221 just accommodates the first component 400, the first component 400 is not convenient to be taken out of the positioning groove 221. The pick-and-place slot 222 is communicated with the positioning slot 221, the first component 400 is not placed in the pick-and-place slot 222, and an auxiliary component such as a crowbar can be inserted into the pick-and-place slot 222 to pull the first component 400 out of the positioning slot 221.
For example, the pick-and-place slot 222 may be disposed at a corner of the positioning slot 221, so as to prevent the slot wall at the corner of the positioning slot 221 from being scratched by the first member 400.
Referring to fig. 1, in one embodiment, a chamfer 330 is formed at the transition between the positioning notch 320 and the second substrate 300. The provision of the chamfer 330 may facilitate placement of the second member 500 and may prevent scratching of the second member 500.
The utility model also provides a thermal module adopts foretell thermal module assembly device equipment to form.
The utility model discloses a radiating module assembly device's a use method does:
connecting the first substrate 200 and the second substrate 300, and adjusting the relative positions of the first substrate 200 and the second substrate 300;
firstly, the first part 400 is placed in the positioning groove 221, and the second part 500 is placed in the positioning notch 320;
adjusting the position of the second member 500 within the positioning notch 320 such that the threaded hole in the first member 400 is aligned with the threaded hole in the second member 500;
connecting the first member 400 and the second member 500 with bolts or screws;
and repeating the steps until the batch assembly of the products is completed.
It should be noted that the preferred embodiments of the present invention are described in the specification and the drawings, but the present invention can be realized in many different forms, and is not limited to the embodiments described in the specification, and these embodiments are not provided as additional limitations to the present invention, and are provided for the purpose of making the understanding of the disclosure of the present invention more thorough and complete. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A heat dissipation module assembly device is used for connecting a first component and a second component, and is characterized by comprising a main body, wherein a first positioning part and a second positioning part are arranged on the main body, the first positioning part and the second positioning part are arranged oppositely, the first positioning part is used for positioning the first component, and the second positioning part is used for positioning the second component and enabling the second component to be partially overlapped with the first component.
2. The apparatus of claim 1, wherein the main body comprises a first substrate and a second substrate, the first substrate has a mounting surface, the second substrate is disposed on the mounting surface, the first positioning portion is disposed on a portion of the mounting surface where the second substrate is not connected, and the second positioning portion is disposed on the second substrate.
3. The assembly apparatus according to claim 2, wherein the first positioning portion comprises a positioning groove disposed on the mounting surface, and the second positioning portion comprises a positioning notch disposed on a side of the second substrate facing the positioning groove.
4. The assembly device as claimed in claim 3, wherein when the first member is disposed in the positioning groove, the two opposite side walls of the positioning groove are just abutted against the two opposite side walls of the first member, respectively.
5. The assembly device of claim 3, wherein when the first member is disposed in the positioning groove, the two opposite side walls of the positioning groove have a gap therebetween.
6. The thermal module assembly device of claim 5 wherein the gap is in the range of 0.20-0.30mm.
7. The assembly device of claim 3, wherein the bottom wall of the positioning groove has an avoiding hole.
8. The apparatus as claimed in claim 3, wherein the mounting surface further defines a pick-and-place slot, the pick-and-place slot communicating with the positioning slot.
9. The assembly device of claim 3, wherein a transition between the positioning notch and the second substrate is chamfered.
10. A heat dissipating module assembled by using the heat dissipating module assembling apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223151655.8U CN218856812U (en) | 2022-11-25 | 2022-11-25 | Heat radiation module assembling device and heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223151655.8U CN218856812U (en) | 2022-11-25 | 2022-11-25 | Heat radiation module assembling device and heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218856812U true CN218856812U (en) | 2023-04-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223151655.8U Active CN218856812U (en) | 2022-11-25 | 2022-11-25 | Heat radiation module assembling device and heat radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218856812U (en) |
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- 2022-11-25 CN CN202223151655.8U patent/CN218856812U/en active Active
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