CN218855246U

CN218855246U - Semiconductor part shaping die

Info

Publication number: CN218855246U
Application number: CN202222323522.8U
Authority: CN
Inventors: 顾仁宝; 杨国江; 李伟东; 朱文健; 余箫伟; 魏韶华; 张牧; 徐国俊; 薛弘宇
Original assignee: Jiangsu Kaiweites Semiconductor Technology Co ltd
Current assignee: Jiangsu Kaiweites Semiconductor Technology Co ltd
Priority date: 2022-09-01
Filing date: 2022-09-01
Publication date: 2023-04-14
Anticipated expiration: 2032-09-01

Abstract

The utility model discloses a semiconductor spare part plastic mould, include: the base, one side fixed mounting of base has the locating piece, and threaded hole is seted up to the inside of locating piece, and the inside threaded connection of screw hole has the threaded rod, and the one end of threaded rod is rotated and is connected with the movable block, the surface that is located the base of movable block, the utility model has the advantages of it is following: the focusing ring product after deformation is placed on the surface of the base, the movable hexagonal prism is installed at the corresponding position of product deformation, the movable block is gradually clamped on the product by utilizing the cylindrical wrench to rotate the threaded rod, the product is slowly extruded, and the position of the product deformed is restored to the original state by means of overall restoration and is not deformed.

Description

Semiconductor part shaping die

Technical Field

The utility model relates to a plastic mould technical field, concretely relates to semiconductor spare part plastic mould.

Background

The PVD (Physical Vapor Deposition) technique is a technique of physically vaporizing the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionizing the gaseous atoms or molecules into ions under vacuum, and depositing a thin film with a specific function on the surface of a substrate by a low-pressure gas (or plasma) process. The component is a focus ring formed without adhesive, the focus ring enables the wafer to be deposited more uniformly in the physical vapor deposition process, and the focus ring comprises a plurality of hexagonal holes and a plurality of connecting members.

The size required for deposition is more precise, a focusing ring part used in the PVD process plays a key role in depositing a wafer, a mother material of the focusing ring part is stainless steel, the part is easy to deform, and the part is easy to deform due to stress action in the processes of disassembly and equipment cleaning;

the deformation of the part can influence the production of the wafer, the dimension of the focusing ring needs to be detected before the focusing ring is installed, and if the focusing ring is unqualified, shaping repair is carried out;

therefore, a semiconductor component shaping mold is designed and produced to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a semiconductor parts plastic mould to in solving the problem in the above-mentioned background art.

The utility model provides a technical scheme that technical problem adopted is: the utility model relates to a semiconductor spare part plastic mould, include: the base, one side fixed mounting of base has the locating piece, threaded hole is seted up to the inside of locating piece, the inside threaded connection of screw hole has the threaded rod, the one end of threaded rod is rotated and is connected with the movable block, the surface that is located the base of movable block rotates the position of adjusting the movable block through the threaded rod, and the movable block of being convenient for blocks the product gradually, slowly extrudees.

As a preferred technical scheme of the utility model, the other end fixed mounting of threaded rod has the guide block, the through-hole has been seted up to the inside of guide block, the inside slip of through-hole is pegged graft and is had the cylinder spanner, rotates through the cylinder spanner and drives the guide block and rotate to it rotates to drive the threaded rod.

As an optimal technical scheme of the utility model, the side of base is provided with a plurality of activity hexagonal prism, installs the corresponding position of product deformation through activity hexagonal prism, is convenient for reset the deformation position.

As an optimal technical scheme of the utility model, the arc setting is personally submitted in the transversal of movable block, the movable block of being convenient for and the side laminating of product.

The utility model has the advantages of it is following:

the utility model discloses a place the focusing ring product after deformation on the surface of base, will move about the hexagonal prism again and install the corresponding position of product deformation, utilize the rotatory threaded rod of cylinder spanner with the gradual chucking product of movable block, slowly extrude, reach the purpose that reconversion and no longer warp through whole prosthetic means with the position that the product warp.

Drawings

Fig. 1 is a schematic view of an overall structure of a semiconductor component shaping mold according to a preferred embodiment of the present invention;

fig. 2 is a schematic perspective view of a movable hexagonal prism of a semiconductor part shaping mold according to a preferred embodiment of the present invention;

fig. 3 is a schematic perspective view of a focusing ring product of a semiconductor component reshaping mold according to a preferred embodiment of the present invention.

Description of reference numerals: 1. a base; 2. positioning blocks; 3. a threaded rod; 4. a movable block; 5. a guide block; 6. a cylindrical wrench; 7. a movable hexagonal prism.

Detailed Description

The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Moreover, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be interpreted broadly, e.g. as a fixed connection, a detachable connection or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

The present invention will be further explained with reference to the accompanying drawings.

Examples

Referring to fig. 1-3, the present invention provides a semiconductor component reshaping mold, comprising: base 1, one side fixed mounting of base 1 has locating piece 2, and threaded hole is seted up to the inside of locating piece 2, and the inside threaded connection of screw hole has threaded rod 3, and the one end of threaded rod 3 is rotated and is connected with movable block 4, and the surface that is located base 1 of movable block 4 rotates the position of adjusting movable block 4 through threaded rod 3, and the movable block 4 of being convenient for clamps the product gradually, slowly extrudees.

Wherein, the other end of 5 fixed mounting threaded rod 3 of guide block, the inside at guide block 5 is seted up to the through-hole, the inside of 6 slip grafting through-holes of cylinder spanner, it rotates to drive guide block 5 through 6 rotations of cylinder spanner, thereby it rotates to drive threaded rod 3, the side of base 1 is provided with a plurality of activity hexagonal prism 7, install the corresponding position of product deformation through activity hexagonal prism 7, be convenient for reset the deformation position, the arc setting is personally submitted to the cross section of movable block 4, be convenient for the movable block 4 and the side laminating of product.

The working principle is as follows: the position of the movable block 4 is firstly opened to the maximum, the longer side of the focusing ring product deformed is aligned to the direction of the rotary threaded rod 3 and is placed on the base 1, the movable hexagonal prism 7 is installed at the corresponding position, the threaded rod 3 is rotated by the cylindrical wrench 6 to gradually clamp the movable block 4 on the product, the product is slowly extruded, and the deformed part of the product is restored to the original state by means of integral repair and is not deformed.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Other parts not described in detail in the present invention belong to the prior art, and are not described herein again.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A semiconductor parts plastic mould, includes base (1), its characterized in that: one side fixed mounting of base (1) has locating piece (2), the inside set up threaded hole of locating piece (2), the internal thread of screw hole is connected with threaded rod (3), the one end of threaded rod (3) is rotated and is connected with movable block (4), the surface that is located base (1) of movable block (4).

2. The semiconductor part shaping die as claimed in claim 1, wherein a guide block (5) is fixedly mounted at the other end of the threaded rod (3), a through hole is formed in the guide block (5), and a cylindrical wrench (6) is inserted in the through hole in a sliding manner.

3. A semiconductor component reshaping mould as claimed in claim 1, characterized in that the base (1) is provided with a plurality of movable hexagonal prisms (7) on its side.

4. The semiconductor component reshaping die as set forth in claim 1, wherein the movable block (4) is provided in an arc shape in cross section.