CN218849469U - Semiconductor heat dissipation packaging structure - Google Patents

Abstract

The utility model relates to an packaging structure technical field just discloses a semiconductor heat dissipation packaging structure, include: lower casing, last casing, dismantlement structure sets up under between casing, the last casing, dismantle the structure and include: the movable plate, respectively with lower casing, go up the inner wall contact of casing, through the dismantlement structure that sets up, only need to align the contact with last casing with casing down, the both sides button is pressed to the rethread, make two movable plates be close to each other, the elastic potential energy that utilizes a spring puts into the through-hole with the bullet piece, the elastic potential energy of rethread spring is with the horizontal butt of bullet piece in the through-hole, thereby realize the installation of casing and last casing down, through pressing the both sides button, and upwards mention last casing, thereby realize the dismantlement between casing and the last casing down, the dismantlement mode is simple, can't open the casing in the solution contrast patent and overhaul inside the equipment.

Description

Semiconductor heat dissipation packaging structure

Technical Field

The utility model relates to an packaging structure technical field specifically is a semiconductor heat dissipation packaging structure.

Background

The semiconductor packaging refers to a process of processing a chip passing a test according to a product model and a functional requirement to obtain an independent chip, common semiconductor materials include silicon, germanium, gallium arsenide and the like, silicon is one of the most influential applications of various semiconductor materials, the discovery time of a semiconductor is long, and the application field of the semiconductor is expanded along with the continuous development of the times, and the semiconductor packaging mainly comprises an integrated circuit, consumer electronics, a communication system, photovoltaic power generation, lighting application, high-power supply conversion and the like.

According to the Chinese patent publication: "a semiconductor package structure with heat dissipation module", the patent number is: CN216980545U, though the patent of comparison has realized the inside radiating effect of equipment, has protected the inside electric elements of equipment, has avoided the equipment trouble that electric elements is ageing to lead to, has improved the life when equipment in-service use, is favorable to the quality when equipment in-service use simultaneously, has avoided spare part in the equipment to drop when receiving the impact, has reduced the maintenance number of times when equipment later stage uses, is favorable to the cost of controlgear later stage use.

However, the compared patents only avoid the equipment failure caused by aging of the electrical elements, the service life of the equipment in actual use is prolonged, "the maintenance times of the equipment in later use are reduced, and the cost of the equipment in later use is controlled, but the equipment is limited in a high-temperature environment or when the equipment is impacted, if the equipment is not used according to regulations or is damaged artificially, the shell in the compared patents cannot be opened to maintain or overhaul the internal electrical elements, so that inconvenience is caused, and the traditional mode of disassembling the shell by bolts needs to be realized by means of an external tool, so that the practicability of the equipment is reduced. Therefore, a semiconductor heat dissipation package structure is proposed to solve the problems of the background art.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a semiconductor heat dissipation packaging structure.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor heat dissipation package structure, comprising:

a lower shell and an upper shell;

the dismounting structure is arranged between the lower shell and the upper shell;

the disassembly structure includes:

the moving plate is respectively contacted with the inner walls of the lower shell and the upper shell;

the connecting rod is movably connected with the inner walls of the lower shell and the upper shell, and one end of the connecting rod is rotatably connected with one side of the moving plate through a bearing;

the button is fixedly connected to the other end of the connecting rod;

the first extension plate is fixedly connected to one side of the moving plate;

the first spring is sleeved on the surface of the connecting rod, and two ends of the first spring are fixedly connected with the inner wall of the lower shell and one side of the movable plate respectively;

the first grooves are respectively formed in the tops of the first extension plates;

the bottom end of the second spring is fixedly connected to the bottom of the first groove;

the elastic block is fixedly connected to the top end of the second spring;

the second extension plate is fixedly connected to the inner side of the upper shell respectively;

and the through holes are respectively formed in the second extension plate.

Preferably, the method further comprises the following steps:

the filter screen disassembling structure is arranged on the lower shell;

the filter screen detaching structure comprises:

the rectangular hole is formed in the bottom of the lower shell;

the filter screen is contacted with the wall of the rectangular hole;

the L-shaped plates are respectively and fixedly connected to four corners of the top of the filter screen;

each L-shaped plate is provided with a threaded hole, the inner wall of the bottom of the lower shell is provided with a threaded groove, and the bolt is in threaded connection with the threaded holes and the threaded grooves respectively.

Preferably, the inner wall fixed mounting who goes up the casing has the motor, the output fixedly connected with flabellum of motor drives the flabellum rotation through the motor that sets up, forms the air current and drives the inside air flow of equipment for the inside heat dissipation of equipment has realized the inside radiating effect of equipment, has protected the inside electrical element of equipment, has avoided the equipment trouble that the electrical element is ageing to lead to, has improved the life when equipment is used in practice, is favorable to the quality when equipment is used in practice simultaneously.

Preferably, the inner wall of the upper shell is fixedly connected with a substrate, a heat dissipation plate and a chip respectively, and the refrigeration effect of the semiconductor is achieved through the mutual matching of the substrate, the heat dissipation plate and the chip.

Preferably, no. two grooves are respectively formed in the elastic blocks, the elastic blocks are matched with the through holes, and the elastic potential energy of the No. two springs is utilized to clamp the elastic blocks in the through holes, so that the lower shell and the upper shell are installed.

Preferably, the back of having seted up wiring hole and casing down on the last casing is provided with control switch, makes things convenient for inside electric elements's wiring through the wiring hole that sets up, makes things convenient for operating personnel to control inside electric elements through the control switch who sets up.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor heat dissipation packaging structure possesses following beneficial effect:

1. this semiconductor heat dissipation packaging structure, dismantlement structure through setting up, only need to align the contact with last casing down the casing, the both sides button is pressed to the rethread, make two movable plates be close to each other, the elastic potential energy that utilizes a spring puts into the through-hole with the bullet piece, the horizontal butt of bullet piece is in the through-hole to the elastic potential energy of rethread spring, thereby realize the installation of casing and last casing down, through pressing the both sides button, and upwards mention the upper housing, thereby realize the dismantlement between casing and the upper housing down, the dismantlement mode is simple, can't open the casing and overhaul inside the equipment in the solution contrast patent.

2. This semiconductor heat dissipation packaging structure dismantles the structure through the filter screen that sets up, and after opening the casing, the bolt is dismantled in proper order to the accessible, makes the bolt break away from screw hole and thread groove respectively to realize the dismantlement of filter screen, solved along with under the long-time use of filter screen in the contrast patent, inconvenient dismantlement is changed or abluent trouble.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a front view of the present invention;

fig. 2 is a schematic structural view of the lower housing of the present invention;

fig. 3 is a schematic structural view of the upper housing of the present invention;

fig. 4 is a schematic structural diagram of the present invention a.

In the figure: 1. a lower housing; 2. disassembling the structure; 201. a button; 202. a connecting rod; 203. moving the plate; 204. a first extension plate; 205. a first spring; 206. a spring block; 207. a second extension plate; 208. a through hole; 209. a second spring; 3. an upper housing; 4. a motor; 5. a fan blade; 6. a filter screen disassembling structure; 601. filtering with a screen; 602. an L-shaped plate; 603. a bolt; 7. and a wiring hole.

Detailed Description

Example 1

As shown in fig. 1-4, the utility model provides a semiconductor heat dissipation packaging structure, include: lower casing 1, last casing 3, the inner wall of going up casing 3 is fixedly connected with base plate, heating panel, chip respectively, through the refrigeration effect of mutually supporting realization semiconductor of base plate, heating panel, chip, dismantles structure 2, and the setting is casing 1, goes up between casing 3 under, and dismantlement structure 2 includes: the movable plate 203 is respectively contacted with the inner walls of the lower shell 1 and the upper shell 3, the connecting rod 202 is movably connected with the inner walls of the lower shell 1 and the upper shell 3, one end of the connecting rod 202 is rotatably connected with one side of the movable plate 203 through a bearing, the button 201 is fixedly connected with the other end of the connecting rod 202, the first extension plate 204 is fixedly connected with one side of the movable plate 203, the first spring 205 is sleeved on the surface of the connecting rod 202, two ends of the first spring 205 are respectively fixedly connected with the inner wall of the lower shell 1 and one side of the movable plate 203, the first grooves are respectively formed in the top of the first extension plate 204, the second spring 209 is fixedly connected with the bottom of the first groove, the elastic block 206 is fixedly connected with the top end of the second spring 209, the second extension plate 207 is respectively and fixedly connected with the inner side of the upper shell 3, the through holes 208 are respectively formed in the second extension plate 207, the elastic block 206 is mutually matched with the through holes 208, and the elastic potential energy of the second spring 209 is utilized to tightly clamp the elastic block 206 in the through holes 208, so that the lower shell 1 and the upper shell 3 are installed.

In this embodiment, through the dismantlement structure 2 that sets up, only need to align the contact with casing 1 and last casing 3 down, the rethread presses both sides button 201, make two movable plates 203 be close to each other, utilize the elastic potential energy of a spring 205 to put into through-hole 208 with bullet piece 206, the horizontal butt of bullet piece 206 in through-hole 208 of the elastic potential energy of rethread spring 205, thereby realize casing 1 and last casing 3's installation down, through pressing both sides button 201, and upwards mention last casing 3, thereby realize the dismantlement between casing 1 and the last casing 3 down, the dismantlement mode is simple, can't open the casing in the solution contrast patent and overhaul inside the equipment.

Example 2

As shown in fig. 1-4, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the method further comprises the following steps: the filter screen dismantles structure 6, sets up under on casing 1, and filter screen dismantles structure 6 and includes: the rectangular hole, set up the bottom of casing 1 under, filter screen 601, the contact is at the pore wall of rectangular hole, L shaped plate 602, fixed connection is in filter screen 601's top four corners department respectively, bolt 603, all set up threaded hole on every L shaped plate 602, the thread groove has been seted up respectively to casing 1's bottom inner wall down, bolt 603 respectively with the screw hole, thread groove internal thread connection, the inner wall fixed mounting who goes up casing 3 has motor 4, motor 4's output fixedly connected with flabellum 5, it is rotatory to drive flabellum 5 through the motor 4 that sets up, it flows to form the inside air of air current drive equipment, accelerate the inside heat dissipation of equipment, the inside radiating effect of equipment has been realized, the inside electrical element of equipment has been protected, the equipment trouble that the electrical element is ageing to result in has been avoided, the life when having improved equipment actual use, be favorable to the quality when equipment actually uses simultaneously, the back of going up wiring hole 7 and casing 1 down of casing 3 is provided with control switch, wiring hole 7 through the wiring that sets up makes things convenient for the inside electrical element, control personnel control through the control switch who sets up, control the inside electrical element controls.

In this embodiment, through the filter screen dismantlement structure 6 that sets up, after opening upper housing 3, the accessible is dismantled bolt 603 in proper order, makes bolt 603 break away from screw hole and thread groove respectively to realize filter screen 601's dismantlement, solved in the contrast patent along with under the long-time use of filter screen, inconvenient dismantlement is changed or abluent trouble.

The working principle of the semiconductor heat dissipation package structure is described in detail below.

As shown in fig. 1-4, when in use, the lower casing 1 is aligned with the upper casing 3, the two moving plates 203 are moved closer to each other by pressing the two side buttons 201, the elastic potential energy of the first spring 205 is utilized to place the elastic block 206 into the through hole 208, the elastic potential energy of the first spring 205 is utilized to transversely abut the elastic block 206 in the through hole 208, so that the lower casing 1 and the upper casing 3 are mounted, the two side buttons 201 are pressed and the upper casing 3 is lifted upwards to detach the lower casing 1 from the upper casing 3, and after the upper casing 3 is opened, the bolts 603 are sequentially detached to separate from the threaded holes and the threaded grooves, so that the filter screen 601 is detached.

Claims (6)

1. A semiconductor heat dissipation package structure, comprising:

a lower shell (1) and an upper shell (3);

the disassembly structure (2) is arranged between the lower shell (1) and the upper shell (3);

the disassembly structure (2) comprises:

a moving plate (203) which is respectively contacted with the inner walls of the lower shell (1) and the upper shell (3);

the connecting rod (202) is movably connected with the inner walls of the lower shell (1) and the upper shell (3), and one end of the connecting rod (202) is rotatably connected with one side of the moving plate (203) through a bearing;

the button (201) is fixedly connected to the other end of the connecting rod (202);

a first extension plate (204) fixedly connected to one side of the moving plate (203);

the first spring (205) is sleeved on the surface of the connecting rod (202), and two ends of the first spring (205) are fixedly connected with the inner wall of the lower shell (1) and one side of the moving plate (203) respectively;

the first grooves are respectively formed in the tops of the first extension plates (204);

the bottom end of the second spring (209) is fixedly connected to the bottom of the first groove;

the elastic block (206) is fixedly connected to the top end of the second spring (209);

a second extension plate (207) fixedly connected to the inner side of the upper housing (3) respectively;

through holes (208) are respectively arranged on the second extending plate (207).

2. The semiconductor heat dissipation package structure of claim 1, further comprising:

the filter screen dismounting structure (6) is arranged on the lower shell (1);

the filter screen detaching structure (6) includes:

the rectangular hole is formed in the bottom of the lower shell (1);

a filter screen (601) contacting the wall of the rectangular hole;

the L-shaped plates (602) are respectively and fixedly connected to four corners of the top of the filter screen (601);

each L-shaped plate (602) is provided with a threaded hole, the inner wall of the bottom of the lower shell (1) is provided with a threaded groove, and the bolt (603) is in threaded connection with the threaded hole and the threaded groove respectively.

3. The semiconductor heat dissipation package structure of claim 1, wherein: the inner wall of the upper shell (3) is fixedly provided with a motor (4), and the output end of the motor (4) is fixedly connected with fan blades (5).

4. The semiconductor heat dissipation package structure of claim 1, wherein: the inner wall of the upper shell (3) is fixedly connected with a substrate, a heat dissipation plate and a chip respectively.

5. The semiconductor heat dissipation package structure of claim 1, wherein: no. two grooves are formed in the elastic blocks (206), and the elastic blocks (206) are matched with the through holes (208).

6. The semiconductor heat dissipation package structure of claim 1, wherein: the upper shell (3) is provided with a wiring hole (7), and the back of the lower shell (1) is provided with a control switch.

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